UPD5738T6N-E2

DATA SHEET CMOS INTEGRATED CIRCUIT μPD5738T6N WIDE BAND DPDT SWITCH DESCRIPTION The μPD5738T6N is a CMOS MMIC DPDT (Double Pole Double Throw) switch which is developed for mobile communications, wireless communications and another RF switching applications. This device can operate within frequency from 0.01 to 2.5 GHz, having low insertion loss and high isolation performances. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6N) package, which allows high-density surface mounting. FEATURES • Supply voltage • Switch control voltage • : VDD = 1.5 to 3.6 V (2.8 V TYP.) : Vcont (H) = 1.5 to 3.6 V (2.8 V TYP.) : Vcont (L) = −0.2 to +0.4 V (0 V TYP.) Low insertion loss Note : Lins1 = 0.5 dB TYP. @ f = 0.01 to 0.05 GHz : Lins2 = 0.8 dB TYP. @ f = 0.05 to 1.0 GHz : Lins3 = 1.4 dB TYP. @ f = 1.0 to 2.0 GHz : Lins4 = 1.6 dB TYP. @ f = 2.0 to 2.5 GHz High isolation Note : ISL1 = 45 dB TYP. @ f = 0.01 to 0.05 GHz : ISL2 = 22 dB TYP. @ f = 0.05 to 1.0 GHz : ISL3 = 16 dB TYP. @ f = 1.0 to 2.0 GHz : ISL4 = 15 dB TYP. @ f = 2.0 to 2.5 GHz Handling power Note : Pin (1 dB) = +20 dBm TYP. @ f = 1.0 GHz : Pin (0.1 dB) = +15 dBm TYP. @ f = 1.0 GHz High-density surface mounting : 6-pin plastic TSON (T6N) package (1.5 × 1.5 × 0.37 mm) High ESD voltage : machine-model 200 V (TYP.), human-body-model 3 kV (TYP.) Note TA = 25°C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V • • • • APPLICATIONS • Mobile communications • Wireless communications • Another RF switching applications ORDERING INFORMATION Part Number Order Number Package 6-pin plastic TSON (T6N) (Pb-Free) Marking C3X Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 3 kpcs/reel μPD5738T6N-E2 μPD5738T6N-E2-A Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPD5738T6N Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PU10750EJ01V0DS (1st edition) Date Published February 2009 NS Printed in Japan 2009 μPD5738T6N PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) (Bottom View) Pin No. Pin Name 1 1 6 1 6 6 1 INPUT1 Vcont OUTPUT1 INPUT2 VDD OUTPUT2 2 3 4 C3X Vcont Low High Parameter Parameter 2 5 2 5 5 2 3 4 3 4 4 3 5 6 Remark Exposed pad : GND TRUTH TABLE INPUT1−OUTPUT1, INPUT2−OUTPUT2 ON OFF INPUT1−OUTPUT2, INPUT2−OUTPUT1 OFF ON Remark High: +2.8 V, Low: 0 V ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Symbol VDD Vcont Vcont (H) − VDD Input Power Operating Ambient Temperature Storage Temperature Pin TA Tstg +23 −45 to +85 −55 to +150 dBm °C °C Ratings −0.5 to +4.6 −0.5 to +4.6 +0.5 Unit V V V Supply Voltage Switch Control Voltage Voltage Difference RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Symbol VDD Vcont (H) Vcont (L) MIN. +1.5 +1.5 −0.2 TYP. +2.8 +2.8 0 MAX. +3.6 +3.6 +0.4 Unit V V V Supply Voltage Switch Control Voltage (H) Switch Control Voltage (L) Remark VDD − 0.4 V ≤ Vcont (H) ≤ VDD + 0.2 V 2 Data Sheet PU10750EJ01V0DS μPD5738T6N ELECTRICAL CHARACTERISTICS (TA = +25°C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, Z0 = 50 Ω, DC blocking capacitors = 10 000 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Insertion Loss 4 Isolation 1 Isolation 2 Isolation 3 Isolation 4 Return Loss 1 Return Loss 2 0.1 dB Loss Compression Input Power Note 1 Symbol Lins1 Lins2 Lins3 Lins4 ISL1 ISL2 ISL3 ISL4 RL1 RL2 Test Conditions f = 0.01 to 0.05 GHz f = 0.05 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 0.01 to 0.05 GHz f = 0.05 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 0.01 to 1.0 GHz f = 1.0 to 2.5 GHz MIN. − − − − 35 18 13 12 13 8 +10 TYP. 0.5 0.8 1.4 1.6 45 22 16 15 18 12 +15 MAX. 0.9 1.2 1.8 2.0 − − − − − − − Unit dB dB dB dB dB dB dB dB dB dB dBm Pin (0.1 dB) f = 1.0 GHz 1 dB Loss Compression Input Power Note 2 Pin (1 dB) f = 1.0 GHz − +20 − dBm Supply Current Switch Control Current Switch Control Speed IDD Icont tSW VDD = Vcont = 2.8 V, RF off VDD = Vcont = 2.8 V, RF off f = 1.0 GHz − − − 0.01 0.01 0.4 1 1 1 μA μA μs Notes 1. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. 2. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution DC blocking capacitors are necessary. (INPUT1, INPUT2, OUTPUT1, OUTPUT2). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. Please do not supply any DC bias to the terminals Data Sheet PU10750EJ01V0DS 3 μPD5738T6N EVALUATION CIRCUIT DC block 10 000 pF INPUT1 1 6 DC block 10 000 pF OUTPUT2 Vcont RF bypass 1 000 pF 2 5 RF bypass 1 000 pF VDD OUTPUT1 DC block 10 000 pF 3 4 DC block 10 000 pF Exposed pad INPUT2 Caution This IC has pull down resistances inside between each RF line and GND line, which bias each RF pin internally to GND, then the IC cannot be used for DC switching. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PU10750EJ01V0DS μPD5738T6N ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD INPUT1 OUTPUT2 NEC WIDE BAND DPDT SWITCH INPUT1 EB Ver 1 OUTPUT2 C1 Vcont C2 Vcont C1 VDD C2 VDD C1 C1 OUTPUT1 INPUT2 OUTPUT1 INPUT2 USING THE NEC EVALUATION BOARD Symbol C1 C2 Values 1 0000 pF 1 000 pF Data Sheet PU10750EJ01V0DS 5 μPD5738T6N TYPICAL CHARACTERISTICS (TA = +25°C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, Z0 = 50 Ω, DC blocking capacitors = 10 000 pF, unless otherwise specified) INPUT1, 2–OUTPUT1, 2 INSERTION LOSS vs. FREQUENCY 0 0 INPUT1, 2–OUTPUT1, 2 ISOLATION vs. FREQUENCY Insertion Loss Lins (dB) –0.5 Isolation ISL (dB) –10 –1.0 –20 –1.5 –30 –2.0 –2.5 0 0.5 1.0 VDD = Vcont (H) = 1.5 V VDD = Vcont (H) = 2.8 V VDD = Vcont (H) = 3.6 V 1.5 2.0 2.5 –40 –50 0 0.5 1.0 VDD = Vcont (H) = 1.5 V VDD = Vcont (H) = 2.8 V VDD = Vcont (H) = 3.6 V 1.5 2.0 2.5 Frequency f (GHz) Frequency f (GHz) INPUT1, 2–OUTPUT1, 2 RETURN LOSS vs. FREQUENCY 0 –10 Return Loss RL (dB) –20 –30 –40 –50 0 0.5 1.0 VDD = Vcont (H) = 1.5 V VDD = Vcont (H) = 2.8 V VDD = Vcont (H) = 3.6 V 1.5 2.0 2.5 Frequency f (GHz) 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) INSERTION LOSS vs. INPUT POWER 0 f = 1.0 GHz –0.5 Insertion Loss Lins (dB) Pin (0.1 dB) vs. FREQUENCY (for reference) 20 19 18 17 16 15 14 13 12 11 10 10 M 100 M 1G 10 G VDD = Vcont (H) = 2.8 V –1.0 –1.5 –2.0 VDD = Vcont (H) = 1.5 V VDD = Vcont (H) = 2.8 V VDD = Vcont (H) = 3.6 V –3.0 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 –2.5 Input Power Pin (dBm) Frequency f (Hz) Remark The graphs indicate nominal characteristics. 6 Data Sheet PU10750EJ01V0DS μPD5738T6N INPUT1, 2–OUTPUT1, 2 INSERTION LOSS vs. FREQUENCY 0 0 INPUT1, 2–OUTPUT1, 2 ISOLATION vs. FREQUENCY Insertion Loss Lins (dB) –0.5 Isolation ISL (dB) –10 –1.0 –20 –1.5 –30 –2.0 –2.5 0 0.5 1.0 1.5 Frequency f (GHz) TA = –45°C TA = +25°C TA = +85°C 2.0 2.5 –40 –50 0 0.5 1.0 1.5 Frequency f (GHz) TA = –45°C TA = +25°C TA = +85°C 2.0 2.5 INPUT1, 2–OUTPUT1, 2 RETURN LOSS vs. FREQUENCY 0 –10 Return Loss RL (dB) –20 –30 –40 –50 0 0.5 1.0 1.5 Frequency f (GHz) TA = –45°C TA = +25°C TA = +85°C 2.0 2.5 INSERTION LOSS vs. INPUT POWER 0 f = 1.0 GHz –0.5 Insertion Loss Lins (dB) –1.0 –1.5 –2.0 –2.5 –3.0 TA = –45°C TA = +25°C TA = +85°C 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10750EJ01V0DS 7 μPD5738T6N MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) MOUNTING PAD 0.3 0.5 0.3 1.0 0.3 0.2 0.3 SOLDER MASK 0.475 0.25 0.475 0.35 0.55 0.15 0.25 Solder thickness : 0.08 mm Remark The mounting pad and solder mask layouts in this document are for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. 8 Data Sheet PU10750EJ01V0DS 0.5 0.5 0.5 0.5 μPD5738T6N PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (T6N) (UNIT: mm) (Top View) 1.5±0.1 (Side View) (Bottom View) 0.3±0.07 (0.24) 0.5±0.06 1.5±0.1 0.08 MIN. 0.37+0.03 –0.05 0.2+0.07 –0.05 0.2±0.1 A A 0.7±0.1 Remark A>0 ( ) : Reference value 1.2±0.1 Data Sheet PU10750EJ01V0DS 9 μPD5738T6N RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Condition Symbol IR260 For soldering Caution Do not use different soldering methods together (except for partial heating). 10 Data Sheet PU10750EJ01V0DS μPD5738T6N • T he information in this document is current as of February, 2009. The information is subject to change without notice. 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