CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
1 of 30
DATE
14.02.2008
Datum
PR
EL
IM
IN
AR
Y
Specification for Production
Applicant / Manufacturer
Hardware
Panasonic Electronic Devices Europe GmbH
Zeppelinstrasse 19
21337 Lüneburg
Germany
Applicant / Manufacturer
Software
Software Version
E-Senza Technologies GmbH
Blarerstrasse 56
78462 Konstanz
Germany
SN55 R3_1_1 from 08.01.2008
Contents
Approval for Mass Production
Customer
By signing this document, Customer accepts the validity of the below-mentioned
contents and declares his full notice to it. Some passages may be changed if required;
the validity shall not be affected thereby.
CHECKED / APPROVED:
DATE:
NAME:
SIGNATURE:
NOTE:
AT LEAST ONE SET OF APPROVED SPECIFICATIONS SHOULD BE RETURNED TO
THE ADDRESS OF THE ISSUING PARTY.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
2 of 30
DATE
14.02.2008
Datum
TABLE OF CONTENTS
Key Features ................................................................................................................ 4
Applications for the Module........................................................................................... 4
Description of the Module ............................................................................................. 5
Scope of this Document................................................................................................ 5
History for this Document ............................................................................................. 5
Terminal Layout............................................................................................................ 6
Block Diagram .............................................................................................................. 8
Key Parts List ............................................................................................................... 8
Test Conditions............................................................................................................. 8
Absolute Maximum Ratings .......................................................................................... 9
Operating Conditions .................................................................................................... 9
DC Electrical Characteristics ...................................................................................... 10
A/D converter Characteristics ..................................................................................... 10
AC Electrical Characteristics....................................................................................... 11
Soldering Temperature-Time Profile (for reflow soldering) .......................................... 12
15.1. For lead solder .................................................................................................. 12
15.2. For leadfree solder ............................................................................................ 12
Module Dimension...................................................................................................... 13
Foot Print of the Module ............................................................................................. 13
Labeling Drawing........................................................................................................ 14
Mechanical Requirements .......................................................................................... 14
Recommended Land Pattern ...................................................................................... 15
Development of Applications with freescale BeeStackPTMP ......................................... 17
Reliability Tests .......................................................................................................... 18
Cautions ..................................................................................................................... 18
23.1. Notes of design ................................................................................................. 18
23.2. Notes of installation ........................................................................................... 19
23.3. Notes of usage conditions ................................................................................. 19
23.4. Notes of storage ................................................................................................ 20
23.5. Cautions for safety............................................................................................. 20
23.6. Other cautions ................................................................................................... 20
Packaging................................................................................................................... 22
24.1. Tape Dimension ................................................................................................ 22
24.2. Packing in Tape................................................................................................. 22
24.3. Component direction ......................................................................................... 23
24.4. Reel Dimension ................................................................................................. 23
24.5. Label for Package.............................................................................................. 24
24.6. Total Packing Handling...................................................................................... 24
PR
EL
IM
IN
AR
Y
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
24.7. Cover tape reel strength .................................................................................... 25
Ordering Information................................................................................................... 25
RoHS Declaration....................................................................................................... 26
Data Sheet Status ...................................................................................................... 26
Regulatory Information ............................................................................................... 26
28.1. FCC Notice........................................................................................................ 26
28.2. Caution.............................................................................................................. 27
28.3. Labeling Requirements...................................................................................... 27
28.4. Antenna Warning............................................................................................... 27
28.5. Approved Antenna List ...................................................................................... 28
28.6. RF Exposure PAN4555 ..................................................................................... 28
Related Documents .................................................................................................... 29
General Information.................................................................................................... 30
Life Support Policy...................................................................................................... 30
PR
EL
IM
IN
AR
Y
25.
26.
27.
28.
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
3 of 30
DATE
14.02.2008
Datum
29.
30.
31.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
1.
KEY FEATURES
Schlüsseleigenschaften
Short range 2,4GHz ISM band transceiver with microcontroller and reference oscillator
Provides complete hardware for a wireless node using IEEE802.15.4 packet structure
Very small size (12.2mm x 16.4mm x 2.2mm)
2 antenna options: Single port 50Ω or ceramic antenna
16 selectable Channels with 250 kbps in the 2.4 GHz band
Low power modes for increased battery life
High sensitivity of -92 dBm typ. at 1% Packet Error Rate
0 dBm typ. output power programmable over a 30 dB range
Low supply voltage (2.0 V to 3.4 V, 2.7 V typ.)
Operating temperature range -40°C to +85°C
Link Quality and Clear Channel Assessment capability
60k Flash and 4k RAM memory
4 channel A/D converter with 10 Bit for fast and easy conversion from analog inputs -such
as temperature, pressure and fluid levels- to digital values.
3 channel 16 Bit timer/pulse width modulation (TPM) outputs
BDM port for direct download programming
In total 20 digital I/O lines with programmable pull-ups and few with high-current driver.
Low power modes for increased battery life
Low battery warning
Low voltage detect/reset
Complies with ETSI EN300328 and FCC Part 15C
PR
EL
IM
IN
AR
Y
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
2.
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
4 of 30
DATE
14.02.2008
Datum
APPLICATIONS FOR THE MODULE
Anwendungen für das Modul
• ZigBee TM FFD (full functional) and RFD (reduced
functional) devices working in star and mesh networks
• Wireless sensor and actuator networks
• Remote control and wire replacement in industrial systems
• Factory and home automation and control
• Inventory and logistics management
• HID (Human Interface Devices)
• Toys
• Home gateways
• proprietary networking solutions using IEEE802.15.4
P
P
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
3.
