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ENW-C9A08A3EF

ENW-C9A08A3EF

  • 厂商:

    NAIS(松下)

  • 封装:

    PCB Module

  • 描述:

    RF TXRX MODULE 802.15.4 CHIP ANT

  • 数据手册
  • 价格&库存
ENW-C9A08A3EF 数据手册
CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 1 of 30 DATE 14.02.2008 Datum PR EL IM IN AR Y Specification for Production Applicant / Manufacturer Hardware Panasonic Electronic Devices Europe GmbH Zeppelinstrasse 19 21337 Lüneburg Germany Applicant / Manufacturer Software Software Version E-Senza Technologies GmbH Blarerstrasse 56 78462 Konstanz Germany SN55 R3_1_1 from 08.01.2008 Contents Approval for Mass Production Customer By signing this document, Customer accepts the validity of the below-mentioned contents and declares his full notice to it. Some passages may be changed if required; the validity shall not be affected thereby. CHECKED / APPROVED: DATE: NAME: SIGNATURE: NOTE: AT LEAST ONE SET OF APPROVED SPECIFICATIONS SHOULD BE RETURNED TO THE ADDRESS OF THE ISSUING PARTY. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 2 of 30 DATE 14.02.2008 Datum TABLE OF CONTENTS Key Features ................................................................................................................ 4 Applications for the Module........................................................................................... 4 Description of the Module ............................................................................................. 5 Scope of this Document................................................................................................ 5 History for this Document ............................................................................................. 5 Terminal Layout............................................................................................................ 6 Block Diagram .............................................................................................................. 8 Key Parts List ............................................................................................................... 8 Test Conditions............................................................................................................. 8 Absolute Maximum Ratings .......................................................................................... 9 Operating Conditions .................................................................................................... 9 DC Electrical Characteristics ...................................................................................... 10 A/D converter Characteristics ..................................................................................... 10 AC Electrical Characteristics....................................................................................... 11 Soldering Temperature-Time Profile (for reflow soldering) .......................................... 12 15.1. For lead solder .................................................................................................. 12 15.2. For leadfree solder ............................................................................................ 12 Module Dimension...................................................................................................... 13 Foot Print of the Module ............................................................................................. 13 Labeling Drawing........................................................................................................ 14 Mechanical Requirements .......................................................................................... 14 Recommended Land Pattern ...................................................................................... 15 Development of Applications with freescale BeeStackPTMP ......................................... 17 Reliability Tests .......................................................................................................... 18 Cautions ..................................................................................................................... 18 23.1. Notes of design ................................................................................................. 18 23.2. Notes of installation ........................................................................................... 19 23.3. Notes of usage conditions ................................................................................. 19 23.4. Notes of storage ................................................................................................ 20 23.5. Cautions for safety............................................................................................. 20 23.6. Other cautions ................................................................................................... 20 Packaging................................................................................................................... 22 24.1. Tape Dimension ................................................................................................ 22 24.2. Packing in Tape................................................................................................. 22 24.3. Component direction ......................................................................................... 23 24.4. Reel Dimension ................................................................................................. 23 24.5. Label for Package.............................................................................................. 