PAN1326C2
Bluetooth Basic Data Rate and Low Energy Module
Product Specification
Rev. 1.3
Wireless Modules
Overview
Panasonic’s new PAN1326C2 is a Host Controlled
®
Interface (HCI) Bluetooth Radio Frequency (RF)
module that brings Texas Instruments™ seventh
generation Bluetooth core integrated circuit, the
CC2564C, to an easy to use module format. The
PAN1326C2 is Bluetooth 4.2 compliant and it offers
best-in-class RF performance with about twice the
range of other Bluetooth Low Energy (LE) solutions.
Panasonic’s tiny footprint technology has produced a
module of only 85.5 mm². The module is designed to
accommodate PCBs pad pitch of 1.3 mm and as few
as two layers for easy implementation and
manufacturing. The module has been designed to be
100 percent pin-compatible with previous
generations of Texas Instruments based Bluetooth
HCI modules.
PAN1326C2 Bluetooth Module
Features
• Bluetooth 4.2 compliant up to the HCI layer
• Best-in-class Bluetooth RF performance
(Tx, Rx sensitivity, blocking)
•
•
•
Dimensions: 9 mm x 9.5 mm x 1.8 mm
Based upon Texas Instruments CC2564C
Interfaces: UART, GPIO, PCM
Characteristics
• Bluetooth 4.2
• Receiver sensitivity: -90 dBm
• Output power: 8 dBm
• Power supply: 1.7 V to 4.8 V
• Power consumption: Tx 40 mA
• Power consumption: Rx 20 mA
• Operating temperature range: -40 ºC to 85 ºC
Block Diagram
Product Specification 1.3
Page 2
PAN1326C2 Bluetooth Module
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of it is contents and recommendations.
Panasonic reserves the right to make changes as required at any time without notification. Please consult
the most recently issued Product Specification before initiating or completing a design.
© Panasonic Industrial Devices Europe GmbH 2019.
This Product Specification is copyrighted. Reproduction of this document is permissible only if reproduction
is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Do not disclose it to a third party.
All rights reserved.
This Product Specification does not lodge the claim to be complete and free of mistakes.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Product Specification and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation
or integration in another product to be sold by the customer,
Deviation or lapse in function of the Engineering Sample,
Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.
Product Specification 1.3
Page 3
PAN1326C2 Bluetooth Module
Table of Contents
1
2
3
4
5
6
About This Document......................................................................................................................... 6
1.1
Purpose and Audience .............................................................................................................. 6
1.2
Revision History ......................................................................................................................... 6
1.3
Use of Symbols ......................................................................................................................... 6
1.4
Related Documents ................................................................................................................... 6
Overview .............................................................................................................................................. 7
2.1
Block Diagram ........................................................................................................................... 8
2.2
Pin Configuration ....................................................................................................................... 9
2.3
Device Power Supply............................................................................................................... 12
2.4
Clock Inputs ............................................................................................................................. 14
2.5
Bluetooth Features .................................................................................................................. 14
2.6
Interfaces ................................................................................................................................. 14
Detailed Description ......................................................................................................................... 20
3.1
Dimensions .............................................................................................................................. 20
3.2
Footprint .................................................................................................................................. 21
3.3
Packaging ................................................................................................................................ 22
3.4
Case Marking .......................................................................................................................... 25
Specification ..................................................................................................................................... 26
4.1
Default Test Conditions ........................................................................................................... 26
4.2
Absolute Maximum Ratings ..................................................................................................... 26
4.3
Recommended Operating Conditions ...................................................................................... 27
4.4
Current Consumption............................................................................................................... 28
4.5
nSHUTD Requirements ........................................................................................................... 28
4.6
External Digital Slow Clock Requirements............................................................................... 28
4.7
Bluetooth ................................................................................................................................. 29
4.8
Reliability Tests ....................................................................................................................... 35
4.9
Recommended Soldering Profile ............................................................................................. 36
Cautions ............................................................................................................................................ 37
5.1
Design Notes ........................................................................................................................... 37
5.2
Installation Notes ..................................................................................................................... 37
5.3
Usage Condition Notes ............................................................................................................ 38
5.4
Storage Notes .......................................................................................................................... 38
5.5
Safety Cautions ....................................................................................................................... 38
5.6
Other Cautions ........................................................................................................................ 39
5.7
Restricted Use ......................................................................................................................... 40
Regulatory and Certification Information ....................................................................................... 41
6.1
Federal Communications Commission (FCC) for US .............................................................. 41
6.2
Innovation, Science, and Economic Development (ISED) for Canada .................................... 44
6.3
European Conformity According to RED (2014/53/EU) ........................................................... 47
6.4
Bluetooth ................................................................................................................................. 48
6.5
RoHS and REACH Declaration ............................................................................................... 48
Product Specification 1.3
Page 4
7
PAN1326C2 Bluetooth Module
Appendix ........................................................................................................................................... 49
7.1
Ordering Information ................................................................................................................ 49
7.2
Contact Details ........................................................................................................................ 50
Product Specification 1.3
Page 5
PAN1326C2 Bluetooth Module
1 About This Document
1 About This Document
1.1
Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic PAN1326C2 module. It is intended for hardware design,
application and Original Equipment Manufacturer (OEM) engineers. The product is referred to
as “the PAN1326C2” or “the module” within this document.
1.2
Revision History
Revision
Date
Modifications/Remarks
1.0
2019-01-20
1st version
1.1
2019-06-17
Corrections in temperature range and approved antenna list. Changed
formatting. Added Bluetooth certification ID’s
1.2
2019-06-24
Added section in chapter “Regulatory and Certification Information“
1.3
2019-10-18
Corrected FCC identifier. Added information in chapter “Bluetooth”.
Updated pictures “Block Diagram”, “Case Marking”, “Pin Assignment”,
and “Footprint”. Updated formatting.
Updated referenced standards in chapter 6.3 EU RED
1.3
Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4
Related Documents
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
Product Specification 1.3
Page 6
PAN1326C2 Bluetooth Module
2 Overview
2 Overview
Panasonic’s new PAN1326C2 is a Host Controlled Interface (HCI) Bluetooth RF module that
brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564, to
an easy to use module format. The PAN1326C2 is Bluetooth 4.2 compliant and it offers
best in class RF performance with about twice the range of other Bluetooth LE solutions.
Panasonic’s tiny footprint technology has produced a module of only 85.5 mm². The module is
designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy
implementation and manufacturing. The module has been designed to be 100 percent
pin-compatible with previous generations of Texas Instruments based Bluetooth HCI modules.
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
Further information on the variants and versions 7.1 Ordering Information.
Product Specification 1.3
Page 7
PAN1326C2 Bluetooth Module
2 Overview
2.1
Block Diagram
The Slow Clock 32.768 kHz is mandatory, otherwise the module does not start
up 2.4 Clock Inputs.
