PAN9028
Wi-Fi Dual Band 2.4 GHz/5 GHz and Bluetooth® Module
Product Specification
Rev. 0.2
Wireless Connectivity
PAN9028 Bluetooth Module
Overview
The PAN9028 is a 2.4 GHz and 5 GHz ISM band
Wi-Fi and Bluetooth radio module, which includes a
wireless radio and a power management IC for
easy integration of Wi-Fi and Bluetooth connectivity
into various electronic devices.
Features
• Dual band 2.4 GHz and 5 GHz 802.11 a/b/g/n/ac
Wi-Fi/Bluetooth combo module
•
•
•
•
•
•
•
•
•
•
•
•
Power management with sleep clock
Coexistence interface for arbitration of
co-located WLAN, Bluetooth, or mobile wireless
system (e.g. LTE or ZigBee®)
Generic interfaces include SDIO 3.0 and
high-speed UART for host processor connection
Software driver Linux®
Characteristics
• Surface Mount Type (SMT)
24 mm × 12 mm × 2.8 mm
Supports 802.11i security standards through AES,
CCMP, and more security mechanism
•
802.11e Quality of Service is supported for
multimedia application
NXP® 88W8987 WLAN 2.4 GHz and 5 GHz and
Bluetooth single-chip solution inside
•
IEEE 802.11ac (Wave 2), 1×1 spatial stream with
data rates up to 433 Mbps (MCS9, 80 MHz
channel bandwidth)
Single power supply: 3.3 V with Marvell®
88PG823 Power Management IC (optional)
•
•
Tx power: 16 dBm at 802.11b
•
IEEE 802.11ac 20 MHz, 40 MHz, 80 MHz
channel bandwidth
IEEE 802.11ac MU-MIMO beamformee
Bluetooth 5 (includes Low Energy)
Dual simultaneous and independent WLAN and
Bluetooth operation
Dynamic Rapid Channel Switching (DRCS) for
simultaneous operation in 2.4 GHz and 5 GHz
bands
Indoor location and navigation with
IEEE 802.11mc
•
•
•
•
Rx sensitivity: –97 dBm at 802.11b DSSS
1 Mbps
Long and Short Guard Interval support
Current consumption Wi-Fi typical 320 mA (at
Tx) and 60 mA (at Rx)
SDIO 1 bit or 4 bit
Wide temperature range of -30 °C to 85 °C
Block Diagram
Product Specification Rev. 0.2
Page 2 of 83
PAN9028 Bluetooth Module
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations. Panasonic
Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time
without notification. Please consult the most recently issued Product Specification before initiating or
completing a design.
© Panasonic Industrial Devices Europe GmbH 2020.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do
not disclose it to a third party.
All rights reserved.
This Product Specification does not lodge the claim to be complete and free of mistakes.
Document Acceptance
By signing the Product Specification, you acknowledge that you are a legal representative for your
company and that you understand and accept the validity of the contents herein.
If the signed version of the Product Specification has not been returned to Panasonic within 30 days
after receipt of the product, the specification or approval sheet shall be deemed to be accepted by
you.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Product Specification and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
•
The use of the Engineering Sample other than for evaluation purposes, particularly the installation
or integration in another product to be sold by the customer,
•
Deviation or lapse in function of the Engineering Sample,
•
Improper use of the Engineering Sample.
•
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and
incidental damages. In case of any queries regarding the Engineering Samples, please contact
your local sales partner or the related product manager.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.
Product Specification Rev. 0.2
Page 3 of 83
PAN9028 Bluetooth Module
Table of Contents
1
2
3
4
5
About This Document .................................................................................................................. 6
1.1
Purpose and Audience......................................................................................................... 6
1.2
Revision History .................................................................................................................. 6
1.3
Use of Symbols ................................................................................................................... 6
1.4
Related Documents ............................................................................................................. 6
Overview....................................................................................................................................... 7
2.1
Block Diagram ..................................................................................................................... 8
2.2
Pin Configuration ................................................................................................................. 9
2.3
Host Interface .................................................................................................................... 16
2.4
Peripheral Bus Interfaces ................................................................................................... 16
2.5
PCM Interfaces.................................................................................................................. 17
2.6
Coexistence ...................................................................................................................... 17
2.7
WLAN ............................................................................................................................... 27
2.8
Bluetooth........................................................................................................................... 32
Detailed Description ................................................................................................................... 35
3.1
Dimensions ....................................................................................................................... 35
3.2
Footprint............................................................................................................................ 36
3.3
Packaging ......................................................................................................................... 37
3.4
Case Marking .................................................................................................................... 40
Specification............................................................................................................................... 41
4.1
Default Test Conditions...................................................................................................... 41
4.2
Absolute Maximum Ratings................................................................................................ 41
4.3
Recommended Operating Conditions ................................................................................. 42
4.4
Current Consumption ......................................................................................................... 44
4.5
Internal Operating Frequencies .......................................................................................... 49
4.6
External Sleep Clock Specifications (only for Module Variant ENWF940[x]A2EF) ................ 50
4.7
Power-up Sequence .......................................................................................................... 50
4.8
Power-down Sequence ...................................................................................................... 51
4.9
Power Good (only for Module Variant ENWF940[x]A1EF) ................................................... 52
4.10
Interfaces .......................................................................................................................... 52
4.11
RF Electrical Characteristics .............................................................................................. 62
4.12
Reliability Tests ................................................................................................................. 75
4.13
Recommended Soldering Profile ........................................................................................ 76
Cautions ..................................................................................................................................... 77
5.1
Design Notes..................................................................................................................... 77
5.2
Installation Notes ............................................................................................................... 77
5.3
Usage Condition Notes ...................................................................................................... 78
5.4
Storage Notes ................................................................................................................... 78
5.5
Safety Cautions ................................................................................................................. 78
5.6
Other Cautions .................................................................................................................. 79
5.7
Restricted Use................................................................................................................... 80
Product Specification Rev. 0.2
Page 4 of 83
PAN9028 Bluetooth Module
6
Regulatory and Certification Information .................................................................................. 81
7
Appendix .................................................................................................................................... 82
7.1
Ordering Information .......................................................................................................... 82
7.2
Contact Details .................................................................................................................. 83
Product Specification Rev. 0.2
Page 5 of 83
PAN9028 Bluetooth Module
1 About This Document
1 About This Document
1.1
Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic PAN9028 module. It is intended for hardware design,
application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to
as “the PAN9028” or “the module” within this document. Unless otherwise stated the data in this
document is valid for all module variants.
1.2
Revision History
Revision
Date
Modifications/Remarks
0.1
2017-09-15
First preliminary version
0.2
2020-08-28
New design. Added CPU frequencies, chapter “Restricted End Use”,
additional module and kit variants and versions, second module variant
without PMIC and 32 kHz, module specific parameters, MR variant.
Changed storage temperature.
Updated disclaimer, product overview, chapter “Overview”, block diagram.
Formal changes.
1.3
Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4
Related Documents
For related documents please refer to the Panasonic website 7.2.2 Product Information.
Product Specification Rev. 0.2
Page 6 of 83
PAN9028 Bluetooth Module
2 Overview
2 Overview
The PAN9028 is a dual band 2.4 GHz and 5 GHz 802.11 a/b/g/n/ac Wi-Fi radio module with
integrated Bluetooth BR/EDR/Low Energy (LE), specifically designed for highly integrated and
cost-effective applications. The simultaneous and independent operation of the two standards
enables very high data rates (802.11ac) and low-power operation (Bluetooth LE). Integrated
power management, a fast dual-core CPU, 802.11i security standard support, and high-speed
data interfaces deliver the performance for the speed, reliability, and quality requirements of
next generation products. Tx power calibration data, Wi-Fi, and Bluetooth system parameters
are pre-stored on the one-time-programmable memory of the PAN9028 during production at
Panasonic. This simplifies passing the certification process for PAN9028 customers.
Furthermore, the module reduces design, test, and calibration effort resulting in reduced timeto-market compared to discrete solutions.
Integrating Wi-Fi and Bluetooth wireless connectivity allows high throughput applications for
industrial devices and appliances. The combination of Wi-Fi and Bluetooth provides the highest
flexibility for connectivity.
For related documents please refer to 7.2.2 Product Information.
For further information on the variants and versions please refer to 7.1 Ordering Information.
Product Specification Rev. 0.2
Page 7 of 83
PAN9028 Bluetooth Module
2.1
2 Overview
Block Diagram
For Module Variant ENWF940[x]A1EF:
For Module Variant ENWF940[x]A2EF:
Product Specification Rev. 0.2
Page 8 of 83
PAN9028 Bluetooth Module
2.2
2 Overview
Pin Configuration
Pin Assignment
Top View
Pin Functions for Module Variant ENWF940[x]A1EF
No.
Pin Name
Pin Type
Description
A1
GND
Ground pin
Connect to ground
A2
PMIC_EN
Input signal
Power down of the PMIC, active-low
A3
VOUT1V1
Power
+1.1 V power supply output, only for internal supply
A4
IO143
Digital I/O
General Purpose I/O – GPIO [14]
NC
Do not connect
Input signal
Clear-to-send input from peripheral device
IO103
Digital I/O
General Purpose I/O – GPIO [10]
UART_RTS
Output signal
Request-to-send output to peripheral device
IO113
Digital I/O
General Purpose I/O – GPIO [11]
UART_SIN
Input signal
Serial data input to peripheral device
IO93
Digital I/O
General Purpose I/O – GPIO [9]
A5
A6
DNC
1
UART_CTS
A71
A81
2
1
Multi-purpose pins: After the firmware download, the pins (GPIO, Serial Interface, RF control) are
programmed in functional mode with dedicated functionality.
2
UART mode: After the dedicated firmware download, the pin is used as Host Controller Interface (HCI) for
Bluetooth.
3
GPIO Mode: After the dedicated firmware download, the pin is used as Multi-Purpose Interface.
Product Specification Rev. 0.2
Page 9 of 83
PAN9028 Bluetooth Module
2 Overview
No.
Pin Name
Pin Type
Description
A9
DNC
NC
Do not connect
A10
IO203
Digital I/O
General Purpose I/O – GPIO [20]
A11
RF_SW2
Input signal
RF Switch Pin 2 – logical voltage level to activate on-board
antenna of RF Pad RF-Switch Pin Function
A12
GND
Ground pin
Connect to ground
B1
PG1
Output signal
+1.1 V Power Good Output (float when not used)
4.9 Power Good
B2
IO13
Digital I/O
General Purpose I/O – GPIO [1]
B3
32KHZ_EN
Input signal
Disable internal 32.768 kHz crystal oscillator for LP modes (100
to GND)
B4
IO03
Digital I/O
General Purpose I/O – GPIO [0]
B5
DNC
NC
Do not connect
B61
UART_DSR
Input signal
Data set ready from peripheral device
IO123
Digital I/O
General Purpose I/O – GPIO [12]
UART_DTR
Output signal
Data terminal ready to peripheral device
IO133
Digital I/O
General Purpose I/O – GPIO [13]
UART_SOUT
Output signal
Serial data output to peripheral device
IO83
Digital I/O
General Purpose I/O – GPIO [8]
B9
IO153
Digital I/O
General Purpose I/O – GPIO [15]
B101
COEX_OUT
Output signal
Serial data output to MWS modem or peripheral device
IO173
Digital I/O
General Purpose I/O – GPIO [17]
RF_SW1
Input signal
RF Switch Pin 1 – logical voltage level to activate on-board
B71
B81
B11
antenna of RF Pad RF-Switch Pin Function
B12
GND
Ground pin
Connect to ground
C1
PGLDO
Output signal
+1.8 V Power Good Output (float when not used)
4.9 Power Good
C6
CNTL2
Input signal
Do not connect
C11
GND
Ground pin
Connect to ground
C12
GND
Ground pin
Connect to ground
D1
PG2
Output signal
+2.2 V Power Good Output (float when not used)
4.9 Power Good
D6
CNTL0
Input signal
Keep open (DNC) if using SDIO interface for Bluetooth or connect
with 100 k to GND if using UART interface for Bluteooth
Control Pin Function.
D11
GND
Ground pin
Connect to ground
D12
GND
Ground pin
Connect to ground
Product Specification Rev. 0.2
Page 10 of 83
PAN9028 Bluetooth Module
2 Overview
No.
Pin Name
Pin Type
Description
E11
PCM_CLK
Input/Output
PCM clock signal, output if PCM master, input if PCM slave
IO63
Digital I/O
General Purpose I/O – GPIO [6]
E6
DNC
NC
Do not connect
E11
GND
Ground pin
Connect to ground
E12
GND
Ground pin
Connect to ground
F1
GND
Ground pin
Connect to ground
F2
VDD3V3
Power
+3.3 V power supply connection
F3
VDD3V3
Power
+3.3 V power supply connection
F4
VIOSD
Power
+1.8 V or +3.3 V Digital I/O SDIO power supply
F51
COEX_SIN
Input signal
Serial data input from MWS modem or peripheral device
IO163
Digital I/O
General Purpose I/O – GPIO[16]
PCM_SYNC
Input/Output
PCM Sync Pulse signal, output if PCM master, input if PCM slave
IO73
Digital I/O
General Purpose I/O – GPIO [7]
PCM_DOUT
Output signal
PCM data output signal
IO53
Digital I/O
General Purpose I/O – GPIO [5]
LED_WLAN
Output pin
WLAN activity LED control
IO23
Digital I/O
General Purpose I/O – GPIO [2]
LED_BT
Output pin
Bluetooth activity LED control
IO33
Digital I/O
General Purpose I/O – GPIO [3]
PCM_DIN
Input signal
PCM data input signal
IO43
Digital I/O
General Purpose I/O – GPIO [4]
F11
GND
Ground pin
Connect to ground
F12
GND
Ground pin
Connect to ground
G1
VOUT2V2
Power
+2.2 V power supply output, only for internal supply
G2
VOUT2V2
Power
+2.2 V power supply output, only for internal supply
G3
VIO
Power
+1.8 V or +3.3 V power supply for General Purpose I/O and UART
G4
VOUT1V8
Power
+1.8 V power supply output, only for internal supply
G5
SD_CLK
Digital I/O
For SDIO specific terminals please refer to SDIO Pin Functions.
G6
SD_CMD
Digital I/O
G7
SD_DAT0
Digital I/O
G8
SD_DAT1
Digital I/O
G9
SD_DAT2
Digital I/O
G10
SD_DAT3
Digital I/O
F61
F71
F81
F91
F101
Product Specification Rev. 0.2
Page 11 of 83
PAN9028 Bluetooth Module
2 Overview
No.
Pin Name
Pin Type
Description
G11
GND
Ground pin
Connect to ground
G12
RF_OUT
RF port
50 bottom pad to be activated by RF_SW1/RF_SW2 control
voltage RF-Switch Pin Function.
EP1
EPAD1
Thermal pin
Connect to ground
EP2
EPAD2
Thermal pin
Connect to ground
EP3
EPAD3
Thermal pin
Connect to ground
EP4
EPAD4
Thermal pin
Connect to ground
The VOUT1V1, VOUT1V8 and VOUT2V2 power supply pins are only for internal
purpose. VOUT1V8 may be used to power VIO/VIOSD of the module.
Do not use them to power external curcuits.
Pin Functions for Module Variant ENWF940[x]A2EF
No.
Pin Name
Pin Type
Description
A1
GND
Ground pin
Connect to ground
A2
DNC
NC
Do not connect
A3
VDD1V1
Power
+1.1 V power supply connection
A4
IO143
Digital I/O
General Purpose I/O – GPIO [14]
A5
DNC
NC
Do not connect
A61
UART_CTS2
Input signal
Clear-to-send input from peripheral device
IO103
Digital I/O
General Purpose I/O – GPIO [10]
UART_RTS
Output signal
Request-to-send output to peripheral device
IO113
Digital I/O
General Purpose I/O – GPIO [11]
UART_SIN
Input signal
Serial data input to peripheral device
IO93
Digital I/O
General Purpose I/O – GPIO [9]
A9
DNC
NC
Do not connect
A10
IO203
Digital I/O
General Purpose I/O – GPIO [20]
A11
RF_SW2
Input signal
RF Switch Pin 2 – logical voltage level to activate on-board
antenna of RF Pad RF-Switch Pin Function.