24 24.6. Total Packing Handling...................................................................................... 24 PR EL IM IN AR Y 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF 24.7. Cover tape reel strength .................................................................................... 25 Ordering Information................................................................................................... 25 RoHS Declaration....................................................................................................... 26 Data Sheet Status ...................................................................................................... 26 Regulatory Information ............................................................................................... 26 28.1. FCC Notice........................................................................................................ 26 28.2. Caution.............................................................................................................. 27 28.3. Labeling Requirements...................................................................................... 27 28.4. Antenna Warning............................................................................................... 27 28.5. Approved Antenna List ...................................................................................... 28 28.6. RF Exposure PAN4555 ..................................................................................... 28 Related Documents .................................................................................................... 29 General Information.................................................................................................... 30 Life Support Policy...................................................................................................... 30 PR EL IM IN AR Y 25. 26. 27. 28. No. REV. DS-4555-2400-102 G PAGE Seite 3 of 30 DATE 14.02.2008 Datum 29. 30. 31. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF 1. KEY FEATURES Schlüsseleigenschaften Short range 2,4GHz ISM band transceiver with microcontroller and reference oscillator Provides complete hardware for a wireless node using IEEE802.15.4 packet structure Very small size (12.2mm x 16.4mm x 2.2mm) 2 antenna options: Single port 50Ω or ceramic antenna 16 selectable Channels with 250 kbps in the 2.4 GHz band Low power modes for increased battery life High sensitivity of -92 dBm typ. at 1% Packet Error Rate 0 dBm typ. output power programmable over a 30 dB range Low supply voltage (2.0 V to 3.4 V, 2.7 V typ.) Operating temperature range -40°C to +85°C Link Quality and Clear Channel Assessment capability 60k Flash and 4k RAM memory 4 channel A/D converter with 10 Bit for fast and easy conversion from analog inputs -such as temperature, pressure and fluid levels- to digital values. 3 channel 16 Bit timer/pulse width modulation (TPM) outputs BDM port for direct download programming In total 20 digital I/O lines with programmable pull-ups and few with high-current driver. Low power modes for increased battery life Low battery warning Low voltage detect/reset Complies with ETSI EN300328 and FCC Part 15C PR EL IM IN AR Y • • • • • • • • • • • • • • • • • • • • 2. No. REV. DS-4555-2400-102 G PAGE Seite 4 of 30 DATE 14.02.2008 Datum APPLICATIONS FOR THE MODULE Anwendungen für das Modul • ZigBee TM FFD (full functional) and RFD (reduced functional) devices working in star and mesh networks • Wireless sensor and actuator networks • Remote control and wire replacement in industrial systems • Factory and home automation and control • Inventory and logistics management • HID (Human Interface Devices) • Toys • Home gateways • proprietary networking solutions using IEEE802.15.4 P P HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF 3. No. REV. DS-4555-2400-102 G PAGE Seite 5 of 30 DATE 14.02.2008 Datum DESCRIPTION OF THE MODULE Beschreibung des Moduls PR EL IM IN AR Y The PAN4555 module is a short range, low power, 2.4 GHz ISM band transceiver which includes a complete 802.15.4 physical layer (PHY) modem, designed for the IEEE 802.15.4 wireless standard and a appropriate microcontroller (MCU) with reference oscillator which provides a cost effective solution for short-range data links and networks. The main purpose of PAN4555 are ZigBee TM (www.zigbee.org ) applications based on “BeeStack” of Freescale Inc.. For details on ZigBee TM application software see chapter 21. P P UTH P P Proprietary networking solutions on top of the IEEE802.15.4 MAC/PHY software package (available at www.freescale.com/zigbee ) could be implemented instead of ZigBee TM as well. H P P As Integrated Development Environment (IDE) the Metrowerks TM CodeWarrior IDE from www.metrowerks.com is required. For device flash programming via the BDM port of PAN4555 the USB HCS08/HCS12 Multilink from www.pemicro.com is recommended. P H 4. P SCOPE OF THIS DOCUMENT Umfang dieses Dokumentes This product specification applies to the ZigBee ready modem ENWC9A0xxxE. The xxx is the indicator for different versions (refer to chapter 25 Ordering Information). The used ZigBee chip is the MC13213 from the US company freescale www.freescale.com/zigbee. Diese Produktionsunterlagen beziehen sich auf das ZigBee ready Modem ENWC9A0xxxE Die Zeichen xxx bezeichnen verschiedene Versionen (Erklärung im Kapitel 25 Ordering Information). Der verwendete ZigBee Chip ist der MC13213 der US Firma Freescale. 