The I/O are 1.8 V driven and might need external level shifter and Low-dropout
regulator (LDO). The Pin MLDO_OUT cannot be used as reference due to RF
internal connection.
The total capacity will not exceed 2.8 µF. The total inductance will not exceed
0 nH. There are no voltage multiplying or voltage boosting circuits.
Product Specification 1.3
Page 8
PAN1326C2 Bluetooth Module
2 Overview
2.2
Pin Configuration
PIN Assignment
C
D
A
B
6
20
17
18
15
16
13
12
14
21
11
Top View
22
10
23
9
2
24
1
4
3
6
5
8
7
Pin Functions
No. Pin Name
Pull at Reset
Def. Dir.
1
I/O Type
1 GND
2
Description
Connect to Ground
2 TX_DBG
PU
O
2 mA
Logger output
3 HCI_CTS
PU
I
8 mA
HCI UART clear-to-send
4 HCI_RTS
PU
O
8 mA
HCI UART request-to-send
5 HCI_RX
PU
I
8 mA
HCI UART data receive
6 HCI_TX
PU
O
8 mA
HCI UART data transmit
7 AUD_FSYNC
PD
I/O
4 mA
PCM frame synchronisation (NC if not used)
Fail-safe3
1
I=input, O=output, I/O=bidirectional, P=power, PU=pulled up, PD=pulled down
2
I/O Type: Digital I/O cells, HY=input hysteresis, current=typ. output current
3
No signals are allowed on the I/O pins if no VDD_IO (Pin 22) power supplied, except pin 7, 8, 17 to 19.
Product Specification 1.3
Page 9
PAN1326C2 Bluetooth Module
2 Overview
No. Pin Name
Pull at Reset
8 SLOW_CLK_IN
Def. Dir.
1
I/O Type
I
2
Description
32.768-kHz clock in
Fail-safe
9 NC
I/O
Not connected
10 MLDO_OUT
O
Main LDO output (1.8 V nom.)
11 CL1.5_LDO_IN
I
PA LDO input
12 GND
Connect to Ground
13 RF
I/O
Bluetooth RF I/O
14 GND
Connect to Ground
15 MLDO_IN
I
Main LDO input
Shutdown input (active low)
16 nSHUTD
PD
I
17 AUD_OUT
PD
O
4 mA
PCM data output. (NC if not used)
Fail-safe
18 AUD_IN
PD
I
4 mA
PCM data input. (NC if not used)
Fail-safe
19 AUD_CLK
PD
I/O
HY, 4 mA
PCM clock. (NC if not used)
Fail-safe
20 GND
Connect to Ground
21 NC
EEPROM I²C SDA (Internal)
22 VDD_IO
PI
23 NC
24 NC
I/O power supply 1.8 V nom.
EEPROM I²C SCL (Internal)
I/O
Not connected
A
GND
Connect to Ground
B
GND
Connect to Ground
C
GND
Connect to Ground
D
GND
Connect to Ground
For RF conducted measurements de-solder the antenna and solder an antenna connector to
the hot pin.
Product Specification 1.3
Page 10
PAN1326C2 Bluetooth Module
2 Overview
Pin Description
HCI_CTS is an input signal to the CC2564C device:
•
•
When HCI_CTS is low: CC2564C is allowed to send data to Host device.
When HCI_CTS is high: CC2564C is not allowed to send data to Host
device.
No. Pin Name
Pull at Reset Def. Dir.
4
I/O Type
5
Description
5 HCI_RX
PU
I
8 mA
HCI UART data receive
6 HCI_TX
PU
O
8 mA
HCI UART data transmit
4 HCI_RTS
PU
O
8 mA
HCI UART request-to-send
3 HCI_CTS
PU
I
8 mA
HCI UART clear-to-send
7 AUD_FYSNC
PD
I/O
4 mA
PCM frame synchronisation (NC if not used)
Fail-safe
19 AUD_CLK
PD
I/O
HY, 4 mS
PCM clock (NC if not used)
Fail-safe
18 AUD_IN
PD
I
4 mA
PCM data input (NC if not used)
Fail-safe
17 AUD_OUT
PD
O
4 mA
PCM data output (NC if not used)
Fail-safe
2 TX_DBG
PU
O
2 mA
Logger output
OPTION: nTX_DBG – logger out (low=1)
8 SLOW_CLK_IN
I
32.768 kHz clock in
Fail-safe
13 RF
16 nSHUTD
22 VDD_IO
PD
I/O
Bluetooth RF I/O (not connected with
antenna)
I
Shutdown input (active low)
PI
I/O power supply 1.8 V nom.
4
I=input, O=output, I/O=bidirectional, P=power, PU=pulled up, PD=pulled down
5
I/O Type: Digital I/O cells, HY=input hysteresis, current=typ. output current
Product Specification 1.3
Page 11
PAN1326C2 Bluetooth Module
2 Overview
No. Pin Name
Pull at Reset Def. Dir.
15 MLDO_IN
4
I/O Type
5
I
Description
Main LDO input
Connect directly to battery or to a
pre-regulated 1.8 V supply
10 MLDO_OUT
O
Main LDO output 1.8 V nom
Can not be used as 1.8 V supply due to
internal connection to the RF part
11 CL1.5_LDO_IN
I
PA LDO input
Connect directly to battery or to a
pre-regulated 1.8 V supply
2.3
1 GND
P
Connect to Ground
12 GND
P
Connect to Ground
14 GND
P
Connect to Ground
20 GND
P
Connect to Ground
23 NC
PU/PD
I
HY, 4 mA
EEPROM I²C SCL (Internal)
21 NC
PU/PD
I/O
HY, 4 mA
EEPROM I²C IRQ (Internal)
Device Power Supply
The PAN1326C2 Bluetooth radio solution is intended to work in devices with a limited power
budget such as cellular phones, headsets, handheld PC’s, and other battery-operated devices.
One of the main differentiators of the PAN1326C2 is its power management. It is ability to draw
as little current as possible.
The PAN1326C2 device requires two kinds of power sources:
Main power supply for the Bluetooth (VDD_IN=VBAT)
Power source for the 1.8 V I/O ring (VDD_IO)
The PAN1326C2 includes several on-chip voltage regulators for increased noise immunity. The
PAN1326C2 can be connected either directly to the battery or to an external 1.8 V DC to DC
converter.
Product Specification 1.3
Page 12
PAN1326C2 Bluetooth Module
2 Overview
Three ways to supply power
Full VBAT system (Maximum RF output power, but not optimum system power):
Full-DC2DC system (Lower RF output power, but optimum system power):
Mixed DC2DC-VBAT system (Maximum RF output power and optimum system power, but
requires routing of VBAT):
Product Specification 1.3
Page 13
PAN1326C2 Bluetooth Module
2 Overview
2.4
Clock Inputs
The Slow Clock is always supplied from an external source. It is connected to the
SLOW_CLK_IN pin number 8 and can be a digital signal with peak to peak of 0 V to 1.8 V.