A12
GND
Ground pin
Connect to ground
B1
DNC
NC
Do not connect
B2
IO13
Digital I/O
General Purpose I/O – GPIO [1]
B3
DNC
NC
Do not connect
A71
A81
Product Specification Rev. 0.2
Page 12 of 83
PAN9028 Bluetooth Module
2 Overview
No.
Pin Name
Pin Type
Description
B4
IO03
Digital I/O
General Purpose I/O – GPIO [0]
B5
PDn
Input signal
Power Down. Low active
B61
UART_DSR
Input signal
Data set ready from peripheral device
IO123
Digital I/O
General Purpose I/O – GPIO [12]
UART_DTR
Output signal
Data terminal ready to peripheral device
IO133
Digital I/O
General Purpose I/O – GPIO [13]
UART_SOUT
Output signal
Serial data output to peripheral device
IO83
Digital I/O
General Purpose I/O – GPIO [8]
B91
IO153
Digital I/O
General Purpose I/O – GPIO [15]
B101
COEX_OUT
Output signal
Serial data output to MWS modem or peripheral device
IO173
Digital I/O
General Purpose I/O – GPIO [17]
B11
RF_SW1
Input signal
RF Switch Pin 1 – logical voltage level to activate on-board
antenna of RF Pad RF-Switch Pin Function.
B12
GND
Ground pin
Connect to ground
C1
DNC
NC
Do not connect
C6
CNTL2
Input signal
Connect this pin (with 50 k to 100 k) to GND
C11
GND
Ground pin
Connect to ground
C12
GND
Ground pin
Connect to ground
D1
DNC
NC
Do not connect
D6
CNTL0
Input signal
Keep open (DNC) if using SDIO interface for Bluetooth or connect
with 100 k to GND if using UART interface for Bluetooth
Control Pin Function.
D11
GND
Ground pin
Connect to ground
D12
GND
Ground pin
Connect to ground
E11
PCM_CLK
Input/Output
PCM clock signal, output if PCM master, input if PCM slave
IO63
Digital I/O
General Purpose I/O – GPIO [6]
E6
DNC
NC
Do not connect
E11
GND
Ground pin
Connect to ground
E12
GND
Ground pin
Connect to ground
F1
GND
Ground pin
Connect to ground
F2
VDD3V3
Power
+3.3 V power supply connection
F3
VDD3V3
Power
+3.3 V power supply connection
B71
1,4
B8
4
Keep this pin open until firmware initialization or reset is finished. The definition of this pin changes
immediately after firmware initialization or reset to its usual function
Product Specification Rev. 0.2
Page 13 of 83
PAN9028 Bluetooth Module
2 Overview
No.
Pin Name
Pin Type
Description
F4
VIOSD
Power
+1.8 V or +3.3 V Digital I/O SDIO power supply
F51
COEX_SIN
Input signal
Serial data input from MWS modem or peripheral device
IO163
Digital I/O
General Purpose I/O – GPIO [16]
PCM_SYNC
Input/Output
PCM Sync Pulse signal, output if PCM master, input if PCM slave
IO73
Digital I/O
General Purpose I/O – GPIO [7]
PCM_DOUT
Output signal
PCM data output signal
IO5
Digital I/O
General Purpose I/O – GPIO [5]
LED_WLAN
Output pin
WLAN activity LED control
IO23
Digital I/O
General Purpose IO – GPIO [2]
LED_BT
Output pin
Bluetooth activity LED control
IO33
Digital I/O
General Purpose I/O – GPIO [3]
PCM_DIN
Input signal
PCM data input signal
IO43
Digital I/O
General Purpose I/O – GPIO [4]
F11
GND
Ground pin
Connect to ground
F12
GND
Ground pin
Connect to ground
G1
VDD2V2
Power
+2.2 V power supply connection
G2
VDD2V2
Power
+2.2 V power supply connection
G3
VIO
Power
+1.8 V or +3.3 V power supply for General Purpose I/O and UART
G4
VDD1V8
Power
+1.8 V power supply connection
G5
SD_CLK
Digital I/O
For SDIO specific terminals please refer to SDIO Pin Functions.
G6
SD_CMD
Digital I/O
G7
SD_DAT0
Digital I/O
G8
SD_DAT1
Digital I/O
G9
SD_DAT2
Digital I/O
G10
SD_DAT3
Digital I/O
G11
GND
Ground pin
Connect to ground
G12
RF_OUT
RF port
50 bottom pad to be activated by RF_SW1/RF_SW2 control
voltage RF-Switch Pin Function.
EP1
EPAD1
Thermal pin
Connect to ground
EP2
EPAD2
Thermal pin
Connect to ground
EP3
EPAD3
Thermal pin
Connect to ground
EP4
EPAD4
Thermal pin
Connect to ground
F61
F71
3
F81
F91
F101
Product Specification Rev. 0.2
Page 14 of 83
PAN9028 Bluetooth Module
2 Overview
SDIO Pin Functions for all Module Variants
No.
Pin Name
Pin Type
Description
4-Bit Mode
1-Bit Mode
G5
SD_CLK
Digital I/O
Clock
Clock
G6
SD_CMD
Digital I/O
Command Line
Command Line
G7
SD_DAT0
Digital I/O
Data Line bit [0]
Data Line
G8
SD_DAT1
Digital I/O
Data Line bit [1] or Interrupt
(optional)
Interrupt
G9
SD_DAT2
Digital I/O
Data Line bit [2] or Read Wait
(optional)
Read Wait (optional)
G10
SD_DAT3
Digital I/O
Data Line bit [3]
Not used
RF-Switch Pin Functions for all Module Variants
No.
Pin Name
Pin Type
Logical Level for Activation
On-Board Chip Antenna
RF OUT Pin
B11
RF_SW1
Input signal
GND (0 V)
3.0 V to 3.6 V (typ. 3.3 V)
A11
RF_SW2
Input signal
3.0 V to 3.6 V (typ. 3.3 V)
GND (0 V)
Control Pin Function for all Module Variants
The control pin is used as configuration input to set parameters following a reset. The definition
of the pin changes immediately after a reset to its usual function. To set a configuration bit to
“02, attach a 50 k to 100 k resistor from the pin to ground. No external circuitry is required to
set a configuration bit to “1”.
The configuration of the control pin is used for the firmware boot option. The
software reads and boots accordingly.
No.
D6
Pin
Name
Pin Type
CNTL0
Input Signal
Product Specification Rev. 0.2
Strap
Value
WLAN
Bluetooth/
Bluetooth
LE
Firmware Download
0
1
Number SDIO
Functions
Type
Mode
SDIO
UART
SDIO+UART
Parallel/Serial 1 (WLAN)
SDIO
SDIO
SDIO+SDIO
Parallel/Serial 2 (WLAN,
Bluetooth)
Page 15 of 83
PAN9028 Bluetooth Module
2.3
2 Overview
Host Interface
The bus interface connects several host interface bus units to the CPU bus of the device
through the internal bus. The connection of each unit is multiplexed with other bus units.
The high-speed UART interface is connected to the CPU bus through a separate bus.
Type
Features
High-speed UART interface
The device supports a high-speed Universal Asynchronous
Receiver/Transmitter (UART) interface, compliant with the industry
standard 16550 specification.
•
•
•
•
SDIO interface
FIFO mode permanently selected for transmit and receive operations
Two pins for transmit and receive operations
Two flow control pins
Interrupt triggers for low-power, high throughput operation
The device supports an SDIO device interface that conforms to the
industry standard SDIO full-speed card specification and allows a host
controller using the SDIO bus protocol to access the device.
•
•
•
•
•
Supports SDIO 3.0 Standard
1-bit SDIO or 4-bit SDIO transfer modes with full clock range up to
208 MHz
On-chip memory used for CIS
Special interrupt register for information exchange
Allows card to interrupt host
For further information please refer to 4.10.1 Host Interface.
2.4
Peripheral Bus Interfaces
The Peripheral Bus Unit (PBU) connects several low speed peripherals to the internal bus of the
device. The device consists of the GPIO Interface and the One Time Programmable
Memory (OTP).
Type
General Purpose I/O (GPIO)
Interface
One Time Programmable
Memory (OTP)
Features
•
•
•
•
•
•
User-defined GPIOs (each configured to either input or output)
Each GPIO controlled independently
Each I/O configurable to output bit from GPIO_OUT
Storing device-specific calibration data and hardware information like
MAC/BD address, WLAN, and Bluetooth parameters
Programmed during production process of device
Device performs calibration when it is powered up
For further information please refer to 4.10.2 Peripheral Interface.
Product Specification Rev. 0.2
Page 16 of 83
PAN9028 Bluetooth Module
2.5
2 Overview
PCM Interfaces
The device supports the PCM interface.
Type
Features
PCM Interface
•
•
•
•
Master or slave mode
PCM bit width size of 8 bits or 16 bits
Up to four slots with configurable bit width and start positions
Short frame and long frame synchronization
For further information please refer to 4.10.3 Audio Interface.
2.6
Coexistence
The implemented coexistence framework is based on the IEEE 802.15.2 recommended practice
Packet Traffic Arbitration (PTA) scheme and the Bluetooth Special Interest Group (Bluetooth)
Core Specification Volume 7 (Wireless Coexistence Volume).
2.6.1
WLAN and Bluetooth Channel Information Exchange
Since Bluetooth and IEEE 802.11b/g/n WLAN use the same 2.4 GHz frequency band, each can
cause interference with the other. The level of interference depends on the respective frequency
channel used by Bluetooth and WLAN (other factors can impact interference, like Tx power and
Rx sensitivity of the device).
In a system with both Bluetooth and WLAN, the common host receives information about WLAN
channel usage and passes the information to the Bluetooth device. For Bluetooth 1.2 devices
with Adaptive Frequency Hopping (AFH) enabled, the Bluetooth device can block channel
usage that overlaps the WLAN channel in use.
When the Bluetooth device avoids all channels used by the WLAN, the impact of interference is
reduced, but not completely eliminated. For Bluetooth 1.1 devices, the Bluetooth device cannot
block WLAN channel usage. In this case, a Bluetooth Coexistence Arbiter (BCA) scheme at
MAC level is required. The BCA scheme can also be used with Bluetooth 1.2 devices to further
reduce the impact of interference to a minimum.
2.6.2
External Mobile Wireless System (LTE or ZigBee) and BCA Exchange
Based on the Bluetooth SIG Wireless Coexistence Volume, the device supports a Wireless
Coexistence Interface 2 (WCI-2) protocol for WLAN/Bluetooth coexistence with an external
Mobile Wireless System (MWS), such as a Long Term Evolution (LTE) or ZigBee device.
WCI-2 is a 2-wire transport interface. An internal coexistence is used to exchange request/grant
with the BCA.
2.6.3
System Configuration
Product Specification Rev. 0.2
Page 17 of 83
PAN9028 Bluetooth Module
2 Overview
External MWS Device
RF Front End
BCA BT
CTL
WLAN
MAC
BCA WLAN
CTL
Bluetooth
BCA
MWS to BCA
COEX SIN
BCA to MWS
COEX SOUT
External LTE
Device
88W8987 Radio SoC
Host
2.6.4
WCI-2 Interface
The coexistence interface includes a Mobile Wireless System (MWS) transport controller to
accommodate a 2-wire, UART-based serial transport interface. This interface is a standard
full-duplex UART (TxD and RxD) carrying logical signals framed as UART characters. In
addition, it allows support of multiple logical channels.
Interface Signals
Pin No.
Signal Name
Specification
Name
Pin Type
Description
F5
COEX_SIN
RxD
Input
Serial data from external MWS device
B10
COEX_SOUT
TxD
Output
Serial data to external MWS device
Signal Waveform Format
The messaging is based on a standard UART format. The UART signals should be connected
like a null-modem. For example, the local TxD connected to the remote RxD and vice versa.
Product Specification Rev. 0.2
Page 18 of 83
PAN9028 Bluetooth Module
2 Overview
Interface Transport Settings
Item
Range
Comment
Baudrate
921 600 ~ 4 000 000
Baud
Data Bits
8
LSB first
Parity Bits
0
No parity
Stop Bit
1
One stop bit
Flow Control
No
No flow control
Support Baud Rates
Baud
921 600
2 000 000
3 000 000
4 000 000
Real-Time Signaling Message
The real-time signaling message is used to transport real-time signals over the 2-wire transport
interface.
The real-time signaling message conveys the real-time signals (Bluetooth Core Specification,
Volume 7, Part A) in one message. The time reference point for the real-time signaling message
is the end of message bit 5 (transition to stop bit).
Defined real-time signaling messages include:
•
•
Coexistence Controller to MWS device
MWS device to Coexistence Controller
Real-Time Signaling
MSG [0]
MSG [1]
MSG [2]
MSG [3]
MSG [4]
MWS to Coexistence
Controller (Signal)
FRAME_SYNC
MWS_RX
MWS_TX
PATTERN [0]
PATTERN [1]
Coexistence Controller to
MWS (Message)
BLUETOOTH
_RX_PRI
BLUETOOTH
_TX_ON
802_RX_PRI
802_TX_ON
RFU
Product Specification Rev. 0.2
Page 19 of 83
PAN9028 Bluetooth Module
2 Overview
Signal Name
FRAME_SYNC
MWS_RX
MWS_TX
PATTERN [1, 0]
BT_RX_PRI
BT_TX_ON
802_RX_PRI
802_TX_ON
MWS_INACTIVITY_DURATION
MWS_SCAN_FREQUENCY_OFFSET
Transport Control Message
The transport control messages can modify the state and request state information of the MWS
coexistence interface.
Message
MSG [0]
Transport Control Message RESEND_REAL
_TIME
MSG [1]
MSG [2]
MSG [3]
MSG [4]
RFU
RFU
RFU
RFU
Signal Name
Description
RESEND_REAL_TIME
This bit is set if a device wants to get a status update of the real-time signals.
The signal is usually used after wake-up from sleep of the transport interface to
get an update of the real-time signals.
If the receiving device’s transport interface is awake it shall send a real-time
message with the current status of the real-time signals within 4 UART
character period. If the signal is not transmitted within 4 UART character
periods, the device is considered asleep.
If the receiving device’s transport interface is not awake it shall not send a realtime message.
Bluetooth initiated: If the MWS is currently scanning or has an ongoing
inactivity duration, the MWS shall send a frequency scan message or an
inactivity duration message after transmitting the real-time message.
If the receiving device’s transport interface is not awake it shall not send a
frequency scan or inactivity duration message.
Transparent Data Message
The transparent control messages can modify the state and request state information of the
MWS coexistence interface.
Product Specification Rev. 0.2
Page 20 of 83
PAN9028 Bluetooth Module
Message
2 Overview
MSG [0]
MSG [1]
Transparent Data Message NIBBLE_POSIT DATA [0]/[4]
ION
Signal Name
Description
NIBBLE_POSITION
0 = least significant nibble
MSG [2]
MSG [3]
MSG [4]
DATA [1]/[5]
DATA [2]/[6]
DATA [3]/[7]
1 = most significant nibble
DATA[n]; n=0 .. 7
Data bits of the message octet
MWS Inactivity Duration Message
The inactivity duration messages is used to send the MWS_INACTIVITY_DURATION signal
from the MWS device to the Coexistence Controller.
Message
MSG [0]
MSG [1]
MSG [2]
MSG [3]
MSG [4]
MWS Inactivity Duration
Message
DURATION [0]
DURATION [1]
DURATION [2]
DURATION [3]
DURATION [4]
The idle duration is encoded in 5 bits given by the formula:
Inactivity_Duartion = DURATION ∙ 5 ms
Inactivity durarations smaller than 5 ms are not communicated.
If all bits are set to “1” the inactivity duration is infinite. If all bits are set to “0” or MWS_RX or
MWS_TX are set to “1”, the inactivity period ends.
MWS Scan Frequency Offset Message
The MWS scan frequency offset message is used to send the MWS_SCAN_FREQUENCY_
OFFSET signal from the MWS device to the Coexistence Controller.
Message
MSG [0]
MSG [1]
MSG [2]
MSG [3]
MSG [4]
MWS Scan Frequency
Offset
BAND
FREQ [0]
FREQ [1]
FREQ [2]
FREQ [3]
The RF scan frequency is encoded in 5 bits given by the formula:
RF_FREQ_OFFSET = FREQ ∙ 10 MHz
If BAND is set to “0” the RF_FREQ_OFFSET is the negative value from the lower edge of the
ISM band and if BAND is set to “1”, RF_FREQ_OFFSET is the positive value from the top edge
of the ISM band.