5. HISTORY FOR THIS DOCUMENT Versionsverwaltung dieses Dokumentes Revision Version Date Datum Modification / Remarks Änderungen / Bemerkungen A 26.04.2007 Initial draft version B 08.06.2007 Corrected pin14 in chapter Terminal Layout and revised chapter Block Diagram. C 28.06.2007 Change IC name from MC13214 to MC13213 in chapter 21. D 11.07.2007 Support fee reduced to $500 in chapter 21. Change MOQ from 1500pcs to 500pcs. Add special note (2) for the ripple on supply voltage. E 20.08.2007 Add chapter Regulatory Information and add [9] in chapter 29. F 16.01.2008 Updated software supplier on the front page and add E-Senza Manual as a link under [9] in chapter 29. G 14.02.2008 Corrected current consumption values and added state-info in chapter 12 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF PR EL IM IN AR Y TERMINAL LAYOUT Anschlußbelegung 12.2 mm 6. No. REV. DS-4555-2400-102 G PAGE Seite 6 of 30 DATE 14.02.2008 Datum Please refer also to the MC1321x technical data sheet and reference manual, which is given in [2] and [3] in chapter Related Documents. Pin No. Pin Name Pin Type Description 1 GND I/O Ground 2 PTB0 / AD1P0 I/O MCU Port B Bit 0 / ATD analog Channel 0 3 PTB1 / AD1P1 I/O MCU Port B Bit 1 / ATD analog Channel 1 4 PTB2 / AD1P2 I/O MCU Port B Bit 2 / ATD analog Channel 2 5 PTB7/AD1P7 I/O MCU Port B Bit 7 / ATD analog Channel 7 6 VREFH I MCU high reference voltage for ATD 7 PTA7 / KBI1P7 Dig. I/O MCU Port A Bit 7 / Keyboard Input Bit 7 8 PTA5 / KBI1P5 Dig. I/O MCU Port A Bit 5 / Keyboard Input Bit 5 9 GND I/O Ground 10 PTA6 / KBI1P6 Dig. I/O MCU Port A Bit 6 / Keyboard Input Bit 6 11 PTG0 / BKGND / MS Dig. I/O MCU Port G Bit 0 / Background / Mode Select (1) P P (2) 12 PTG1 / XTAL Dig. I/O / O MCU Port G Bit 1 / Crystal oscillator output 13 PTG2 / EXTAL Dig. I/O / I MCU Port G Bit 2 / Crystal oscillator input 14 CLKO O Programmable Clock Output (default: 32,768 kHz) HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt P P (2) (3) P P CHECKED geprüft (3) P DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 7 of 30 DATE 14.02.2008 Datum Pin Name Pin Type Description 15 PTC0 / TXD2 Dig. I/O MCU Port C Bit 0 / SCI2 TX data out 16 PTC1 / RXD2 Dig. I/O MCU Port C Bit 1/ SCI2 RX data in 17 GND I/O Ground 18 PTC5 Dig. I/O MCU Port C Bit 5 19 PTC3 / SCL1 Dig. I/O MCU Port C Bit 1/ IIC bus clock 20 PTC2 / SDA1 Dig. I/O MCU Port C Bit 1/ IIC bus clock 21 PTE0 / TXD1 Dig. I/O MCU Port E Bit 0 / SCI1 TX data out 22 PTE1 / RXD1 Dig. I/O MCU Port E Bit 1/ SCI1 RX data in 23 VDDA Power O Modem analog regulated supply output 24 Vcc Power I Modem voltage regulators’ input 25 GND I/O Ground 26 Vcc Power I Modem voltage regulators’ input Dig. I/O MCU reset. Active low PR EL IM IN AR Y Pin No. 27 RESET 28 PTD6 / TPM2CH3 Dig. I/O MCU Port D Bit 6 / TPM2 Channel 3 29 PTD4 / TPM2CH1 Dig. I/O MCU Port D Bit 4 / TPM2 Channel 1 30 PTD2 / TPM1CH2 Dig. I/O MCU Port D Bit 2 / TPM1 Channel 2 31 GND I/O Ground 32 EXANT I/O Pin for external antenna (50 Ω) Note: (1) PTG0 is output only. Pin is I/O when used as BDM function. (2) Full I/O when not used as clock source. Please refer also to [2]. (3) CLKO (Pin 14) and PTG2/EXTAL (Pin 13) must be connected externally if the microcontroller should use the programmable clock derived from the internal 16 MHz crystal. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF BLOCK DIAGRAM Blockdiagramm 8. KEY PARTS LIST Liste der Schlüsselkomponenten PR EL IM IN AR Y 7. Part Name Teilenummer P.W.Board Leiterplatte Casing Deckel IC part name IC Name 9. No. REV. DS-4555-2400-102 G PAGE Seite 8 of 30 DATE 14.02.2008 Datum Material Material Glass cloth epoxide resin with gold plating FR4 mit Goldauflage Material: BZn15-20, thickness 0.15mm Material: Weißblech 0,15mm Dicke MC13213 (freescale www.freescale.com/zigbee) All information are based on [2] chapter 28 TEST CONDITIONS Meßbedingungen Measurements shall be made under room temperature and humidity unless otherwise specified. Messungen unter normalen Bedingungen, Abweichungen sind gesondert notiert. Temperature Temperatur 25 ± 10°C 25 ± 10°C Humidity Luftfeuchtigkeit HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH 40 to 85%RH 40 to 85%RH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 9 of 30 DATE 14.02.2008 Datum 10. ABSOLUTE MAXIMUM RATINGS Absolute Grenzwerte PR EL IM IN AR Y The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the module will result. No. Item Punkt Symbol Zeichen Absolute Maximum Ratings Absolute Grenzwerte Unit Einheit 1 Supply voltage V CC -0.3 to +3.6 Vdc B B 2 Ripple on V CC Vcc rip 3 Digital input voltages V in 4 Instantaneous maximum current Single pin limit for all digital I/O (1) pins 5 6 B 8 9 10 B tbd B (ripple frequency ≥200kHz) mVpp -0.3 to V CC +0.3 Vdc IBDB ±25 mAdc Storage temperature range T stg -40 to +105 °C Operating temperature range T op -40 to +85 °C RF Input Power P max 10 dBm ±2 kV Please refer to chapter 15.2. °C P 7 B (2) B B B B P ESD on any pin except for pin 32 EXANT. Human Body Model (HBM) Lead temperature Löttemperatur Moisture Sensitivity Level B B B B B B V THHBM B T Death B B B MSL 3 (168 hours) Notes: (1) Input must be current limited to the value specified (2) The supply voltage has to be free of ac ripple voltage, as for example from a battery or a low noise regulator output. For noisy supply voltages provide a decoupling circuit as for example a ferrite in series connection and a blocking capacitor to ground of at least 47uF directly at the module. The exact allowed ripple will be published at a later revision. 