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
5 of 30
DATE
14.02.2008
Datum
DESCRIPTION OF THE MODULE
Beschreibung des Moduls
PR
EL
IM
IN
AR
Y
The PAN4555 module is a short range, low power, 2.4 GHz ISM band transceiver which
includes a complete 802.15.4 physical layer (PHY) modem, designed for the IEEE 802.15.4
wireless standard and a appropriate microcontroller (MCU) with reference oscillator which
provides a cost effective solution for short-range data links and networks.
The main purpose of PAN4555 are ZigBee TM (www.zigbee.org ) applications based on
“BeeStack” of Freescale Inc.. For details on ZigBee TM application software see chapter 21.
P
P
UTH
P
P
Proprietary networking solutions on top of the IEEE802.15.4 MAC/PHY software package
(available at www.freescale.com/zigbee ) could be implemented instead of ZigBee TM as well.
H
P
P
As Integrated Development Environment (IDE) the Metrowerks TM CodeWarrior IDE from
www.metrowerks.com is required. For device flash programming via the BDM port of PAN4555
the USB HCS08/HCS12 Multilink from www.pemicro.com is recommended.
P
H
4.
P
SCOPE OF THIS DOCUMENT
Umfang dieses Dokumentes
This product specification applies to the ZigBee ready modem ENWC9A0xxxE.
The xxx is the indicator for different versions (refer to chapter 25 Ordering Information).
The used ZigBee chip is the MC13213 from the US company freescale
www.freescale.com/zigbee.
Diese Produktionsunterlagen beziehen sich auf das ZigBee ready Modem ENWC9A0xxxE
Die Zeichen xxx bezeichnen verschiedene Versionen (Erklärung im Kapitel 25 Ordering
Information).
Der verwendete ZigBee Chip ist der MC13213 der US Firma Freescale.
5.
HISTORY FOR THIS DOCUMENT
Versionsverwaltung dieses Dokumentes
Revision
Version
Date
Datum
Modification / Remarks
Änderungen / Bemerkungen
A
26.04.2007
Initial draft version
B
08.06.2007
Corrected pin14 in chapter Terminal Layout and revised chapter Block Diagram.
C
28.06.2007
Change IC name from MC13214 to MC13213 in chapter 21.
D
11.07.2007
Support fee reduced to $500 in chapter 21. Change MOQ from 1500pcs to
500pcs. Add special note (2) for the ripple on supply voltage.
E
20.08.2007
Add chapter Regulatory Information and add [9] in chapter 29.
F
16.01.2008
Updated software supplier on the front page and add E-Senza Manual as a link
under [9] in chapter 29.
G
14.02.2008
Corrected current consumption values and added state-info in chapter 12
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
PR
EL
IM
IN
AR
Y
TERMINAL LAYOUT
Anschlußbelegung
12.2 mm
6.
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
6 of 30
DATE
14.02.2008
Datum
Please refer also to the MC1321x technical data sheet and reference manual, which is given in
[2] and [3] in chapter Related Documents.
Pin
No.
Pin
Name
Pin
Type
Description
1
GND
I/O
Ground
2
PTB0 / AD1P0
I/O
MCU Port B Bit 0 / ATD analog Channel 0
3
PTB1 / AD1P1
I/O
MCU Port B Bit 1 / ATD analog Channel 1
4
PTB2 / AD1P2
I/O
MCU Port B Bit 2 / ATD analog Channel 2
5
PTB7/AD1P7
I/O
MCU Port B Bit 7 / ATD analog Channel 7
6
VREFH
I
MCU high reference voltage for ATD
7
PTA7 / KBI1P7
Dig. I/O
MCU Port A Bit 7 / Keyboard Input Bit 7
8
PTA5 / KBI1P5
Dig. I/O
MCU Port A Bit 5 / Keyboard Input Bit 5
9
GND
I/O
Ground
10
PTA6 / KBI1P6
Dig. I/O
MCU Port A Bit 6 / Keyboard Input Bit 6
11
PTG0 / BKGND / MS
Dig. I/O
MCU Port G Bit 0 / Background / Mode Select
(1)
P
P
(2)
12
PTG1 / XTAL
Dig. I/O / O
MCU Port G Bit 1 / Crystal oscillator output
13
PTG2 / EXTAL
Dig. I/O / I
MCU Port G Bit 2 / Crystal oscillator input
14
CLKO
O
Programmable Clock Output (default: 32,768 kHz)
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
P
P
(2) (3)
P
P
CHECKED
geprüft
(3)
P
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
7 of 30
DATE
14.02.2008
Datum
Pin
Name
Pin
Type
Description
15
PTC0 / TXD2
Dig. I/O
MCU Port C Bit 0 / SCI2 TX data out
16
PTC1 / RXD2
Dig. I/O
MCU Port C Bit 1/ SCI2 RX data in
17
GND
I/O
Ground
18
PTC5
Dig. I/O
MCU Port C Bit 5
19
PTC3 / SCL1
Dig. I/O
MCU Port C Bit 1/ IIC bus clock
20
PTC2 / SDA1
Dig. I/O
MCU Port C Bit 1/ IIC bus clock
21
PTE0 / TXD1
Dig. I/O
MCU Port E Bit 0 / SCI1 TX data out
22
PTE1 / RXD1
Dig. I/O
MCU Port E Bit 1/ SCI1 RX data in
23
VDDA
Power O
Modem analog regulated supply output
24
Vcc
Power I
Modem voltage regulators’ input
25
GND
I/O
Ground
26
Vcc
Power I
Modem voltage regulators’ input
Dig. I/O
MCU reset. Active low
PR
EL
IM
IN
AR
Y
Pin
No.
27
RESET
28
PTD6 / TPM2CH3
Dig. I/O
MCU Port D Bit 6 / TPM2 Channel 3
29
PTD4 / TPM2CH1
Dig. I/O
MCU Port D Bit 4 / TPM2 Channel 1
30
PTD2 / TPM1CH2
Dig. I/O
MCU Port D Bit 2 / TPM1 Channel 2
31
GND
I/O
Ground
32
EXANT
I/O
Pin for external antenna (50 Ω)
Note:
(1) PTG0 is output only. Pin is I/O when used as BDM function.