FREQ set to all “0” indicates the end of the scan period.
2.6.5
Bluetooth Coexistence Arbiter
Type
Features
Product Specification Rev. 0.2
Page 21 of 83
PAN9028 Bluetooth Module
Type
Capability
Features
•
•
•
•
•
•
•
Arbitration
•
•
Programmable coexistence interface timing, interface modes, and signal polarity to
support a variety of external Bluetooth devices
Programmable decision policies and transaction lock behavior for various use cases
Interface with external or on-chip Bluetooth device
Support Bluetooth 1.1 or Bluetooth 1.2 AFH
WLAN-/Bluetooth-coordinated low-power design
Enhanced information sharing between WLAN and Bluetooth for combo systems
WLAN/Bluetooth/MWS (LTE or ZigBee) coexistence support
Contention resolved by a customizable decision matrix that allows independent
grant decision for each device
Vectors for the decision matrix:
−
−
−
−
−
−
−
AFH
2 Overview
WLAN priority (2-bit)
WLAN direction
Bluetooth priority (1-bit or 2-bit)
Bluetooth direction
Bluetooth frequency in/out band
MWS priority (2-bit)
MWS direction
If AFH is enabled in the Bluetooth device, and there is a sufficient guard-band outside
the WLAN operating frequency, the Bluetooth device uses the Out-Of-Band (OOB)
channel with respect to the WLAN device. Otherwise, the Bluetooth device uses the InBand (IB) and OOB channels with respect to the WLAN device.
The IB and OOB information is either provided by the Bluetooth device through the
coexistence interface, or it can be provided through firmware controls in a shared-host
system. IB/OOB is a vector in the decision matrix.
Decision
Policies
System configuration is a major consideration when planning decision policies. The
configuration governs how RF paths are shared and how much interference will occur.
Interference combinations include:
−
−
−
−
WLAN Tx and Bluetooth Tx
WLAN Tx and Bluetooth Rx
WLAN Rx and Bluetooth Tx
WLAN Rx and Bluetooth Rx
Interference combinations where WLAN and Bluetooth share the same antenna:
− WLAN Tx and Bluetooth Tx share same antenna, the decision matrix allows
either WLAN or Bluetooth Tx (both OOB and IB), based on relative packet priorities.
− WLAN Tx and Bluetooth Rx (both OOB and IB) have sizable interference impacts
on Bluetooth Rx, the decision matrix grants or denies WLAN Tx based on relative
packet priorities.
− WLAN Rx and Bluetooth Tx (both OOB and IB) have sizable interference impacts
on WLAN Rx, the decision matrix grants or denies Bluetooth Tx based on relative
packet priorities.
− WLAN Rx and Bluetooth Rx (both OOB and IB) have no impact on each other,
the decision matrix grants both.
Product Specification Rev. 0.2
Page 22 of 83
PAN9028 Bluetooth Module
Type
2 Overview
Features
Interference combinations where WLAN and Bluetooth have their own antenna:
− WLAN Tx and Bluetooth Tx in OOB situation have little interference impact on
each other, the decision matrix grants both.
− WLAN Tx and Bluetooth Tx in IB have sizable interference impact on each other,
the decision matrix allows either WLAN or Bluetooth Tx, based on relative packet
priorities.
− WLAN Tx and Bluetooth Rx in OOB situation have little interference impact on
each other, the decision matrix grants both provided there is enough antenna
isolation between WLAN and Bluetooth antenna.
− WLAN Tx and Bluetooth Rx in IB situation have sizable interference impact on
Bluetooth Rx, the decision matrix grants or denies WLAN Tx based on relative
packet priorities.
− WLAN Rx and Bluetooth Tx in OOB situation have little interference impact on
each other, the decision matrix grants both provided there is enough antenna
isolation between WLAN and Bluetooth antenna.
− WLAN Rx and Bluetooth Tx in IB situation have sizable interference impact on
WLAN RX, the decision matrix grants or denies Bluetooth Tx based on relative
packet priorities.
− WLAN Rx and Bluetooth Rx (both OOB and IB) have no impact on each other,
the decision matrix grants both.
Decision
Policies
(continued)
For the devices running in a basic shared antenna configuration, the linear switching
imposes restrictions on simultaneous transfer. Reasonable policies include:
−
−
−
−
WLAN and Bluetooth are never granted at the same time
Decision matrix grants a device based on relative packet priorities and direction
Priority order: High > Medium High > Medium > Low
For equal priority contention, select one device to win, that optimizes the usage
case
For the devices running in an enhanced shared antenna configuration, the linear
switching imposes restrictions on some simultaneous transfers.
Transaction
Stopping
2.6.6
The arbiter allows control of what transfers can be stopped after an initial grant. If
allowed, a transaction can be stopped for higher priority request. A transaction stop
decision is a function of the decision policies and transaction stopping control. The
transaction stopping control is configurable per device and direction.
Bluetooth Capability
Product Specification Rev. 0.2
Page 23 of 83
PAN9028 Bluetooth Module
2 Overview
Type
Features
Request
Schemes
The PTA signals are directly controlled by the hardware to meet timing requirements of
the Bluetooth radio. The software controls the type of traffic in priority mode.
Mechanisms enforced for control include:
•
•
•
•
Selection of certain types of communication always treated as high priority
Selection of individual frames marked with high priority
Real-time signaling of the next slot marked with high priority
Automatic hardware control based on the grant/denial history of the Bluetooth link
Timing Control The PTA signal timing scheme is fully programmable relative to the Bluetooth packet
timing.
2.6.7
WLAN Capability
Type
Features
Capability
The WLAN device technology uses an internal coexistence interface to exchange
request/grant with the BCA.
Features:
•
•
•
•
•
Packet
Classification
•
•
•
Queue
Classification
•
•
Packet-based request signaling with direction and priority information
1-bit or 2-bit priority signaling to support 4 priority levels
Multiple WLAN Rx request trigger sources, including early prediction
WLAN Tx request cancellation and abort if grant denied or revoked in middle of
request
802.11n A-MPDU treated as single packet
Programmable mask allows each frame type to be mapped to a priority
Default setting puts response frames (ACK), beacons, and QoS frames as high
priority
WLAN Tx and Rx have separate priority masks
Programmable mask allows each transmit queue to be mapped to a priority
Queue-based mapping is optional for software-generated frames only
Product Specification Rev. 0.2
Page 24 of 83
PAN9028 Bluetooth Module
2.6.8
2 Overview
LTE (MWS) Capability
The device supports a Bluetooth SIG WCI-2 MWS coexistence signaling interface. The
coexistence logical signaling is designed to enable a standard interface to allow an MWS device
and a Coexistence Controller to exchange information and support cooperative coexistence.
The WCI-2 signals carry time-critical information such as the start point of an MWS frame. The
logical coexistence signaling architecture also includes transparent data messaging and vendor
specific data messaging mechanism to enable passing information to and from the collocated
MWS device and Coexistence Controller when long latency (tens of milliseconds) cannot be
tolerated.
For further information please refer to 2.6.4 WCI-2 Interface.
Coexistence Signals
The logical signals assist in time alignment, protecting MWS from interference and maximizing
the usability of the Bluetooth radio.
Time-Critical Coexistence Signals
2.6.9
Signal Name
Direction
FRAME_SYNC
MWS to Bluetooth
BT_RX_PRI
Bluetooth to MWS
BT_TX_ON
Bluetooth to MWS
802_RX_PRI
Bluetooth to MWS
802_TX_ON
Bluetooth to MWS
MWS_PATTERN
MWS to Bluetooth
MWS_RX
MWS to Bluetooth
MWS_TX
MWS to Bluetooth
MWS_INACTIVITY_DURATION
MWS to Bluetooth
MWS_SCAN_FREQUENCY_OFFSET
MWS to Bluetooth
MWS_TX_PRIL (MWS TX Priority Level)
MWS to Bluetooth
MWS_RX_PRIL (MWS RX Priority Level)
MWS to Bluetooth
ZigBee (MWS) Coexistence Capability
ZigBee is based on the IEEE 802.15.4 standard and it is used by a suite of communication
protocols to create Personal Area Networks (PANs) supporting home automation, lighting
control, etc. ZigBee radios operate in the 2.4 GHz ISM band worldwide. Unlike Bluetooth, the
ZigBee specification does not use AFH. When coexisting with WLAN/Bluetooth in the 2.4 GHz
band, it is important to avoid co-channel (IB) operation of these radios.
Product Specification Rev. 0.2
Page 25 of 83
PAN9028 Bluetooth Module
2 Overview
The device re-uses the MWS coexistence interface to support ZigBee coexistence. The
coexistence logical signaling is used to allow a ZigBee device and a WLAN/Bluetooth combo
device to exchange information and support cooperative coexistence.
Coexistence Signals
The logical signals used for ZigBee and WLAN/Bluetooth coexistence are a subset of the LTE
coexistence signaling. Considering the lower data rate of ZigBee packets, a lower baud rate
may be chosen for the 2-wire UART physical interface. The BCA supports 3-way arbitration
among ZigBee/WLAN/Bluetooth requests.
Coexistence Signals
Signal Name
Direction
MWS_RX
MWS to Bluetooth
MWS_TX
MWS to Bluetooth
MWS_PATTERN
MWS to Bluetooth
MWS_RX_PRI
MWS to Bluetooth
MWS_TX_PRI
MWS to Bluetooth
802_RX_PRI
Bluetooth to MWS
802_TX_ON
Bluetooth to MWS
BT_RX_PRI
Bluetooth to MWS
BT_TX_ON
Bluetooth to MWS
Product Specification Rev. 0.2
Page 26 of 83
PAN9028 Bluetooth Module
2.7
2 Overview
WLAN
Type
IEEE 802.11/
Standards
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
WLAN MAC
•
•
•
•
•
802.11 data rates 1 Mbps and 2 Mbps (DSSS)
802.11b data rates 5.5 Mbps and 11 Mbps (CCK)
802.11a/g data rates 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps,
48 Mbps, and 54 Mbps (OFDM)
802.11b/g performance enhancements
802.11n/ac with maximum data rates up to 86.7 Mbps (20 MHz channel), 200 Mbps
(40 MHz channel), 433 Mbps (80 MHz channel)
802.11d international roaming
802.11e quality of service (QoS)
802.11h transmit power control
802.11h DFS radar pulse detection
802.11i enhanced security (WEP, WPA, WPA2)
802.11k radio resource measurement
802.11mc precise indoor location and navigation
802.11n block acknowledgment extension
802.11r fast hand-off for AP roaming
802.11u Hotspot 2.0 (STA mode only)
802.11v TIM frame transmission/reception
802.11w protected management frames
Support clients (stations) implementing IEEE Power Save mode
Frame exchange at the MAC level to deliver data
Received frame filtering and validation (CRC)
Generation of MAC header and trailer information (MPDUs)
Fragmentation of data frames (MSDUs)
Access mechanism support for fair access to shared wireless medium through:
− Distributed Coordination Function (DCF)
− Enhanced Distributed Channel Access (EDCA)
•
•
•
•
•
•
•
•
•
•
•
•
•
A-MPDU aggregation/de-aggregation (supports 802.11ac single-MPDU A-MPDU)
20 MHz, 40 MHz, and 80 MHz channel coexistence
RIFS burst receive
Management information base
Radio resource measurement
Quality of service
Block acknowledgement
802.11ac downlink MU-MIMO (receive)
Dynamic frequency selection
TIM frame Tx and Rx
Multiple BSS/Station
Transmit rate adaption
Transmit power control
Product Specification Rev. 0.2
Page 27 of 83
PAN9028 Bluetooth Module
Type
WLAN
Baseband
2 Overview
Features
•
•
•
•
•
•
•
802.11ac 1×1 SISO (WLAN SoC with SISO RF radio)
Backward compatibility with legacy 802.11a/b/g/n technology
WLAN/Bluetooth LNA sharing
PHY data rates up to 433 Mbps
20 MHz bandwidth/channel, 40 MHz bandwidth/channel, upper/lower 20 MHz
bandwidth in 40 MHz channel, and 20 MHz duplicate legacy bandwidth in 40 MHz
channel mode operation
80 MHz bandwidth/channel, 4 positions of 20 MHz bandwidth in 80 MHz channel,
upper/lower 40 MHz bandwidth in 80 MHz channel, 20 MHz quadruplicate legacy
bandwidth in 80 MHz channel mode operation
Modulation and Coding Scheme
− 802.11n: MCS 0 ~ 7 and MCS 32 (duplicate 6 Mbps)
− 802.11ac: MCS 0~9 NSTS = 1
•
Dynamic frequency selection (radar detection)
− Enhanced radar detection for short and long pulse radar
− Enhanced AGC scheme for DFS channel
− Japan DFS requirement for W53 and W56
•
802.11k Radio resource measurement
•
802.11n/ac optional features:
− 20 MHz, 40 MHz, and 80 MHz coexistence with middle-packet detection (GI
detection) for enhancd CCA
− Space-Time-Block-Coding (STBC) one spatial stream reception
− LDPC transmission and reception for both 802.11n and 802.11ac
− 256 QAM (MCS 8, 9) modulation (optional support for 802.11ac MCS 9 in 20 MHz
using LDPC)
− Short Guard Interval
− RIFS on receive path for 802.11n packets
− Explicit Beamformee support
− 802.11ac multi-user beamformee
− 802.11n Greenfield Tx/Rx
− MU-PPDUs (receive)
•
•
WLAN Radio
•
•
•
•
802.11mc locationing
Power save features
Integrated direct-conversion radio
20 MHz, 40 MHz, and 80 MHz channel bandwidth
Shared WLAN/Bluetooth receive input scheme for 2.4 GHz band
Rx Path
− On-chip gain selectable LNA with optimized noise figure and power consumption
− High dynamic range AGC function in receive mode
•
Tx Path
− Internal PA with power control
− Optimized Tx gain distribution for linearity and noise performance
•
Local Oscillator with fine channel step
Product Specification Rev. 0.2
Page 28 of 83
PAN9028 Bluetooth Module
Type
WLAN
Encryption
2 Overview
Features
•
•
•
•
•
WEP 64-bit and 128-bit encryption with hardware TKIP processing (WPA)
AES-CCMP hardware implementation as part of 802.11i security standard (WPA2)
Advanced encryption standard (AES)/Counter-Mode/CBC-MAC Protocol (CCMP)
AES-Cipher-Based Message Authentication Code (CMAC) as part of the 802.11w
security standard
WLAN Authentication and Privacy Infrastructure (WAPI)
Operation Modes
Parameter
Operation Mode
Standard Conformance
IEEE 802.11/IEEE 802.11b
Specification
IEEE 802.11a
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
Modulation
Physical layer data rates
Supported data rates
IEEE 802.11a
OFDM
IEEE 802.11b
DSSS/CCK
IEEE 802.11g
OFDM
IEEE 802.11n
OFDM at MCS0~7 and MCS32 (duplicate
6 Mbps)
IEEE 802.11ac
OFDM at MCS0~9
IEEE 802.11
1 Mbps, 2 Mbps at DSSS
IEEE 802.11b
5.5 Mbps, 11 Mbps at DSSS/CCK
IEEE 802.11g
[6, 9, 12, 18, 24, 36, 48, 54] Mbps
IEEE 802.11a
[6, 9, 12, 18, 24, 36, 48, 54] Mbps
IEEE 802.11n
MCS0~7
HT20
LGI
[6.5, 13, 19.5, 26, 39, 52, 58.5, 65] Mbps
SGI [7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,
72.2] Mbps
HT40
LGI
[13.5, 27, 40.5, 54, 81, 108, 121.5,
135] Mbps
SGI [15, 30, 45, 60, 90, 120, 135, 150] Mbps
IEEE 802.11ac MCS0~8
HT20
LGI
[6.5, 13, 19.5, 26, 39, 52, 58.5, 65,
78] Mbps
SGI [7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65, 72.2,
86.7] Mbps
MCS0~9
HT40
LGI
[13.5, 27, 40.5, 54, 81, 108, 121.5, 135,
162, 180] Mbps
SGI [15, 30, 45, 60, 90, 120, 135, 150, 180,
200] Mbps
VHT80
LGI
[29.3, 58.5, 87.8, 117, 175.5, 234, 263.3,
292.5, 351, 390] Mbps
SGI [32.5, 65, 97.5, 130, 195, 260, 292.5, 325,
390, 433.3] Mbps
Product Specification Rev. 0.2
Page 29 of 83
PAN9028 Bluetooth Module
2 Overview
Parameter
Operation Mode
Specification
Supported bandwidth
IEEE 802.11n
20 MHz, 40 MHz (BW)
IEEE 802.11ac
20 MHz, 40 MHz, 80 MHz (BW)
IEEE 802.11n
20 MHz BW/channel, 40 MHz BW/channel,
upper/lower 20 MHz BW at 40 MHz channel,
20 MHz duplicate legacy BW at 40 MHz
channel
IEEE 802.11ac
20 MHz BW/channel, 40 MHz BW/channel,
80 MHz BW/channel, upper/lower 20 MHz
BW at 40 MHz channel, 20 MHz duplicate
legacy BW at 40 MHz channel, 4 positions
of 20 MHz BW at 80 MHz channel,
upper/lower 40 MHz BW at 80 MHz channel,
20 MHz quadruplicate legacy BW at 80 MHz
channel
IEEE 802.11n
400 ns (SGI), 800 ns (LGI)
IEEE 802.11ac
400 ns (SGI), 800 ns (LGI)
Supported channel mode
operation
Supported Guard Interval
Channels and Frequencies (without Regulatory Restrictions)
2.4 GHz – IEEE 802.11b/g/n
20 MHz Channels
Channel
40 MHz Channels
Frequency
Unit
Channel
Frequency
Unit
1
2 412
MHz
1 to 5
2 422
MHz
2
2 417
MHz
2 to 6
2 427
MHz
3
2 422
MHz
3 to 7
2 432
MHz
4
2 427
MHz
4 to 8
2 437
MHz
5
2 432
MHz
5 to 9
2 442
MHz
6
2 437
MHz
6 to 10
2 447
MHz
7
2 442
MHz
7 to 11
2 452
MHz
8
2 447
MHz
9
2 452
MHz
10
2 457
MHz
11
2 462
MHz
12
2 467
MHz
13
2 472
MHz
5 GHz – IEEE 802.11a/n/ac
20 MHz Channels
Channel
40 MHz Channels
Frequency
Unit
Channel
Frequency
Unit
36
5 180
MHz
36 to 40
5 190
MHz
40
5 200
MHz
44 to 48
5 230
MHz
44
5 220
MHz
52 to 56
5 270
MHz
Product Specification Rev. 0.2
Page 30 of 83
PAN9028 Bluetooth Module
2 Overview
5 GHz – IEEE 802.11a/n/ac
20 MHz Channels
Channel
40 MHz Channels
Frequency
Unit
Channel
48
5 240
MHz
52
5 260
MHz
56
5 280
MHz
60
5 300
MHz
64
5 320
MHz
100
5 500
104
Frequency
Unit
60 to 64
5 310
MHz
MHz
100 to 104
5 510
MHz
5 520
MHz
108 to 112
5 550
MHz
108
5 540
MHz
116 to 120
5 590
MHz
112
5 560
MHz
124 to 128
5 630
MHz
116
5 580
MHz
132 to 136
5 670
MHz
120
5 600
MHz
149 to 153
5 755
MHz
124
5 620
MHz
157 to 161
5 795
MHz
128
5 640
MHz
132
5 660
MHz
136
5 680
MHz
140
5 700
MHz
149
5 745
MHz
153
5 765
MHz
157
5 785
MHz
161
5 805
MHz
165
5 825
MHz
5 GHz – IEEE 802.11a/n/ac
80 MHz Channels
Channel
Frequency
Unit
Channel
36 to 48
5 210
MHz
52 to 64
5 290
MHz
100 to 112
5 530
MHz
116 to 128
5 610
MHz
132 to 144
5 690
MHz
149 to 161
5 775
MHz
Product Specification Rev. 0.2
Frequency
Unit
Page 31 of 83
PAN9028 Bluetooth Module
2 Overview
5 GHz – IEEE 802.11a/n/ac (India and additional UNII Channels)
20 MHz Channels
Channel
40 MHz Channels
Frequency
Unit
Channel
Frequency
Unit
144
5 720
MHz
68 to 72
5 350
MHz
5
5 845
MHz
76 to 80
5 390
MHz
5
5 865
MHz
84 to 88
5 430
MHz
177
5 885
MHz
92 to 96
5 470
MHz
181
5 905
MHz
140 to 144
5 710
MHz
165 to 169
5 835
MHz
6
5 855
MHz
173 to 177
5 875
MHz
169
173
169 to 173
5 GHz – IEEE 802.11a/n/ac (India and additional UNII Channels)
80 MHz Channels
Channel
2.8
Frequency
Unit
Channel
68 to 80
5 370
MHz
84 to 96
5 410
MHz
165 to 177
5 855
MHz
Frequency
Unit
Bluetooth
Type
Features
General
•
•
•
•
Supports Bluetooth 5
Shared LNA for Bluetooth
Digital Audio Interface including PCM interface for voice application
Bluetooth and WLAN coexistence
5
India channels that can be used in other countries as well.