11. OPERATING CONDITIONS Betriebsbedingungen No. Item 1 Supply voltage 2 RF Input Frequency 3 Return loss of load at pin 32 EXANT 4 Logic Input Voltage Low 5 Logic Input Voltage High 6 SPI clock rate 7 Operating temperature range Condition / Remark The typical value is recommended Symbol Value Min Typ Max V CC 2.0 2.7 3.4 Vdc f in 2405 2480 MHz B B Receive/Transmit Mode to 50Ω reference load B B a -10 V IL B B HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH B f SPI B T op B dB 0 B V IH The typical value is recommended Unit 0.7xV CC B B APPROVED genehmigt - V V CC V 8.0 MHz +85 °C B B B B 0.3xV CC 8.0 -40 CHECKED geprüft B B DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 10 of 30 DATE 14.02.2008 Datum 12. DC ELECTRICAL CHARACTERISTICS V CC = 2.7V, T amb = 25°C if nothing else stated B B No. B B Item (12) Symbol Condition / Remark Value Typ Max 36.5 42.5 mA 37 42 mA 0.25 5 µA I CCH 1.9 17 µA Standby I CCD 36 120 µA (8) I CCI 1.6 2.7 mA 7 pF Unit PR EL IM IN AR Y Min 1 2 Transmit current consumption Receive current consumption Transmit Mode Receive Mode Off 3 Low power current consumption (1)(9) I CCT B (9) I CCR B (2)(5) B I leakage B (2)(6)(10) Sleep B (2)(3)(7)(10) Idle B B B B B B B 4 digital I/O pin characteristics Please refer to [2] 6.3.1 MCU DC Characteristics 5 digital I/O pin input capacitance all non-supply pins 6 Low voltage warning/detection Power on reset re-arm voltage Please refer to [2] 6.3.1 MCU DC Characteristics (4) C In B B Notes: (1) SPI Register 12 is default value of 0x00BC which sets output power to nominal value (2) To attain specified low power current, all GPIO and other digital IO must be handled properly. Detailed description could be found at [2] at section 7.2 Low Power Considerations. (3) CLKO frequency at default value of 32.786 kHz. (4) This parameter is characterized and not tested on each device. (5) Off mode: Stop1 on µC, Modem off [3]. Wakeup by IRQ or Reset (6) Sleep mode: Stop2 + RTC on µC, Modem Hibernate [3]. Wakeup by IRQ, Reset or Real-TimeInterrupt (7) Standby mode: Stop3 + RTC on µC, Modem Doze [3]. Wakeup by IRQ, Reset, RTI or Keyboard Interrupt (8) Idle mode: µC runs at reduced 2 MHz clock, Modem is in Idle state [3] (9) µC runs in full speed mode (16 MHz clock) (10) RTC requires external 32 kHz crystal. Without RTC 300nA less current (11) µC must run on internal RC oscillator or external 32 kHz crystal, as internal crystal oscillator is off (12) Max values at +85°C 13. A/D CONVERTER CHARACTERISTICS No Item Remark 1 ATD characteristics Please refer to [2] 6.3.3 MCU ATD Characteristics 2 ATD timing/performance characteristics Please refer to [2] 6.3.3 MCU ATD Characteristics The A/D high reference voltage VREFH is connected to pin 6 (VREFH) The A/D low reference voltage VREFL is internally connected to GND. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 11 of 30 DATE 14.02.2008 Datum 14. AC ELECTRICAL CHARACTERISTICS V CC = 2.7V, T amb = 25°C, 50Ω load at EXANT, for all channels number 11,12,..., 26 according to [1] B B B B Receiver Empfänger Sensitivity for 1% Packet Error Rate (PER), -85dBm required by [1] Limit Min Typ Max Unit Einheit - -92 -87 dBm Saturation (maximum input level) 0 10 - dBm 0 29 - dB 0 40 - dB - 200 kHz 80 ppm PR EL IM IN AR Y No Nr 1 2 3 4 Adjacent Channel Interference for 1% PER (±5MHz; desired signal -82dBm) Alternate Channel Interference for 1% PER (±10MHz; desired signal -82dBm) 5 Frequency Error Tolerance - 6 Symbol Rate Error Tolerance - 7 In-band Spurious Emission - tbd - dBm 8 Spurious Emissions 1GHz - tbd -47 dBm No Nr Transmitter Sender Limit Min Typ Max Unit Einheit 1 Maximum Output Power -3.0 0.0 - dBm 2 Nominal Output Power - -4.0 - dBm 3 Minimum Output Power - tbd - dBm 4 Error Vector Magnitude (EVM) - 25 35 % 5 Power Control Range - 30 - dB 6 Over the Air Data Rate - 250 - kbps harmonic @ maximum output power - -50 -30 dBm harmonic @ maximum output power - -60 -30 dBm 7 2 nd P P rd (1) P P (2) P P 8 3 9 Spurious Emissions 1GHz - < -40 -30 dBm No Nr Stand By In Bereitschaft Limit Min Typ Max Unit Einheit 1 Spurious Emissions 1GHz - < -50 -47 dBm P P Notes: (1) SPI Register 12 programmed to 0xFF which sets output power to maximum. Measured at pin EXANT for the SMD pad version. (2) SPI Register 12 programmed to 0xBC which sets output power to nominal. Measured at pin EXANT for the SMD pad version. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 12 of 30 DATE 14.02.2008 Datum 15. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING) Temperatur-Zeit Profil für die Reflowlötung PR EL IM IN AR Y 15.1. FOR LEAD SOLDER 10 ±1s Recommended temp. profile for reflow soldering 30 +20/-10s 235°C max. Temp.[°C] 220 ±5°C 200°C 150 ±10°C 90 ±30s Time [s] 15.2. FOR LEADFREE SOLDER Our used temp. profile for reflow soldering Temp.[°C] 30 +20/-10s 230°C -250°C max. 220°C 150°C – 190°C 90 ±30s Time [s] Reflow permissible cycle: 2 Opposite side reflow is prohibited due to module weight. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 13 of 30 DATE 14.02.2008 Datum 16. MODULE DIMENSION Modulabmessungen Item Punkt Dimension Abmessung Tolerance Toleranz 1 Width 12.20 ± 0.20 2 Lenght 16.40 ± 0.20 3 Height 2.20 ± 0.20 Remark Bemerkung PR EL IM IN AR Y No. With case 17. FOOT PRINT OF THE MODULE Lötpads vom Modul 24 23 22 21 20 19 18 26 Pad 1 = 4 x 1.0mm x 1.3mm 16 27 Pad 2 = 28 x 0.6mm x 1.3mm 15 28 31 11 32 10 2 3 4 5 6 7 8 9 0.3 mm 1 3.4 mm 12 2.8 mm 30 2.2 mm 13 12.2 mm Top View 11.9 mm 14 29 Antenna 17 1.6 mm 25 5.1 mm 6.1 mm 6.7 mm 7.3 mm 7.9 mm 16.1 mm 16.4 mm All dimensions in mm. The outer dimensions has a tolerance of ± 0.2mm. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 14 of 30 DATE 14.02.2008 Datum 18. LABELING DRAWING Kennzeichnung des Moduls durch Label 7.5 mm 12.2 mm PR EL IM IN AR Y This label is suitable for reflow soldering and designed for the engineering sample status. Information in the 2D-Barcode are the date code in the format Year-Month-Day [6 signs], serial number [6 signs], ordering number [8 signs; without ENW and F], the identifier for the hardware release [2 signs, now 01] and the ES, separated by a semicolon. ES stands for Engineering Samples, please refer to chapter General Information. In mass production status, the ES will be eliminated and replaced by a software identifier. And will be also implemented at the last information in the 2D-Barcode. The point on the label is the identifier for pin 1 of the module. 01 is the hardware revision. 19. MECHANICAL REQUIREMENTS Mechanische Anforderungen No. Item Punkt 1 Solderability Lötfähigkeit 2 Resistance to soldering heat Limit Grenzwerte More than 75% of the soldering area shall be coated by solder Mehr als 75% der Lötfläche soll mit Lötpaste bedeckt sein. It shall be satisfied electrical requirements and not be mechanical damage HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt Condition Bedingung Reflow soldering with recommendable temperature profile Please refer to chapter 15.2. CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 15 of 30 DATE 14.02.2008 Datum PR EL IM IN AR Y 20. RECOMMENDED LAND PATTERN Empfohlenes Land Pattern In comparison to the module, we recommend to use 50µm bigger pad size to each direction! 24 23 22 21 20 19 18 26 Pad 1 = 4 x 1.1mm x 1.4mm 16 27 Pad 2 = 28 x 0.7mm x 1.4mm 15 28 14 Top View 29 7.0 mm 5.0 mm Antenna 17 13 30 12 31 11 32 10 1 2 3 4 5 6 7 8 11.7 mm 25 9 5.0 mm 11.1 mm When using the ceramic antenna, this minimum area is restriced, means no ground, no line and in general no metal, e.g. screws. Dimensions in mm. The land pattern dimensions above can serve as a guidance, but this information is given without any legal responsibility. For your footprint, we recommend to use 50µm bigger size for the pads at each direction in comparison to the module footprint, please refer to chapter 17. Foot Print of the Module. For the solder paste screen please use the same as for the module, but slight different measures and shapes of the solder paste screen cutouts might be optimum depending on your soldering process, for example on the chosen solder paste screen thickness. The solder screen thickness depends on your production standard, we recommend 120µm to 150µm. IMPORTANT: The bottom side of PAN4555 is fully coated, nevertheless no copper, such as through hole vias, planes or tracks on your board component layer should be located below PAN4555 in order to avoid short cuts. In cases where a track or through hole via has to be located under the module it has to be kept away from PAN4555 bottom pads. The PN4555 multilayer pcb contains an inner RF shielding plane, therefore no pcb shielding plane below the module is needed. When using the antenna pad version and if your application allows, please place the antenna on the edge of your carrier board. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 16 of 30 DATE 14.02.2008 Datum PR EL IM IN AR Y If you have any questions on these points, we are open to discuss your individual situation. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 17 of 30 DATE 14.02.2008 Datum 21. DEVELOPMENT OF APPLICATIONS WITH FREESCALE BEESTACK TM Entwiclung von Applikationen mit Hilfe des BeeStacks von freescale P P This chapter are copied from [8], please refer to this document to get more information. PR EL IM IN AR Y PAN4555 is built around the MC13213 single package from Freescale Inc. which includes the freescale ZigBee codebase BeeStack TM (downscaled versions of PAN4555 with MC1321x suited for IEEE802.15.4 or SMAC only are available on demand as well). P P The access to BeeStackPTMP is provided after registration and login at http://www.freescale.com/zigbee . After login the BEEKITDOWNLOADPACKAGE.zip can be downloaded. This package contains BeeStackPTMP , IEEE802.15.4 MAC and SMAC codebases. For PAN4555 PHY testing using TestToolPTM P the download of the latest 1321xEVK package is recommended. After successful installation of Beekit on a PC open BeeKit. A ZigBee sample solution *.bksln can be created in a few steps. Important: Before a solution may be exported for PAN4555 the MC1321x target settings have to be changed via the “User defined target editor”. The required changes are: • Uncheck the “Use external Antenna Switch” • Adjust the port settings depending on your application, the PAN4555 datasheet and for use of the PAN4555 carrier board the pin list in chapter PAN4555 PINLIST at [8]. For importing, compiling and debugging of the BeeKit TM solution the Integrated Development Environment (IDE) Metrowerks TM CodeWarrior from www.metrowerks.com is required. P P P P As device flash programmer the USB HCS08/HCS12 Multilink from www.pemicro.com is recommended. Important: PAN4555 is a single RF port design with MC13213, refer also to AN3248. The Freescale reference boards 13213-NCB and 13213-SRB are dual port designs, software for these boards will not run. The shipping of products which use ZigBee TM technology requires a membership of the ZigBee TM Alliance (www.zigbee.org), at least as an adopter member, and is mandatory for the ZigBee TM product certification procedure and use of the