The Slow Clock's frequency accuracy must be 32.768 kHz 250 ppm for Bluetooth usage
(according to the Bluetooth specification).
The Slow Clock 32.768 kHz is mandatory to start the internal controller;
otherwise the module does not start up.
2.5
2.6
2.6.1
Bluetooth Features
•
•
•
•
•
Bluetooth 4.2 compliant up to the HCI layer
•
Assisted mode for Handset Profile (HFP) 1.6 Wideband Speech (WBS) profile or Advanced
Audio Distribution Profile (A2DP) profile to reduce host processing and power
•
•
•
Support of multiple Bluetooth profiles with enhanced QoS
•
•
•
•
Built-in coexistence and prioritization handling for BR, EDR, and LE
Up to seven active devices
Scatternet: up to three piconets simultaneously, one as master and two as slaves
Up to two Synchronous Connection Oriented (SCO) links on the same piconet
Support for all voice Air-Coding – Continuously Variable Slope Delta (CVSD), A-law, µ-law,
modified Subband Coding (mSBC), and transparent (uncoded)
Multiple sniff instances tightly coupled to achieve minimum power consumption
Independent buffering for LE allows large numbers of multiple connections without affecting
BR or EDR performance
Capabilities of link layer topology Scatternet (can act concurrently as peripheral and central)
Network support for up to ten devices
Time line optimization algorithms to achieve maximum channel utilization
Interfaces
Host Controller Interface (HCI)
The CC2564C2 incorporates one UART module dedicated to the HCI transport layer. The HCI
interface transports commands, events, ACL, and synchronous data between the Bluetooth
device, and it is host using HCI data packets.
The UART module supports H4 (4-wires) protocol with maximum baud rate of 4 Mbps for all fast
clock frequencies.
Product Specification 1.3
Page 14
PAN1326C2 Bluetooth Module
2 Overview
After power up the baud rate is set for 115.2 kbps, irrespective of fast clock frequency. The baud
rate can thereafter be changed with a vendor specific command. The CC2564C responds with a
Command Complete Event (still at 115.2 kbps), after which the baud rate change takes place.
HCI hardware includes the following features:
Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions
Transmitter underflow detection
CTS/RTS hardware flow control
The interface includes four signals: TXD, RXD, CTS, and RTS. Flow control between the host
and the CC2564C is byte-wise by hardware.
Flow control is obtained by the following:
When the UART Rx buffer of the CC2564C passes the “flow control” threshold, it will set the
signal UART_RTS high to stop transmission from the host.
When the signal UART_CTS is set high, the CC2564C will stop it is transmission on the
interface. In case HCI_CTS is set high in the middle of transmitting a byte, the CC2564C will
finish transmitting the byte and stop the transmission.
2.6.2
Audio/Voice CODEC Interface
The codec interface is a fully-dedicated programmable serial port that provides the logic to
2
interface to several kinds of PCM or Inter-IC Sound (I S) codec’s. PAN1326C2 supports all
voice coding schemes required by Bluetooth specification, Log PCM (A-Law or μ-Law) and
Linear (CVSD). In addition, module also supports transparent scheme:
Two voice channels
Master/slave modes
µ-Law, A-Law, linear, transparent coding schemes
Long and short frames
Different data sizes, order, and positions
High rate PCM interface for EDR
Enlarged interface options to support a wider variety of codecs
PCM bus sharing
Product Specification 1.3
Page 15
PAN1326C2 Bluetooth Module
2 Overview
2.6.2.1
PCM Hardware Interface
The PCM interface is one implementation of the codec interface. It contains the following four
lines:
Clock: configurable direction (input or output)
Frame synchronization: configurable direction (input or output)
Data In: Input
Data Out: Output/3-state
The Bluetooth device can be either the master of the interface where it generates the clock and
the frame synchronization signals, or slave where it receives these two signals. The PCM
interface is fully configured by a vendor specific command.
For slave mode, clock input frequencies of up to 16 MHz are supported. At clock rates above
12 MHz, the maximum data burst size is 32 bit. For master mode, the CC2564C can generate
any clock frequency between 64 kHz and 6 MHz.
2
When the I S bus is used in an application, it is recommended adding a low
pass filter (series resistor and capacitor to GND) to the bus for better noise
suppression. Connecting the host microcontroller/DSP directly with the
2
module’s I S interface is not recommended.
The suggested low pass filter component values are:
•
•
2.6.2.2
470 pF
120 Ω
Data Format
The data format is fully configurable:
•
The data length can be from 8 bit to 320 bit, in 1 bit increments, when working with two
channels, or up to 640 bit when using one channel. The Data length can be set
independently for each channel.
•
The data position within a frame is also configurable in with 1 clock (bit) resolution and can
be set independently (relative to the edge of the frame synchronisation signal) for each
channel.
•
The bit order Data_In and Data_Out can be configured independently. For example:
Data_In can start with the MSB while Data_Out starts with LSB. Each channel is separately
configurable. The inverse bit order (that is LSB first) is supported only for sample sizes up to
24 bit.
•
•
It is not necessary for the data in and data out size to be the same length.
The Data_Out line is configured to “high-Z” output between data words. Data_Out can also
be set for permanent high-Z, irrespective of data out. This allows the CC2564C to be a bus
slave in a multi-slave PCM environment. At power up, Data_Out is configured as “high-Z”.
Product Specification 1.3
Page 16
PAN1326C2 Bluetooth Module
2 Overview
2.6.2.3
Frame Idle Period
The codec interface has the capability for frame idle periods, where the PCM clock can “take a
break” and become “0” at the end of the PCM frame, after all data has been transferred.
The CC2564C supports frame idle periods both as master and slave of the PCM bus.
When CC2564C is the master of the interface, the frame idle period is configurable. There are
two configurable parameters:
Clk_Idle_Start:
Indicates the number of PCM clock cycles from the beginning of the frame until the beginning of
the idle period. After Clk_Idle_Start clock cycles, the clock will become “0”.
Clk_Idle_End:
Indicates the time from the beginning of the frame till the end of the idle period. This time is
given in multiples of PCM clock periods.
The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period.
For example, for PCM clock rate=1 MHz and frame synchronisation period=10 kHz:
Clk_Idle_Start=60, Clk_Idle_End=90.
Between each two frame synchronisations there are 70 clock cycles (instead of 100). The clock
idle period starts 60 clock cycles after the beginning of the frame, and lasts 90 to 60=30 clock
cycles. This means that the idle period ends 100 to 90=10 clock cycles before the end of the
frame. The data transmission must end prior to the beginning of the idle period.