6
India use only.
Product Specification Rev. 0.2
Page 32 of 83
PAN9028 Bluetooth Module
Type
Bluetooth Classic
(BR/EDR)
2 Overview
Features
•
•
•
Bluetooth Classic with Bluetooth Class 1 support
Baseband and radio Basic Rate (BR) and Enhanced Data Rate (EDR) packet
types with 1 Mbps (GFSK), 2 Mbps (π/4-DQPSK) and 3 Mbps (8DPSK)
Fully functional Bluetooth baseband with:
−
−
−
−
−
−
−
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Adaptive Frequency Hopping (AFH)
Forward error correction
Header error control
Access code correlation
CRC
Encryption bit stream generation
Whitening
Adaptive Frequency Hopping (AFH) including Packet Loss Rate (PLR)
Interlaced scan for faster connection setup
Simultaneous 7 active ACL connection support
Automatic ACL packet type selection
Full master and slave piconet support
Scatternet support
Standard UART and SDIO HCI transport layer
3 SCO/eSCO links with hardware accelerated audio signal processing and
hardware supported PPEC algorithm for speech quality improvement
All standard SCO/eSCO voice coding
All standard pairing, authentication, link key, and encryption operations
Standard Bluetooth power saving mechanism (i.e. hold, sniff modes, and sniff-sub
rating)
Enhanced Power Control (EPC)
Channel Quality Driven (CQD) data rate
Wideband Speech (WBS) support (1 WBS link)
Encryption (AES) support
LTE/MWS coexistence
Bluetooth 2.1 to 5.0 Core Specification Support
Packet types
− ACL (DM1, DH1, DM3, DH3, DM5, DH5, 2-DH1, 2-DH3, 2-DH5, 3-DH1, 3-DH3,
3-DH5)
− SCO (HV1, HC3)
− eSCO (EV3, EV4, EV5, 2EV3, 3EV3, 2EV5, 3EV5)
•
Profile Support
−
−
−
−
−
−
−
−
Product Specification Rev. 0.2
A2DP Source/Sink
AVRCP Target/Controller
HFP Dev/gateway
OPP Server/Client
PAN Traffic
SPP
HID
PBAP
Page 33 of 83
PAN9028 Bluetooth Module
Type
Bluetooth Low
Energy (LE)
2 Overview
Features
•
•
•
•
•
•
•
•
•
•
•
•
Broadcaster, Observer, Central, and Peripheral roles
Supports link layer topology to be master and slave (connects up to 16 links)
Shared RF with BR/EDR
Encryption AES support
Hardware support for intelligent Adaptive Frequency Hopping (AFH)
LE Privacy 1.2
LE Secure Connection
LE Data Length Extension
LE Advertising Length Extension
High Duty Cycle Directed Advertising
2 Mbps LE Bluetooth Low Energy 4.0 to 5.0 Support
Direction Finding
− Connectionless Angle of Departure (AoD)
− Connection-oriented Angle of Arrival (AoA)
•
Profile Support
− GATT
− HOGP
Product Specification Rev. 0.2
Page 34 of 83
PAN9028 Bluetooth Module
3 Detailed Description
3 Detailed Description
3.1
Dimensions
All dimensions are in millimeters.
12
2,73
Top View
24
No.
Item
Dimension
Tolerance
Remark
1 Width
12.00
±0.35
2 Length
24.00
±0.35
3 Height
2.75
Product Specification Rev. 0.2
±0.20 With case
Page 35 of 83
PAN9028 Bluetooth Module
3.2
3 Detailed Description
Footprint
The outer dimensions have a tolerance of 0.35 mm.
Top View
Product Specification Rev. 0.2
Page 36 of 83
PAN9028 Bluetooth Module
3.3
3 Detailed Description
Packaging
The module is a mass production status product and will be delivered in the package described
below.
3.3.1
Tape Dimensions
3.3.2
Packing in Tape
Empty spaces in the component packed area shall be less than two per reel and those spaces
shall not be consecutive.
The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
Product Specification Rev. 0.2
Page 37 of 83
PAN9028 Bluetooth Module
3.3.3
3 Detailed Description
Component Direction
Pin 1 Marking
(Top Side)
Direction of
unreeling
(for customer)
3.3.4
Reel Dimension
Product Specification Rev. 0.2
Page 38 of 83
PAN9028 Bluetooth Module
3.3.5
3 Detailed Description
Package Label
Example:
3.3.6
(1T)
Lot code
(1P)
Customer order number, if applicable
(2P)
Order number
(9D)
Date code
(Q)
Quantity
(HW/SW)
Hardware/software version
Total Package
Product Specification Rev. 0.2
Page 39 of 83
PAN9028 Bluetooth Module
3.4
3 Detailed Description
Case Marking
Example:
2
1
4
5
3
PAN9028 HW/SW ES
M/N: ENWF9401A1EF
YYWWDLL
12345678
7 0013430B801E
8 0013430B801F
6
9
11
10
1 Brand name
2 Hardware/software version
3 Engineering Sample (optional)
4 Order number
5 Lot code
6 Serial number
7 WLAN MAC address
8 BD address
9 (Reserved)
10 Marking for Pin 1
11 2D barcode, for internal usage only
Product Specification Rev. 0.2
Page 40 of 83
PAN9028 Bluetooth Module
4 Specification
4 Specification
All specifications are over temperature and process, unless indicated
otherwise.
4.1
Default Test Conditions
Temperature:
Humidity:
Supply Voltage:
Supply Voltage:
4.2
25 °C ± 10 °C
40 to 85 % RH
+3.3 V (for module variant ENWF490xA1EF)
+3.3 V / +2.2 V / +1.8 V / +1.1 V (for module variant
ENWF490xA2EF)
Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
Symbol
Parameter
TSTOR
Storage
temperature
VESD
ESD
robustness
Condition
Min.
Typ.
Max.
-40
Units
+85
°C
1 000
V
500
V
+2
dBm
3.3
4
V
2.2
2.3
V
VDD1V8
1.8
1.98
V
VDD1V1
1.1
1.21
V
VIOSD
1.8
2.2
V
3.3
4
V
1.8
2.2
V
3.3
4
V
3.3
4
V
All pads, according to human
body model (HBM), JEDEC
STD 22, method A114
According to charged device
model (CDM), JEDEC STD 22,
method C101
PRF
RF input level
VDD3V3
Maximum
voltage
VDD2V2
VIO
VRF_SW1/2
Product Specification Rev. 0.2
Maximum power supply voltage
from any pin with respect to
VSS (GND)
Page 41 of 83
PAN9028 Bluetooth Module
4.3
4 Specification
Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
Symbol
Parameter
Condition
TA
Ambient
operating
temperature
range
Extended grade
VDD3V3
3.3 V supply
voltage
VDD voltage on pins F2, F3
3.07
VDD2V2
2.2 V supply
voltage
VDD voltage on pins G1, G2
1.8 V supply
voltage
VDD voltage on pin G4
1.1 V supply
voltage
VDD voltage on pin A3
VDD1V8
VDD1V1
VIOSD
VIO
VRF_SW1/2
7
Min.
Typ.
Max.
-30
Units
+85
°C
3.3
3.53
V
2.09
2.2
2.26
V
1.71
1.8
1.89
V
1.05
1.1
1.15
V
Digital I/O
Pin F4 with 1.8 V operation
VIOSD supply SDIO Pin Functions
voltage7
Pin F4 with 3.3 V operation
SDIO Pin Functions
1.67
1.8
1.92
V
3.07
3.3
3.53
V
Digital I/O VIO Pin G3 with 1.8 V operation
supply
Pin G3 with 3.3 V operation
voltage7
1.67
1.8
1.92
V
3.07
3.3
3.53
V
VRF_SW1/2
Pin A11, B11 with 3.3 V logical
switch voltage level switch operation RFSwitch Pin Function
3.07
3.3
3.6
V
(only for module variant
ENWF940[x]A2EF)
(only for module variant
ENWF940[x]A2EF)
(only for module variant
ENWF940[x]A2EF)
1.8 V or 3.3 V supply voltage possible.
Product Specification Rev. 0.2
Page 42 of 83
PAN9028 Bluetooth Module
4 Specification
Digital Pin Characteristics
VIO with 1.8 V Operation8
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VIH
High level input
voltage
1.8 V operation (VIO = 1.8 V)
0.7 VIO
VIO + 0.4
V
VIL
Low level input
voltage
1.8 V operation (VIO = 1.8 V)
-0.4
0.3 VIO
V
VHYS
Input hysteresis
VOH
High level
output voltage
1.8 V operation (VIO = 1.8 V)
VHO
Low level
output voltage
1.8 V operation (VIO = 1.8 V)
100
mV
VIO - 0.4
V
0.4
V
VIO with 3.3 V Operation8
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VIH
High level input
voltage
3.3 V operation (VIO = 3.3 V)
0.7 VIO
VIO + 0.4
V
VIL
Low level input
voltage
3.3 V operation (VIO = 3.3 V)
-0.4
0.3 VIO
V
VHYS
Input hysteresis
VOH
High level
output voltage
3.3 V operation (VIO = 3.3 V)
VHO
Low level
output voltage
3.3 V operation (VIO = 3.3 V)
100
mV
VIO - 0.4
V
0.4
V
VIOSD with 1.8 V Operation for SDIO I/F8
Symbol
Parameter
Condition
VIH
High level input
voltage
1.8 V operation (VIOSD = 1.8 V)
0.7 VIO
VIO + 0.4
V
VIL
Low level input
voltage
1.8 V operation (VIOSD = 1.8 V)
-0.4
0.3 VIO
V
VHYS
Input hysteresis
VOH
High level
output voltage
1.8 V operation (VIOSD = 1.8 V)
VHO
Low level
output voltage
1.8 V operation (VIOSD = 1.8 V)
8
Min.
Typ.
Max.
Units
100
mV
VIO - 0.4
V
0.4
V
The capacitive load should not be larger than 50 pF for all I/Os when using the default driver strength
settings. Large capacitive loads increase the overall current consumption.
Product Specification Rev. 0.2
Page 43 of 83
PAN9028 Bluetooth Module
4 Specification
VIOSD with 3.3 V Operation for SDIO I/F8
4.4
4.4.1
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VIH
High level input
voltage
3.3 V operation (VIOSD = 3.3 V)
0.7 VIO
VIO + 0.4
V
VIL
Low level input
voltage
3.3 V operation (VIOSD = 3.3 V)
-0.4
0.3 VIO
V
VHYS
Input hysteresis
VOH
High level
output voltage
3.3 V operation (VIOSD = 3.3 V)
VIO - 0.4
VHO
Low level
output voltage
3.3 V operation (VIOSD = 3.3 V)
100
mV
V
0.4
V
Current Consumption
For ENWF940[x]A1EF
The current consumption depends on the user scenario and on the setup and
timing in the power modes. Following current consumptions are valid for
module variant ENWF940[x]A1EF.
Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated.
Parameter
Condition
Min.
Typ.
Max.
Unit
IVDD3V3 @ PMIC_EN
Power Down
Grounding of PMIC_EN pin
TBD
mA
IVDD3V3 @ DeepSleep
Deep Sleep
Low-power state used in sleep state
TBD
mA
IVDD3V3 @ Firmware Init
Firmware
Initialization
Device Initialization
TBD
mA
WLAN Current Consumption
Symbol
Parameter
Condition
IVDD3V3 @ TX
Active
Transmit9
PTX = +TBD dBm for 5 GHz band
802.11a at 6 Mbps
TBD
mA
PTX = +TBD dBm for 5 GHz band
802.11n 20 MHz at 72 Mbps
TBD
mA
PTX = +TBD dBm for 5 GHz band
802.11ac 80 MHz at 433 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11b at 11 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11g at 54 Mbps
TBD
mA
9
Min.
