PAN1740
Bluetooth® Low Energy Module
Product Specification
Rev. 1.9
Wireless Modules
PAN1740 Bluetooth Module
Overview
The PAN1740 is a short-range Bluetooth Low
Energy (LE) single mode module used for the
implementation of Bluetooth functionality into
various electronic devices.
Characteristics
• Peak power consumption 4.9 mA Rx and Tx
• Link budget 93 dBm (Rx sensitivity -93, Tx
0 dBm)
•
Operating temperature range -40 °C to +85 °C
Features
• Pre-programmed BT/MAC address
• Includes 16 MHz and 32 768 kHz crystal
calibrated up to 1 ppm
•
•
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Single-mode Bluetooth Smart System-on-Chip
®
®
Programmable ARM Cortex -M0 CPU
Autonomous Bluetooth LE stand-alone operation
Bluetooth 4.2 (LE) embedded GATT profile, Low
Energy single mode
Small 9.0 mm x 9.5 mm x 1.8 mm SMD package
with antenna
Less than a few µA in low power modes
Integrated shielding to resist EMI
No external components needed
Block Diagram
Vcc 3.3 V
PAN1740
Bluetooth 4.2 Module
Slow Clock
32 KHz
UART/SPI/I2C
Crystal
16 MHz
GPIOs
Quad Decoder
Dialog
DA14580
Chip
Antenna
DC-DC
Conversion
ADC/Wake-up
Reset
Product Specification Rev. 1.9
Page 2
PAN1740 Bluetooth Module
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations. Panasonic
reserves the right to make changes as required at any time without notification. Please consult the most
recently issued Product Specification before initiating or completing a design.
© Panasonic Industrial Devices Europe GmbH 2019.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do
not disclose it to a third party.
All rights reserved.
This Product Specification does not lodge the claim to be complete and free of mistakes.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Product Specification and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation
or integration in another product to be sold by the customer,
Deviation or lapse in function of the Engineering Sample,
Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.
Product Specification Rev. 1.9
Page 3
PAN1740 Bluetooth Module
Table of Contents
1
2
3
4
5
6
About This Document......................................................................................................................... 6
1.1
Purpose and Audience .............................................................................................................. 6
1.2
Revision History ......................................................................................................................... 6
1.3
Use of Symbols ......................................................................................................................... 6
1.4
Related Documents ................................................................................................................... 6
Overview .............................................................................................................................................. 7
2.1
Block Diagram ........................................................................................................................... 8
2.2
Bluetooth IC ............................................................................................................................... 9
2.3
System Overview ....................................................................................................................... 9
2.4
Pin Configuration ..................................................................................................................... 13
2.5
Interfaces ................................................................................................................................. 15
Detailed Description ......................................................................................................................... 19
3.1
Dimensions .............................................................................................................................. 19
3.2
Footprint .................................................................................................................................. 20
3.3
Packaging ................................................................................................................................ 21
3.4
Case Marking .......................................................................................................................... 24
Specification ..................................................................................................................................... 25
4.1
Default Test Conditions ........................................................................................................... 25
4.2
Absolute Maximum Ratings ..................................................................................................... 25
4.3
Recommended Operating Conditions ...................................................................................... 26
4.4
DC Characteristics ................................................................................................................... 26
4.5
MHz Crystal Oscillator: Timing Characteristics ........................................................................ 27
4.6
32 kHz Crystal Oscillator: Timing Characteristics ..................................................................... 27
4.7
DC-DC Converter: DC Characteristics..................................................................................... 27
4.8
Reliability Tests ....................................................................................................................... 28
4.9
Recommended Soldering Profile ............................................................................................. 29
Cautions ............................................................................................................................................ 30
5.1
Design Notes ........................................................................................................................... 30
5.2
Installation Notes ..................................................................................................................... 30
5.3
Usage Condition Notes ............................................................................................................ 31
5.4
Storage Notes .......................................................................................................................... 31
5.5
Safety Cautions ....................................................................................................................... 31
5.6
Other Cautions ........................................................................................................................ 32
5.7
Restricted Use ......................................................................................................................... 32
Regulatory and Certification Information ....................................................................................... 34
6.1
Federal Communications Commission (FCC) for US .............................................................. 34
6.2
Industry Canada Certification .................................................................................................. 36
6.3
Japanese Radio Law Compliance ........................................................................................... 38
6.4
European Conformity According to RED (2014/53/EU) ........................................................... 39
6.5
Bluetooth ................................................................................................................................. 39
6.6
RoHS and REACH Declaration ............................................................................................... 39
Product Specification Rev. 1.9
Page 4
7
PAN1740 Bluetooth Module
Appendix ........................................................................................................................................... 40
7.1
Ordering Information ................................................................................................................ 40
7.2
Contact Details ........................................................................................................................ 41
Product Specification Rev. 1.9
Page 5
PAN1740 Bluetooth Module
1 About This Document
1 About This Document
1.1
Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic PAN1740 module. It is intended for hardware design,
application, and Original Equipment Manufacturer (OEM) engineers. The product is referred to
as “the PAN1740” or “the module” within this document.