Product Specification 1.3
Page 17
PAN1326C2 Bluetooth Module
2 Overview
2.6.2.4
Clock-Edge Operation
The codec interface of the CC2564C can work on the rising or the falling edge of the clock. It
also has the ability to sample the frame synchronisation and the data at inversed polarity.
This is the operation of a falling-edge-clock type of codec. The codec is the master of the PCM
bus. The frame synchronisation signal is updated (by the codec) on the falling clock edge and
therefore shall be sampled (by the CC2564C) on the next rising clock. The data from the codec
is sampled (by the CC2564C) on the clock falling edge.
2.6.2.5
Two-Channel PCM Bus Example
In below figure, a two-channel PCM bus is shown where the two channels have different word
sizes and arbitrary positions in the bus frame. (FT=Frame Timer)
2.6.2.6
Audio Encoding
The CC2564C codec interface can use one of four audio-coding patterns:
A-Law (8 bit)
µ-Law (8 bit)
Linear (8 bit or 16 bit)
Product Specification 1.3
Page 18
PAN1326C2 Bluetooth Module
2 Overview
2.6.2.7
Improved Algorithm for Lost Packets
The CC2564C features an improved algorithm for improving voice quality when received voice
data packets are lost. There are two options:
Repeat the last sample: possible only for sample sizes up to 24 bit. For sample sizes
>24 bit, the last byte is repeated.
Repeat a configurable sample of 8 bit to 24 bit (depends on the real sample size): in
order to simulate silence (or anything else) in the PCM bus. The configured sample
will be written in a specific register for each channel.
The choice between those two options is configurable separately for each channel.
2.6.2.8
Bluetooth/PCM Clock Mismatch Handling
In Bluetooth Rx, the CC2564C receives RF voice packets and writes these to the codec I/F. If
the CC2564C receives data faster than the codec I/F output allows, an overflow will occur. In
this case, the Bluetooth has two possible behavior modes:
2.6.2.9
•
“allow overflow”: The Bluetooth will continue receiving data and will overwrite any data not
yet sent to the codec.
•
“don’t’ allow overflow”: RF voice packets received when buffer is full will be discarded.
Bluetooth Inter-IC Sound (I2S)
2
2
The CC2564C can be configured as an I S serial interface to an I S codec device. In this mode,
the CC2564C audio codec interface is configured as a bi-directional, full-duplex interface with
two time slots per frame: Time slot 0 is used for the left channel audio data and time slot 1 for
the right channel audio data. Each time slot is configurable up to 40 serial clock cycles in length
and the frame is configurable up to 80 serial clock cycles in length.
Do not connect the microcontroller/DSP directly to the module’s PCM interface.
It is recommended to use a simple RC low pass filter to improve noise
suppression.
Product Specification 1.3
Page 19
PAN1326C2 Bluetooth Module
3 Detailed Description
3 Detailed Description
3.1
Dimensions
All dimensions are in millimeters.
No.
Item
Dimension
Tolerance
Remark
1 Width
9.50
0.35
2 Length
9.00
0.35
3 Height
1.80
0.25 With case
Product Specification 1.3
Page 20
PAN1326C2 Bluetooth Module
3 Detailed Description
Footprint
All dimensions are in millimeters.
The outer dimensions have a tolerance of 0.35 mm.
The layout is symmetric to center.
The inner pins (2, 4, 6, 9, 11, 14, 16, 18, 21, 23) are shifted to the
center by 1 mm.
3.95
2.95
2.70
1.80
0.90
0.60
D
A
B
6
9.50
20
17
18
15
16
13
12
14
21
11
Top View
22
10
0.55
1.00
23
Product Specification 1.3
9
2
24
1
4
3
6
5
8
1.70
1.80
2.70
1.80
0.60
1.80
C
0.90
3.2
7
9.00
Page 21
PAN1326C2 Bluetooth Module
3 Detailed Description
3.3
Packaging
The product is a mass production status product and will be delivered in the package described
below.
3.3.1
Tape Dimensions
Y
X
X
Y
SECTION YSCALE 3.5 :
Y
1
SECTION XSCALE 3.5 :
X
1
Ao
Bo
Ko
K1
F
P1
W
3.3.2
9.90
9.40
2.80
2.00
7.50
12.00
16.00
+/- 0.10
+/- 0.10
+/- 0.10
+/- 0.10
+/- 0.10
+/- 0.10
+/- 0.30
(I)
(II)
(III)
Tooling code: Flatbed - 9
Estimated Max Length: 72m per 22B3
(IV)
Measured from centreline of sprocket hole
to centreline of pocket.
Cumulative tolerance of 10 sprocket
holes is ± 0.20 .
Measured from centreline of sprocket
hole to centreline of pocket.
Other material available.
ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED.
Packing in Tape
Direction of unreeling (for customer)
trailer (empty)
1 x circumference /hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch
Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Empty spaces in the component packed area shall be less than two per reel and those spaces
shall not be consecutive.
The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
Product Specification 1.3
Page 22
PAN1326C2 Bluetooth Module
3 Detailed Description
3.3.3
Component Direction
3.3.4
1851211
PAN1326C2
ENW89823A5KF
01/04
Direction of
unreeling
(for customer)
Machine
readable
2D-barcode
Pin 1 Marking
(Top Side)
Pin 1 Marking
(Bottom Side)
Circle r = 0.5 mm
on solder resist
near Pin 1
Reel Dimension
Product Specification 1.3
Page 23
PAN1326C2 Bluetooth Module
3 Detailed Description
3.3.5
Package Label
Example
3.3.6
(1T)
Lot code
(1P)
Customer order number, if applicable
(2P)
Order number
(3P)
Brand name
(9D)
Date code
(Q)
Quantity
(HW/SW)
Hardware/software version
Total Package
Product Specification 1.3
Page 24
PAN1326C2 Bluetooth Module
3 Detailed Description
3.4
Case Marking
Example
1 Brand name
2 Engineering Sample (optional)
3 Order number
4 Hardware/software version
5 2D Data Matrix Code
6 ISED marking
7 Lot code
8 Marking for Pin 1
9 FCC ID marking
Product Specification 1.3
Page 25
PAN1326C2 Bluetooth Module
4 Specification
4 Specification
All specifications are over temperature and process, unless indicated
otherwise.
4.1
Default Test Conditions
Temperature:
Humidity:
Supply Voltage:
4.2
25 °C ± 10 °C
40 to 85 % RH
3.3 V
Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
All parameters are measured as follows unless stated otherwise:
6
VDD_IN =3.3 V, VDD_IO=1.8 V.
7
No. See
Min.
Max.