(2) Full I/O when not used as clock source. Please refer also to [2].
(3) CLKO (Pin 14) and PTG2/EXTAL (Pin 13) must be connected externally if the microcontroller should
use the programmable clock derived from the internal 16 MHz crystal.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
BLOCK DIAGRAM
Blockdiagramm
8.
KEY PARTS LIST
Liste der Schlüsselkomponenten
PR
EL
IM
IN
AR
Y
7.
Part Name
Teilenummer
P.W.Board
Leiterplatte
Casing
Deckel
IC part name
IC Name
9.
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
8 of 30
DATE
14.02.2008
Datum
Material
Material
Glass cloth epoxide resin with gold plating
FR4 mit Goldauflage
Material: BZn15-20, thickness 0.15mm
Material: Weißblech 0,15mm Dicke
MC13213 (freescale www.freescale.com/zigbee)
All information are based on [2] chapter 28
TEST CONDITIONS
Meßbedingungen
Measurements shall be made under room temperature and humidity unless otherwise specified.
Messungen unter normalen Bedingungen, Abweichungen sind gesondert notiert.
Temperature
Temperatur
25 ± 10°C
25 ± 10°C
Humidity
Luftfeuchtigkeit
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
40 to 85%RH
40 to 85%RH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
9 of 30
DATE
14.02.2008
Datum
10. ABSOLUTE MAXIMUM RATINGS
Absolute Grenzwerte
PR
EL
IM
IN
AR
Y
The maximum ratings may not be exceeded under any circumstances, not even momentarily
and individually, as permanent damage to the module will result.
No.
Item
Punkt
Symbol
Zeichen
Absolute Maximum Ratings
Absolute Grenzwerte
Unit
Einheit
1
Supply voltage
V CC
-0.3 to +3.6
Vdc
B
B
2
Ripple on V CC
Vcc rip
3
Digital input voltages
V in
4
Instantaneous maximum current
Single pin limit for all digital I/O
(1)
pins
5
6
B
8
9
10
B
tbd
B
(ripple frequency ≥200kHz)
mVpp
-0.3 to V CC +0.3
Vdc
IBDB
±25
mAdc
Storage temperature range
T stg
-40 to +105
°C
Operating temperature range
T op
-40 to +85
°C
RF Input Power
P max
10
dBm
±2
kV
Please refer to chapter 15.2.
°C
P
7
B
(2)
B
B
B
B
P
ESD on any pin except for pin
32 EXANT.
Human Body Model (HBM)
Lead temperature
Löttemperatur
Moisture Sensitivity Level
B
B
B
B
B
B
V THHBM
B
T Death
B
B
B
MSL
3 (168 hours)
Notes:
(1) Input must be current limited to the value specified
(2) The supply voltage has to be free of ac ripple voltage, as for example from a battery or a low noise
regulator output. For noisy supply voltages provide a decoupling circuit as for example a ferrite in
series connection and a blocking capacitor to ground of at least 47uF directly at the module.
The exact allowed ripple will be published at a later revision.
11. OPERATING CONDITIONS
Betriebsbedingungen
No.
Item
1
Supply voltage
2
RF Input Frequency
3
Return loss of load at pin 32
EXANT
4
Logic Input Voltage Low
5
Logic Input Voltage High
6
SPI clock rate
7
Operating temperature range
Condition / Remark
The typical value
is recommended
Symbol
Value
Min
Typ
Max
V CC
2.0
2.7
3.4
Vdc
f in
2405
2480
MHz
B
B
Receive/Transmit
Mode to 50Ω reference
load
B
B
a
-10
V IL
B
B
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
B
f SPI
B
T op
B
dB
0
B
V IH
The typical value is
recommended
Unit
0.7xV CC
B
B
APPROVED
genehmigt
-
V
V CC
V
8.0
MHz
+85
°C
B
B
B
B
0.3xV CC
8.0
-40
CHECKED
geprüft
B
B
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
10 of 30
DATE
14.02.2008
Datum
12. DC ELECTRICAL CHARACTERISTICS
V CC = 2.7V, T amb = 25°C if nothing else stated
B
B
No.
B
B
Item
(12)
Symbol
Condition / Remark
Value
Typ
Max
36.5
42.5
mA
37
42
mA
0.25
5
µA
I CCH
1.9
17
µA
Standby
I CCD
36
120
µA
(8)
I CCI
1.6
2.7
mA
7
pF
Unit
PR
EL
IM
IN
AR
Y
Min
1
2
Transmit current consumption
Receive current consumption
Transmit Mode
Receive Mode
Off
3
Low power current
consumption
(1)(9)
I CCT
B
(9)
I CCR
B
(2)(5)
B
I leakage
B
(2)(6)(10)
Sleep
B
(2)(3)(7)(10)
Idle
B
B
B
B
B
B
B
4
digital I/O pin characteristics
Please refer to [2] 6.3.1 MCU DC Characteristics
5
digital I/O pin input capacitance
all non-supply pins
6
Low voltage warning/detection
Power on reset re-arm voltage
Please refer to [2] 6.3.1 MCU DC Characteristics
(4)
C In
B
B
Notes:
(1) SPI Register 12 is default value of 0x00BC which sets output power to nominal value
(2) To attain specified low power current, all GPIO and other digital IO must be handled properly.
Detailed description could be found at [2] at section 7.2 Low Power Considerations.
(3) CLKO frequency at default value of 32.786 kHz.
(4) This parameter is characterized and not tested on each device.
