DATA SHEET
MOS INTEGRATED CIRCUIT
μPD720114
ECOUSBTM Series USB 2.0 HUB CONTROLLER
The μPD720114 is a USB 2.0 hub device that complies with the Universal Serial Bus (USB) Specification Revision 2.0 and works up to 480 Mbps. USB 2.0 compliant transceivers are integrated for upstream and all downstream ports. The μPD720114 works backward compatible either when any one of the downstream ports is connected to a USB 1.1 compliant device, or when the upstream port is connected to a USB 1.1 compliant host. Detailed function descriptions are provided in the following user’s manual. Be sure to read the manual before designing. μPD720114 User’s Manual: S17463E
FEATURES
• Compliant with Universal Serial Bus Specification Revision 2.0 (Data Rate 1.5/12/480 Mbps) • High-speed or full-speed packet protocol sequencer for Endpoint 0/1 • 4 (Max.) downstream facing ports • Low power consumption (10 μA when hub in idle status, 149 mA when all parts run in HS mode) • All downstream facing ports can handle high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) transaction. • Supports split transaction to handle full-speed and low-speed transaction on downstream facing ports when Hub controller is working in high-speed mode. • One Transaction Translator per Hub and supports four non-periodic buffers • Supports self-powered and bus-powered mode • Supports individual or global over-current detection and individual or ganged power control • Supports downstream port status with LED • Supports non-removable devices by I/O pin configuration • Support Energy Star for PC peripheral system • On chip Rpu, Rpd resistors and regulator (for core logic) • Use 30 MHz crystal • 3.3 V power supply
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.
Document No. S17462EJ4V0DS00 (4th edition) Date Published June 2007 NS Printed in Japan
The mark "" shows major revised points.
2005
μPD720114
ORDERING INFORMATION
Part Number Package 48-pin plastic TQFP (Fine pitch) (7 × 7) 48-pin plastic TQFP (Fine pitch) (7 × 7) Remark Lead-free product Lead-free product
μPD720114GA-9EU-A μPD720114GA-YEU-A
BLOCK DIAGRAM
To Host/Hub downstream facing port
Upstream facing port UP_PHY
CDR
SERDES
UPC
FS_REP
SIE_2H ALL_TT F_TIM EP1 EP0
CDR
DP(1)_PHY Downstream facing port #1 DP(2)_PHY DPC Downstream facing port #2 DP(3)_PHY Downstream facing port #3
To Hub/Function upstream facing port To Hub/Function upstream facing port To Hub/Function upstream facing port To Hub/Function upstream facing port
APLL
X1/X2
OSB DP(4)_PHY Downstream facing port #4 2.5V REG
CSB(4:1)
PPB(4:1)
2
Data Sheet S17462EJ4V0DS
μPD720114
APLL ALL_TT : Generates all clocks of Hub. : Translates the high-speed transactions (split transactions) for full/low-speed device to full/low-speed transactions. ALL_TT buffers the data transfer from either upstream or downstream direction. For OUT transaction, ALL_TT buffers data from upstream port and sends it out to the downstream facing ports after speed conversion from high-speed to full/low-speed. For IN transaction, ALL_TT buffers data from downstream ports and sends it out to the upstream facing ports after speed conversion from full/low-speed to high-speed. CDR DPC DP(n)_PHY EP0 EP1 F_TIM (Frame Timer) : Data & clock recovery circuit : Downstream Port Controller handles Port Reset, Enable, Disable, Suspend and Resume : Downstream transceiver supports high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) transaction : Endpoint 0 controller : Endpoint 1 controller : Manages hub’s synchronization by using micro-SOF which is received at upstream port, and generates SOF packet when full/low-speed device is attached to FS_REP OSB 2.5V REG SERDES SIE_2H UP_PHY UPC downstream facing port. : Full/low-speed repeater is enabled when the μPD720114 are worked at full-speed mode : Oscillator Block : On chip 2.5V regulator : Serializer and Deserializer : Serial Interface Engine (SIE) controls USB2.0 and 1.1 protocol sequencer. : Upstream Transceiver supports high-speed (480 Mbps), full-speed (12 Mbps) transaction : Upstream Port Controller handles Suspend and Resume
Data Sheet S17462EJ4V0DS
3
μPD720114
PIN CONFIGURATION (TOP VIEW)
• 48-pin plastic TQFP (Fine pitch) (7 × 7)
μPD720114GA-9EU-A μPD720114GA-YEU-A
VDD33REG VBUSM CSB1 PPB1 CSB2 PPB2 VSS CSB3 PPB3 CSB4 PPB4 SYSRSTB 48 47 46 45 44 43 42 41 40 39 38 37 VDD25OUT VSSREG LED4 LED3 LED2 LED1 GREEN AMBER VDD33 X1 X2 VDD25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 36 35 34 33 32 31 30 29 28 27 26 25 VSS DP4 DM4 VDD25 DP3 DM3 VDD33 DP2 DM2 VSS DP1 DM1 4 BUS_B TEST RREF AVSS(R) AVDD AVSS AVDD VDD33 DMU DPU VSS VDD25
Data Sheet S17462EJ4V0DS
μPD720114
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 Pin Name VDD25OUT VSSREG LED4 LED3 LED2 LED1 GREEN AMBER VDD33 X1 X2 VDD25 Pin No. 13 14 15 16 17 18 19 20 21 22 23 24 Pin Name BUS_B TEST RREF AVSS(R) AVDD AVSS AVDD VDD33 DMU DPU VSS VDD25 Pin No. 25 26 27 28 29 30 31 32 33 34 35 36 Pin Name DM1 DP1 VSS DM2 DP2 VDD33 DM3 DP3 VDD25 DM4 DP4 VSS Pin No. 37 38 39 40 41 42 43 44 45 46 47 48 Pin Name SYSRSTB PPB4 CSB4 PPB3 CSB3 VSS PPB2 CSB2 PPB1 CSB1 VBUSM VDD33REG
Remark
AVSS(R) should be used to connect RREF through 1 % precision reference resistor of 2.43 kΩ.
Data Sheet S17462EJ4V0DS
5
μPD720114
1. PIN INFORMATION
Pin Name I/O Buffer Type Active Level X1 X2 SYSRSTB DP(4:1) DM(4:1) DPU DMU BUS_B RREF CSB1 CSB(4:2) PPB(4:1) I O I I/O I/O I/O I/O I A (O) I I I/O 2.5 V input 2.5 V output 3.3 V Schmitt input USB D+ signal I/O USB D− signal I/O USB D+ signal I/O USB D− signal I/O 3.3 V Schmitt input Analog 5 V tolerant Schmitt input 3.3 V Schmitt input 3.3 V output / input Low Low Low Low 30 MHz Crystal oscillator in 30 MHz Crystal oscillator out Asynchronous chip hardware reset USB’s downstream facing port D+ signal USB’s downstream facing port D− signal USB’s upstream facing port D+ signal USB’s upstream facing port D− signal Power mode select Reference resistor connection Port’s over-current status input. Port’s over-current status input Port’s power supply control output or hub configuration input VBUSM AMBER I I/O 5 V tolerant Schmitt input 3.3V output / input Upstream VBUS monitor Amber colored LED control output or port indicator select GREEN O 3.3V output Green colored LED control output or port indicator select LED(4:1) I/O 3.3V output / input Low LED indicator output show downstream port status or Removable/Non-removable select TEST VDD25OUT I 3.3 V Schmitt input Test signal On chip 2.5 V regulator output, it must have a 4.7 μF (or greater) capacitor to VSSREG 3.3 V VDD 3.3 V VDD for on chip 2.5 V regulator input, it must have a 4.7μF ( or greater) capacitor to VSSREG 2.5 V VDD 2.5 V VDD for analog circuit VSS On chip 2.5 V regulator VSS VSS for analog circuit VSS for reference resistor, Connect to AVSS. Function
VDD33 VDD33REG
VDD25 AVDD VSS VSSREG AVSS AVSS(R)
Remark “5 V tolerant“ means that the buffer is 3 V buffer with 5 V tolerant circuit.
6
Data Sheet S17462EJ4V0DS
μPD720114
2.
