CND0214A

This product complies with the RoHS Directive (EU 2002/95/EC). Photo Couplers CND0214A Infrared Optocal Module (IrDA) Infrared data link for cellular phones, peripheral devices  Features M Di ain sc te on na tin nc ue e/ d  Compliant with IrDA Ver.1.2  Corresponding low I/O (interface) voltage: 1.5 V  Corresponding reflow solder (260°C)  Ultra-small top view package (2.0 mm × 8.2 mm × 1.7 mm）  GaAlAs LED + IC + PIN Photodiode di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n.  Type  Absolute Maximum Ratings Ta = 25°C±3°C Parameter Symbol Operating supply voltage VCC Output voltage VO Input voltage VI Shutdown input voltage VSD LED operating supply voltage VLEDA Pulse forward current * IFP Low level output current IOL Operating ambient temperature Topr Storage temperature Tstg Unit – 0.5 to +3.8 V – 0.5 to +3.8 V – 0.5 to +3.8 V – 0.5 to +3.8 V – 0.5 to +7.0 V 200 mA 10 mA –20 to +70 °C –30 to +85 °C on tin ue Note) *: tw ≤ 90 µs, Duty ≤ 20 % Rating  Operatong Condition Symbol ce /D isc Parameter LED operating supply voltage VCC VLEDA VIO Ma int en Input / output supply voltage an Operating supply voltage Conditions Min Typ Max Unit 2.4 2.8 3.3 V 4.5 V 2.7 1.5 1.8 VCC V Min Typ Max Unit  Electrical-Optical Characteristics VCC = VIO = 2.8 V, Ta = 25°C±3°C Parameter High level supply current *1 Symbol Conditions ICCH VLEDA = 3.6 V, VI = 0.5 V, VSD ≤ 0.5 V 90 120 mA Shut down supply current *1 ICCSD VI = 0.5 V, VIO ≥ VSD ≥ VIO – 0.3 (SD = High) 10 200 nA Maximum reception distance *5 Lmax VLEDA = 2.7 V to 4.5 V, VSD ≤ 0.5 V, External components Data Rates 23 cm  9.6 115.2 kbps SD high level input voltage VIHSD VIO – 0.5 VIO V SD low level input voltage VILSD 0 0.5 V Publication date : January 2009 SHF00011BEK 1 This product complies with the RoHS Directive (EU 2002/95/EC). CND0214A  Electrical-Optical Characteristics (Continued) VCC = VIO = 2.8 V, Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Transmitter Peak emission wavelength Pulse forward current *1 Center radiant intensity *1, 2 θT = 0 θT = ±15 λP IFP = 60 mA, Duty 3/16 850 870 900 nm IFP VLEDA = 3.2 V, VSD ≤ 0.5 V 40 60 90 mA Ie VLEDA = 3.2 V, VSD ≤ 0.5 V 12 18 7 12 mW/sr VLEDA = 3.2 V, VSD ≤ 0.5 V VIH VCC = 2.4 V to 3.3 V, VSD ≤ 0.5 V VIO – 0.5 VIO V Low level input voltage *1 VIL VCC = 2.4 V to 3.3 V, VSD ≤ 0.5 V 0 0.5 V TX half-angle θT M Di ain sc te on na tin nc ue e/ d Ie15 High level input voltage *1 ±15 TWT Rise time *1, 3 tr Fall time *1, 3 tf TX wake up time *8 Minimum input irradiance EI min High level output voltage *6 VOH Low level output voltage *7 VOL θR RXD output pulse width TWR RX wake up time *9 tRwu tr Fall time *4 tf isc ce /D an en int Ma 2 2.2 ms 0.2 ms 0.2 ms 1 ms 5 μW/cm2 Non signal condition IOH = –200 mA, VSD ≤ 0.5 V VIO – 0.3 VIO V IOL = 500 mA, VSD ≤ 0.5 V 0 0.5 V ±15 CL = 15 pF, 9.6 kbps to 115.2 kbps 4.2 μs EI = 8.1 mW/cm2 200 400 μs EI = 8.1 mW/cm2 100 200 μs CL = 10 pF 50 200 ns CL = 10 pF 50 200 ns SHF00011BEK 1.0 ° 2.3 on tin 0.3 VSD ≤ 0.5 V ue tL Rise time *4 1.6 tw = 1.6 ms, RL = 50 Ω Receiver Receiver latency time 1.41 tw = 1.6 ms, RL = 50 Ω tTwu RX half angle TXD Pulse = 1.6 μs ° di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. LED optical pulse width mW/sr This product complies with the RoHS Directive (EU 2002/95/EC). CND0214A  Electrical-Optical Characteristics (Continued) Note) Measuring circuit *1: *2: VCC R VSD R: 4.7 Ω C1,C2: 4.7 µF 7: GND C1 C2 6: VCC +θT −θT 5: SD 4: RXD VI 3: TXD VIO 2: V/O M Di ain sc te on na tin nc ue e/ d VO VLEDA 1: LEDA di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. Side View *4: *3: tw H VI signal VI signal TXD APD 90% 10% Light-emitting debice test LED (3.6 mW/sr) θT = 0°±15° 90% 10% tf VL Lmax RXD +150 V L tr *5: tr RL tf *6: *7: R C2 VSD VOH isc ce /D an 2: V/O 1: LEDA Ma int VLEDA 3: TXD en VIO 5: SD 4: RXD VI IOH 6: VCC *8: VCC ue VCC 7: GND VSD on tin C1 VOL IOL *9: SD TXD LED Current H SD R C2 7: GND 6: VCC 5: SD 4: RXD VI 3: TXD VIO 2: V/O VLEDA TX wake up time C1 1: LEDA RX wake up time H L L H Signal L H RXD H L H L L tRwu tTwu SHF00011BEK 3  Pin name 1. LEDA 2. VIO 3. TXD 4. RXD 5. SD 4 シールド GND/Shield GND an en ue on tin isc ce /D di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit (受光中心) d d te te ow (Lighting Receiver Center) p:/ fo /w llo dis isc nan nan ing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. int Ma M Di ain sc te on na tin nc ue e/ d This product complies with the RoHS Directive (EU 2002/95/EC). CND0214A  Package (Unit: mm) KMTLTM7K0001 6. VCC 7. GND 8. Shield GND 9. Shield GND SHF00011BEK Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. d pla inc ne lud se pla m d m es ne ain ain foll htt visit d d te te ow p:/ fo d /w llo is isc nan nan ing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i / on . (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. Pl ea Ma int en an ce /D isc on tin ue 20080805