(5) Off mode: Stop1 on µC, Modem off [3]. Wakeup by IRQ or Reset
(6) Sleep mode: Stop2 + RTC on µC, Modem Hibernate [3]. Wakeup by IRQ, Reset or Real-TimeInterrupt
(7) Standby mode: Stop3 + RTC on µC, Modem Doze [3]. Wakeup by IRQ, Reset, RTI or Keyboard
Interrupt
(8) Idle mode: µC runs at reduced 2 MHz clock, Modem is in Idle state [3]
(9) µC runs in full speed mode (16 MHz clock)
(10) RTC requires external 32 kHz crystal. Without RTC 300nA less current
(11) µC must run on internal RC oscillator or external 32 kHz crystal, as internal crystal oscillator is off
(12) Max values at +85°C
13. A/D CONVERTER CHARACTERISTICS
No
Item
Remark
1
ATD characteristics
Please refer to [2] 6.3.3 MCU ATD Characteristics
2
ATD timing/performance
characteristics
Please refer to [2] 6.3.3 MCU ATD Characteristics
The A/D high reference voltage VREFH is connected to pin 6 (VREFH)
The A/D low reference voltage VREFL is internally connected to GND.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
11 of 30
DATE
14.02.2008
Datum
14. AC ELECTRICAL CHARACTERISTICS
V CC = 2.7V, T amb = 25°C, 50Ω load at EXANT, for all channels number 11,12,..., 26 according to [1]
B
B
B
B
Receiver
Empfänger
Sensitivity for 1% Packet Error Rate (PER),
-85dBm required by [1]
Limit
Min
Typ
Max
Unit
Einheit
-
-92
-87
dBm
Saturation (maximum input level)
0
10
-
dBm
0
29
-
dB
0
40
-
dB
-
200
kHz
80
ppm
PR
EL
IM
IN
AR
Y
No
Nr
1
2
3
4
Adjacent Channel Interference for 1% PER
(±5MHz; desired signal -82dBm)
Alternate Channel Interference for 1% PER
(±10MHz; desired signal -82dBm)
5
Frequency Error Tolerance
-
6
Symbol Rate Error Tolerance
-
7
In-band Spurious Emission
-
tbd
-
dBm
8
Spurious Emissions 1GHz
-
tbd
-47
dBm
No
Nr
Transmitter
Sender
Limit
Min
Typ
Max
Unit
Einheit
1
Maximum Output Power
-3.0
0.0
-
dBm
2
Nominal Output Power
-
-4.0
-
dBm
3
Minimum Output Power
-
tbd
-
dBm
4
Error Vector Magnitude (EVM)
-
25
35
%
5
Power Control Range
-
30
-
dB
6
Over the Air Data Rate
-
250
-
kbps
harmonic @ maximum output power
-
-50
-30
dBm
harmonic @ maximum output power
-
-60
-30
dBm
7
2
nd
P
P
rd
(1)
P
P
(2)
P
P
8
3
9
Spurious Emissions 1GHz
-
< -40
-30
dBm
No
Nr
Stand By
In Bereitschaft
Limit
Min
Typ
Max
Unit
Einheit
1
Spurious Emissions 1GHz
-
< -50
-47
dBm
P
P
Notes:
(1) SPI Register 12 programmed to 0xFF which sets output power to maximum.
Measured at pin EXANT for the SMD pad version.
(2) SPI Register 12 programmed to 0xBC which sets output power to nominal.
Measured at pin EXANT for the SMD pad version.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
12 of 30
DATE
14.02.2008
Datum
15. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
Temperatur-Zeit Profil für die Reflowlötung
PR
EL
IM
IN
AR
Y
15.1. FOR LEAD SOLDER
10 ±1s
Recommended temp. profile
for reflow soldering
30 +20/-10s
235°C max.
Temp.[°C]
220 ±5°C
200°C
150 ±10°C
90 ±30s
Time [s]
15.2. FOR LEADFREE SOLDER
Our used temp. profile
for reflow soldering
Temp.[°C]
30 +20/-10s
230°C -250°C max.
220°C
150°C – 190°C
90 ±30s
Time [s]
Reflow permissible cycle:
2
Opposite side reflow is prohibited due to module weight.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
13 of 30
DATE
14.02.2008
Datum
16. MODULE DIMENSION
Modulabmessungen
Item
Punkt
Dimension
Abmessung
Tolerance
Toleranz
1
Width
12.20
± 0.20
2
Lenght
16.40
± 0.20
3
Height
2.20
± 0.20
Remark
Bemerkung
PR
EL
IM
IN
AR
Y
No.
With case
17. FOOT PRINT OF THE MODULE
Lötpads vom Modul
24
23
22
21
20
19
18
26
Pad 1 = 4 x 1.0mm x 1.3mm
16
27
Pad 2 = 28 x 0.6mm x 1.3mm
15
28
31
11
32
10
2
3
4
5
6
7
8
9
0.3 mm
1
3.4 mm
12
2.8 mm
30
2.2 mm
13
12.2 mm
Top View
11.9 mm
14
29
Antenna
17
1.6 mm
25
5.1 mm
6.1 mm
6.7 mm
7.3 mm
7.9 mm
16.1 mm
16.4 mm
All dimensions in mm.
The outer dimensions has a tolerance of ± 0.2mm.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
14 of 30
DATE
14.02.2008
Datum
18. LABELING DRAWING
Kennzeichnung des Moduls durch Label
7.5 mm
12.2 mm
PR
EL
IM
IN
AR
Y
This label is suitable for reflow soldering and
designed for the engineering sample status.
Information in the 2D-Barcode are the date code
in the format Year-Month-Day [6 signs], serial
number [6 signs], ordering number [8 signs;
without ENW and F], the identifier for the
hardware release [2 signs, now 01] and the ES,
separated by a semicolon.
ES stands for Engineering Samples, please
refer to chapter General Information.
In mass production status, the ES will be eliminated and replaced by a software identifier.