ZigBee TM Logo. P P P P P P P P The prices and fees as known from today are as follows: • IDE CodeWarrior order number CWS-H08-C64K-CX from www.metrowerks.com : US$ 995,-. • USB HCS08/HCS12 Multilink (www.pemicro.com), orderable at www.freescale.com/zigbee with the ID USBMULTILINKBDM: US$ 99,• BeeStack TM : The support fee after a 30 days period free of charge required by Freescale P P HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 18 of 30 DATE 14.02.2008 Datum Inc. is US$ 500,-. • Companies selling products using ZigBee TM technology have to be a member of the ZigBee TM Alliance ( www.zigbee.org). The minimum fee per year for a membership as adopter is US$ 3500,-. • For adopter members the fee for listing the first product at ( www.zigbee.org) is US$ 1000,-. • The cost of a ZigBee TM product certification at a test house (TÜV Rheinland) ranges from approximately US$ 4000,- to US$ 8000,-, depending on the implemented software. P P P H PR EL IM IN AR Y P H P P 22. RELIABILITY TESTS Zuverlässigkeitstests The measurement should be done after exposed to room temperature and humidity for 1hour. Die Messungen sollten erst nach einer Stunde Lagerung unter normalen Bedingungen erfolgen. No. Item Punkt Limit Grenzwerte Condition Bedingung a) Freq.:10~50Hz,Amplitude:1.5mm a) 20min. / cycle,1hrs. each of XYZ axis b) Freq.:30~100Hz, 6G b) 20min. / cycle,1hrs. each of XYZ axis Dropped onto hard wood from height of 50cm for 3 times -40°C for 30min. and +85°C for 30min.; each temperature 300 cycles 1 Vibration test Electrical parameter should be in specification 2 Shock test the same as the above 3 Heat cycle test the same as the above 4 Moisture test the same as the above +60°C, 90% RH, 300h 5 Low temp. test the same as the above -40°C, 300h 6 High temp. test the same as the above +85°C, 300h 23. CAUTIONS Warnungen Failure to do so may result in degrading of the product’s functions and damage to the product. 23.1. NOTES OF DESIGN Designhinweise (1) (2) (3) (4) Please follow the condition written in this specification, especially the control signals of this module. The supply voltage has to be free of ac ripple voltage, as for example from a battery or a low noise regulator output. For noisy supply voltages provide a decoupling circuit as for example a ferrite in series connection and a blocking capacitor to ground of at least 47uF directly at the module. This product should not be stressed when installed. Heat is the major cause of shortening the life of these products. Please keep this product away from heat. Avoid assembly and use of the target equipment in conditions where the HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF (5) products' temperature may exceed the maximum allowable. The supply voltage should not be exceeding or reverse, and should not carry noise and spike. Please keep this product away from other high frequency circuits. PR EL IM IN AR Y (6) No. REV. DS-4555-2400-102 G PAGE Seite 19 of 30 DATE 14.02.2008 Datum 23.2. NOTES OF INSTALLATION Verarbeitungshinweise (1) (2) (3) (4) (5) (6) (7) (8) (9) Reflow soldering is possible for twice on the condition in chapter 15. Please set up the temperature at the soldering portion of this product according to this reflow profile. Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components. If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. This product should not be stressed or vibrated when reflowed. Please keep the following conditions when you install this product for reparation by hand soldering. Please do not wash this product. Please refer to the recommended pattern when designing a board. Pressing on parts of the metal cover or fastening objects to the metal cover is not allowed. 23.3. NOTES OF USAGE CONDITIONS Benutzerhinweise (1) (2) (3) (4) (5) (6) (7) Please take measure against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, then before use, check and evaluate their operation when assembled on your products. Please do not use the fallen product. Please do not put on damage and dirt to the pin , and don't touch the electric components. Please follow the condition written in the ratings , about the power supply instruments applied to this product. Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB Pressing on parts of the metal cover or fastening objects to the metal cover is not allowed. These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information and communication equipment. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 20 of 30 DATE 14.02.2008 Datum 23.4. NOTES OF STORAGE Lagerhinweise The module may not be stressed mechanically during storage. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected: • Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX • Storage in direct sunlight • Storage in an environment where the temperature may be outside the range of 5°C to 35°C range, or where the humidity may be outside the 45 to 85% range. • Storage of the products for more than one year after the date of delivery at your company if all the above conditions (1) to (3) have been avoided Storage period: Please check the adhesive strength of the embossed tape and soldering after 6 months of storage. Please keep this product away from water, poisonous gas and corrosive gas. This product should not be stressed or shocked when transported. Please follow the specification when piling up the packed crate ( max. 10). PR EL IM IN AR Y (1) (2) (3) (4) (5) (6) 23.5. CAUTIONS FOR SAFETY Sicherheitshinweise These specifications are intended to preserve the quality assurance of products as individual components. Before use, check and evaluate their operation when mounted on your products. Abide by these specifications, without deviation when using the products.These products may shortcircuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then at least, provide the following failsafe functions, as a minimum. (1) Ensure the safety of the whole system by installing a protection circuit and a protection device. (2) Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. 