1.2
1.3
Revision History
Revision
Date
Modifications/Remarks
1.0
2014-10-01
Final Specification incl. DoC
1.1
2014-12-01
Changed tolerances in chapter 11 “Module Dimension”.
1.2
2015-04-01
Added „nntrinsic safety values“.
1.3
2016-01-01
Editorial changes
1.4
2016-10-01
Updated chapter “EU regulatory”. Changed “VCC” to “VBAT3V”.
1.5
2017-06-01
Updated chapter “EU regulatory” to “RED”
1.6
2017-06-01
New layout and document structure
1.7
2017-11-01
Added “MIC ID” for Japanese Radio Law
1.8
2018-01-01
Added “order information” for Evaluation Tools
1.9
2019-02-25
Updated “Bluetooth Subsystem IDs” to Bluetooth 4.2. Formal changes.
Added chapter “Restricted End Use”. Updated pictures.
Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4
Related Documents
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
Product Specification Rev. 1.9
Page 6
PAN1740 Bluetooth Module
2 Overview
2 Overview
The PAN1740 is a short-range Bluetooth LE single mode module used for the implementation of
Bluetooth functionality into various electronic devices. The PAN1740 is fully-compliant with the
Bluetooth 4.2 standard. It includes dedicated hardware for Link Layer implementation of
Bluetooth Smart and interface controllers for enhanced connectivity capabilities.
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
Further information on the variants and versions 7.1 Ordering Information.
Product Specification Rev. 1.9
Page 7
PAN1740 Bluetooth Module
2 Overview
2.1
Block Diagram
Vcc 3.3 V
PAN1740
Bluetooth 4.2 Module
Slow Clock
32 KHz
UART/SPI/I2C
Crystal
16 MHz
GPIOs
Quad Decoder
Dialog
DA14580
Chip
Antenna
DC-DC
Conversion
ADC/Wake-up
Reset
Total capacity shall not exceed 2.5 µF.
The total inductance shall not exceed 2.5 µH.
There is no resistor value in this design.
Product Specification Rev. 1.9
Page 8
PAN1740 Bluetooth Module
2 Overview
2.2
Bluetooth IC
2.3
System Overview
The PAN1740 contains the following internal blocks:
•
•
2.3.1
ARM Cortex-M0 CPU
Bluetooth Smart
ARM Cortex-M0 CPU
The Cortex-M0 processor is a 32-bit Reduced Instruction Set Computing (RISC) processor with
a “von-Neumann-architecture” (single bus interface). It uses an instruction set called Thumb,
which was first supported in the ARM7TDMI processor. Several newer instructions from the
ARMv6 architecture and a few instructions from the Thumb-2 technology are also included.
Thumb-2 technology extended the previous Thumb instruction set to allow all operations to be
carried out in one CPU state. The instruction set in Thumb-2 includes both 16-bit and 32-bit
instructions; most instructions generated by the C compiler use the 16-bit instructions, and the
32-bit instructions are used when the 16-bit version cannot carry out the required operations.
This results in high code density and avoids the overhead of switching between two instruction
sets.
In total, the Cortex-M0 processor supports 56 base instructions, although some instructions can
have more than one form. While the instruction set is small, the Cortex-M0 processor is highly
capable because the Thumb instruction set is highly optimized.
Product Specification Rev. 1.9
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PAN1740 Bluetooth Module
2 Overview
2.3.2
Bluetooth Smart
Bluetooth LE core
The Bluetooth LE core is a qualified Bluetooth 4.2 baseband controller compatible with
Bluetooth Smart specification and it is in charge of packet encoding- decoding and frame
scheduling.