Typ.
Max.
Units
Peak values for specified output power level and data rate with UDP traffic between the AP and Device
(STA).
Product Specification Rev. 0.2
Page 44 of 83
PAN9028 Bluetooth Module
Symbol
IVDD3V3 @ RX
IVDD3V3 @ IEEE-PS
Parameter
Active Receive9
IEEE Power
Save10
4 Specification
Condition
Min.
Typ.
Max.
Units
PTX = +TBD dBm for 2.4 GHz band
802.11n 40 MHz at 150 Mbps
TBD
mA
5 GHz band 802.11a at 6 Mbps
TBD
mA
5 GHz band 802.11n 20 MHz
at 72 Mbps
TBD
mA
5 GHz band 802.11ac 80 MHz
at 433 Mbps
TBD
mA
2.4 GHz band 802.11b at 11 Mbps
TBD
mA
2.4 GHz band 802.11g at 54 Mbps
TBD
mA
2.4 GHz band 802.11n 40 MHz
at 150 Mbps
TBD
mA
DTIM = 1 with beacon interval
100 ms
TBD
mA
Bluetooth Current Consumption
Symbol
Parameter
Condition
IVDD3V3 @ TX
Peak BR
PTX = +TBD dBm
TBD
mA
Peak EDR
PTX = +TBD dBm
TBD
mA
Peak LE
PTX = +TBD dBm
TBD
mA
Peak BR
TBD
mA
Peak EDR
TBD
mA
Peak LE
TBD
mA
IVDD3V3 @ RX
4.4.2
Min.
Typ.
Max.
Units
ISCAN BT
Page/Inquiry
Scan
1.28 s at normal mode
TBD
mA
IA2DP BT
A2DP
BR/EDR at 330 kbps (3M baud rate)
TBD
mA
For ENWF940[x]A2EF
The current consumption depends on the user scenario, on the setup, and
timing in the power modes. Following current consumptions are valid for
module variant ENWF940[x]A2EF.
Assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V, VDD1V8 = 1.8 V, VDD1V1 = 1.1 V and
Tamb = 25 °C, if nothing else stated.
10
In IEEE Power Save the device automatically wakes up on beacons. This is dependent on the DTIM value
of the AP it is connected to. If it is a DTIM value of 1 along with a beacon interval of 100 ms, the device
wakes up every 100 ms.
Product Specification Rev. 0.2
Page 45 of 83
PAN9028 Bluetooth Module
4 Specification
Symbol
Parameter
Condition
IVDD3V3
Deep Sleep
Low-power state used in sleep state
TBD
mA
IVDD2V2
Low-power state used in sleep state
TBD
mA
IVDD1V8
Low-power state used in sleep state
TBD
mA
IVDD1V1
Low-power state used in sleep state
TBD
mA
IVDD3V3
Typ.
Max.
Units
Device Initialization
TBD
mA
Device Initialization
TBD
mA
IVDD1V8
Device Initialization
TBD
mA
IVDD1V1
Device Initialization
TBD
mA
IVDD2V2
Firmware
Initialization
Min.
WLAN Current Consumption
Symbol
Parameter
Condition
IVDD3V3 @ TX
Active
Transmit9
PTX = +TBD dBm for 5 GHz band
802.11a at 6 Mbps
TBD
mA
PTX = +TBD dBm for 5 GHz band
802.11n 20 MHz at 72 Mbps
TBD
mA
PTX = +TBD dBm for 5 GHz band
802.11ac 80 MHz at 433 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11b at 11 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11g at 54 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11n 40 MHz at 150 Mbps
TBD
mA
5 GHz band 802.11a at 6 Mbps
TBD
mA
5 GHz band 802.11n 20 MHz
at 72 Mbps
TBD
mA
5 GHz band 802.11ac 80 MHz
at 433 Mbps
TBD
mA
2.4 GHz band 802.11b at 11 Mbps
TBD
mA
2.4 GHz band 802.11g at 54 Mbps
TBD
mA
2.4 GHz band 802.11n 40 MHz
at 150 Mbps
TBD
mA
IVDD3V3 @ RX
Active Receive9
Min.
Typ.
Max.
Units
IVDD3V3 @ IEEE-PS
IEEE Power
Save10
DTIM = 1 with beacon interval
100 ms
TBD
mA
IVDD2V2 @ TX
Active
Transmit9
PTX = +TBD dBm for 5 GHz band
802.11a at 6 Mbps
TBD
mA
PTX = +TBD dBm for 5 GHz band
802.11n 20 MHz at 72 Mbps
TBD
mA
PTX = +TBD dBm for 5 GHz band
802.11ac 80 MHz at 433 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11b at 11 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11g at 54 Mbps
TBD
mA
Product Specification Rev. 0.2
Page 46 of 83
PAN9028 Bluetooth Module
Symbol
IVDD2V2 @ RX
Parameter
Active Receive9
4 Specification
Condition
Min.
Typ.
Max.
Units
PTX = +TBD dBm for 2.4 GHz band
802.11n 40 MHz at 150 Mbps
TBD
mA
5 GHz band 802.11a at 6 Mbps
TBD
mA
5 GHz band 802.11n 20 MHz
at 72 Mbps
TBD
mA
5 GHz band 802.11ac 80 MHz
at 433 Mbps
TBD
mA
2.4 GHz band 802.11b at 11 Mbps
TBD
mA
2.4 GHz band 802.11g at 54 Mbps
TBD
mA
2.4 GHz band 802.11n 40 MHz
at 150 Mbps
TBD
mA
IVDD2V2 @ IEEE-PS
IEEE Power
Save10
DTIM = 1 with beacon interval
100 ms
TBD
mA
IVDD1V8 @ TX
Active
Transmit9
PTX = +TBD dBm for 5 GHz band
802.11a at 6 Mbps
TBD
mA
PTX = +TBD dBm for 5 GHz band
802.11n 20 MHz at 72 Mbps
TBD
mA
PTX = +TBD dBm for 5 GHz band
802.11ac 80 MHz at 433 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11b at 11 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11g at 54 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11n 40 MHz at 150 Mbps
TBD
mA
5 GHz band 802.11a at 6 Mbps
TBD
mA
5 GHz band 802.11n 20 MHz
at 72 Mbps
TBD
mA
5 GHz band 802.11ac 80 MHz
at 433 Mbps
TBD
mA
2.4 GHz band 802.11b at 11 Mbps
TBD
mA
2.4 GHz band 802.11g at 54 Mbps
TBD
mA
2.4 GHz band 802.11n 40 MHz
at 150 Mbps
TBD
mA
IVDD1V8 @ RX
Active Receive9
IVDD1V8 @ IEEE-PS
IEEE Power
Save10
DTIM = 1 with beacon interval
100 ms
TBD
mA
IVDD1V1 @ TX
Active
Transmit9
PTX = +TBD dBm for 5 GHz band
802.11a at 6 Mbps
TBD
mA
PTX = +TBD dBm for 5 GHz band
802.11n 20 MHz at 72 Mbps
TBD
mA
PTX = +TBD dBm for 5 GHz band
802.11ac 80 MHz at 433 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11b at 11 Mbps
TBD
mA
PTX = +TBD dBm for 2.4 GHz band
802.11g at 54 Mbps
TBD
mA
Product Specification Rev. 0.2
Page 47 of 83
PAN9028 Bluetooth Module
Symbol
IVDD1V1 @ RX
IVDD1V1 @ IEEE-PS
Parameter
Active Receive9
IEEE Power
Save10
4 Specification
Condition
Min.
Typ.
Max.
Units
PTX = +TBD dBm for 2.4 GHz band
802.11n 40 MHz at 150 Mbps
TBD
mA
5 GHz band 802.11a at 6 Mbps
TBD
mA
5 GHz band 802.11n 20 MHz
at 72 Mbps
TBD
mA
5 GHz band 802.11ac 80 MHz
at 433 Mbps
TBD
mA
2.4 GHz band 802.11b at 11 Mbps
TBD
mA
2.4 GHz band 802.11g at 54 Mbps
TBD
mA
2.4 GHz band 802.11n 40 MHz
at 150 Mbps
TBD
mA
DTIM = 1 with beacon interval
100 ms
TBD
mA
Bluetooth Current Consumption
Symbol
Parameter
Condition
IVDD3V3 @ TX
Peak BR
PTX = +TBD dBm
TBD
mA
Peak EDR
PTX = +TBD dBm
TBD
mA
Peak LE
PTX = +TBD dBm
TBD
mA
Peak BR
TBD
mA
Peak EDR
TBD
mA
Peak LE
TBD
mA
IVDD3V3 @ RX
IVDD2V2 @ TX
IVDD2V2 @ RX
IVDD1V8 @ TX
IVDD1V8 @ RX
IVDD1V1 @ RX
IVDD3V3 SCAN BT
Typ.
Max.
Units
Peak BR
PTX = +TBD dBm
TBD
mA
Peak EDR
PTX = +TBD dBm
TBD
mA
Peak LE
PTX = +TBD dBm
TBD
mA
Peak BR
TBD
mA
Peak EDR
TBD
mA
Peak LE
TBD
mA
Peak BR
PTX = +TBD dBm
TBD
mA
Peak EDR
PTX = +TBD dBm
TBD
mA
Peak LE
PTX = +TBD dBm
TBD
mA
Peak BR
TBD
mA
Peak EDR
TBD
mA
Peak LE
IVDD1V1 @ TX
Min.
TBD
mA
Peak BR
PTX = +TBD dBm
TBD
mA
Peak EDR
PTX = +TBD dBm
TBD
mA
Peak LE
PTX = +TBD dBm
TBD
mA
Peak BR
TBD
mA
Peak EDR
TBD
mA
Peak LE
TBD
mA
TBD
mA
Page/Inquiry
Scan
Product Specification Rev. 0.2
1.28 s at normal mode
Page 48 of 83
PAN9028 Bluetooth Module
4.5
4 Specification
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
IVDD2V2 SCAN BT
Page/Inquiry
Scan
1.28 s at normal mode
TBD
mA
IVDD1V8 SCAN BT
Page/Inquiry
Scan
1.28 s at normal mode
TBD
mA
IVDD1V1 SCAN BT
Page/Inquiry
Scan
1.28 s at normal mode
TBD
mA
IVDD3V3 A2DP BT
A2DP
BR/EDR at 330 kbps (3M baud rate)
TBD
mA
IVDD2V2 A2DP BT
A2DP
BR/EDR at 330 kbps (3M baud rate)
TBD
mA
IVDD1V8 A2DP BT
A2DP
BR/EDR at 330 kbps (3M baud rate)
TBD
mA
IVDD1V1 A2DP BT
A2DP
BR/EDR at 330 kbps (3M baud rate)
TBD
mA
Internal Operating Frequencies
Symbol
Parameter
Condition
fSYSCLK1
CPU1/System/
Encryption
clock speed
Refers to clock speed of SoC’s
CPU1
256
MHz
fSYSCLK2
CPU2
Refers to clock speed of SoC’s
CPU2
64
MHz
fREFCLK1
Crystal
fundamental
frequency
Frequency tolerance < ±10 ppm
over operating temperature and
process
fSLEEPCLK
Sleep Clock
frequency
Frequency tolerance < ±30 ppm
over operating temperature, aging
and process, CMOS input clock
signal type
(only for module
variant
ENWF940[x]A1E
F)
Product Specification Rev. 0.2
Min.
Typ.
Max.
Units
26
MHz
32.768
kHz
Page 49 of 83
PAN9028 Bluetooth Module
4.6
4 Specification
External Sleep Clock Specifications (only for Module Variant
ENWF940[x]A2EF)
An external sleep clock of 32.768 kHz can be used for lowest current consumption in sleep
mode. Voltage level of external sleep clock must be the same value which is used for
Pin G4 (VIO).
Parameter
Min.
Typ.
Clock frequency range/accuracy
•
•
Units
32.768
kHz
CMOS input clock signal type
±250 ppm (initial, aging,
temperature)
Phase noise requirement (at 100 kHz)
-125
Cycle jitter
dBc/Hz
1.5
Slew rate limit (10 % to 90 %)
Duty cycle tolerance
4.7
Max.
20
ns (RMS)
100
ns
80
%
Power-up Sequence
For Module Variant ENWF940[x]A1EF:
A minimum time of 100 ms is required after PMIC_EN is de-asserted (low) and
before it is asserted (high).
Product Specification Rev. 0.2
Page 50 of 83
PAN9028 Bluetooth Module
4 Specification
For Module Variant ENWF940[x]A2EF:
•
•
•
•
•
•
•
•
•
4.8
VIO/VIOSD/VDD3V3 must be good (90 %) before or at the same time all other power supplies
start ramping up.
VIO/VIOSD/VDD3V3 must be good (90%) before or at the same time PDn starts ramping up.
VDD2V2 must be good (90 %) before or at the same time VDD1V8 starts ramping up.
It is recommended to start ramping up VDD1V8 ≤ 1ms after VDD2V2 ramps up.
VDD1V8 must be good (90 %) before or at the same time VDD1V1 starts ramping up.
Ramp-up time of VIO/VIOSD/VDD3V3 must be < 100 ms.
Ramp-up time of VDD2V2 / VDD1V8 must be < 100 ms.
Ramp-up time of VDD1V1 must be < 5ms.
All supplies must be monotonic.
Power-down Sequence
For Module Variant ENWF940[x]A1EF:
Power down sequencing is performed from internal power management IC after PMIC_EN pin
is pulled to low state.
For Module Variant ENWF940[x]A2EF:
•
•
•
It is recommended to ramp down VDD1V8 after VDD2V2 ramps down.
It is recommended to discharge all of the power supplies to less than 0.2V to reduce
leakage
PDn must be asserted when powering down the module
Product Specification Rev. 0.2
Page 51 of 83
PAN9028 Bluetooth Module
4.9
4 Specification
Power Good (only for Module Variant ENWF940[x]A1EF)
Do not connect the power good outputs (PG1, PG2, and PGLDO) if they are
not used.
The PAN9028 contains power good comparators, which pull the signal to a logical low level,
when the associated output voltage drops below 90 % of its regulated value. Also, when the
associated rising output voltage is above 95 % of its regulated value, the power good
comparators pull the signal to a logical low level.
No.
4.10
Pin Name
Pin Type
Logical Level
Low (typ. 0 V)
High (typ. 3.3 V)
B1
PG1
Output signal
1.1 V voltage supply not stabilized
1.1 V voltage supply stabilized
D1
PG2
Output signal
2.2 V voltage supply not stabilized
2.2 V voltage supply stabilized
C1
PGLDO
Output signal
1.8 V voltage supply not stabilized
1.8 V voltage supply stabilized
Interfaces
4.10.1
Host Interface
4.10.1.1
SDIO Interface
The SDIO Interface pins are powered from the VIOSD voltage supply with either
3.3 V or 1.8 V. The SDIO electrical specifications are identical for the 1-bit and
4-bit SDIO modes.
For DC specifications please refer to “Digital Pin Characteristics” 4.3 Recommended
Operating Conditions.
SDIO Timing Data – Default and High-Speed Modes (VIOSD 3.3 V)11,12
Symbol
Parameter
Condition
fPP
Clock frequency
Normal
0
25
MHz
High-speed
0
50
MHz
TWL
Clock low time
Normal
High-speed
Min.
Typ.
Max.
Units
10
ns
7
ns
11
For SDIO 2.0 running at 50 MHz clock frequency, a supply voltage VIOSD of 1.8 V is recommended.
12
For SDIO 2.0 running at 25 MHz clock frequency, either 1.8 V or 3.3 V can be used.
Product Specification Rev. 0.2
Page 52 of 83
PAN9028 Bluetooth Module
4 Specification
Symbol
Parameter
Condition
TWH
Clock high time
Normal
TISU
TIH
Input setup time
Input hold time
TODLY
TOH
Min.
Typ.
Max.