And will be also implemented at the last information in the 2D-Barcode.
The point on the label is the identifier for pin 1 of the module.
01 is the hardware revision.
19. MECHANICAL REQUIREMENTS
Mechanische Anforderungen
No.
Item
Punkt
1
Solderability
Lötfähigkeit
2
Resistance to
soldering heat
Limit
Grenzwerte
More than 75% of the soldering area shall be
coated by solder
Mehr als 75% der Lötfläche soll mit Lötpaste
bedeckt sein.
It shall be satisfied electrical requirements and
not be mechanical damage
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
Condition
Bedingung
Reflow soldering with
recommendable temperature
profile
Please refer to chapter 15.2.
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
15 of 30
DATE
14.02.2008
Datum
PR
EL
IM
IN
AR
Y
20. RECOMMENDED LAND PATTERN
Empfohlenes Land Pattern
In comparison to the module, we
recommend to use 50µm bigger
pad size to each direction!
24
23
22
21
20
19
18
26
Pad 1 = 4 x 1.1mm x 1.4mm
16
27
Pad 2 = 28 x 0.7mm x 1.4mm
15
28
14
Top View
29
7.0 mm
5.0 mm
Antenna
17
13
30
12
31
11
32
10
1
2
3
4
5
6
7
8
11.7 mm
25
9
5.0 mm
11.1 mm
When using the ceramic antenna,
this minimum area is restriced,
means no ground, no line and in
general no metal, e.g. screws.
Dimensions in mm.
The land pattern dimensions above can serve as a guidance, but this information is given
without any legal responsibility.
For your footprint, we recommend to use 50µm bigger size for the pads at each direction in
comparison to the module footprint, please refer to chapter 17. Foot Print of the Module.
For the solder paste screen please use the same as for the module, but slight different
measures and shapes of the solder paste screen cutouts might be optimum depending on your
soldering process, for example on the chosen solder paste screen thickness. The solder screen
thickness depends on your production standard, we recommend 120µm to 150µm.
IMPORTANT:
The bottom side of PAN4555 is fully coated, nevertheless no copper, such as through hole vias,
planes or tracks on your board component layer should be located below PAN4555 in order to
avoid short cuts. In cases where a track or through hole via has to be located under the module
it has to be kept away from PAN4555 bottom pads. The PN4555 multilayer pcb contains an
inner RF shielding plane, therefore no pcb shielding plane below the module is needed.
When using the antenna pad version and if your application allows, please place the antenna on
the edge of your carrier board.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
16 of 30
DATE
14.02.2008
Datum
PR
EL
IM
IN
AR
Y
If you have any questions on these points, we are open to discuss your individual situation.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
17 of 30
DATE
14.02.2008
Datum
21. DEVELOPMENT OF APPLICATIONS WITH FREESCALE BEESTACK TM
Entwiclung von Applikationen mit Hilfe des BeeStacks von freescale
P
P
This chapter are copied from [8], please refer to this document to get more information.
PR
EL
IM
IN
AR
Y
PAN4555 is built around the MC13213 single package from Freescale Inc. which includes the
freescale ZigBee codebase BeeStack TM (downscaled versions of PAN4555 with MC1321x
suited for IEEE802.15.4 or SMAC only are available on demand as well).
P
P
The access to BeeStackPTMP is provided after registration and login at
http://www.freescale.com/zigbee . After login the BEEKITDOWNLOADPACKAGE.zip can be
downloaded. This package contains BeeStackPTMP , IEEE802.15.4 MAC and SMAC codebases.
For PAN4555 PHY testing using TestToolPTM P the download of the latest 1321xEVK package is
recommended.
After successful installation of Beekit on a PC open BeeKit. A ZigBee sample solution *.bksln
can be created in a few steps.
Important: Before a solution may be exported for PAN4555 the MC1321x target settings have
to be changed via the “User defined target editor”. The required changes are:
• Uncheck the “Use external Antenna Switch”
• Adjust the port settings depending on your application, the PAN4555 datasheet and for use
of the PAN4555 carrier board the pin list in chapter PAN4555 PINLIST at [8].
For importing, compiling and debugging of the BeeKit TM solution the Integrated Development
Environment (IDE) Metrowerks TM CodeWarrior from www.metrowerks.com is required.
P
P
P
P
As device flash programmer the USB HCS08/HCS12 Multilink from www.pemicro.com is
recommended.
Important: PAN4555 is a single RF port design with MC13213, refer also to AN3248.
The Freescale reference boards 13213-NCB and 13213-SRB are dual port designs,
software for these boards will not run.
The shipping of products which use ZigBee TM technology requires a membership of the
ZigBee TM Alliance (www.zigbee.org), at least as an adopter member, and is mandatory for the
ZigBee TM product certification procedure and use of the ZigBee TM Logo.
P
P
P
P
P
P
P
P
The prices and fees as known from today are as follows:
• IDE CodeWarrior order number CWS-H08-C64K-CX from www.metrowerks.com :
US$ 995,-.
• USB HCS08/HCS12 Multilink (www.pemicro.com), orderable at www.freescale.com/zigbee
with the ID USBMULTILINKBDM: US$ 99,• BeeStack TM : The support fee after a 30 days period free of charge required by Freescale
P
P
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
18 of 30
DATE
14.02.2008
Datum
Inc. is US$ 500,-.
• Companies selling products using ZigBee TM technology have to be a member of the
ZigBee TM Alliance ( www.zigbee.org). The minimum fee per year for a membership as
adopter is US$ 3500,-.
• For adopter members the fee for listing the first product at ( www.zigbee.org) is US$ 1000,-.
• The cost of a ZigBee TM product certification at a test house (TÜV Rheinland) ranges from
approximately US$ 4000,- to US$ 8000,-, depending on the implemented software.