Unit
Ratings Over Operating Free-Air Temperature Range
1 VDD_IN
-0.5
5.5
V
2 VDDIO_1.8 V
-0.5
2.145
V
3 Input voltage to RF (Pin 13)
-0.5
2.1
V
4 Operating ambient temperature range
-40
85
°C
5 Storage temperature range
-40
125
°C
500
V
6 ESD: Human Body Model (HBM). JEDEC 22-A114
6
7
VDD_IN is supplied to MLDO_IN (Pin 15) and CL1.5_LDO_IN (Pin 11). Other options are described in
2.3 Device Power Supply.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions
beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Product Specification 1.3
Page 26
PAN1326C2 Bluetooth Module
4 Specification
4.3
Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not
even momentarily or individually, as permanent damage to the module may
result.
Symbol
Parameter
Condition
8
VDD_IN
Power Supply Voltage
VDD_IO
I/O Power Supply Voltage
Min.
Max.
Unit
1.7
4.8
V
1.62
1.92
V
High-Level Input Voltage
Default
0.65 x
VDD_IO
VDD_IO
V
VIL
Low-Level Input Voltage
Default
0
0.35 x VDD_IO
V
Tr/Tf
I/O Input Rise/Fall Times, 10 % to
90 % 9
1
10
ns
0 MHz to 0.1 MHz
60
mVp-p
0.1 MHz to 0.5 MHz
50
0.5 MHz to 2.5 MHz
30
2.5 MHz to 3 MHz
15
VIH
Maximum Ripple on VDD_IN (Sine
wave) for 1.8 V (DC2DC) Mode
>3 MHz
5
Voltage Dips on VDD_IN (VBAT)
(duration=577 µs to
2.31 ms, period=4.6 m)
Maximum Ambient Operating
Temperature10
-40
8
Excluding 1.98 < VDD_IN < 2.2 V range is not allowed 2.3 Device Power Supply.
9
Asynchronous mode.
10
400
mV
85
C
The device can be reliably operated for seven years at Tambient of 85 °C, assuming 25 percent active mode
and 75 percent sleep mode (15 400 cumulative active power-on hours).
Product Specification 1.3
Page 27
PAN1326C2 Bluetooth Module
4 Specification
4.4
Current Consumption
No. Characteristics
Min.
Typ.
Max. Min.
25 °C 25 °C 25 °C -40 °C
4.5
Typ.
Max.
Unit
-40 °C
-40 °C
+85 °C +85 °C +85 °C
7
A
40
105
700
A
1
mA
1
1
40
mA
nSHUTD Requirements
Symbol
Parameter
VIH
Operation Mode Level
VIL
Tr/Tf
4.6
Min.
3
3 Total I/O current
consumption for
Active Mode
4 Current
consumption during
transmit DH5 full
throughput
Max.
1
1 Current
consumption in
Shutdown Mode
2 Current
consumption in
Deep Sleep Mode
Typ.
Min.
11
Max.
Unit
1.42
1.98
V
Shutdown Mode Level
0
0.4
V
Minimum Time for nSHUT_DOWN Low to Reset the Device
5
ms
Rise/Fall Times
20
µs
External Digital Slow Clock Requirements
Symbol
Parameter
Condition
Min.
Typ.
Input Slow Clock Frequency
Input Slow Clock Accuracy
(Initial + temp + aging)
Tr/Tf
Max.
32 768
Bluetooth
Input Transition Time
Tr/Tf – 10 % to 90 %
Frequency Input Duty Cycle
VIH
VIL
11
Unit
15
Phase Noise
At 1 kHz
Jitter
Integrated over
300 Hz to 15 000 Hz
Slow Clock Input Voltage
Limits
Square wave, DC
coupled
0.65 x
Slow Clock Input Voltage
Limits
Square wave, DC
coupled
0
50
Hz
±250
Ppm
100
Ns
85
%
-125
1
dBc/Hz
Hz
VDD_IO
V peak
0.35 x
V peak
VDD_IO
VDD_IO
Internal pull down retains shut down mode when no external signal is applied to this pin.
Product Specification 1.3
Page 28
PAN1326C2 Bluetooth Module
4 Specification
Symbol
Parameter
Condition
Min.
Typ.
Input Impedance
Max.
Unit
1
M
Input Capacitance
4.7
5
pF
Bluetooth
Bluetooth Receiver: In-Band Signals
Characteristics
Condition
Min.
Operation frequency range
2 402
Channel spacing
12
Sensitivity, Dirty Tx on
-91
dBm
π/4-DQPSK, BER=0.01 %
-91
8DPSK, BER=0.01 %
-84
8DPSK
1E–6
Maximum usable input power
GFSK, BER=0.1 %
Image=–1 MHz
1E–7
dBm
-5
π/4-DQPSK, BER=0.1 %
-10
8DPSK, BER=0.1 %
-10
Level of interferers (for n=3, 4, and 5)
-36
-30
dBm
GFSK, cochannel
dB
π/4-DQPSK
9.5
11
16.5
20
-10
-5
-10
-5
-5
-1
-38
-35
π/4-DQPSK
-38
-35
8DPSK
-38
-30
-28
-20
π/4-DQPSK
-28
-20
8DPSK
-22
-13
-45
-43
π/4-DQPSK
-45
-43
8DPSK
-44
-36
-63
-58
EDR, cochannel
8DPSK
GFSK, adjacent ±1 MHz
EDR, adjacent ±1 MHz, (image)
π/4-DQPSK
8DPSK
GFSK, adjacent +2 MHz
EDR, adjacent, +2 MHz
GFSK, adjacent –2 MHz
EDR, adjacent –2 MHz
GFSK, adjacent ≥ |±3| MHz
EDR, adjacent ≥ |±3| MHz
Rx mode LO leakage
MHz
GFSK, BER=0.1 %
1E–6
C/I performance
2 480
MHz
π/4-DQPSK
13
Max. Unit
1
BER error floor at sensitivity
+10 dB, dirty Tx off
Intermodulation characteristics
Typ.
Frf=(received RF – 0.6 MHz)
dBm
12
Sensitivity degradation up to 3 dB may occur for minimum and typical values where the Bluetooth frequency
is a harmonic of the fast clock.
13
Numbers show ratio of desired signal to interfering signal. Smaller numbers indicate better C/I performance.
Product Specification 1.3
Page 29
PAN1326C2 Bluetooth Module
4 Specification
Bluetooth Receiver: General Blocking
Characteristics
Condition.
Typ.
Unit
Blocking performance over full
range, according to Bluetooth
specification14
30 to 2 000
-6
MHz
2 000 to 2 399
-6
MHz
2 484 to 3 000
-6
MHz
3 to 12.75
-6
GHz
Bluetooth Transmitter: GFSK
Characteristics
Min.
Maximum RF output power15
Typ.
Max Unit
VDD_IN=VBAT
8
10
VDD_IN=external regulator to 1.8 V
7
10
Power variation over Bluetooth band
-1
1
dBm
dB
Gain control range
30
dB
Power control step
5
dB
Adjacent channel power |M–N|=2
-45
dBm
Adjacent channel power |M–N|>2
-50
dBm
Bluetooth Transmitter: EDR
Characteristics
EDR output power16
Min.
