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UPC3207GR-E1

UPC3207GR-E1

  • 厂商:

    NEC(日电电子)

  • 封装:

  • 描述:

    UPC3207GR-E1 - FREQUENCY DOWN CONVERTER FOR VHF TO UHF BAND RECEIVER - NEC

  • 数据手册
  • 价格&库存
UPC3207GR-E1 数据手册
DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC3207GR FREQUENCY DOWN CONVERTER FOR VHF TO UHF BAND RECEIVER DESCRIPTION The µPC3207GR is a Silicon monolithic IC designed for receiver applications. This IC consists of a double balanced mixer (DBM), local oscillator, preamplifier for precscaler operation, IF amplifier, regulator, UHF/VHF switching circuit, and so on. This one-chip IC covers a wide frequency band from VHF to UHF bands. This IC is packaged in 20-pin SSOP (Shrink Small Outline Package) suitable for surface mounting. FEATURES • VHF to UHF bands operation. • Low distortion • Supply voltage CM: VHF (@fRF = 470 MHz) 96 dBµ UHF (@fRF = 890 MHz) 92 dBµ : 9V • Packaged in 20-pin SSOP suitable for surface mounting APPLICATIONS • Tuners for TV and VCR • Receivers for VHF to UHF bands ORDERING INFORMATION Part Number Package 20-pin plastic SSOP (225 mil) Supplying Form Embossed tape 12 mm wide. Pin 1 indicates pull-out direction of tape. Qty 2.5 kp/reel. µPC3207GR-E1 To order evaluation samples, please contact your local NEC office. (Part number for sample order: µPC3207GR) Caution electro-static sensitive device The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P13717EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1998,1999 µPC3207GR INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION (TOP VIEW) U OSC C1 U OSC B2 U OSC B1 U OSC C2 UB OSC OUT GND V OSC B1 V OSC B2 1 2 3 4 5 6 7 8 9 20 19 18 17 16 15 14 13 12 URF IN URF IN GND VRF IN VRF IN MIX OUT MIX OUT VCC IF OUT REG V OSC C1 10 REG 11 2 Data Sheet P13717EJ3V0DS00 µPC3207GR PIN EXPLANATION Pin No. 1 Symbol UOSC collector (Tr. 1) Function and Explanation Collector pin of UHF oscillator with balance amplifier. Assemble LC resonator with 2 pin through capacitor ~ 1 pF to oscillate with active feedback loop. Base pin of UHF oscillator with balance amplifier. Connected to LC resonator through feedback capacitor ~ 360 pF. Equivalent Circuit 3 1 4 2 2 UOSC base (Tr.2) UOSC base (Tr. 1) UOSC collector (Tr. 2) 3 4 Collector pin of UHF oscillator with balance amplifier. Assemble LC resonator with 2 pin through capacitor ~ 1 pF to oscillate with active feedback loop. Double balanced oscillator with transistor 1 and transistor 2. Switching pin for VHF or UHF operation. VHF operation = open UHF operation = 9.0 V UHF and VHF oscillator output pin. In case of F/S tuner application, connected PLL symthesizer IC’s input pin. Grounded through 1.5 kΩ resistor. 