UPC1679G

DATA DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC1679G 5 V-BIAS, +15.5 dBm OUTPUT, 1.8 GHz WIDEBAND Si MMIC AMPLIFIER DESCRIPTION The µPC1679G is a silicon monolithic integrated circuit designed as medium output power amplifier for high frequency system applications. Due to +13 dBm TYP. output at 1 GHz, this IC is recommendable for transmitter stage amplifier of L Band wireless communication systems. This IC is packaged in 8-pin plastic SOP. This IC is manufactured using NEC’s 20 GHz fT NESATTMIV silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES • Supply voltage • Saturated output power • Wideband response • Isolation • Power Gain : VCC = 4.5 to 5.5 V : PO(sat) = +15.5 dBm TYP. @ f = 500 MHz with external inductor : fu = 1.8 GHz TYP. @ 3 dB bandwidth : ISL = 34 dB TYP. @ f = 500 MHz : GP = 21.5 dB TYP. @ f = 500 MHz ORDERING INFORMATION Part Number Package 8-pin plastic SOP (225 mil) Marking 1679 Supplying Form Embossed tape 12 mm wide. 1 pin is tape pull-out direction. Qty 2.5 kp/reel. Embossed tape 12 mm wide. 1 pin is tape roll-in direction. Qty 2.5 kp/reel. µPC1679G-E1 µPC1679G-E2 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC1679G) Caution Electro-static sensitive devices. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P12434EJ4V0DS00 (4th edition) Date Published September 1999 N CP(K) Printed in Japan The mark shows major revision points. © 1994, 1999 µPC1679G EQUIVALENT CIRCUIT 8 VCC 5 OUT PIN CONNECTIONS (Top View) INPUT GND GND 1 2 3 4 8 7 6 5 VCC GND GND OUTPUT IN 1 GND 6 7 2 3 4 ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Power Power Dissipation Symbol VCC Pin PD Conditions TA = +25 °C, pin 5, pin 8 TA = +25 °C Mounted on double copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85 °C) Rating 6 +10 360 −45 to +85 −55 to +150 Unit V dBm mW Operating Ambient Temperature Storage Temperature TA Tstg °C °C RECOMMENDED OPERATING RANGE Parameter Supply Voltage Symbol VCC MIN. 4.5 −45 TYP. 5.0 MAX. 5.5 Unit V Notice The same voltage should be applied to pin 5 and 8 Operating Ambient Temperature TA +25 +85 °C ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω) Parameter Circuit Current Power Gain Noise Figure Upper Limit Operating Frequency Isolation Input Return Loss Output Return Loss Saturated Output Power Symbol ICC GP NF fu ISL RLin RLout PO(sat) No signal f = 500 MHz f = 500 MHz 3 dB down below the gain at 0.1 GHz f = 500 MHz f = 500 MHz f = 500 MHz f = 500 MHz, Pin = +3 dBm Conditions MIN. 32 19.5 − 1.5 29 9 1 +13.5 TYP. 40 21.5 6.0 1.8 34 12 3 +15.5 MAX. 49 23.5 8.0 − − − − − Unit mA dB dB GHz dB dB dB dBm 2 Data Sheet P12434EJ4V0DS00 µPC1679G TEST CIRCUIT VCC 1 800 pF C3 8 50 Ω IN 1 800 pF C1 1 5 1 800 pF L C2 L: 20.5 T, 2 mm I.D., φ 0.25 UEW (about 300 nH) 50 Ω OUT 2, 3, 4, 6, 7 INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 30 mA, to output medium power. To supply current for output