2.1 • • • • • • •
ELECTRICAL SPECIFICATIONS
Buffer List 2.5 V Oscillator interface X1, X2 5 V tolerant Schmitt input buffer CSB1, VBUSM 3.3 V Schmitt input buffer CSB(4:2),BUS_B, SYSRSTB, TEST 3.3 V IOL = 12 mA output buffer GREEN 3.3 V input and 3.3 V IOL = 3 mA output buffer PPB(4:1), LED(4:1) 3.3 V input and IOL = 12 mA output buffer AMBER USB2.0 interface DPU, DMU, DP(4:1), DM(4:1), RREF Above, “5 V” refers to a 3 V input buffer that is 5 V tolerant (has 5 V maximum input voltage). Therefore, it is
possible to have a 5 V connection for an external bus.
Data Sheet S17462EJ4V0DS
7
μPD720114
2.2 Terminology
Terms Used in Absolute Maximum Ratings
Parameter Power supply voltage Symbol VDD33, VDD33REG Input voltage VI Meaning Indicates voltage range within which damage or reduced reliability will not result when power is applied to a VDD pin. Indicates voltage range within which damage or reduced reliability will not result when power is applied to an input pin. Output voltage VO Indicates voltage range within which damage or reduced reliability will not result when power is applied to an output pin. Output current IO Indicates absolute tolerance values for DC current to prevent damage or reduced reliability when current flows out of or into an output pin. Operating temperature Storage temperature TA Tstg Indicates the ambient temperature range for normal logic operations. Indicates the element temperature range within which damage or reduced reliability will not result while no voltage or current are applied to the device.
Terms Used in Recommended Operating Range
Parameter Power supply voltage Symbol VDD33, VDD33REG High-level input voltage VIH Meaning Indicates the voltage range for normal logic operations to occur when VSS = 0 V. Indicates the voltage, applied to the input pins of the device, which indicates the high level state for normal operation of the input buffer. * If a voltage that is equal to or greater than the “Min.” value is applied, the input voltage is guaranteed as high level voltage. Low-level input voltage VIL Indicates the voltage, applied to the input pins of the device, which indicates the low level state for normal operation of the input buffer. * If a voltage that is equal to or less than the “Max.” value is applied, the input voltage is guaranteed as low level voltage. Hysteresis voltage VH Indicates the differential between the positive trigger voltage and the negative trigger voltage. Indicates allowable input rise time to input signal transition time from 0.1 × VDD to 0.9 × VDD. Indicates allowable input fall time to input signal transition time from 0.9 × VDD to 0.1 × VDD.
Input rise time
tri
Input fall time
tfi
8
Data Sheet S17462EJ4V0DS
μPD720114
Terms Used in DC Characteristics
Parameter Off-state output leakage current Symbol IOZ Meaning Indicates the current that flows into a 3-state output pin when it is in a highimpedance state and a voltage is applied to the pin. Output short circuit current IOS Indicates the current that flows from an output pin when it is shorted to GND pins. Indicates the current that flows into an input pin when a voltage is applied to the pin. Indicates the current that flows to the output pins when the rated low-level output voltage is being applied. Indicates the current that can flow out of an output pin in the high-level state without reducing the output voltage below the specified VOH. (A negative current indicates current flowing out of the pin.)