π/4-DQPSK
Typ.
VDD_IN=VBAT
6
Max Unit
10
dBm
VDD_IN=external regulator to 1.8 V
8DPSK
VDD_IN=VBAT
VDD_IN=external regulator to 1.8 V
EDR relative power
-2
1
dB
Power variation over Bluetooth band
-1
1
dB
Gain control range
30
dB
Power control step
5
dB
Adjacent channel power |M–N|=1
-36
dBc
Adjacent channel power |M–N|=2
-30
dBm
Adjacent channel power |M–N|>2
-42
dBm
14
Exceptions are taken out of the total 24 allowed in the Bluetooth specification.
15
To modify maximum output power, use an HCI VS command.
16
To modify maximum output power, use an NCI VS command.
Product Specification 1.3
Page 30
PAN1326C2 Bluetooth Module
4 Specification
Bluetooth Modulation: GFSK
Characteristics
F1 avg
Condition
Min.
–20 dB bandwidth
GFSK
Modulation
characteristics
Δf1avg
Mod data=4 1 s, 4 0 s:
111100001111...
Δf2max ≥ limit for at
Mod data=1010101...
F2 max
Typ.
Max. Unit
kHz
925
kHz
165
kHz
least 99.9 % of all
130
Δf2max
Δf2avg, Δf1avg
Absolute carrier frequency drift
88
%
DH1
-25
25
DH3 and DH5
-35
35
Drift rate
Initial carrier frequency tolerance
-75
kHz
15
kHz/5
0 μs
75
kHz
Bluetooth LE Transceiver, Out-Of-Band and Spurious Emissions
Characteristics
Condition
Typ.
Second harmonic
Measured at maximum output power (conducted)
Unit
-50
Third harmonic
-50
Fourth harmonics
-50
dBm
Bluetooth LE Receiver: In-Band Signals
Characteristics
Condition
Operation frequency range
Min.
Typ.
2 402
Channel spacing
Sensitivity, Dirty Tx on
17
PER=30.8 %; dirty Tx on
Maximum usable input power
GMSK, PER=30.8 %
Intermodulation characteristics
Level of interferers (for n=3, 4, 5)
18
MHz
-92
dBm
dBm
-5
-30
Image=–1 MHz
GMSK, adjacent ±1 MHz
-5
GMSK, adjacent ±2 MHz
-45
GMSK, adjacent -2 MHz
-22
GMSK, adjacent ≥ |±3| MHz
-47
Frf=(received RF: 0.6 MHz)
-63
18
MHz
2
GMSK, cochannel
17
Unit
2 480
C/I performance
Rx mode LO leakage
Max.
dBm
8
dB
dBm
Sensitivity degradation up to 3 dB may occur where the Bluetooth LE frequency is a harmonic of the fast
clock.
Numbers show wanted signal-to-interfering signal ratio. Smaller numbers indicate better C/I performance.
Product Specification 1.3
Page 31
PAN1326C2 Bluetooth Module
4 Specification
Bluetooth LE Receiver: General Blocking
Characteristics
Condition
Blocking performance over full
30 to 2 000 MHz
–15
range, according to Bluetooth
2 000 to 2 399 MHz
–15
2 484 to 3 000 MHz
–15
3 to 12.75 GHz
–15
LE specification19
Typ.
Unit
dBm
Bluetooth LE Transmitter
Characteristics
Typ.
RF output power
Max. Unit
VDD_IN=VBAT
8
10
VDD_IN=External regulator to 1.8 V
6
10
Power variation over Bluetooth LE band
1
dBm
dB
Adjacent channel power |M-N|=2
-45
dBm
Adjacent channel power |M-N|>2
-50
dBm
Bluetooth LE Modulation
Characteristics
Condition
Δf1 avg
Δf1avg
Modulation
characteristics
Δf2 max
Min.
Mod data=4 1 s, 4 0 s:
Typ.
240
250
185
210
0.85
0.9
Max. Unit
260
kHz
1111000011110000...
Δf2max ≥ limit for at
Mod data=1010101...
kHz
least 99.9 % of all
Δf2max
Δf2avg, Δf1avg
Absolute carrier frequency drift
-25
Drift rate
Initial carrier frequency tolerance
No.
Parameter
-75
Min.
45 Sensitivity
Typ.
25
kHz
15
kHz/
50 ms
75
kHz
Max. Unit
-81
-93
1 Average Power Hopping DH5
4
11.3
20
dBm
2 Average Power: Ch0
4
11.4
20
dBm
11.6
23
dBm
11.3
20
dBm
Power
3 Peak Power: Ch0
4 Average Power: Ch39
19
4
Exceptions are taken out of the total 10 allowed in the Bluetooth LE specification.
Product Specification 1.3
Page 32
PAN1326C2 Bluetooth Module
4 Specification
No.
Parameter
Min.
5 Peak Power: Ch39
6 Average Power: Ch78
4
7 Peak Power: Ch78
Typ.
Max. Unit
11.6
23
dBm
11.3
20
dBm
11.5
23
dBm
Frequency
8 Max. Frequency Tolerance: Ch0
-75
-2.6
75
kHz
9 Max. Frequency Tolerance: Ch39
-75
-2.2
75
kHz
10 Max. Frequency Tolerance: Ch78
-75
-2.1
75
kHz
11 Max. Drift: Ch0_DH1
-25
3.6
25
kHz
12 Max. Drift: Ch0_DH3
-40
3.7
40
kHz
13 Max. Drift: Ch0_DH5
-40
4.0
40
kHz
14 Max. Drift Rate: Ch0_DH1
-20
-2.6
20
kHz
15 Max. Drift Rate: Ch0_DH3
-20
-3.2
20
kHz
16 Max. Drift Rate: Ch0_DH5
-20
-3.3
20
kHz
17 Max. Drift: Ch39_DH1
-25
4
25
kHz
18 Max. Drift: Ch39_DH3
-40
4.3
40
kHz
19 Max. Drift: Ch39_DH5
-40
4.3
40
kHz
20 Max. Drift Rate: Ch39_DH1
-20
-3.1
20
kHz
21 Max. Drift Rate: Ch39_DH3
-20
-3.6
20
kHz
22 Max. Drift Rate: Ch39_DH5
-20
-3.7
20
kHz
23 Max. Drift: Ch78_DH1
-25
4.1
25
kHz
24 Max. Drift: Ch78_DH3
-40
4.5
40
kHz
25 Max. Drift: Ch78_DH5
-40
4.4
40
kHz
26 Max. Drift Rate: Ch78_DH1
-20
-3.4
20
kHz
27 Max. Drift Rate: Ch78_DH3
-20
-3.9
20
kHz
28 Max. Drift Rate: Ch78_DH5
-20
-4.1
20
kHz
29 Delta F1 Avg: Ch0
140
159.5
175
kHz
30 Delta F2 Max.: Ch0
99.9
100
31 Delta F2 Avg/Delta F1 Avg: Ch0
0.8
0.9
32 Delta F1 Avg: Ch39
140
159.8
33 Delta F2 Max.: Ch39
99.9
100
34 Delta F2 Avg/Delta F1 Avg: Ch39
0.8
0.9
35 Delta F1 Avg: Ch78
140
159.1
36 Delta F2 Max.: Ch78
99.9
100
0.8
0.9
Drift
37 Delta F2 Avg/Delta F1 Avg: Ch78
Product Specification 1.3
%
175
kHz
%
175
kHz
%
Page 33
PAN1326C2 Bluetooth Module
4 Specification
No.
Parameter
Min.
Typ.
Max. Unit
EDR Carrier Frequency Stability and Modulation Accuracy
70 omega i 2-DH5: Ch0
-75
-4.7
75
kHz
71 omega o + omega i 2-DH5: Ch0
-75
-6.0
75
kHz
72 omega o 2-DH5: Ch0
-10
-1.5
10
kHz
73 DEVM RMS 2-DH5: Ch0
0
0.2
%
74 DEVM Peak 2-DH5: Ch0
0.1
0.35
%
75 DEVM 99 % 2-DH5: Ch0
99
100
76 omega i 3-DH5: Ch0
-75
-3.7
75
kHz
77 omega o + omega i 3-DH5: Ch0
-75
-5.8
75
kHz
78 omega o 3-DH5: Ch0
-10
-2.6
10
kHz
79 DEVM RMS 3-DH5: Ch0
0
0.13
%
80 DEVM Peak 3-DH5: Ch0
0.1
0.25
%
81 DEVM 99 % 3-DH5: Ch0
%
99
100
82 omega i 2-DH5: Ch39
-75
-4.8
75
kHz
83 omega o + omega i 2-DH5: Ch39
-75
-6.1
75
kHz
84 omega o 2-DH5: Ch39
-10
-1.4
10
kHz
85 DEVM RMS 2-DH5: Ch39
0
0.2
%
86 DEVM Peak 2-DH5: Ch39
0.1
0.35
%
87 DEVM 99 % 2-DH5: Ch39
%
99
100
88 omega i 3-DH5: Ch39
-75
-3.8
75
kHz
89 omega o + omega i 3-DH5: Ch39
-75
-5.9
75
kHz
90 omega o 3-DH5: Ch39
-10
-2.6
10
kHz
91 DEVM RMS 3-DH5: Ch39
0
0.13
%
92 DEVM Peak 3-DH5: Ch39
0.1
0.25
%
93 DEVM 99% 3-DH5: Ch39
%
99
100
94 omega i 2-DH5: Ch78
-75
-4.9
75
kHz
95 omega o + omega i 2-DH5: Ch78
-75
-6.2
75
kHz
96 omega o 2-DH5: Ch78
-10
-1.4
10
kHz
97 DEVM RMS 2-DH5: Ch78
0
0.2
%
98 DEVM Peak 2-DH5: Ch78
0.1
0.35
%
99 DEVM 99 % 2-DH5: Ch78
%
99
100
100 omega i 3-DH5: Ch78
-75
-3.8
75
kHz
101 omega o + omega i 3-DH5: Ch78
-75
-6.0
75
kHz
102 omega o 3-DH5: Ch78
-10
-2.7
10
kHz
0
0.13
103 DEVM RMS 3-DH5: Ch78
Product Specification 1.3
%
%
Page 34
PAN1326C2 Bluetooth Module
4 Specification
No.
Parameter
Min.
104 DEVM Peak 3-DH5: Ch78
0.1
105 DEVM 99 % 3-DH5: Ch78
4.8
Typ.
99
Max. Unit
0.25
100
%
%
Reliability Tests
The measurement should be done after the test device has been exposed to room temperature
and humidity for one hour.
No.
Item
1 Vibration test
Limit
Electrical parameter should be in
specification
Condition
•
•
Freq.: 10 Hz~50 Hz; Amplitude: 1.5 mm;
20 min./cycle, 1 h. each of XYZ axis
Freq.: 30 Hz~100 Hz, 6 G; 20 min./cycle,
1 h. each of XYZ axis
2 Shock test
See above
Dropped onto hard wood from a height of
50 cm for 3 times
3 Heat cycle test
See above
-40 °C for 30 min. and +85 °C for 30 min.;
each temperature 300 cycles
4 Moisture test
See above
+60 °C, 90 % RH, 300 h
5 Low temperature test
See above
-40 °C, 300 h
6 High temperature test
See above
+85 °C, 300 h
Product Specification 1.3
Page 35
PAN1326C2 Bluetooth Module
4 Specification
4.9
Recommended Soldering Profile
Product Specification 1.3
Reflow permissible cycles: 2
Opposite side reflow is prohibited due to module weight
More than 75 percent of the soldering area shall be coated by solder
The soldering profiles should be adhered to in order to prevent
electrical or mechanical damage
Soldering profile assumes lead-free soldering
Page 36
PAN1326C2 Bluetooth Module
5 Cautions
5 Cautions
Failure to follow the guidelines set forth in this document may result in
degrading of the module functions and damage to the module.
5.1
Design Notes
1. Follow the conditions written in this specification, especially the control signals of this
module.
2. The supply voltage should abide by the maximum ratings ( 4.2 Absolute Maximum
Ratings).
3. The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for
example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF
directly at the module).
4. This module should not be mechanically stressed when installed.
5. Keep this module away from heat. Heat is the major cause of decreasing the life time of
these modules.
6. Avoid assembly and use of the target equipment in conditions where the module
temperature may exceed the maximum tolerance.
7. Keep this module away from other high frequency circuits.
8. Refer to the recommended pattern when designing a board.
5.2
Installation Notes
1. Reflow soldering is possible twice based on the conditions set forth in
4.9 Recommended Soldering Profile. Set up the temperature at the soldering portion
of this module according to this reflow profile.
2. Carefully position the module so that the heat will not burn into printed circuit boards or
affect other components that are susceptible to heat.
3. Carefully locate the module, to avoid an increased temperature caused by heat
generated by neighboring components.
4. If a vinyl-covered wire comes into contact with the module, the wire cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between a vinyl cover
and these modules to occur.
5. This module should not be mechanically stressed or vibrated when reflowed.
6. To repair the board by hand soldering, follow the conditions set forth in this chapter.
7. Do not wash this product.
8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage
to the module.
Product Specification 1.3
Page 37
PAN1326C2 Bluetooth Module
5 Cautions
5.3
Usage Condition Notes
1. Take measures to protect the module against static electricity.
If pulses or transient loads (a large load, which is suddenly applied) are applied to the
modules, check and evaluate their operation before assembly of the final products.
2. Do not use dropped modules.
3. Do not touch, damage, or soil the pins.
4. Follow the recommended condition ratings about the power supply applied to this
module.
5. Electrode peeling strength: Do not apply a force of more than 4.9 N in any direction on
the soldered module.
6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause
damage.
7. These modules are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information, and communication
equipment.
5.4
Storage Notes
1. The module should not be stressed mechanically during storage.
2. Do not store these modules in the following conditions or the performance characteristics
of the module, such as RF performance will be adversely affected:
–
Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX,
–
Storage in direct sunlight,
–
Storage in an environment where the temperature may be outside the range of 5 °C to
35 °C, or where the humidity may be outside the 45 % to 85 % range,
–
Storage of the modules for more than one year after the date of delivery storage period:
Please check the adhesive strength of the embossed tape and soldering after 6 months
of storage.
3. Keep this module away from water, poisonous gas, and corrosive gas.
4. This module should not be stressed or shocked when transported.
5. Follow the specification when stacking packed crates (max. 10).
5.5
Safety Cautions
These specifications are intended to preserve the quality assurance of products and individual
components.
Before use, check and evaluate the operation when mounted on your products. Abide by these
specifications without deviation when using the products. These products may short-circuit. If
electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a
short circuit occurs, provide the following failsafe functions as a minimum:
Product Specification 1.3
Page 38
PAN1326C2 Bluetooth Module
5 Cautions
1. Ensure the safety of the whole system by installing a protection circuit and a protection
device.
2. Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
5.6
Other Cautions
1. Do not use the module for other purposes than those listed in section 5.3 Usage
Condition Notes.
2. Be sure to provide an appropriate fail-safe function on your product to prevent any
additional damage that may be caused by the abnormal function or the failure of the
module.
3. This module has been manufactured without any ozone chemical controlled under the
Montreal Protocol.
4. These modules are not intended for use under the special conditions shown below.
Before using these modules under such special conditions, carefully check their
performance and reliability under the said special conditions to determine whether or not
they can be used in such a manner:
–
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash,
–
In direct sunlight, outdoors, or in a dusty environment,
–
In an environment where condensation occurs,
–
In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2,
H2S, NH3, and NOX).
5. If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these modules with new modules, because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
Please refer to the Panasonic website for for further information
7.2.2 Product Information.
Product Specification 1.3
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PAN1326C2 Bluetooth Module
5 Cautions
5.7
5.7.1
Restricted Use
Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a
significant personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect it is safety or effectiveness.
Panasonic customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any
damages resulting.
5.7.2
Restricted End Use
This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted
activity that supports the development, production, handling usage, maintenance, storage,
inventory or proliferation of any weapons or military use.
Transfer, export, re-export, usage or reselling of this product to any destination, end user or any
end use prohibited by the European Union, United States or any other applicable law is strictly
prohibited.
Product Specification 1.3
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PAN1326C2 Bluetooth Module
6 Regulatory and Certification Information
6 Regulatory and Certification Information
6.1
6.1.1
Federal Communications Commission (FCC) for US
FCC Notice
The PAN1326C2, including the ceramic antenna and the antennas, which are
listed in 6.1.5 Approved Antenna List, complies with Part 15 of the FCC
Rules.
The device meets the requirements for modular transmitter approval as detailed in FCC public
Notice DA00-1407. The transmitter operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may
cause undesired operation.
The FCC identifier for ENW89823A5KF is FCC ID: T7V1326C2.
6.1.2
Caution
The FCC requires the user to be notified that any changes or modifications
made to this device that are not expressly approved by
Panasonic Industrial Devices Europe GmbH may void the user's authority to
operate the equipment.
This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates uses and
can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications.
There is no guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on.
Product Specification 1.3
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PAN1326C2 Bluetooth Module
6 Regulatory and Certification Information
It is recommended to try to correct the interference by one or more of the
following measures:
6.1.3
•
•
•
Reorient or relocate the receiving antenna.
•
Consult the dealer or an experienced radio/TV technician for help.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to
which the receiver is connected.
Label Requirements
The OEM must ensure that FCC labelling requirements are met. This includes
a clearly visible label (laser marking) on the outside of the OEM enclosure
specifying the appropriate Panasonic FCC identifier for this product as well as
the FCC Notice above.
The FCC identifier for model ENW89823A5KF is FCC ID: T7V1326C2.
This FCC identifier is valid for the PAN1326C2. The end product must in any case be labelled
on the exterior with:
“Contains FCC ID: T7V1326C2”.
6.1.4
Antenna Warning
The device is tested with a standard SMA connector and with the antenna listed below. When
integrated into the OEM’s product, these fixed antennas require installation preventing end
users from replacing them with non-approved antennas. Any antenna not in the following table
must be tested to comply with FCC Section 15.203 for unique antenna connectors and with
Section 15.247 for emissions. The FCC identifier for the device with the antenna listed in
6.1.5 Approved Antenna List is the same (FCC ID: T7V1326C2).
6.1.5
Approved Antenna List
Item
Part Number
1 ANT016008LCS2442MA1
Manufacturer
Frequency Band
Type
TDK
2.4 GHz
Chip antenna
Gain (dBi)
+1.6
We are able to qualify your antenna and will add it to this list when the
certification process is completed.
Product Specification 1.3
Page 42
PAN1326C2 Bluetooth Module
6 Regulatory and Certification Information
6.1.6
RF Exposure
To comply with FCC RF Exposure requirements, the OEM must ensure that
only antennas from the Approved Antenna List are installed 6.1.5 Approved
Antenna List.
The preceding statement must be included as a caution statement in manuals
for products operating with the approved antennas in the previous table to alert
users on FCC RF Exposure compliance.
Any notification to the end user of installation or removal instructions about the
integrated radio module is not allowed.
The radiated output power of the PAN1326C2 with a mounted ceramic chip
antenna (FCC ID: T7V1326C2 for model ENW89823A5KF) are fulfilled for
portable configuration. The PAN1326C2 shall be used in such a manner that the
potential for human contact during normal operation is minimized.
End users may not be provided with the module installation instructions.
OEM integrators and end users must be provided with transmitter operating
conditions for satisfying RF exposure compliance.
6.1.7
Integration Instructions for Host Product Manufacturers According to KDB
996369 D03 OEM Manual v01
Section
Topic and comment
2.2
List of applicable FCC rules
FCC part 15.247 operation within the bands 902 MHz to 928 MHz, 2 400 MHz to 2 483.5 MHZ,
and 5 725 MHz to 5 850 MHz
2.3
Specific operational use conditions
Please refer to 5 Cautions and especially part 5.3 Usage Condition Notes.
2.4
Limited module procedures
Not applicable.
The module has a single-modular transmitter approval.
2.5
Trace antenna designs
Not applicable.
The module has a fixed ceramic chip antenna.
2.6
RF exposure considerations
Portable (Distance to human body
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