P
P
P
H
PR
EL
IM
IN
AR
Y
P
H
P
P
22. RELIABILITY TESTS
Zuverlässigkeitstests
The measurement should be done after exposed to room temperature and humidity for 1hour.
Die Messungen sollten erst nach einer Stunde Lagerung unter normalen Bedingungen erfolgen.
No.
Item
Punkt
Limit
Grenzwerte
Condition
Bedingung
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
Dropped onto hard wood from height of 50cm for
3 times
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
1
Vibration test
Electrical parameter should be
in specification
2
Shock test
the same as the above
3
Heat cycle test
the same as the above
4
Moisture test
the same as the above
+60°C, 90% RH, 300h
5
Low temp. test
the same as the above
-40°C, 300h
6
High temp. test
the same as the above
+85°C, 300h
23. CAUTIONS
Warnungen
Failure to do so may result in degrading of the product’s functions and damage to the product.
23.1. NOTES OF DESIGN
Designhinweise
(1)
(2)
(3)
(4)
Please follow the condition written in this specification, especially the control
signals of this module.
The supply voltage has to be free of ac ripple voltage, as for example from a
battery or a low noise regulator output. For noisy supply voltages provide a
decoupling circuit as for example a ferrite in series connection and a blocking
capacitor to ground of at least 47uF directly at the module.
This product should not be stressed when installed.
Heat is the major cause of shortening the life of these products. Please keep this
product away from heat.
Avoid assembly and use of the target equipment in conditions where the
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
(5)
products' temperature may exceed the maximum allowable.
The supply voltage should not be exceeding or reverse, and should not carry
noise and spike.
Please keep this product away from other high frequency circuits.
PR
EL
IM
IN
AR
Y
(6)
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
19 of 30
DATE
14.02.2008
Datum
23.2. NOTES OF INSTALLATION
Verarbeitungshinweise
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
Reflow soldering is possible for twice on the condition in chapter 15.
Please set up the temperature at the soldering portion of this product according
to this reflow profile.
Carefully position the products so that their heat will not burn into printed circuit
boards or affect the other components that are susceptible to heat.
Carefully locate these products so that their temperatures will not increase due
to the effects of heat generated by neighboring components.
If a vinyl-covered wire comes into contact with the products, then the cover will
melt and generate toxic gas, damaging the insulation. Never allow contact
between the cover and these products to occur.
This product should not be stressed or vibrated when reflowed.
Please keep the following conditions when you install this product for reparation
by hand soldering.
Please do not wash this product.
Please refer to the recommended pattern when designing a board.
Pressing on parts of the metal cover or fastening objects to the metal cover is
not allowed.
23.3. NOTES OF USAGE CONDITIONS
Benutzerhinweise
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Please take measure against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied
to the products, then before use, check and evaluate their operation when
assembled on your products.
Please do not use the fallen product.
Please do not put on damage and dirt to the pin , and don't touch the electric
components.
Please follow the condition written in the ratings , about the power supply
instruments applied to this product.
Electrode peeling strength: Do not add pressure of more than 4.9N when
soldered on PCB
Pressing on parts of the metal cover or fastening objects to the metal cover is
not allowed.
These products are intended for general purpose and standard use in general
electronic equipment, such as home appliances, office equipment, information
and communication equipment.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
20 of 30
DATE
14.02.2008
Datum
23.4. NOTES OF STORAGE
Lagerhinweise
The module may not be stressed mechanically during storage.
Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely
affected:
• Storage in salty air or in an environment with a high concentration of corrosive
gas, such as Cl2, H2S, NH3, SO2, or NOX
• Storage in direct sunlight
• Storage in an environment where the temperature may be outside the range of
5°C to 35°C range, or where the humidity may be outside the 45 to 85% range.
• Storage of the products for more than one year after the date of delivery at your
company if all the above conditions (1) to (3) have been avoided
Storage period: Please check the adhesive strength of the embossed tape and
soldering after 6 months of storage.
Please keep this product away from water, poisonous gas and corrosive gas.
This product should not be stressed or shocked when transported.
Please follow the specification when piling up the packed crate ( max. 10).
PR
EL
IM
IN
AR
Y
(1)
(2)
(3)
(4)
(5)
(6)
23.5. CAUTIONS FOR SAFETY
Sicherheitshinweise
These specifications are intended to preserve the quality assurance of products as
individual components.
Before use, check and evaluate their operation when mounted on your products. Abide by
these specifications, without deviation when using the products.These products may shortcircuit. If electrical shocks, smoke, fire, and/or accidents involving human life are
anticipated when a short circuit occurs, then at least, provide the following failsafe
functions, as a minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a
protection device.
(2) Ensure the safety of the whole system by installing a redundant circuit or
another system to prevent a single fault causing an unsafe status.
23.6. OTHER CAUTIONS
Weitere Hinweise
(1)
(2)
(3)
(4)
(5)
This specification sheet is copyrighted. Please do not open it to the third party.
Please do not use this product of our company for another purpose.
Be sure to provide an appropriate fail-safe function on your product to prevent a
second damage that may be caused by the abnormal function or the failure of
our product.
This product has not been manufactured with any ozone chemical controlled
under the Montreal Protocol.
These products are not intended for other uses, other than under the special
conditions shown below. Before using these products under such special
conditions, check their performance and reliability under the said special
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
21 of 30
DATE
14.02.2008
Datum
PR
EL
IM
IN
AR
Y
conditions carefully to determine whether or not they can be used in such a
manner.
• In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places
where liquid may splash.
• In direct sunlight, outdoors, or in a dusty environment
• In an environment where condensation occurs.
• In an environment with a high concentration of harmful gas (e.g. salty air,
HCl, Cl2, SO2, H2S, NH3, and NOX)
If an abnormal voltage is applied due to a problem occurring in other
components or circuits, replace these products with new products because they
may not be able to provide normal performance even if their electronic
characteristics and appearances appear satisfactory.