23.6. OTHER CAUTIONS Weitere Hinweise (1) (2) (3) (4) (5) This specification sheet is copyrighted. Please do not open it to the third party. Please do not use this product of our company for another purpose. Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. This product has not been manufactured with any ozone chemical controlled under the Montreal Protocol. These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 21 of 30 DATE 14.02.2008 Datum PR EL IM IN AR Y conditions carefully to determine whether or not they can be used in such a manner. • In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. • In direct sunlight, outdoors, or in a dusty environment • In an environment where condensation occurs. • In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX) If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. When you have any question or uncertainty , both of you and Panasonic sincerely cope with it. (6) (7) HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 22 of 30 DATE 14.02.2008 Datum 24. PACKAGING Verpackung P2 2.0 0.1(I) Do 1.55 0.05 T 0.30 0.05 Po 4.0 0.1(II) Y E1 1.75 0.1 PR EL IM IN AR Y 24.1. TAPE DIMENSION W REF 8.8 Bo F(III) D1 1.5MIN X R0.5 TYPICAL REF 8.0 Y K1 Ko P1 REF 1.9 X Ao SECTION Y-Y Ao Bo Ko K1 F 12.60 16.80 +/- 0.1 +/- 0.1 3.40 2.60 11.50 +/- 0.1 +/- 0.1 +/- 0.1 P1 W 20.00 24.00 +/- 0.1 +/- 0.3 (I) (II) SECTION X-X Forming format : Flatbed Estimated max. length : 60 (III) (IV) meter/22B3 reel Measured from centreline of sprocket hole to centreline of pocket. Cumulative tolerance of 10 sprocket holes is± 0.20 . Measured from centreline of sprocket hole to centreline of pocket. Other material available. ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED. This package will be available latest as the mass production status are confirmed. 24.2. PACKING IN TAPE Empty hollow in component packed area shall be less than two per reel and those hollows shall not be consecutive. Top cover tape shall not be found on reel holes and shall not stick out from reel. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 23 of 30 DATE 14.02.2008 Datum PR EL IM IN AR Y 24.3. COMPONENT DIRECTION Komponentenanordnung Please refer also to chapter 18. Labeling Drawing This package will be available latest as the mass production status are confirmed. 24.4. REEL DIMENSION TAPE SIZE A MAX B MIN 24mm 330.0 1.5 C 13 +0.5 -0.2 D MIN ±1.0 N 20.2 100.0 W1 25.0 +2.0 -0.0 W2 MAX W3 24.4 +3.0 30.4 All dimensions in millimeters unless otherwise stated HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH -0.5 Assembly Method *Latch *Latch (2PC) APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 24 of 30 DATE 14.02.2008 Datum 42,30mm PR EL IM IN AR Y 24.5. LABEL FOR PACKAGE (P)P/N PAN4555 (1P)PO No. ENWC9A08A3EF Descr iption ES Sample ES Status (Q)QT Y 500 (D)DAT E CO DE 7419 MSL tbd Tmax tbd [[G]] MADE IN GERMANY The label must be stick 3 times, reel, barrier bag and inner carton box. 24.6. TOTAL PACKING HANDLING HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 25 of 30 DATE 14.02.2008 Datum 24.7. COVER TAPE REEL STRENGTH PR EL IM IN AR Y Force direction θ = 10deg Speed = 300mm/min. Cover tape reel strength =0.098~0.68N (10~70g) 25. ORDERING INFORMATION Bestellinformationen Ordering part number ENWCZA08A3EF (2) P (2) ENWCZA09N4EF ENWC9A08A3EF ENWC9A09N4EF P P P (3) P P (3) P P Description MOQ Engineering Sample ZigBee ready PAN4555, 2.4GHz ZigBee ready with Ceramic Antenna 60kBit Flash Memory Engineering Sample ZigBee ready PAN4555, 2.4GHz ZigBee ready with RF out on a SMD pad 60kBit Flash Memory Mass Production Sample ZigBee ready PAN4555, 2.4GHz ZigBee ready with Ceramic Antenna 60kBit Flash Memory Mass Production Sample ZigBee ready PAN4555, 2.4GHz ZigBee ready with RF out on a SMD pad 60kBit Flash Memory (1) P P 1 1 500 500 (4) P P (4) P P Note: (1) (2) (3) (4) Minimum order quantity. The “Z” in the ordering part number, refers to the engineering sample status. After mass production the “Z” will be changed to the “9”. Could only be ordered, if we released the mass production status. If we finishing, this document will change from PRELIMINARY to RELEASE also the revision status will move from alphabetic numbering to 1.0. On special agreement we can also deliver in lower quantity! HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 26 of 30 DATE 14.02.2008 Datum 26. ROHS DECLARATION RoHS-Erklärung Declaration of environmental compatibility for supplied products: PR EL IM IN AR Y Hereby we declare to our best present knowledge based on declaration of our suppliers that this product do not contain by now the following substances which are banned by Directive 2002/95/EC (RoHS) or if contain a maximum concentration of 0,1% by weight in homogeneous materials for • • • • • Lead and lead compounds Mercury and mercury compounds Chromium (VI) PBB (polybrominated biphenyl) category PBDE (polybrominated biphenyl ether) category And a maximum concentration of 0,01% by weight in homogeneous materials for • Cadmium and cadmium compounds 27. DATA SHEET STATUS Datenblatt Status This data sheet contains data from the PRELIMINARY specification. Supplementary data will be published at a later date. Panasonic Electronic Devices Europe GmbH reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Please consult the most recently issued data sheet before initiating or completing a design. If there is an update, please download under: PAN4555 Latest Data Sheet! 