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Bluetooth Smart Specifications compliant according to the Specification of the Bluetooth 4.2
System, Bluetooth SIG
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All device classes are supported (Broadcast, Central, Observer, Peripheral)
All packet types (Advertising/Data/Control)
Encryption (AES/CCM)
Bit stream processing (CRC, Whitening)
FDMA/TDMA/events formatting and synchronization
Frequency Hopping calculation
Operating clock with internal 16 MHz
Low power modes with internal 32.678 kHz
Supports power down of the baseband during the protocol’s idle periods
Advanced High performance Bus (AHB) Slave interface for register file access
AHB Slave interface for Exchange Memory access of CPU via Bluetooth LE core
AHB Master interface for direct access of Bluetooth LE core to exchange memory space
SmartSnippetsTM
The PAN1740 is available together with Dialog’s SmartSnippets Bluetooth Software platform
which includes a qualified Bluetooth Smart single-mode stack on chip.
Numerous Bluetooth Smart profiles for consumer wellness, sport, fitness, security, and
proximity applications are supplied as standard, while additional customer profiles can be
developed and added as needed.
TM
The SmartSnippets software development environment is based on Keil ‘s µVision mature
tools and contains example application code for both embedded and hosted modes.
Product Specification Rev. 1.9
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PAN1740 Bluetooth Module
2 Overview
Memory
The following memories are part of the PAN1740’s internal blocks:
•
ROM
This is an 84 kB ROM containing the Bluetooth Smart protocol stack as well as the boot
code sequence.
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OTP (One Time Programmable)
This is a 32 kB One-Time Programmable memory array, used to store the application code
as well as Bluetooth Smart profiles. It also contains the system configuration and calibration
data.
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System SRAM
This is a 42 kB system SRAM (Sys-RAM) which is primarily used for mirroring the program
code from the OTP when the system wakes/powers up. It also serves as Data RAM for
intermediate variables and various data that the protocol requires. Optionally, it can be used
as extra memory space for the Bluetooth LE data structures TX and RX.
•
Retention RAMs
These are four special low leakage SRAM cells (2 kB+2 kB+3 kB+1 kB) used to store
various data of the Bluetooth Smart protocol as well as the system’s global variables and
processor stack when the system goes into Deep Sleep mode. Storage of this data ensures
secure and quick configuration of the Bluetooth LE Core after the system wakes up. Every
cell can be powered on or off according to the application needs for retention area when in
Deep Sleep mode.
Functional Modes
The PAN1740 is optimized for embedded applications such as health monitoring, sports
measuring, human interaction devices, etc. Customers are able to develop and test their own
applications. Upon completion of development, the application code can be programmed into
the OTP.
In general, the system has three functional modes of operation:
•
Development Mode
During this phase application code is developed using the ARM Cortex-M0 SW
environment. The compiled code is then downloaded into the System RAM or any Retention
RAMs by means of SWD (JTAG) or any serial interface (e.g. UART). Address 0x00 is
remapped to the physical memory that contains the code and the CPU is configured to reset
and execute code from the remapped device. This mode enables application development,
debugging and on-the-fly testing.
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Normal Mode
After the application is completed and verified, the code can be burned into the OTP. When
the system boots/wakes up, the DMA of the OTP controller will automatically copy the
program code from the OTP into the system RAM. Next, a SW reset will remap address
0x00 to the System RAM and code execution is started. Hence, in this mode, the system is
autonomous, contains the required SW in OTP and is ready for integration into the final
product.
•
Calibration Mode
Programming the Bluetooth device address is completed in Calibration Mode.
Product Specification Rev. 1.9
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PAN1740 Bluetooth Module
2 Overview
Power Modes
There are four different power modes in the PAN1740:
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Active Mode
System is active and operates at full speed.
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Sleep Mode
No power gating has been programmed, the ARM CPU is idle, waiting for an interrupt.
PD_SYS is on. PD_PER and PED_RAD depending on the programmed enabled value.
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Extended Sleep Mode
All power domains are off except for the PD_AON, the programmed PD_RRx and the
PD_SR. Since the SysRAM retains its data, no OTP mirroring is required upon waking up
the system.
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Deep Sleep Mode
All power domains are off except for the PD_AON and the programmed PD_RRx. This
mode dissipates the minimum leakage power. However, since the SysRAM has not retained
its data, an OTP mirror action is required upon waking up the system.
Product Specification Rev. 1.9
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PAN1740 Bluetooth Module
2 Overview
2.4
Pin Configuration
Pin Assignment
Top View
0,55
C
D
A
B
19
20
17
18
15
16
13
9.50
1.80
9.00
12
14
21 Pad = 28 x 0.60mm x 0.60mm 11
Top View
10
23
9
2
24
1
4
3
6
5
8
0,60
22
7
Pin Functions
No
Pin Name
Pin Type
Description
2 RST
I
INPUT. Reset signal (active high).