5 UB 6 OSC output 6 1.5 k * External element 7 8 GND VOSC base (Tr. 1) GND pin of VHF and UHF oscillator. Base pin of VHF oscillator. Grounded through capacitor ~ 10 pF. 8 10 9 9 VOSC base (Tr. 2) Base pin of VHF oscillator. Assemble LC resonator with 10 pin to oscillate with active feedback loop. 10 VOSC collector (Tr. 1) Collector pin of VHF oscillator. Connected to LC resonator through feedback capacitor ~ 3 pF. Data Sheet P13717EJ3V0DS00 3 µPC3207GR Pin No. 11 12 Symbol REG IF output Function and Explanation Monitor pin of regulator output voltage. IF signal output pin of VHF-UHF band functions. Equivalent Circuit 12 13 VCC Power supply pin for VHF-UHF band functions. VHF and UHF MIX output pins. These pins should be equipped with tank circuit to adjust intermediate frequency. 14 15 14 MIX output1 15 MIX output2 VRF input (bypass) 16 Bypass pin for VHF MIX input. Grounded through capacitor. 17 16 17 VRF input VRF signal input pin. 18 GND GND pin of MIX, IF amplifier and regulator. Bypass pin for UHF Mü\œinput. Grounded through capacitor. 14 15 19 URF input (bypass) 20 URF input URF signal input pin. 19 20 4 Data Sheet P13717EJ3V0DS00 µPC3207GR ABSOLUTE MAXIMUM RATINGS (TA = +25 °C UNLESS OTHERWISE SPECIFIED) Parameter Supply Voltage 1 Supply Voltage 2 Power Dissipation Operating Ambient Temperature Storage Temperature Symbol VCC UB PD TA Tstg TA = 75 °CNote Condition Rating 11.0 11.0 500 –40 to +75 –60 to +150 Unit V V mW °C °C Note Mounted on 50 × 50 × 1.6 mm double epoxy glass board. RECOMMENDED OPERATING RANGE Parameter Supply Voltage 1 Supply Voltage 2 Operating Ambient Temperature Symbol VCC UB TA MIN. 8.0 8.0 –20 TYP. 9.0 9.0 +25 MAX. 10.0 10.0 +75 Unit V V °C Data Sheet P13717EJ3V0DS00 5 µPC3207GR ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = 9 V, fIF = 45 MHz, fOSC = fRF + 45 MHz, POSC = –10 dBm) Parameter Circuit Current 1 Circuit Current 2 Conversion Gain 1 Conversion Gain 2 Conversion Gain 3 Conversion Gain 4 Conversion Gain 5 Noise Figure 1 Noise Figure 2 Noise Figure 3 Noise Figure 4 Noise Figure 5 Maximum Output Power 1 Maximum Output Power 2 Maximum Output Power 3 Maximum Output Power 4 Maximum Output Power 5 Symbol ICC1 ICC2 CG1 CG2 CG3 CG4 CG5 NF1 NF2 NF3 NF4 NF5 Po (sat)1 Po (sat)2 Po (sat)3 Po (sat)4 Po (sat)5 Test Conditions @VHF, no input signal @UHF, no input signal VHF, fRF = 55 MHz, PRF = –30 dBm VHF, fRF = 200 MHz, PRF = –30 dBm VHF, fRF = 470 MHz, PRF = –30 dBm UHF, fRF = 470 MHz, PRF = –30 dBm UHF, fRF = 890 MHz, PRF = –30 dBm VHF, fRF = 55 MHz VHF, fRF = 200 MHz VHF, fRF = 470 MHz UHF, fRF = 470 MHz UHF, fRF = 890 MHz VHF, fRF = 55 MHz, PRF = 0 dBm VHF, fRF = 200 MHz, PRF = 0 dBm VHF, fRF = 470 MHz, PRF = 0 dBm UHF, fRF = 470 MHz, PRF = 0 dBm UHF, fRF = 890 MHz, PRF = 0 dBm Notes 1, 2 Notes 1, 2 Note 3 Note 3 Note 3 Note 3 Note 3 Note 4 Note 4 Note 4 Note 4 Note 4 Note 3 Note 3 Note 3 Note 3 Note 3 MIN. 31.0 31.0 18.5 18.5 18.5 24.5 24.5 — — — — — 7.0 7.0 7.0 7.0 7.0 TYP. 38.0 38.0 22.0 22.0 22.0 28.0 28.0 11.0 11.0 11.0 9.5 10.0 10.0 10.0 10.0 10.0 10.0 MAX. 45.0 45.0 25.5 25.5 25.5 31.5 31.5 14.0 14.0 14.0 12.5 13.0 — — — — — Unit mA mA dB dB dB dB dB dB dB dB dB dB dBm dBm dBm dBm dBm Notes 1. no resistance of OSC output 2. By measurement circuit 1 3. By measurement circuit 2 4. By measurement circuit 3 6 Data Sheet P13717EJ3V0DS00 µPC3207GR STANDARD CHARACTERISTICS (TA = +25 °C, VCC = 9 V, fIF = 45 MHz, fOSC = fRF + 45 MHz, POSC = –10 dBm) Parameter 1 % cross-modulation distortion 1 1 % cross-modulation distortion 2 1 % cross-modulation distortion 3 1 % cross-modulation distortion 4 1 % cross-modulation distortion 5 Symbol CM1 CM2 CM3 CM4 CM5 fRF = 55 MHz fRF = 200 MHz fRF = 470 MHz fRF = 470 MHz fRF = 890 MHz Test Conditions Note Note Note Note Note Reference Value 100 100 96 94 92 Unit dBµ dBµ dBµ dBµ dBµ Note By measurement circuit 4, fundes = fdes + 6 MHz, PRF = –30 dBm, AM 100 kHz, 30 % modulation, DES/CM = 46 dBc Data Sheet P13717EJ3V0DS00 7 µPC3207GR TYPICAL CHARACTERISTICS CIRCUIT CURRENT vs. SUPPLY VOLTAGE 60 VHF no input signal TA=−20°C TA=+25°C TA=+75°C measurement circuit 1 60 CIRCUIT CURRENT vs. SUPPLY VOLTAGE UHF no input signal TA=−20°C TA=+25°C TA=+75°C measurement circuit 1 50 Circuit Current ICC (mA) 50 Circuit Current ICC (mA) 4 6 8 10 12 40 40 30 30 20 20 10 10 0 0 2 Supply Voltage VCC (V) OUTPUT POWER vs. INPUT POWER 20 0 0 2 4 6 8 10 12 Supply Voltage VCC (V) OUTPUT POWER vs. INPUT POWER 20 Output Power Pout (dBm) 0 VHF fRF=470MHz fOSC=515MHz POSC=−10dBm TA=−20°C TA=+25°C TA=+75°C measurement circuit 2 −30 −10 Input Power Pin (dBm) −20 0 10 Output Power Pout (dBm) 10 10 0 UHF fRF=890MHz fOSC=935MHz POSC=−10dBm TA=−20°C TA=+25°C TA=+75°C measurement circuit 2 −30 −20 −10 0 10 Input Power Pin (dBm) NOISE FIGURE vs. INPUT FREQUENCY 20 −10 −10 −20 −40 −20 −40 CONVERSION GAIN vs. INPUT FREQUENCY 40 Conversion Gain CG (dB) 15 30 Noise Figure NF (dB) 10 20 fOSC=fRF+45MHz PRF=−30dBm POSC=−10dBm TA=−20°C TA=+25°C TA=+75°C measurement circuit 2 0 200 400 600 800 Input Frequency fRF (MHz) 1000 5 10 0 0 fOSC=fRF+45MHz POSC=−10dBm TA=−20°C TA=+25°C TA=+75°C measurement circuit 3 200 400 600 800 Input Frequency fRF (MHz) 1000 8 Data Sheet P13717EJ3V0DS00 µPC3207GR STANDARD CHARACTERISTICS (VCC = 9 V) 1% CROSS-MODULATION DISTORTION vs. INPUT FREQUENCY 110 1% Cross-Modulation Distortion CM (dB µ ) OUTPUT POWER vs. OSC INPUT POWER 10 5 Output Power Pout (dBm) 105 0 −5 −10 −15 −20 −25 −30 −50 fRF=890MHz 100 fRF=470MHz 95 fundes=fRF+6MHz 90 fOSC=fRF+45MHz PRF=−30dBm POSC=−10dBm TA=−20°C 85 TA=+25°C TA=+75°C measurement 80 circuit 4 0 200 400 600 800 Input Frequency fRF (MHz) fOSC=fRF+45MHz PRF=−30dBm measurement circuit 2 −40 −30 −20 −10 0 Oscillator Input Power Posc (dBm) 10 1000 3rd ORDER INTERMODULATION DISTORTION 20 20 10 0 Output Power Pout (dBm) Output Power Pout (dBm) 3rd ORDER INTERMODULATION DISTORTION 0 −10 −20 −30 −40 −50 −60 −70 −80 −40 −30 −20 −10 UHF fRF1=890MHz fRF2=896MHz fOSC=935MHz POSC=−10dBm TA=−20°C TA=+25°C TA=+75°C measurement circuit 4 0 10 Input Power Pin (dBm) −20 VHF fRF1=470MHz fRF2=476MHz fOSC=515MHz POSC=−10dBm TA=−20°C TA=+25°C TA=+75°C measurement circuit 4 −30 −20 −10 Input Power Pin (dBm) 0 10 −40 −60 −80 −40 OSC FREQUENCY vs. TUNING VOLTAGE 1000 application circuit example 800 OSC Frequency fosc (MHz) U 600 400 VH 200 VL 0 0 5 10 15 20 Tuning Voltage Vtu (V) 25 30 Data Sheet P13717EJ3V0DS00 9 µPC3207GR INPUT IMPEDANCE (BY MEASUREMENT CIRCUIT 5) 1: 45 MHz 851.97 Ω –275.69 Ω 2: 200 MHz 346.66 Ω –441.2 Ω 3: 450 MHz 112.42 Ω –265.13 Ω 3 1 2 START STOP 0.045000000 GHz 0.450000000 GHz 1: 400 MHz 105.59 Ω –265.56 Ω 2: 650 MHz 55.539 Ω –169.88 Ω 3: 900 MHz 39.918 Ω –119.70 Ω 1 3 2 START STOP 0.400000000 GHz 0.900000000 GHz 10 Data Sheet P13717EJ3V0DS00 µPC3207GR OUTPUT IMPEDANCE (BY MEASUREMENT CIRCUIT 5) 2 1: 45 MHz 25.903 Ω +17.223 Ω 2: 60 MHz 26.446 Ω +22.927 Ω 1 START STOP 0.045000000 GHz 0.095000000 GHz Data Sheet P13717EJ3V0DS00 11 µPC3207GR MEASUREMENT CIRCUIT 1 OPEN OPEN 1 000 20T pF 1 000 pF 1 000 pF 1 000 pF 27 pF VCC(9V) OPEN 1 000 1 000 pF pF 1 000 pF 20 19 18 17 16 15 14 13 12 11 REG 1 2 3 4 1 000 pF 5 6 7 8 9 10 1 000 pF 1 000 pF 1 000 pF OPEN 1 000 pF Voltage of 5 pin OPEN VHF UHF OPEN 9V 1 000 pF OPEN UB(9V) MEASUREMENT CIRCUIT 2 VHF UHF 1 000 20T pF 1 000 pF 1 000 pF 1 000 pF 27 pF 1 000 pF 1 000 pF 1 000 pF Spectrum Analyzer SG1 20 19 18 17 16 15 14 13 12 11 REG 1 2 3 4 1 000 pF 5 6 7 1 000 pF 8 9 10 Voltage of 5 pin 1 000 pF VHF UHF VHF SG2 UHF OPEN 9V 1 000 pF 1 000 pF 1.5k 1 000 pF OPEN 12 Data Sheet P13717EJ3V0DS00 µPC3207GR MEASUREMENT CIRCUIT 3 Noise Meter VCC(9V) Noise Source VHF UHF 1 000 pF 1 000 pF 1 000 20T pF 1 000 pF 27 pF 1 000 pF 1 000 pF 1 000 pF 20 19 18 17 16 15 14 13 12 11 REG 1 2 3 4 1 000 pF 5 6 7 8 9 10 1 000 pF 1 000 pF 1.5k 1 000 pF OPEN 1 000 pF Voltage of 5 pin VHF UHF VHF SG1 UHF OPEN 9V 1 000 pF UB(9V) MEASUREMENT CIRCUIT 4 VHF UHF SG1 desire SG2 undesire 1 000 pF 1 000 20T pF 1 000 pF 1 000 pF 27 pF 1 000 1 000 pF pF 1 000 pF MIX PAD Spectrum Analyzer 20 19 18 17 16 15 14 13 12 11 REG 1 2 3 4 1 000 pF 5 6 7 8 9 10 Voltage of 5 pin 1 000 pF VHF UHF VHF SG3 UHF OPEN 9V 1 000 pF 1 000 pF 1 000 1.5k pF OPEN 1 000 pF Data Sheet P13717EJ3V0DS00 13 µPC3207GR MEASUREMENT CIRCUIT 5 Network Analyzer VCC(9V) 1 000 pF 1 000 pF 1 000 pF 1 000 pF 1 000 pF 1 000 pF 1 000 pF 20 19 18 17 16 15 14 13 12 11 REG 1 2 3 4 1 000 pF 5 6 7 8 9 10 1 000 pF 1 000 pF 1 000 pF OPEN 1 000 pF Voltage of 5 pin OPEN VHF UHF OPEN 9V 1 000 pF OPEN UB(9V) 14 Data Sheet P13717EJ3V0DS00 µPC3207GR APPLICATION CIRCUIT EXAMPLE URF IN 1 000 pF 1 000 pF VRF IN 1 000 pF 1 000 pF 20T 27 pF VCC IF OUT 1 000 pF 1 000 pF 1 000 pF 20 19 18 17 16 15 14 13 12 11 REG 1 4 pF 2 3 4 5 1 000 pF 47 k 6 1.5 k 7 8 10 pF 9 200 pF 75 10 3 pF HVU307 × 2 47 k 4T 82 pF 1 pF 3 pF 1 pF 360 pF 6 pF 8 pF 2T 360 pF Vtu 47 k 1 000 pF 47 k OSC OUT Vtu 47 k 0.5 pF HVU 307 1 000 pF HB 47 k UB 7T 1 000 pF LB 2.7 k 1 000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet P13717EJ3V0DS00 15 µPC3207GR ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (SURFACE) 1000p 1 A ULO IN URF IN VRF IN µPC3207GR OSC OUT VLO IN IF OUT B 16 Data Sheet P13717EJ3V0DS00 µPC3207GR ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (BACK SIDE) A B 1 000p 1 000p 1 000p 4p 47k VCC 1p 3p 27p 20T 1 000p 47k 200p 3p 10p 75 1 000p 82p 47k 1T363×2 47k 1.5k 1p 360p 2T 6p 8p 360p 1T363 Vtu 0.5pF 1 000p UB 7T 1 000p 4T 47k 1 000p 2.7k 1 000p 47k 1 000p 1 000p LB represents cutout HB Data Sheet P13717EJ3V0DS00 17 µPC3207GR PACKAGE DIMENSIONS 20 PIN PLASTIC SSOP (225 mil) (UNIT: mm) 20 11 detail of lead end 3˚–3˚ +7˚ 1 6.7 ± 0.3 10 1.8 MAX. 1.5 ± 0.1 6.4 ± 0.2 4.4 ± 0.1 1.0 ± 0.2 0.5 ± 0.2 0.65 0.22 –0.05 0.1 ± 0.1 +0.10 0.15 0.10 M 0.15 0.575 MAX. +0.10 –0.05 NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. 18 Data Sheet P13717EJ3V0DS00 µPC3207GR NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesires oscillation). (3) Keep the track length of the ground pins as short as possible. (4) A low pass filter must be attached to VCC line. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Recommended Condition Symbol IR35-00-3 Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Count: 3, Exposure limit: NoneNote Package peak temperature: 215 °C or below Time: 40 seconds or less (at 200 °C) Count: 3, Exposure limit: NoneNote Pin temperature: 300 °C Time: 3 seconds or less (per side of device) Exposure limit: NoneNote VPS VP15-00-3 Partial Heating – Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P13717EJ3V0DS00 19 µPC3207GR • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98.8
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