Units
10
ns
High-speed
7
ns
Normal
5
ns
High-speed
6
ns
Normal
5
ns
High-speed
2
ns
Output delay time
Normal
14
ns
CL 40 pF (1 card)
High-speed
14
ns
Output hold time
High-speed
2.5
ns
SDIO Protocol Timing Diagram – Default Speed Mode (VIOSD 3.3 V)
fPP
TWL
TWH
Clock
TISU
TIH
Input
Output
TODLY
SDIO Protocol Timing Diagram – High-Speed Mode (VIOSD 3.3 V)
fPP
TWL
TWH
Clock
TISU
TIH
Input
Output
Product Specification Rev. 0.2
TODLY
TOH
Page 53 of 83
PAN9028 Bluetooth Module
4 Specification
SDIO Timing Data – SDR12, SDR25, SDR50 Modes (VIOSD 1.8 V)
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
fPP
Clock frequency
SDR12/SDR25/SDR50
25
TIS
Input setup time
SDR12/SDR25/SDR50
3
ns
TIH
Input hold time
SDR12/SDR25/SDR50
0.8
ns
TCLK
Clock time
SDR12/SDR25/SDR50
10
TCR, TCF
Rise time, fall time
TCR, TCF < 2 ns (max)
at 100 MHz
CCARD = 10 pF
TODLY
TOH
100
MHz
40
ns
SDR12/SDR25/SDR50
0.2 TCLK
ns
Output delay time
CL 30 pF
SDR12/SDR25/SDR50
7.5
ns
Output hold time
CL 15 pF
SDR12/SDR25/SDR50
1.5
ns
SDIO Protocol Timing Diagram – SDR12, SDR25, SDR50 Modes (VIOSD 1.8 V)
TCLK
fPP
Clock
TCR
TCF
TIS
TIH
Input
TODLY
TOH
Output
SDIO Timing Data – SDR104 Mode (VIOSD 1.8 V)
Symbol
Parameter
Condition
fPP
Clock frequency
SDR104
0
TIS
Input setup time
SDR104
1.4
ns
TIH
Input hold time
SDR104
0.8
ns
TCLK
Clock time
SDR104
4.8
ns
TCR, TCF
Rise time, fall time
TCR, TCF < 0.96 ns
(max) at 208 MHz
CCARD = 10 pF
SDR104
TOP
Card output phase
SDR104
0
TODW
Output timing of
variable data window
SDR104
2.88
Product Specification Rev. 0.2
Min.
Typ.
Max.
Units
208
MHz
0.2 TCLK
ns
10
ns
ns
Page 54 of 83
PAN9028 Bluetooth Module
4 Specification
SDIO Protocol Timing Diagram – SDR104 Mode (VIOSD 1.8 V)
TCLK
fPP
Clock
TCR
TCF
TIS
TIH
Input
TOP
TODW
Output
SDIO Timing Data – DDR50 Mode (VIOSD 1.8 V)
Symbol
Parameter
Condition
TCLK
Clock time
50 MHz (max) between
rising edges
DDR50
TCR, TCF
Rise time, fall time
TCR, TCF < 4.00 ns (max)
at 50 MHz
CCARD = 10 pF
DDR50
Min.
Typ.
Max.
Units
Clock
Clock Duty
DDR50
20
45
ns
0.2 TCLK
ns
55
%
CMD Input (referenced to clock rising edge)
TIS
Input setup time
CCARD 10 pF (1 card)
DDR50
6
ns
TIH
Input hold time
CCARD 10 pF (1 card)
DDR50
0.8
ns
CMD Output (referenced to clock rising edge)
TOLDY
Output delay time during
data transfer mode
CL 30 pF (1 card)
DDR50
TOHLD
Output hold time
CL 15 pF (1 card)
DDR50
13.7
ns
1.5
ns
DAT[3:0] Input (referenced to clock rising and falling edges)
TIS2x
Input setup time
CCARD 10 pF (1 card)
DDR50
3
ns
TIH2x
Input hold time
CCARD 10 pF (1 card)
DDR50
0.8
ns
Product Specification Rev. 0.2
Page 55 of 83
PAN9028 Bluetooth Module
Symbol
4 Specification
Parameter
Condition
Min.
Typ.
Max.
Units
DAT[3:0] Output (referenced to clock rising and falling edges)
TODLY2x (max)
Output delay time during
data transfer mode
CL 25 pF (1 card)
DDR50
TODLY2x (min)
Output hold time
CL 15 pF (1 card)
DDR50
7.0
1.5
ns
ns
SDIO CMD Timing Diagram – DDR50 Mode (VIOSD 1.8 V, 50 MHz)
TCLK
Clock
TCR
TCF
TIS
TIH
CMD Input
TODLY
TOHLD
CMD Output
SDIO DAT[3:0] Timing Diagram – DDR50 Mode (VIOSD 1.8 V, 50 MHz)
TCLK
Clock
TIS2x
TIH2x
TIS2x
TIH2x
DAT[3:0]
Input
TODLY2x (max)
TODLY2x (max)
DAT[3:0]
Output
TODLY2x
(min)
Product Specification Rev. 0.2
TODLY2x
(min)
Page 56 of 83
PAN9028 Bluetooth Module
4.10.1.2
4 Specification
High-Speed UART Interface
The High-Speed UART Interface pins are powered from the VIO voltage supply
with either 3.3 V or 1.8 V.
For DC specifications please refer to “Digital Pin Characteristics” 4.3 Recommended
Operating Conditions.
The UART interface operation includes:
•
•
•
•
•
•
•
Support data input/output operations for peripheral devices connected through a standard
UART interface
4-wire data transfer (RxD, TxD, RTS and CTS) or 6-wire data transfer (RxD, TxD, RTS,
CTS, DSR, and DTR)
Programmable baud rate (1 200 bps to 4 Mbps)
Data format (LSB first)
Data bit: (5 bit to 8 bit)
Parity bit: (0 bit to 4 bit)
Stop bit: (1 bit to 2 bit)
Interface Signals
Pin No.
Signal Name
Specification
Name
Type
Description
B8
UART_SOUT TxD
Host Controller
Interface (HCI)
Transmit data output
A8
UART_SIN
RxD
A7
UART_RTS
RTS
Request to send (active low)
A6
UART_CTS
CTS
Clear to send (active low)
B6
UART_DSR
DSR
B7
UART_DTR
DTR
optional
Receive data input
Data set ready (active low)
Data terminal ready (active low)
Interface Transport Settings
Item
Baud Rate
Range
Default
1 200 ~ 4 000 000
Comment
3 000 000 Baud
Data Bits
5 ~ 8
8 LSB first
Parity Bits
0 ~ 4
0
1/1.5/2
1
Stop Bits
Product Specification Rev. 0.2
Page 57 of 83
PAN9028 Bluetooth Module
4 Specification
Supported Baud Rates
Baud Rate
1 200
2 400
4 800
9 600
19 200
38 400
57 600
76 800
115 200
230 400
460 800
500 000
921 600
1 000 000
1 382 400
1 500 000
1 843 200
2 000 000
2 100 000
2 764 800
3 000 000
3 250 000
3 692 300
4 000 000
UART Timing Diagram
UART RTS
Request to send
HOST à UART
UART CTS
HOST ß UART
Clear to send
Clear to send
Data bits
Data bits
UART TXD
HOST à UART
4.10.2
Peripheral Interface
The Peripheral Interface pins are powered from the VIO voltage supply with
either 3.3 V or 1.8 V.
For DC specifications please refer to “Digital Pin Characteristics” 4.3 Recommended
Operating Conditions.
GPIO Interface
The General-Purpose I/O (GPIO) interface is used to implement user-defined input and output
signals to and from the device, such as external interrupts and other user-defined I/Os.
Configurable GPIOs
Function
GPIO Pin Name
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
GPIO IN
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
GPIO OUT
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
IRQ IN
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
LED
NO
NO
YES
YES
NO
NO
NO
NO
NO
NO
Product Specification Rev. 0.2
Page 58 of 83
PAN9028 Bluetooth Module
4 Specification
Function
GPIO Pin Name
IO10
IO11
IO12
IO13
IO14
IO15
IO16
IO17
IO20
GPIO IN
YES
YES
YES
YES
YES
YES
YES
YES
YES
GPIO OUT
YES
YES
YES
YES
YES
YES
YES
YES
YES
IRQ IN
YES
YES
YES
YES
YES
YES
YES
YES
YES
LED
NO
NO
NO
NO
NO
NO
NO
NO
NO
LED Mode
4.10.3
Symbol
Parameter
Condition
Typ.
Units
IOH
Switching current high
Tristate on pin (requires pull-up)
Tristate when
driving high
mA
IOL
Switching current low
At 0.4 V
10
mA
Audio Interface: PCM Interface
Interface Signals
Pin No.
Signal Name
Specification
Name
Type
Description
F7
PCM_DOUT
DOUT
Output
PCM data
E1
PCM_CLK
CLK
Input/Output
PCM clock signal, output if PCM
master, input if PCM slave
E1
PCM_MCLK
MCLK
Output
PCM clock signal (optional),
optional clock used for some codecs,
derived from PCM_CLK
E11
PCM_DIN
DIN
Input
PCM data
F6
PCM_SYNC
SYNC
Input/Output
PCM Sync pulse signal, output if PCM
master, input if PCM slave
Modes of Operation
The PCM Interface supports two modes of operation:
•
•
PCM master
PCM slave
When in PCM master mode, the interface generates a 2 MHz or a 2.048 MHz PCM_CLK and a
8 kHz PCM_SYNC signal. An alternative PCM master mode is available that uses an externally
generated PCM_CLK, but still generate the 8 kHz PCM_SYNC. The external PCM_CLK must
have a frequency that is an integer multiple of 8 kHz. Supported frequencies are in the 512 kHz
to 4 MHz range.
When in PCM slave mode, the interface has both PCM_CLK and PCM_SYNC as inputs,
thereby letting another unit on the PCM bus generate the signals.
Product Specification Rev. 0.2
Page 59 of 83
PAN9028 Bluetooth Module
4 Specification
The PCM interface consists of up to four PCM slots (time-divided) preceded by a PCM sync
signal. Each PCM slot can be either 8 bits or 16 bits wide. The slots can be separated in time,
but they are not required to follow immediately after another. The timing is relative to
PCM_SYNC.
PCM Timing Data – Master Mode
Symbol
Min.
Typ.
FBCLK
Max.
Units
2/2.048
Duty CycleBLCK
0.4
TBCLK rise/fall
0.5
MHz
0.6
3
TDO
ns
15
ns
TDISU
20
ns
TDIHO
15
ns
TBF
15
ns
PCM Timing Diagram – Master Mode
TBCLK
CLK
TTDO
DOUT
TDISU
TDIHO
DIN
TBF
SYNC
Product Specification Rev. 0.2
Page 60 of 83
PAN9028 Bluetooth Module
4 Specification
PCM Timing Data – Slave Mode
Symbol
Min.
Typ.
FBCLK
Max.
Units
2/2.048
Duty CycleBLCK
0.4
TBCLK rise/fall
0.5
MHz
0.6
3
TDO
ns
30
ns
TDISU
15
ns
TDIHO
10
ns
TBFSU
15
ns
TBFHO
10
PCM Timing Diagram – Slave Mode
TBCLK
CLK
TTDO
DOUT
TDISU
TDIHO
TBFSU
TBFHO
DIN
SYNC
4.10.4
Coexistence Interface
The Peripheral Interface pins are powered from the VIO voltage supply with
either 3.3 V or 1.8 V.
For DC specifications please refer to “Digital Pin Characteristics” 4.3 Recommended
Operating Conditions.
Product Specification Rev. 0.2
Page 61 of 83
PAN9028 Bluetooth Module
4.11
4.11.1
4 Specification
RF Electrical Characteristics
WLAN Radio Specification
Receive Mode
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2.4 GHz – IEEE 802.11b/g/n
2 400
2 500
MHz
5 GHz – IEEE 802.11a/n/ac
4 900
5 925
MHz
Transmit Mode
4.11.2
4.11.2.1
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2.4 GHz – IEEE 802.11b/g/n
2 400
2 500
MHz
5 GHz – IEEE 802.11a/n/ac
4 900
5 925
MHz
WLAN RF Characteristics
RF Characteristics for IEEE 802.11b
For module variant ENWF940[x]A1EF assume VDD3V3 = 3.3 V, VIOSD = 3.3 V,
VIO = 3.3 V and Tamb = 25 °C, if nothing else stated.
For module variant ENWF940[x]A2EF assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V,
VDD1V8 = 1.8 V, VDD1V1 = 1.1 V, VIOSD = 3.3 V, VIO = 3.3 V and Tamb = 25 °C, if
nothing else stated.
50 Ω terminal load connected to the RF connector.
Parameter
Condition
RF frequency range
Carrier frequency tolerance
Min.
Typ.
2 483.5
MHz
-25
+25
ppm
+16
dBm
fC ± 11 MHz
-30
dBr
fC ± 22 MHz
-50
dBr
2
µs
-15
dB
35
%
Power-on/Power-down ramp
RF Carrier suppression
Error Vector Magnitude (EVM)
Peak
Minimum receive sensitivity
1 Mbps (DSSS)
FER 8 %
-97
2 Mbps (DSSS)
FER 8 %
-93
5.5 Mbps (CCK)
FER 8 %
-91
11 Mbps (CCK)
FER 8 %
-88
Maximum input level
FER 8 %
Adjacent channel rejection
FER 8 %
Product Specification Rev. 0.2
Units
2 400
Transmit output power
Spectrum mask
Max.
35
dBm
-80
dBm
dBm
-76
dBm
-10
dBm
dB
Page 62 of 83
PAN9028 Bluetooth Module
4.11.2.2
4 Specification
RF Characteristics for IEEE 802.11g
For module variant ENWF940[x]A1EF assume VDD3V3 = 3.3 V, VIOSD = 3.3 V,
VIO = 3.3 V and Tamb = 25 °C, if nothing else stated.
For module variant ENWF940[x]A2EF assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V,
VDD1V8 = 1.8 V, VDD1V1 = 1.1 V, VIOSD = 3.3 V, VIO = 3.3 V and Tamb = 25 °C, if
nothing else stated.
50 Ω terminal load connected to the RF connector.
Parameter
RF frequency range
Condition
2.4 GHz
Carrier frequency tolerance
Transmit output power
Spectrum mask
Min.
Typ.
2 483.5
MHz
-25
+25
ppm
6 Mbps ~ 36 Mbps
+16
dBm
48 Mbps ~ 54 Mbps
+16
dBm
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-40
dBr
-15
dB
+4
dB
BPSK, CR 1/2 (6 Mbps)
-5
dB
BPSK, CR 3/4 (9 Mbps)
-8
dB
QPSK, CR 1/2 (12 Mbps)
-10
dB
QPSK, CR 3/4 (18 Mbps)
-13
dB
16-QAM, CR 1/2 (24 Mbps)
-16
dB
16-QAM, CR 3/4 (36 Mbps)
-19
dB
64-QAM, CR 2/3 (48 Mbps)
-22
dB
64-QAM, CR 3/4 (54 Mbps)
-25
dB
Transmitter Spectral Flatness
Minimum receive sensitivity
Units
2 400
Transmitter center frequency
leakage
EVM Constellation Error (EVM)
Max.
-4
BPSK, CR 1/2 (6 Mbps)
PER 10 %
-89
-82
dBm
BPSK, CR 3/4 (9 Mbps)
PER 10 %
-89
-81
dBm
QPSK, CR 1/2 (12 Mbps)
PER 10 %
-88
-79
dBm
QPSK, CR 3/4 (18 Mbps)
PER 10 %
-86
-77
dBm
16-QAM, CR 1/2 (24 Mbps)
PER 10 %
-83
-74
dBm
16-QAM, CR 3/4 (36 Mbps)
PER 10 %
-80
-70
dBm
64-QAM, CR 2/3 (48 Mbps)
PER 10 %
-76
-66
dBm
64-QAM, CR 3/4 (54 Mbps)
PER 10 %
-74
-65
dBm
-20
dBm
Maximum input level
PER 10 %
Adjacent channel rejection
PER 10 %
16
dB
PER 10 %
-1
dB
Product Specification Rev. 0.2
Page 63 of 83
PAN9028 Bluetooth Module
4.11.2.3
4 Specification
RF Characteristics for IEEE 802.11n (BW 20 MHz, 2.4 GHz)
For module variant ENWF940[x]A1EF assume VDD3V3 = 3.3 V, VIOSD = 3.3 V,
VIO = 3.3 V and Tamb = 25 °C, if nothing else stated.
For module variant ENWF940[x]A2EF assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V,
VDD1V8 = 1.8 V, VDD1V1 = 1.1 V, VIOSD = 3.3 V, VIO = 3.3 V and Tamb = 25 °C, if
nothing else stated.