3 P0.7
IO
General purpose I/O port bit or alternate function nodes.
4 P0.6
IO
General purpose I/O port bit or alternate function nodes.
5 P0.5
IO
General purpose I/O port bit or alternate function nodes.
1
UART RX
6 P0.4
IO
General purpose I/O port bit or alternate function nodes.
1
UART TX
1 GND
1
Dependent on the software configuration the UART can be set also to any other IO.
Product Specification Rev. 1.9
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PAN1740 Bluetooth Module
2 Overview
No
Pin Name
Pin Type
Description
8 VBAT3V
AI
Power supply
9 P0.3
IO
General purpose I/O port bit or alternate function nodes.
1
UART CTS
10 P0.2
IO
General purpose I/O port bit or alternate function nodes.
1
UART RTS
11 P0.1
IO
General purpose I/O port bit or alternate function nodes.
12 P0.0
IO
General purpose I/O port bit or alternate function nodes.
AI
INPUT. This pin is used while OTP programming and
2
testing.
IO
INPUT JTAG clock signal
IO
INPUT/OUTPUT. JTAG Data input/output.
21 P1.3
IO
General purpose I/O port bit or alternate function nodes.
22 P1.2
IO
General purpose I/O port bit or alternate function nodes.
23 P1.1
IO
General purpose I/O port bit or alternate function nodes.
24 P1.0
IO
General purpose I/O port bit or alternate function nodes.
7 GND
13 n.c.
14 VPP
15 GND
16 P1_4/SWCLK
17 GND
18 P1_5/SW_DIO
19 GND
20 GND
A
GND
B
GND
C
GND
D
GND
For a more detailed description of the alternate function nodes please refer to the Dialog
datasheet 7.2.2 Product Information.
2
Supply voltage on pin VPP during OTP programming is 6.8 V+/-0.25 V
Product Specification Rev. 1.9
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PAN1740 Bluetooth Module
2 Overview
2.5
2.5.1
Interfaces
UART
The UART is compliant to the industry standard “16550” and is used for serial communication
with a peripheral, modem (data carrier equipment (DCE)) or data set. Data is written from a
master (CPU) over the APB bus to the UART and it is converted to serial form and transmitted
to the destination device. Serial data is also received by the UART and stored for the master
(CPU) to read back. There is no DMA support on the UART block since it’s contains internal
FIFOs. Both UARTs support hardware flow control signals (RTS, CTS, DTR, DSR).
Features
•
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16 bytes Transmit and receive FIFOs.
Hardware flow control support (CTS/RTS)
Shadow registers to reduce software overhead and a software programmable reset
Transmitter Holding Register Empty (THRE) interrupt mode
IrDA 1.0 SIR mode supporting low power mode.
Functionality based on the industry standard “16550":
2.5.2
•
Programmable character properties, such as number of data bits per character (5-8),
optional
•
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parity bit (with odd or even select) and number of stop bits (1, 1.5 or 2)
Line break generation and detection
Prioritized interrupt identification
Programmable serial data baud rate as calculated by the following:
baud rate = (serial clock frequency)/(divisor)
Serial Peripheral Interface (SPI+)
This interface supports a subset of the Serial Peripheral Interface SPI™. The serial interface
can transmit and receive in master/slave mode: 8, 16 or 32 bits and transmit in master mode:
9 bits. The SPI+ interface has enhanced functionality with bidirectional 2x16-bit word FIFOs.
SPI™ is a trademark of Motorola, Inc.
Features
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Master and Slave mode
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SPI mode 0, 1, 2, 3 support (clock edge and phase)
8 bit, 9 bit, 16 bit or 32 bit operation
Clock speeds up to 16 MHz. Programmable output frequencies of SPI source clock divided
by 1, 2, 4, 8
Programmable SPI_DO idle level
Maskable Interrupt generation
Bus load reduction by unidirectional writes-only and reads-only modes
Built-in RX/TX FIFOs for continuous SPI bursts
Product Specification Rev. 1.9
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PAN1740 Bluetooth Module
2 Overview
2.5.3
Inter IC-Bus (I2C)
2
The I C is a programmable control bus that provides support for the communications link
between Integrated Circuits in a system. It is a simple two-wire bus with a software-defined
protocol for system control, which is used in temperature sensors and voltage level translators
to EEPROMs, general-purpose I/O, A/D and D/A converters.
Features
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2.5.4
2
Two-wire I C serial interface consists of a serial data line (SDA) and a serial clock (SCL)
Two speeds are supported: Standard mode (0 Kb/s to 100 Kb/s), Fast mode (
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