When you have any question or uncertainty , both of you and Panasonic
sincerely cope with it.
(6)
(7)
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
22 of 30
DATE
14.02.2008
Datum
24. PACKAGING
Verpackung
P2
2.0 0.1(I)
Do
1.55 0.05
T
0.30 0.05
Po
4.0 0.1(II)
Y
E1
1.75 0.1
PR
EL
IM
IN
AR
Y
24.1. TAPE DIMENSION
W
REF
8.8
Bo
F(III)
D1
1.5MIN
X
R0.5
TYPICAL
REF
8.0
Y
K1
Ko
P1
REF
1.9
X
Ao
SECTION Y-Y
Ao
Bo
Ko
K1
F
12.60
16.80
+/- 0.1
+/- 0.1
3.40
2.60
11.50
+/- 0.1
+/- 0.1
+/- 0.1
P1
W
20.00
24.00
+/- 0.1
+/- 0.3
(I)
(II)
SECTION X-X
Forming format : Flatbed
Estimated max. length : 60
(III)
(IV)
meter/22B3 reel
Measured from centreline of sprocket hole
to centreline of pocket.
Cumulative tolerance of 10 sprocket
holes is± 0.20 .
Measured from centreline of sprocket
hole to centreline of pocket.
Other material available.
ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED.
This package will be available latest as the mass production status are confirmed.
24.2. PACKING IN TAPE
Empty hollow in component packed area shall be less than two per reel and those hollows
shall not be consecutive.
Top cover tape shall not be found on reel holes and shall not stick out from reel.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
23 of 30
DATE
14.02.2008
Datum
PR
EL
IM
IN
AR
Y
24.3. COMPONENT DIRECTION
Komponentenanordnung
Please refer also to chapter 18. Labeling Drawing
This package will be available latest as the mass production status are confirmed.
24.4. REEL DIMENSION
TAPE SIZE
A
MAX
B
MIN
24mm
330.0
1.5
C
13 +0.5
-0.2
D
MIN
±1.0
N
20.2
100.0
W1
25.0 +2.0
-0.0
W2
MAX
W3
24.4 +3.0
30.4
All dimensions in millimeters unless otherwise stated
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
-0.5
Assembly
Method
*Latch
*Latch (2PC)
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
24 of 30
DATE
14.02.2008
Datum
42,30mm
PR
EL
IM
IN
AR
Y
24.5. LABEL FOR PACKAGE
(P)P/N
PAN4555
(1P)PO No.
ENWC9A08A3EF
Descr iption
ES Sample
ES Status
(Q)QT Y
500
(D)DAT E CO DE
7419
MSL tbd
Tmax tbd
[[G]]
MADE IN
GERMANY
The label must be stick 3 times, reel, barrier bag and inner carton box.
24.6. TOTAL PACKING HANDLING
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
25 of 30
DATE
14.02.2008
Datum
24.7. COVER TAPE REEL STRENGTH
PR
EL
IM
IN
AR
Y
Force direction
θ = 10deg
Speed = 300mm/min.
Cover tape reel strength
=0.098~0.68N (10~70g)
25. ORDERING INFORMATION
Bestellinformationen
Ordering part number
ENWCZA08A3EF
(2)
P
(2)
ENWCZA09N4EF
ENWC9A08A3EF
ENWC9A09N4EF
P
P
P
(3)
P
P
(3)
P
P
Description
MOQ
Engineering Sample ZigBee ready
PAN4555, 2.4GHz ZigBee ready with Ceramic Antenna
60kBit Flash Memory
Engineering Sample ZigBee ready
PAN4555, 2.4GHz ZigBee ready with RF out on a SMD pad
60kBit Flash Memory
Mass Production Sample ZigBee ready
PAN4555, 2.4GHz ZigBee ready with Ceramic Antenna
60kBit Flash Memory
Mass Production Sample ZigBee ready
PAN4555, 2.4GHz ZigBee ready with RF out on a SMD pad
60kBit Flash Memory
(1)
P
P
1
1
500
500
(4)
P
P
(4)
P
P
Note:
(1)
(2)
(3)
(4)
Minimum order quantity.
The “Z” in the ordering part number, refers to the engineering sample status. After mass production
the “Z” will be changed to the “9”.
Could only be ordered, if we released the mass production status.
If we finishing, this document will change from PRELIMINARY to RELEASE also the revision status
will move from alphabetic numbering to 1.0.
On special agreement we can also deliver in lower quantity!
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
26 of 30
DATE
14.02.2008
Datum
26. ROHS DECLARATION
RoHS-Erklärung
Declaration of environmental compatibility for supplied products:
PR
EL
IM
IN
AR
Y
Hereby we declare to our best present knowledge based on declaration of our suppliers that this
product do not contain by now the following substances which are banned by Directive
2002/95/EC (RoHS) or if contain a maximum concentration of 0,1% by weight in homogeneous
materials for
•
•
•
•
•
Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0,01% by weight in homogeneous materials for
•
Cadmium and cadmium compounds
27. DATA SHEET STATUS
Datenblatt Status
This data sheet contains data from the PRELIMINARY specification. Supplementary data will be
published at a later date. Panasonic Electronic Devices Europe GmbH reserves the right to
change the specification without notice, in order to improve the design and supply the best
possible product.
Please consult the most recently issued data sheet before initiating or completing a design.
If there is an update, please download under: PAN4555 Latest Data Sheet!