Input leakage current
II
Low-level output current
IOL
High-level output current
IOH
Data Sheet S17462EJ4V0DS
9
μPD720114
2.3 Electrical Specifications
Absolute Maximum Ratings
Parameter Power supply voltage Input/output voltage 3.3 V input/output voltage Symbol VDD33,VDD33REG VI/VO 3.0 V ≤ VDD33 ≤ 3.6 V VI /VO < VDD33 + 1.0 V 5 V input/out voltage 3.0 V ≤ VDD33 ≤ 3.6 V VI /VO < VDD33 + 3.0 V Output current IO IOL = 3 mA IOL = 12 mA 10 40 0 to +70 −65 to +150 mA mA °C °C −0.5 to +6.6 V −0.5 to +4.6 V Condition Rating −0.5 to +4.6 Unit V
Operating temperature Storage temperature
TA Tstg
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameters. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. The ratings and conditions indicated for DC characteristics and AC characteristics represent the quality assurance range during normal operation. Recommended Operating Ranges
Parameter Operating voltage High-level input voltage 3.3 V High-level input voltage 5.0 V High-level input voltage Low-level input voltage 3.3 V Low-level input voltage 5.0 V Low-level input voltage Hysteresis voltage 5 V Hysteresis voltage 3.3 V Hysteresis voltage Input rise time for SYSRSTB Input rise time Normal buffer Schmitt buffer Input fall time Normal buffer Schmitt buffer tfi 0 0 200 10 ns ms trst tri 0 0 200 10 ns ms VH 0.3 0.2 1.5 1.0 10 V V ms VIL 0 0 0.8 0.8 V V Symbol VDD33,VDD33REG VIH 2.0 2.0 VDD33 5.5 V V Condition 3.3 V for VDD33 pins Min. 3.14 Typ. 3.30 Max. 3.46 Unit V
10
Data Sheet S17462EJ4V0DS
μPD720114
DC Characteristics (VDD33 = 3.14 to 3.46 V, TA = 0 to +70 °C) Control Pin Block
Parameter Off-state output leakage current Output short circuit current Low-level output current 3.3 V low-level output current (3 mA) 3.3 V low-level output current (12 mA) High-level output current 3.3 V high-level output current (3 mA) 3.3 V high-level output current (12 mA) Input leakage current 3.3 V buffer 5.0 V buffer II VI = VDD or VSS VI = VDD or VSS ±10 ±10 IOH VOH = 2.4 V VOH = 2.4 V −3 −12 mA mA Symbol IOZ IOS IOL VOL = 0.4 V VOL = 0.4 V 3 12 mA mA
Note
Condition VO = VDD33, VDD25 or VSS
Min.
Max. ±10 −250
Unit
μA
mA
μA μA
Note The output short circuit time is measured at one second or less and is tested with only one pin on the LSI.
Data Sheet S17462EJ4V0DS
11
μPD720114
USB Interface Block
Parameter Output pin impedance Termination voltage for upstream facing port pullup (full-speed) Input Levels for Low-/full-speed: High-level input voltage (drive) High-level input voltage (floating) Low-level input voltage Differential input sensitivity Differential common mode range Output Levels for Low-/full-speed: High-level output voltage Low-level output voltage SE1 Output signal crossover point voltage Input Levels for High-speed: High-speed squelch detection threshold (differential signal) High-speed disconnect detection threshold (differential signal) High-speed data signaling common mode voltage range High-speed differential input signaling levels Output Levels for High-speed: High-speed idle state High-speed data signaling high High-speed data signaling low Chirp J level (different signal) Chirp K level (different signal) VHSOI VHSOH VHSOL VCHIRPJ VCHIRPK −10.0 360 −10.0 700 −900 +10 440 +10 1100 −500 mV mV mV mV mV VHSSQ 100 150 mV VOH VOL VOSE1 VCRS RL of 14.25 kΩ to GND RL of 1.425 kΩ to 3.6 V 2.8 0.0 0.8 1.3 2.0 3.6 0.3 V V V V VIH VIHZ VIL VDI VCM ⏐(D+) − (D−)⏐ Includes VDI range 0.2 0.8 2.5 2.0 2.7 3.6 0.8 V V V V V Symbol ZHSDRV VTERM Conditions Includes RS resistor Min. 40.5 3.0 Max. 49.5 3.6 Unit Ω V
VHSDSC
525 −50
625 +500
mV
VHSCM
mV
See Figure 2-4.