28. REGULATORY INFORMATION 28.1. FCC NOTICE The device PAN4555, including the ceramic antenna (ENWC9A08A3EF) and also the SMD type (ENWC9A09N4EF), including with the antennas, which are listed in 28.5, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 27 of 30 DATE 14.02.2008 Datum 28.2. CAUTION PR EL IM IN AR Y The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Electronic Devices Europe GmbH may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help 28.3. LABELING REQUIREMENTS The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC identifier are FCC ID: T7VPAN4555. This FCC identifier is valid for both versions, for details, please see the chapter 25. Ordering Information. Due to the size limitation, the EUT could not be labelled with the FCC ID: T7VPAN4555. However the FCC ID can be read from the UART of the device with the AT command “FCC ID ?” and the module will answer with FCC ID: T7VPAN4555. In any case end product must be labelled exterior with "Contains FCC ID: T7VPAN4555" 28.4. ANTENNA WARNING The related part number for this device is ENWC9A09N4EF (PAN4555 with SMD pad). For details, please see the chapter 25. Ordering Information. This device are tested with a standard SMA connector and with the antennas listed below. When integrated in the OEMs product, these fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions. The FCC identifier for this device with the antenna listed in item 1 are the same (FCC ID: T7VPAN4555). HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 28 of 30 DATE 14.02.2008 Datum 28.5. APPROVED ANTENNA LIST Note: We are able to qualify your antenna and will add to this list as that process is completed. Part Number Manufacturer Frequency Band Type Gain (dBi) 1 BKR2400 Embedded Antenna Design Ltd. 2.4GHz ½ Wave Dipole +2 PR EL IM IN AR Y Item 2 28.6. RF EXPOSURE PAN4555 To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure that the approved antenna in the previous table must be installed. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas in the previous table to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of PAN4555 with mounted ceramic antenna (FCC ID: T7VPAN4555) is far below the FCC radio frequency exposure limits. Nevertheless, the PAN4555 shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 29 of 30 DATE 14.02.2008 Datum 29. RELATED DOCUMENTS Mitgeltende Dokumente For an update, please search in the suitable homepage. PR EL IM IN AR Y [1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [2] Technical Data MC1321x Document Number: MC1321x Rev. 1.1, 03/2007 Freescale Semiconductor [3] MC1321x Reference Manual Document Number: MC1321xRM Rev. 1.1, 10/2006 Freescale Semiconductor [4] Handling MAC Address erasure, AN2825, Rev. 0.0 10/2004, Freescale Semiconductor [5] 802154MPSUG 802.15.4 MAC/PHY Software User´s Guide, Rev 1.1, Freescale Semiconductor [6] 802154EBRM.pdf 802.15.4 / ZigBee Embedded Bootloader Reference Manual Rev. 0.0 09/2004 [7] AN2771 ZigBee/802.15.4 PHY Protocol Test Client (PTC) Rev. 0.0 Freescale Semiconductor [8] Manual to the Evaluation Kit from Panasonic Downloadable under: www.pedeu.panasonic.de. [9] Manual to the E-Senza SN55 Programmer Interface Manual Downloadable under: www.pedeu.panasonic.de. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 (ZIGBEE) Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4555 ENWC9A0xxxEF No. REV. DS-4555-2400-102 G PAGE Seite 30 of 30 DATE 14.02.2008 Datum 30. GENERAL INFORMATION Allgemeine Informationen PR EL IM IN AR Y © Panasonic Electronic Devices Europe GmbH 2007. All rights reserved. This product description does not lodge the claim to be complete and free of mistakes. Please contact the related product manager in every case. If we deliver samples to the customer, these samples have the status Engineering Samples. This means, the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and there may be differences to be published Data Sheet. Engineering Samples are not qualified and are not to be used for reliability testing or series production. Disclaimer: Customer acknowledges that samples may deviate from the Data Sheet and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic Electronic Devices Europe GmbH rejects any liability or product warranty for Engineering Samples. In particular, Panasonic Electronic Devices Europe GmbH disclaims liability for damages caused by • the use of the Engineering Sample other than for Evaluation Purposes, particularly the installation or integration in an other product to be sold by Customer, • deviation or lapse in function of Engineering Sample, • improper use of Engineering Samples. Panasonic Electronic Devices Europe GmbH disclaimes any liability for consequential and incidental damages. In case of any questions, please contact your local sales partner or the related product manager. U 31. LIFE SUPPORT POLICY Politik für Lebenserhaltungssysteme This Panasonic Electronic Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Electronic Devices Europe GmbH for any damages resulting. HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt
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