50 Ω terminal load connected to the RF connector.
Parameter
Condition
2.4 GHz
RF frequency range
Carrier frequency tolerance
Transmit output power
Spectrum mask
Min.
Typ.
Max.
2 400
2 483.5
MHz
-25
+25
ppm
MCS0 ~ MCS2
+16
dBm
MCS3 ~ MCS4
+16
dBm
MCS5 ~ MCS7
+16
dBm
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-45
dBr
-15
dB
+4
dB
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
Transmitter center frequency
leakage
Transmitter spectral flatness
Constellation Error (EVM)
Minimum receive sensitivity
13
13
Units
-4
6.5 Mbps (MCS0)
PER 10 %
-89
-82
dBm
13 Mbps (MCS1)
PER 10 %
-87
-79
dBm
19.5 Mbps (MCS2)
PER 10 %
-84
-77
dBm
26 Mbps (MCS3)
PER 10 %
-81
-74
dBm
39 Mbps (MCS4)
PER 10 %
-78
-70
dBm
52 Mbps (MCS5)
PER 10 %
-75
-66
dBm
58.5 Mbps (MCS6)
PER 10 %
-73
-65
dBm
65 Mbps (MCS7)
PER 10 %
-71
-64
dBm
The minimum sensitivity levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI, and BCC.
Product Specification Rev. 0.2
Page 64 of 83
PAN9028 Bluetooth Module
4 Specification
Parameter
Condition
4.11.2.4
Typ.
PER 10 %
Maximum input level
Adjacent channel rejection
Min.
14
65 Mbps (MCS7)
Max.
Units
-20
PER 10 %
dBm
-2
dB
RF Characteristics for IEEE 802.11n (BW 40 MHz, 2.4 GHz)
For module variant ENWF940[x]A1EF assume VDD3V3 = 3.3 V, VIOSD = 3.3 V,
VIO = 3.3 V and Tamb = 25 °C, if nothing else stated.
For module variant ENWF940[x]A2EF assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V,
VDD1V8 = 1.8 V, VDD1V1 = 1.1 V, VIOSD = 3.3 V, VIO = 3.3 V and Tamb = 25 °C, if
nothing else stated.
50 Ω terminal load connected to the RF connector.
Parameter
Condition
2.4 GHz
RF frequency range
Carrier frequency tolerance
Transmit output power
Spectrum mask
Min.
Typ.
2 483.5
MHz
-25
+25
ppm
MCS0 ~ MCS2
+14
dBm
MCS3 ~ MCS4
+14
dBm
MCS5 ~ MCS7
+13
dBm
fC ± 21 MHz
-20
dBr
fC ± 40 MHz
-28
dBr
fC ± 60 MHz
-45
dBr
-20
dB
+4
dB
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
Transmitter spectral flatness
Minimum receive sensitivity
14
13
Units
2 400
Transmitter center frequency
leakage
Constellation Error (EVM)
Max.
-4
13.5 Mbps (MCS0)
PER 10 %
-83
-79
dBm
27 Mbps (MCS1)
PER 10 %
-83
-76
dBm
40.5 Mbps (MCS2)
PER 10 %
-80
-74
dBm
54 Mbps (MCS3)
PER 10 %
-78
-71
dBm
The adjacent channel rejection levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI, and BCC.
Product Specification Rev. 0.2
Page 65 of 83
PAN9028 Bluetooth Module
4 Specification
Parameter
Condition
4.11.2.5
Typ.
Max.
Units
81 Mbps (MCS4)
PER 10 %
-73
-67
dBm
108 Mbps (MCS5)
PER 10 %
-70
-63
dBm
121.5 Mbps (MCS6)
PER 10 %
-68
-62
dBm
135 Mbps (MCS7)
PER 10 %
-66
-61
dBm
-20
dBm
PER 10 %
Maximum input level
Adjacent channel rejection14
Min.
135 Mbps (MCS7)
PER 10 %
-2
dB
RF Characteristics for IEEE 802.11n (BW 20 MHz, 5 GHz)
For module variant ENWF940[x]A1EF assume VDD3V3 = 3.3 V, VIOSD = 3.3 V,
VIO = 3.3 V and Tamb = 25 °C, if nothing else stated.
For module variant ENWF940[x]A2EF assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V,
VDD1V8 = 1.8 V, VDD1V1 = 1.1 V, VIOSD = 3.3 V, VIO = 3.3 V and Tamb = 25 °C, if
nothing else stated.
50 Ω terminal load connected to the RF connector.
Parameter
RF frequency range
Condition
Spectrum mask
Typ.
5 150
5 250
MHz
5 250
5 350
MHz
5 GHz U-NII-2C
5 470
5 725
MHz
5 GHz U-NII-3
5 725
5 825
MHz
-20
+20
ppm
MCS0 ~ MCS2
+16
dBm
MCS3 ~ MCS4
+16
dBm
MCS5 ~ MCS7
+15
dBm
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-40
dBr
-15
dB
+4
dB
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
Transmitter spectral flatness
Product Specification Rev. 0.2
Units
5 GHz U-NII-2A
Transmitter center frequency
leakage
Constellation Error (EVM)
Max.
5 GHz U-NII-1
Carrier frequency tolerance
Transmit output power
Min.
-4
Page 66 of 83
PAN9028 Bluetooth Module
4 Specification
Parameter
Condition
Minimum receive sensitivity
13
4.11.2.6
Typ.
Units
PER 10 %
-90
-82
dBm
13 Mbps (MCS1)
PER 10 %
-87
-79
dBm
19.5 Mbps (MCS2)
PER 10 %
-85
-77
dBm
26 Mbps (MCS3)
PER 10 %
-82
-74
dBm
39 Mbps (MCS4)
PER 10 %
-80
-70
dBm
52 Mbps (MCS5)
PER 10 %
-75
-66
dBm
58.5 Mbps (MCS6)
PER 10 %
-74
-65
dBm
65 Mbps (MCS7)
PER 10 %
-72
-64
dBm
-30
dBm
PER 10 %
14
Max.
6.5 Mbps (MCS0)
Maximum input level
Adjacent channel rejection
Min.
65 Mbps (MCS7)
PER 10 %
-2
dB
RF Characteristics for IEEE 802.11n (BW 40 MHz, 5 GHz)
For module variant ENWF940[x]A1EF assume VDD3V3 = 3.3 V, VIOSD = 3.3 V,
VIO = 3.3 V and Tamb = 25 °C, if nothing else stated.
For module variant ENWF940[x]A2EF assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V,
VDD1V8 = 1.8 V, VDD1V1 = 1.1 V, VIOSD = 3.3 V, VIO = 3.3 V and Tamb = 25 °C, if
nothing else stated.
50 Ω terminal load connected to the RF connector.
Parameter
RF frequency range
Condition
Spectrum mask
Typ.
5 250
MHz
5 GHz U-NII-2A
5 250
5 350
MHz
5 GHz U-NII-2C
5 470
5 725
MHz
5 GHz U-NII-3
5 725
5 825
MHz
-20
+20
ppm
MCS0 ~ MCS2
+16
dBm
MCS3 ~ MCS4
+16
dBm
MCS5 ~ MCS7
+15
dBm
fC ± 21 MHz
-20
dBr
fC ± 40 MHz
-28
dBr
fC ± 60 MHz
-40
dBr
-20
dB
+4
dB
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
Transmitter spectral flatness
Product Specification Rev. 0.2
Units
5 150
Transmitter center frequency
leakage
Constellation Error (EVM)
Max.
5 GHz U-NII-1
Carrier frequency tolerance
Transmit output power
Min.
-4
Page 67 of 83
PAN9028 Bluetooth Module
4 Specification
Parameter
Condition
Minimum receive sensitivity
13
4.11.2.7
Typ.
Units
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
13.5 Mbps (MCS0)
PER 10 %
-87
-79
dBm
27 Mbps (MCS1)
PER 10 %
-84
-76
dBm
40.5 Mbps (MCS2)
PER 10 %
-82
-74
dBm
54 Mbps (MCS3)
PER 10 %
-79
-71
dBm
81 Mbps (MCS4)
PER 10 %
-77
-67
dBm
108 Mbps (MCS5)
PER 10 %
-73
-63
dBm
121.5 Mbps (MCS6)
PER 10 %
-71
-62
dBm
135 Mbps (MCS7)
PER 10 %
-70
-61
dBm
-30
dBm
PER 10 %
14
Max.
16-QAM, CR 3/4 (MCS4)
Maximum input level
Adjacent channel rejection
Min.
135 Mbps (MCS7)
PER 10 %
-2
dB
RF Characteristics for IEEE 802.11ac (BW 20 MHz)
For module variant ENWF940[x]A1EF assume VDD3V3 = 3.3 V, VIOSD = 3.3 V,
VIO = 3.3 V and Tamb = 25 °C, if nothing else stated.
For module variant ENWF940[x]A2EF assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V,
VDD1V8 = 1.8 V, VDD1V1 = 1.1 V, VIOSD = 3.3 V, VIO = 3.3 V and Tamb = 25 °C, if
nothing else stated.
50 Ω terminal load connected to the RF connector.
Parameter
RF frequency range
Condition
Spectrum mask
Transmitter center frequency
leakage
Product Specification Rev. 0.2
Typ.
Max.
Units
5 GHz U-NII-1
5 150
5 250
MHz
5 GHz U-NII-2A
5 250
5 350
MHz
5 GHz U-NII-2C
5 470
5 725
MHz
5 GHz U-NII-3
5 725
5 825
MHz
-20
+20
ppm
Carrier frequency tolerance
Transmit output power
Min.
MCS0 ~ MCS2
+16
dBm
MCS3 ~ MCS4
+16
dBm
MCS5 ~ MCS7
+15
dBm
MCS8
+15
dBm
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-40
dBr
P-17.48
dB
P is transmit power per
antenna in dBm
Page 68 of 83
PAN9028 Bluetooth Module
4 Specification
Parameter
Condition
Min.
Transmitter spectral flatness
Constellation Error (EVM)
Minimum receive sensitivity
13
-4
4.11.2.8
Max.
Units
+4
dB
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
256-QAM, CR 3/4 (MCS8)
-30
dB
6.5 Mbps (MCS0)
PER 10 %
-90
-82
dBm
13 Mbps (MCS1)
PER 10 %
-87
-79
dBm
19.5 Mbps (MCS2)
PER 10 %
-85
-77
dBm
26 Mbps (MCS3)
PER 10 %
-82
-74
dBm
39 Mbps (MCS4)
PER 10 %
-80
-70
dBm
52 Mbps (MCS5)
PER 10 %
-75
-66
dBm
58.5 Mbps (MCS6)
PER 10 %
-74
-65
dBm
65 Mbps (MCS7)
PER 10 %
-72
-64
dBm
78 Mbps (MCS 8)
PER 10 %
-68
-59
dBm
-30
dBm
PER 10 %
Maximum input level
Adjacent channel rejection14
Typ.
78 Mbps (MCS8)
PER 10 %
-7
dB
RF Characteristics for IEEE 802.11ac (BW 40 MHz)
For module variant ENWF940[x]A1EF assume VDD3V3 = 3.3 V, VIOSD = 3.3 V,
VIO = 3.3 V and Tamb = 25 °C, if nothing else stated.
For module variant ENWF940[x]A2EF assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V,
VDD1V8 = 1.8 V, VDD1V1 = 1.1 V, VIOSD = 3.3 V, VIO = 3.3 V and Tamb = 25 °C, if
nothing else stated.
50 Ω terminal load connected to the RF connector.
Parameter
RF frequency range
Condition
Product Specification Rev. 0.2
Typ.
Max.
Units
5 GHz U-NII-1
5 150
5 250
MHz
5 GHz U-NII-2A
5 250
5 350
MHz
5 GHz U-NII-2C
5 470
5 725
MHz
5 GHz U-NII-3
5 725
5 825
MHz
-20
+20
ppm
Carrier frequency tolerance
Transmit output power
Min.
MCS0 ~ MCS2
+16
dBm
Page 69 of 83
PAN9028 Bluetooth Module
4 Specification
Parameter
Condition
Spectrum mask
Transmitter center frequency
leakage
Minimum receive sensitivity
13
Product Specification Rev. 0.2
Max.
Units
+16
dBm
MCS5 ~ MCS7
+15
dBm
MCS8 ~ MCS9
+14
dBm
fC ± 21 MHz
-20
dBr
fC ± 40 MHz
-28
dBr
fC ± 60 MHz
-40
dBr
P-20.57
dB
+4
dB
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
256-QAM, CR 3/4 (MCS8)
-30
dB
256-QAM, CR 5/6 (MCS9)
-32
dB
P is transmit power per
antenna in dBm
-4
13.5 Mbps (MCS0)
PER 10 %
-87
-79
dBm
27 Mbps (MCS1)
PER 10 %
-84
-76
dBm
40.5 Mbps (MCS2)
PER 10 %
-82
-74
dBm
54 Mbps (MCS3)
PER 10 %
-79
-71
dBm
81 Mbps (MCS4)
PER 10 %
-77
-67
dBm
108 Mbps (MCS5)
PER 10 %
-73
-63
dBm
121.5 Mbps (MCS6)
PER 10 %
-71
-62
dBm
135 Mbps (MCS7)
PER 10 %
-70
-61
dBm
162 Mbps (MCS8)
PER 10 %
-65
-56
dBm
180 Mbps (MCS9)
PER 10 %
-64
-54
dBm
-30
dBm
PER 10 %
Maximum input level
Adjacent channel rejection14
Typ.
MCS3 ~ MCS4
Transmitter spectral flatness
Constellation Error (EVM)
Min.
180 Mbps (MCS9)
PER 10 %
-9
dB
Page 70 of 83
PAN9028 Bluetooth Module
4.11.2.9
4 Specification
RF Characteristics for IEEE 802.11ac (BW 80 MHz)
For module variant ENWF940[x]A1EF assume VDD3V3 = 3.3 V, VIOSD = 3.3 V,
VIO = 3.3 V and Tamb = 25 °C, if nothing else stated.
For module variant ENWF940[x]A2EF assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V,
VDD1V8 = 1.8 V, VDD1V1 = 1.1 V, VIOSD = 3.3 V, VIO = 3.3 V and Tamb = 25 °C, if
nothing else stated.
50 Ω terminal load connected to the RF connector.
Parameter
Condition
RF frequency range
Spectrum mask
Transmitter center frequency
leakage
Minimum receive sensitivity
13
Product Specification Rev. 0.2
Max.
Units
5 150
5 250
MHz
5 GHz U-NII-2A
5 250
5 350
MHz
5 GHz U-NII-2C
5 470
5 725
MHz
5 GHz U-NII-3
5 725
5 825
MHz
-20
+20
ppm
MCS0 ~ MCS2
+14
dBm
MCS3 ~ MCS4
+14
dBm
MCS5 ~ MCS7
+12
dBm
MCS8 ~ MCS9
+6
dBm
fC ± 41 MHz
-20
dBr
fC ± 80 MHz
-28
dBr
fC ± 120 MHz
-40
dBr
P-23.84
dB
+4
dB
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
256-QAM, CR 3/4 (MCS8)
-30
dB
256-QAM, CR 5/6 (MCS9)
-32
dB
P is transmit power per
antenna in dBm
Transmitter spectral flatness
Constellation Error (EVM)
Typ.
5 GHz U-NII-1
Carrier frequency tolerance
Transmit output power
Min.
-4
29.3 Mbps (MCS0)
PER 10 %
-83
-76
dBm
58.5 Mbps (MCS1)
PER 10 %
-81
-73
dBm
87.8 Mbps (MCS2)
PER 10 %
-78
-71
dBm
117 Mbps (MCS3)
PER 10 %
-76
-68
dBm
175.5 Mbps (MCS4)
PER 10 %
-74
-64
dBm
Page 71 of 83
PAN9028 Bluetooth Module
4 Specification
Parameter
Condition
4.11.2.10
Typ.
Max.
Units
234 Mbps (MCS5)
PER 10 %
-69
-60
dBm
263.3 Mbps (MCS6)
PER 10 %
-68
-59
dBm
292.5 Mbps (MCS7)
PER 10 %
-66
-58
dBm
351 Mbps (MCS8)
PER 10 %
-62
-53
dBm
390 Mbps (MCS9)
PER 10 %
-59
-51
dBm
-30
dBm
PER 10 %
Maximum input level
Adjacent channel rejection14
Min.