28. REGULATORY INFORMATION
28.1. FCC NOTICE
The device PAN4555, including the ceramic antenna (ENWC9A08A3EF) and also the SMD
type (ENWC9A09N4EF), including with the antennas, which are listed in 28.5, complies
with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter
approval as detailed in FCC public Notice DA00-1407.transmitter
Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) This device must accept any interference received, including
interference that may cause undesired operation.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
27 of 30
DATE
14.02.2008
Datum
28.2. CAUTION
PR
EL
IM
IN
AR
Y
The FCC requires the user to be notified that any changes or modifications made to this
device that are not expressly approved by Panasonic Electronic Devices Europe GmbH
may void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help
28.3. LABELING REQUIREMENTS
The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements
are met. This includes a clearly visible label on the outside of the OEM enclosure
specifying the appropriate Panasonic FCC identifier for this product as well as the FCC
Notice above. The FCC identifier are FCC ID: T7VPAN4555. This FCC identifier is valid for
both versions, for details, please see the chapter 25. Ordering Information.
Due to the size limitation, the EUT could not be labelled with the FCC ID: T7VPAN4555.
However the FCC ID can be read from the UART of the device with the
AT command “FCC ID ?” and the module will answer with FCC ID: T7VPAN4555.
In any case end product must be labelled exterior with "Contains FCC ID: T7VPAN4555"
28.4. ANTENNA WARNING
The related part number for this device is ENWC9A09N4EF (PAN4555 with SMD pad). For
details, please see the chapter 25. Ordering Information. This device are tested with a
standard SMA connector and with the antennas listed below. When integrated in the OEMs
product, these fixed antennas require installation preventing end-users from replacing them
with non-approved antennas. Any antenna not in the following table must be tested to
comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for
emissions. The FCC identifier for this device with the antenna listed in item 1 are the same
(FCC ID: T7VPAN4555).
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
28 of 30
DATE
14.02.2008
Datum
28.5. APPROVED ANTENNA LIST
Note: We are able to qualify your antenna and will add to this list as that process is completed.
Part Number
Manufacturer
Frequency Band
Type
Gain (dBi)
1
BKR2400
Embedded Antenna Design Ltd.
2.4GHz
½ Wave Dipole
+2
PR
EL
IM
IN
AR
Y
Item
2
28.6. RF EXPOSURE PAN4555
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer
(OEM) must ensure that the approved antenna in the previous table must be installed.
The preceding statement must be included as a CAUTION statement in manuals for
products operating with the approved antennas in the previous table to alert users on FCC
RF Exposure compliance.
Any notification to the end user of installation or removal instructions about the integrated
radio module is not allowed.
The radiated output power of PAN4555 with mounted ceramic antenna
(FCC ID: T7VPAN4555) is far below the FCC radio frequency exposure limits.
Nevertheless, the PAN4555 shall be used in such a manner that the potential for human
contact during normal operation is minimized.
End users may not be provided with the module installation instructions. OEM integrators
and end users must be provided with transmitter operating conditions for satisfying RF
exposure compliance.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
29 of 30
DATE
14.02.2008
Datum
29. RELATED DOCUMENTS
Mitgeltende Dokumente
For an update, please search in the suitable homepage.
PR
EL
IM
IN
AR
Y
[1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical Layer
(PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[2] Technical Data MC1321x Document Number: MC1321x
Rev. 1.1, 03/2007 Freescale Semiconductor
[3] MC1321x Reference Manual Document Number: MC1321xRM
Rev. 1.1, 10/2006 Freescale Semiconductor
[4] Handling MAC Address erasure, AN2825, Rev. 0.0 10/2004, Freescale Semiconductor
[5] 802154MPSUG 802.15.4 MAC/PHY Software User´s Guide, Rev 1.1, Freescale
Semiconductor
[6] 802154EBRM.pdf 802.15.4 / ZigBee Embedded Bootloader Reference Manual Rev. 0.0
09/2004
[7] AN2771 ZigBee/802.15.4 PHY Protocol Test Client (PTC) Rev. 0.0 Freescale Semiconductor
[8] Manual to the Evaluation Kit from Panasonic
Downloadable under: www.pedeu.panasonic.de.
[9] Manual to the E-Senza SN55 Programmer Interface Manual
Downloadable under: www.pedeu.panasonic.de.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4555
ENWC9A0xxxEF
No.
REV.
DS-4555-2400-102
G
PAGE
Seite
30 of 30
DATE
14.02.2008
Datum
30. GENERAL INFORMATION
Allgemeine Informationen
PR
EL
IM
IN
AR
Y
© Panasonic Electronic Devices Europe GmbH 2007.
All rights reserved.
This product description does not lodge the claim to be complete and free of mistakes.
Please contact the related product manager in every case.
If we deliver samples to the customer, these samples have the status Engineering Samples.
This means, the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and there may be differences to be published Data Sheet.
Engineering Samples are not qualified and are not to be used for reliability testing or series
production.
Disclaimer:
Customer acknowledges that samples may deviate from the Data Sheet and may bear defects
due to their status of development and the lack of qualification mentioned above.
Panasonic Electronic Devices Europe GmbH rejects any liability or product warranty for
Engineering Samples. In particular, Panasonic Electronic Devices Europe GmbH disclaims
liability for damages caused by
• the use of the Engineering Sample other than for Evaluation Purposes, particularly the
installation or integration in an other product to be sold by Customer,
• deviation or lapse in function of Engineering Sample,
• improper use of Engineering Samples.
Panasonic Electronic Devices Europe GmbH disclaimes any liability for consequential and
incidental damages. In case of any questions, please contact your local sales partner or the
related product manager.
U
31. LIFE SUPPORT POLICY
Politik für Lebenserhaltungssysteme
This Panasonic Electronic Devices Europe GmbH product is not designed for use in life
support appliances, devices, or systems where malfunction can reasonably be expected to
result in a significant personal injury to the user, or as a critical component in any life support
device or system whose failure to perform can be reasonably expected to cause the failure of
the life support device or system, or to affect its safety or effectiveness. Customers using or
selling these products for use in such applications do so at their own risk and agree to fully
indemnify Panasonic Electronic Devices Europe GmbH for any damages resulting.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt