LNJ214R8ARA

This product complies with the RoHS Directive (EU 2002/95/EC). LNJ214R8ARA Surface Mounting Chip LED USS Type  Absolute Maximum Ratings Ta = 25°C Symbol Rating Unit Power dissipation PD 40 mW Forward current IF 15 mA Pulse forward current * IFP 50 mA Reverse voltage VR 3 V Operating ambient temperature Topr –30 to +85 °C Storage temperature Tstg –40 to +100 °C  Red di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d d te te ow p:/ fo d l /w low isc isc nan nan ing ww in on on ce ce fo .se g U tin tin typ ty ur mi RL ued ued e pe Pro co a ty ty du Relative luminous n.p intensity bo (%)pe pe ct life d an ut cy as lat cle on es ic. t in sta co fo ge .jp rm . /en ati on . M Di ain sc te on na tin nc ue e/ d Parameter  Lighting Color Note) *: The condition of IFP is duty 10%, Pulse width 1 msec.  Electro-Optical Characteristics Ta = 25°C±3°C Parameter Symbol Luminous intensity * IO Reverse current IR Forward voltage VF Peak emission wavelength λP Spectral half band width Δλ Note) *: Measurement tolerance: ±20% IO  I F IF = 10 mA Typ 2.75 6.7 Max 100 Unit mcd µA IF = 10 mA 1.72 IF = 10 mA 655 nm IF = 10 mA 20 nm IF  VF 103 2.5 V Relative luminous intensity  Ta ue Forward current IF (mA) isc on tin 10 en an ce /D 1 1 10 10 102 1 102 Ma 10−1 Min VR = 3 V 102 int Luminous intensity IO (mcd) 102 Conditions Forward current IF (mA) 1.6 1.8 2.0 2.2 10 2.4 −20 Forward voltage VF (V) Relative luminous intensity  λP 0 20 40 60 80 100 Ambient temperature Ta (°C) IF  Ta 100 Directive characteristics 80 30° 60 20° 10° 40° 0 650 700 Peak emission wavelength λP (nm) Publication date: October 2011 90° 100 40° 50° 60° 70° 20° 80° 600 30° 40° 70° 550 20° 60° 60° 20 10° 80° 50° 40 0° 80 60 40 20 0 Forward current IF (mA) Relative luminous intensity (%) 25 20 15 10 5 80° 20 40 60 Relative luminous intensity (%) Ver. BEK 80 90° 100 0 0 20 40 60 80 100 Ambient temperature Ta (°C) 1 2 an en ue on tin isc ce /D  Pin name 1: Anode 2: Cathode di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d d te te ow p:/ fo d l /w low isc isc nan nan ing ww in on on ce ce fo .se g U tin tin typ ty ur mi RL ued ued e pe Pro co a ty ty du n.p bo pe pe ct life d an ut cy as lat cle on es ic. t in sta co fo ge .jp rm . /en ati on . int Ma M Di ain sc te on na tin nc ue e/ d This product complies with the RoHS Directive (EU 2002/95/EC). LNJ214R8ARA  Package (Unit: mm) KLTFTN2K1400 Ver. BEK Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. d pla inc ne lud se pla m d m es v ne ain ain foll htt isit d d te te ow p:/ fo d l /w low isc isc nan nan ing ww in on on ce ce fo .se g U tin tin typ ty ur mi RL ued ued e pe Pro co a ty ty du n.p bo pe pe ct life d an ut cy as lat cle on es ic. t in sta co fo ge .jp rm . /en ati on . (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. Pl ea Ma int en an ce /D isc on tin ue 20100202