390 Mbps (MCS9)
PER 10 %
-9
dB
RF Characteristics for IEEE 802.11a
For module variant ENWF940[x]A1EF assume VDD3V3 = 3.3 V, VIOSD = 3.3 V,
VIO = 3.3 V and Tamb = 25 °C, if nothing else stated.
For module variant ENWF940[x]A2EF assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V,
VDD1V8 = 1.8 V, VDD1V1 = 1.1 V, VIOSD = 3.3 V, VIO = 3.3 V and Tamb = 25 °C, if
nothing else stated.
50 Ω terminal load connected to the RF connector.
Parameter
RF frequency range
Condition
Spectrum mask
Typ.
5 250
MHz
5 GHz U-NII-2A
5 250
5 350
MHz
5 GHz U-NII-2C
5 470
5 725
MHz
5 GHz U-NII-3
5 725
5 825
MHz
-20
+20
Ppm
6 Mbps ~ 36 Mbps
+16
dBm
48 Mbps ~ 54 Mbps
+16
dBm
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-40
dBr
-15
dB
+4
dB
BPSK, CR 1/2 (6 Mbps)
-5
dB
BPSK, CR 3/4 (9 Mbps)
-8
dB
QPSK, CR 1/2 (12 Mbps)
-10
dB
QPSK, CR 3/4 (18 Mbps)
-13
dB
16-QAM, CR 1/2 (24 Mbps)
-16
dB
16-QAM, CR 3/4 (36 Mbps)
-19
dB
64-QAM, CR 2/3 (48 Mbps)
-22
dB
64-QAM, CR 3/4 (54 Mbps)
-25
dB
Transmitter spectral flatness
Product Specification Rev. 0.2
Units
5 150
Transmitter center frequency
leakage
Constellation Error (EVM)
Max.
5 GHz U-NII-1
Carrier frequency tolerance
Transmit output power
Min.
-4
Page 72 of 83
PAN9028 Bluetooth Module
4 Specification
Parameter
Condition
Minimum receive sensitivity
4.11.3
Typ.
Max.
Units
BPSK, CR 1/2 (6 Mbps)
PER 10 %
-90
-82
dBm
BPSK, CR 3/4 (9 Mbps)
PER 10 %
-90
-79
dBm
QPSK, CR 1/2 (12 Mbps)
PER 10 %
-89
-77
dBm
QPSK, CR 3/4 (18 Mbps)
PER 10 %
-87
-74
dBm
16-QAM, CR 1/2 (24 Mbps)
PER 10 %
-85
-70
dBm
16-QAM, CR 3/4 (36 Mbps)
PER 10 %
-81
-66
dBm
64-QAM, CR 2/3 (48 Mbps)
PER 10 %
-77
-65
dBm
64-QAM, CR 3/4 (54 Mbps)
PER 10 %
-75
-64
dBm
-30
dBm
PER 10 %
Maximum input level
Adjacent channel rejection
Min.
BPSK, CR 1/2 (6 Mbps)
PER 10 %
16
dB
64-QAM, CR 3/4 (54 Mbps)
PER 10 %
-1
dB
Bluetooth RF Characteristics
For module variant ENWF940[x]A1EF assume VDD3V3 = 3.3 V, VIOSD = 3.3 V,
VIO = 3.3 V and Tamb = 25 °C, if nothing else stated.
For module variant ENWF940[x]A2EF assume VDD3V3 = 3.3 V, VDD2V2 = 2.2 V,
VDD1V8 = 1.8 V, VDD1V1 = 1.1 V, VIOSD = 3.3 V, VIO = 3.3 V and Tamb = 25 °C, if
nothing else stated.
50 Ω terminal load connected to the RF connector.
4.11.3.1
Receiver Section RF Characteristics
Parameter
Condition
Min.
RF frequency range
Interference Performance
(Basic Rate)
C/I Ratio
2 400
GFSK
RSL = -67 dBm
BER 0.1 %
C/I (Co-channel)
Max.
Units
2 483.5
MHz
11
dB
C/I (1 MHz)
0
dB
C/I (2 MHz)
-30
dB
C/I (3 MHz)
-40
dB
C/I (Image)
-9
dB
-20
dB
C/I (Image ± 1 MHz)
Product Specification Rev. 0.2
Typ.
Page 73 of 83
PAN9028 Bluetooth Module
4 Specification
Parameter
Condition
Interference Performance
(Enhanced Data Rate)
π/4-DQPSK
C/I Ratio
RSL= -67 dBm
BER 0.01 %
Min.
Typ.
C/I (Co-channel)
dB
C/I (1 MHz)
0
dB
C/I (2 MHz)
-30
dB
C/I (3 MHz)
-40
dB
-7
dB
-20
dB
21
dB
C/I (1 MHz)
5
dB
C/I (2 MHz)
-25
dB
C/I (3 MHz)
-33
dB
C/I (Image)
0
dB
-13
dB
21
dB
C/I (1 MHz)
15
dB
C/I (2 MHz)
-17
dB
C/I (3 MHz)
-27
dB
C/I (Image)
-9
dB
-15
dB
C/I (Co-channel)
21
dB
C/I (2 MHz)
15
dB
C/I (3 MHz)
-17
dB
C/I (6 MHz)
-27
dB
C/I (Image ± 1 MHz)
RSL = -67 dBm
BER 0.01 %
C/I (Co-channel)
C/I (Image ± 1 MHz)
Interference Performance
(Low Energy)
C/I Ratio
GFSK
RSL = -67 dBm
BER 0.1 %
1 Mbps
C/I (Co-channel)
C/I (Image ± 1 MHz)
GFSK
RSL = -67 dBm
BER 0.1 %
2 Mbps
C/I (Image)
C/I (Image ± 2 MHz)
Minimum Receive Sensitivity
Out-of-band blocking
(Basic Rate)
Interfering Signal Power
Out-of-band blocking
(Low Energy)
Interfering Signal Power
RSSI Range
Product Specification Rev. 0.2
Units
13
C/I (Image)
8-DPSK
Max.
-9
dB
-15
dB
BR, DH1
BER ≤ 0.1 %
-94
-70
dBm
EDR, 2DH1
BER ≤ 0.01 %
-90
-70
dBm
LE, GFSK
BER ≤ 0.1 %
-90
-70
dBm
GFSK
30 MHz to 2 000 MHz
-10
dB
2 GHz to 2.399 GHz
-27
dB
2.484 GHz to 3 GHz
-27
dB
3 GHz to 12.75 GHz
-10
dB
30 MHz to 2 000 MHz
-30
dB
2 GHz to 2.399 GHz
-35
dB
2.484 GHz to 3 GHz
-35
dB
3 GHz to 12.75 GHz
-30
dB
0
dB
RSL = -67 dBm
BER 0.1 %
GFSK
RSL = -67 dBm
BER 0.1 %
Resolution = 1 dB
-90
Page 74 of 83
PAN9028 Bluetooth Module
4.11.3.2
4 Specification
Transmitter Section RF Characteristics
Parameter
Condition
Min.
RF frequency range
Maximum output power
Gain range
Spurious emission (EDR)
(in-band)
Spurious emission (LE)
(in-band)
2 483.5
Units
MHz
Basic Rate (BR)
+8
dBm
Enhanced Data Rate (EDR)
+6
dBm
Low energy (LE)
+6
dBm
Gain Control
30
dB
0.5
dB
± 500 kHz
-20
dBc
± 2 MHz, |M-N| = 2
-20
dBm
± 3 MHz or greater, |M-N| ≥ 3
-40
dBm
± 1 MHz
-26
dBc
± 1.5 MHz
-20
dBm
± 2.5 MHz
-40
dBm
± 2 MHz, |M-N| = 2
-20
dBm
± 3 MHz or greater, |M-N| ≥ 3
-30
dBm
± 4 MHz, |M-N| = 4
-20
dBm
± 5 MHz, |M-N| = 5
-20
dBm
± 6 MHz or greater, |M-N| ≥ 6
-30
dBm
1 Mbps
2 Mbps
4.12
Max.
2 400
Gain resolution
Spurious emission (BR)
(in-band)
Typ.
Reliability Tests
The measurement should be done after the test device has been exposed to room temperature
and humidity for one hour.
No.
Item
1 Vibration test
Limit
Condition
Electrical parameter are in
specification
Freq.: 10~50 Hz; Amplitude: 1.5 mm;
20 min./cycle, 1 h each of XYZ axis
2 Shock test
Dropped 3 times onto hard wood from
a height of 1 m
3 Heat cycle test
-30 °C for 30 min. and 85 °C for
30 min.; each temperature 300 cycles
4 Moisture test
60 °C, 90 % RH, 300 h
5 Low temperature test
-40 °C, 300 h
6 High temp. test
85 °C, 300 h
Product Specification Rev. 0.2
Page 75 of 83
PAN9028 Bluetooth Module
4.13
4 Specification
Recommended Soldering Profile
•
•
•
•
•
Reflow permissible cycles: 2
Opposite side reflow is prohibited due to module weight
More than 75 percent of the soldering area shall be coated by solder
The soldering profiles should be adhered to in order to prevent electrical
or mechanical damage
Soldering profile assumes lead-free soldering
Product Specification Rev. 0.2
Page 76 of 83
PAN9028 Bluetooth Module
5 Cautions
5 Cautions
Failure to follow the guidelines set forth in this document may result in
degrading of the module functions and damage to the module.
5.1
Design Notes
1. Follow the conditions written in this specification, especially the control signals of this
module.
2. The supply voltage should abide by the maximum ratings ( 4.2 Absolute Maximum
Ratings).
3. The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for
example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF
directly at the module).
4. This module should not be mechanically stressed when installed.
5. Keep this module away from heat. Heat is the major cause of decreasing the life time of
these modules.
6. Avoid assembly and use of the target equipment in conditions where the module
temperature may exceed the maximum tolerance.
7. Keep this module away from other high frequency circuits.
8. Refer to the recommended pattern when designing a board.
5.2
Installation Notes
1. Reflow soldering is possible twice based on the conditions set forth in
4.13 Recommended Soldering Profile. Set up the temperature at the soldering portion
of this module according to this reflow profile.
2. Carefully position the module so that the heat will not burn into printed circuit boards or
affect other components that are susceptible to heat.
3. Carefully locate the module, to avoid an increased temperature caused by heat
generated by neighboring components.
4. If a vinyl-covered wire comes into contact with the module, the wire cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between a vinyl cover
and these modules to occur.
5. This module should not be mechanically stressed or vibrated when reflowed.
6. To repair the board by hand soldering, follow the conditions set forth in this chapter.
7. Do not wash this product.
8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage
to the module.
Product Specification Rev. 0.2
Page 77 of 83
PAN9028 Bluetooth Module
5.3
5 Cautions
Usage Condition Notes
1. Take measures to protect the module against static electricity.
If pulses or transient loads (a large load, which is suddenly applied) are applied to the
modules, check and evaluate their operation before assembly of the final products.
2. Do not use dropped modules.
3. Do not touch, damage, or soil the pins.
4. Follow the recommended condition ratings about the power supply applied to this
module.
5. Electrode peeling strength: Do not apply a force of more than 4.9 N in any direction on
the soldered module.
6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause
damage.
7. These modules are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information, and communication
equipment.
5.4
Storage Notes
1. The module should not be stressed mechanically during storage.
2. Do not store these modules in the following conditions or the performance characteristics
of the module, such as RF performance will be adversely affected:
–
Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX,
–
Storage in direct sunlight,
–
Storage in an environment where the temperature may be outside the range of 5 °C to
35 °C, or where the humidity may be outside the 45 % to 85 % range,
–
Storage of the modules for more than one year after the date of delivery storage period:
Please check the adhesive strength of the embossed tape and soldering after 6 months
of storage.
3. Keep this module away from water, poisonous gas, and corrosive gas.
4. This module should not be stressed or shocked when transported.
5. Follow the specification when stacking packed crates (max. 10).
5.5
Safety Cautions
These specifications are intended to preserve the quality assurance of products and individual
components.
Before use, check and evaluate the operation when mounted on your products. Abide by these
specifications without deviation when using the products. These products may short-circuit. If
electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a
short circuit occurs, provide the following failsafe functions as a minimum:
Product Specification Rev. 0.2
Page 78 of 83
PAN9028 Bluetooth Module
5 Cautions
1. Ensure the safety of the whole system by installing a protection circuit and a protection
device.
2. Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
5.6
Other Cautions
1. Do not use the module for other purposes than those listed in section 5.3 Usage
Condition Notes.
2. Be sure to provide an appropriate fail-safe function on your product to prevent any
additional damage that may be caused by the abnormal function or the failure of the
module.
3. This module has been manufactured without any ozone chemical controlled under the
Montreal Protocol.
4. These modules are not intended for use under the special conditions shown below.
Before using these modules under such special conditions, carefully check their
performance and reliability under the said special conditions to determine whether or not
they can be used in such a manner:
–
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash,
–
In direct sunlight, outdoors, or in a dusty environment,
–
In an environment where condensation occurs,
–
In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2,
SO2, H2S, NH3, and NOX).
5. If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these modules with new modules, because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
For further information please refer to the Panasonic website 7.2.2 Product
Information.
Product Specification Rev. 0.2
Page 79 of 83
PAN9028 Bluetooth Module
5.7
5.7.1
5 Cautions
Restricted Use
Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a
significant personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
Panasonic customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any
damages resulting.
5.7.2
Restricted End Use
This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted
activity that supports the development, production, handling usage, maintenance, storage,
inventory or proliferation of any weapons or military use.
Transfer, export, re-export, usage or reselling of this product to any destination, end user or any
end use prohibited by the European Union, United States or any other applicable law is strictly
prohibited.
Product Specification Rev. 0.2
Page 80 of 83
PAN9028 Bluetooth Module
6 Regulatory and Certification Information
6 Regulatory and Certification Information
TBD
Product Specification Rev. 0.2
Page 81 of 83
PAN9028 Bluetooth Module
7 Appendix
7 Appendix
7.1
Ordering Information
Variants and Versions
MOQ15
Order Number
Brand Name
Description
ENWF9408A1EF16
PAN9028
Wi-Fi/Bluetooth radio module IEEE 802.11 a/b/g/n/ac
Bluetooth/Bluetooth LE 5 with a ceramic chip-antenna,
1 000
Multi-region version certified for US, EU, and CA 17
ENWF9408A2EF16
PAN9028
Wi-Fi/Bluetooth radio module IEEE 802.11 a/b/g/n/ac
Bluetooth/Bluetooth LE 5 with a ceramic chip-antenna,
without PMIC 88PG823 and without 32 kHz crystal, Multi-
1 000
region version certified for US, EU, and CA17
ENWF9408AXEF
PAN9028-IMX
i.MX6+PAN9028 Development Kit:
1
1× PAN9028 MicroSD Adapter,
1× Wandboard WBIMX6U,
1× MicroSD Card,
1× Adapter cable USB-A to DC 5.5/2.5mm plug
ENWF9408AWEF
PAN9028-MSD PAN9028 MicroSD Adapter with module
ENWF9408A1EF
1
15
Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1000 pieces,
fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution
channels.
16
Samples are available on customer demand.
17
The multi-region version is restricted to FCC, European ETSI, and Canadian ISED regulatory domain with
blocked Tx power table, which is stored on the OTP memory of device. The device does not support the
channels 12 to13 in the 2.4 GHz band. DFS and passive scanning mechanism are not necessary as only the
non-DFS channels in the 5 GHz band are supported.
Product Specification Rev. 0.2
Page 82 of 83
PAN9028 Bluetooth Module
7.2
7.2.1
7 Appendix
Contact Details
Contact Us
Please contact your local Panasonic Sales office for details on additional product options and
services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: wireless@eu.panasonic.com
For Panasonic Sales assistance in North America, visit the Panasonic website
“Sales & Support” to find assistance near you at
https://na.industrial.panasonic.com/distributors
Please visit the Panasonic Wireless Technical Forum to submit a question at
https://forum.na.industrial.panasonic.com
7.2.2
Product Information
Please refer to the Panasonic Wireless Connectivity website for further information on our
products and related documents:
For complete Panasonic product details in the EU, visit
http://pideu.panasonic.de/products/wireless-modules.html
For complete Panasonic product details in North America, visit
http://www.panasonic.com/rfmodules
Product Specification Rev. 0.2
Page 83 of 83
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