transistor, connect an inductor between the VCC pin (pin 8) and output pin (pin 5). Select large value inductance, as listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor make output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable. CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1 800 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 Ω load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 800 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 πRfc). Data Sheet P12434EJ4V0DS00 3 µPC1679G TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 60 No Signal 50 50 60 No Signal VCC = 5.0 V CIRCUIT CURRENT vs. OPERATATING AMBIENT TEMPERATURE Circuit Current ICC (mA) 40 30 20 10 0 Circuit Current ICC (mA) 0 1 2 3 4 5 6 40 30 20 10 0 –60 –40 –20 0 +20 +40 +60 +80 +100 Supply Voltage VCC (V) Operating Ambient Temperature TA (°C) NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY 9 25 VCC = 5.5 V 25 INSERTION POWER GAIN vs. FREQUENCY VCC = 5.0 V TA = –45 °C Insertion Power Gain GP (dB) 8 20 GP VCC = 5.0 V 15 VCC = 4.5 V Insertion Power Gain GP (dB) 20 TA = +25 °C TA = +85 °C Noise Figure NF (dB) 7 15 6 10 VCC = 5.5 V 5 NF 0 0.01 0.03 VCC = 5.0 V 0.1 0.3 VCC = 4.5 V 1.0 3.0 10 5 5 4 0 0.01 0.03 0.1 0.3 1.0 3.0 Frequency f (GHz) Frequency f (GHz) ISOLATION vs. FREQUENCY 0 VCC = 5.0 V –10 +10 INPUT RETURN LOSS AND OUTPUT RETURN LOSS vs. FREQUENCY VCC = 5.0 V Input Return Loss RLin (dB) Output Return Loss RLout (dB) 0 RLout Isolation ISL (dB) –20 –10 RLin –30 –20 –40 –30 –50 0.01 0.03 0.1 0.3 1.0 3.0 –40 0.01 0.03 0.1 0.3 1.0 3.0 Frequency f (GHz) Frequency f (GHz) 4 Data Sheet P12434EJ4V0DS00 µPC1679G OUTPUT POWER vs. INPUT POWER +25 f = 500 MHz +25 OUTPUT POWER vs. INPUT POWER f = 500 MHz VCC = 5.0 V Output Power Pout (dBm) Output Power Pout (dBm) +20 VCC = 5.5 V VCC = 5.0 V +20 TA = +25 °C TA = +85 °C +15 VCC = 4.5 V +15 TA = –45 °C +10 +10 +5 +5 0 –20 –15 –10 –5 0 +5 +10 0 –20 –15 –10 –5 0 +5 +10 Input Power Pin (dBm) Input Power Pin (dBm) Third Order Intermodulation Distortion IM3 (dBc) Saturated Output Power PO(sat) (dBm) SATURATED OUTPUT POWER vs. FREQUENCY +25 Pin = +3 dBm +20 VCC = 5.5 V THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE –60 –50 VCC = 5.5 V –40 VCC = 5.0 V –30 –20 –10 0 –5 VCC = 4.5 V f1 = 500 MHz f2 = 502 MHz +15 VCC = 5.0 V +10 VCC = 4.5 V +5 0 0.01 0.03 0.1 0.3 1.0 3.0 0 +5 +10 +15 Frequency f (GHz) Output Power of Each Tone PO(each) (dBm) Data Sheet P12434EJ4V0DS00 5 µPC1679G S-PARAMETER (TA = +25°C, VCC = Vout = 5.0 V) S11-FREQUENCY 3.0 G 1.0 G 0.1 G 2.0 G S22-FREQUENCY 3.0 G 0.1 G 2.0 G 0.5 G 1.0 G 6 Data Sheet P12434EJ4V0DS00 µPC1679G TYPICAL S-PARAMETER VALUES µ PC1679G VCC = Vout = 5.0 V, ICC = 40 mA FREQUENCY MHz MAG. S11 ANG. MAG. S21 ANG. MAG. S12 ANG. MAG. S22 ANG. K 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 0.133 0.154 0.184 0.217 0.247 0.279 0.307 0.333 0.342 0.412 0.419 0.434 0.450 0.461 0.481 0.486 0.487 0.486 0.479 0.469 0.467 0.454 0.450 0.449 0.443 0.441 0.430 0.426 0.429 0.432 0.419 177.2 171.2 159.6 147.3 132.4 117.7 102.8 88.3 76.4 60.4 46.1 31.7 18.1 3.2 −12.2 −27.2 −43.7 −61.2 −78.4 −95.6 −113.5 −130.9 −148.4 −165.0 179.3 163.8 149.9 139.0 128.2 118.6 110.7 11.167 11.585 12.121 12.690 13.210 13.509 13.902 13.966 13.895 14.401 14.244 14.249 14.096 13.945 13.888 13.645 13.460 13.043 12.509 11.678 10.720 9.763 8.754 7.849 7.022 6.289 5.800 5.277 5.108 4.894 4.541 −4.7 −9.8 −16.1 −23.9 −32.2 −40.9 −51.0 −59.8 −69.5 −78.5 −87.9 −97.3 −106.9 −116.9 −125.9 −136.5 −147.3 −157.9 −170.0 179.0 168.4 158.2 150.0 142.4 135.4 130.2 126.1 121.8 116.7 114.0 107.4 0.024 0.022 0.018 0.015 0.015 0.017 0.021 0.026 0.027 0.033 0.037 0.041 0.043 0.047 0.051 0.053 0.053 0.056 0.058 0.057 0.057 0.056 0.054 0.050 0.045 0.037 0.029 0.027 0.027 0.025 0.028 −4.9 −10.3 −3.0 4.9 20.0 35.5 42.6 44.8 42.5 52.0 46.1 42.5 41.8 35.8 34.1 30.5 27.3 21.6 17.7 13.6 9.9 3.5 −1.4 −6.4 −9.9 −13.3 −11.1 −1.1 6.1 15.9 31.2 0.589 0.620 0.648 0.669 0.681 0.680 0.674 0.659 0.628 0.646 0.636 0.635 0.640 0.655 0.664 0.691 0.707 0.742 0.771 0.794 0.819 0.840 0.846 0.852 0.829 0.790 0.733 0.697 0.672 0.635 0.598 −3.9 −9.7 −17.3 −25.9 −35.1 −44.3 −53.6 −62.0 −70.6 −75.4 −83.6 −90.1 −97.8 −105.0 −112.7 −120.6 −129.2 −138.5 −147.7 −158.3 −169.0 179.9 168.7 157.1 145.9 133.6 124.7 117.2 110.0 103.2 98.0 1.40 1.41 1.51 1.63 1.42 1.15 0.88 0.71 0.72 0.48 0.46 0.43 0.41 0.39 0.39 0.39 0.42 0.44 0.48 0.53 0.59 0.63 0.71 0.78 0.90 1.11 1.49 1.75 1.84 2.02 2.05 Data Sheet P12434EJ4V0DS00 7 µPC1679G PACKAGE DIMENSIONS 8 PIN PLASTIC SOP (225 mil) (Unit: mm) 8 5 detail of lead end P 1 A 4 H F G I J S B E D NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. L K N S C M M ITEM A B C D E F G H I J K L M N P MILLIMETERS 5.2 ± 0.2 0.85 MAX. 1.27 (T.P.) 0.42 + 0.08 − 0.07 0.1 ± 0.1 1.57 ± 0.2 1.49 6.5 ± 0.3 4.4 ± 0.15 1.1 ± 0.2 0.17 + 0.08 − 0.07 0.6 ± 0.2 0.12 0.10 +7° 3° −3° 8 Data Sheet P12434EJ4V0DS00 µPC1679G NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The inductor must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be attached to input pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Note Count: 3, Exposure limit: None Package peak temperature: 215 °C or below Time: 40 seconds or less (at 200 °C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260 °C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300 °C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3 VPS VP15-00-3 Wave Soldering WS60-00-1 Partial Heating – Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P12434EJ4V0DS00 9 µPC1679G [MEMO] 10 Data Sheet P12434EJ4V0DS00 µPC1679G [MEMO] Data Sheet P12434EJ4V0DS00 11 µPC1679G NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • N o part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • D escriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8