12
Data Sheet S17462EJ4V0DS
μPD720114
Figure 2-1. Differential Input Sensitivity Range for Low-/full-speed
Differential Input Voltage Range Differential Output Crossover Voltage Range
-1.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 4.6
Input Voltage Range (Volts)
Figure 2-2. Full-speed Buffer VOH/IOH Characteristics for High-speed Capable Transceiver
VDD−3.3 VDD−2.8 VDD−2.3 VDD−1.8 VDD−1.3 VDD−0.8 VDD−0.3 VDD 0
−20
IOUT (mA)
−40 Min. −60 Max. −80 VOUT (V)
Figure 2-3. Full-speed Buffer VOL/IOL Characteristics for High-speed Capable Transceiver
80 Max. 60
IOUT (mA)
Min. 40
20
0 0 0.5 1 1.5 VOUT (V) 2 2.5 3
Data Sheet S17462EJ4V0DS
13
μPD720114
Figure 2-4. Receiver Sensitivity for Transceiver at DP/DM
Level 1
+400 mV Differential
Point 3
Point 4
Point 1
Point 2
0V Differential
Point 5
Point 6
Level 2
−400 mV Differential
0%
Unit Interval
100%
Figure 2-5. Receiver Measurement Fixtures
Test Supply Voltage 15.8 Ω USB Connector Nearest Device VBUS D+ DGND 50 Ω Coax 50 Ω Coax + To 50 Ω Inputs of a High Speed Differential Oscilloscope, or 50 Ω Outputs of a High Speed Differential Data Generator −
15.8 Ω
143 Ω
143 Ω
14
Data Sheet S17462EJ4V0DS
μPD720114
Power Consumption
Parameter Power Consumption Symbol PW-0 Condition The power consumption under the state without suspend. All the ports do not connect to any function.
Note 1
Typ.
Unit
Hub controller is operating at full-speed mode. Hub controller is operating at high-speed mode. PW-2 The power consumption under the state without suspend. The number of active ports is 2.
Note 2
31 86
mA mA
Hub controller is operating at full-speed mode. Hub controller is operating at high-speed mode. PW-3 The power consumption under the state without suspend. The number of active ports is 3.
Note 2
36 120
mA mA
Hub controller is operating at full-speed mode. Hub controller is operating at high-speed mode. PW-4 The power consumption under the state without suspend. The number of active ports is 4.
Note 2
38 134
mA mA
Hub controller is operating at full-speed mode. Hub controller is operating at high-speed mode. PW-UNP The power consumption under unplug and the hub in idle state. PW_S
Note 3
41 149 10
mA mA
μA μA
The power consumption under plug (VBUS ON) and the hub in suspend state.
Note 4
220
Notes 1. Ports available but inactive or unplugged do not add to the power consumption. 2. The power consumption depends on the number of ports available and actively operating. 3. If the μPD720114 is locally powered and the upstream facing port is unplugged, μPD720114 goes into suspend state and downstream facing port VBUS goes down. 4. If the upstream VBUS in OFF state, the power consumption is same as PW-UNP.
Data Sheet S17462EJ4V0DS
15
μPD720114
AC Characteristics (VDD33 = 3.14 to 3.46 V, TA = 0 to +70 °C) Pin capacitance
Parameter Input capacitance Output capacitance I/O capacitance Symbol CI CO CIO Condition VDD = 0 V, TA = 25 °C fC = 1 MHz Unmeasured pins returned to 0 V Min. Max. 6 6 6 Unit pF pF pF
System Clock Ratings
Parameter Clock frequency Symbol fCLK Crystal Condition Min. −500 ppm Clock Duty cycle tDUTY 40 50 Typ. 30 Max. +500 ppm 60 % Unit MHz
Remarks 1. Recommended accuracy of clock frequency is ± 100 ppm. 2. Required accuracy of X’tal is including initial frequency accuracy, the spread of X’tal capacitor loading, supply voltage, temperature, and aging, etc. System Reset Timing
Parameter Reset active time (Figure 2-6) trst Symbol Conditions Min. 5 Max. Unit
μs
Figure 2-6. System Reset Timing
trst
SYSRSTB
16
Data Sheet S17462EJ4V0DS
μPD720114
Over-current Response Timing
Parameter Over-current response time from CSB low tOC to PPB high (Figure 2-7) Symbol Condition Min. 4 Typ. Max. 5 Unit ms
Figure 2-7. Over-current Response Timing
CSB(4:1) tOC PPB(4:1)
Figure 2-8. CSB/PPB Timing
4 ms 4 ms 4 ms 4 ms
Hub power supply
Bus reset
Up port D+ line
PPB pin output
Output cut-off
CSB pin input
Port power supply ON
Device connection inrush current
Overcurrent generation
CSB pin operation region
Bus power: Up port connection Self power: Power supply ON
CSB detection delay time
CSB active period
Remark
The active period of the CSB pin is in effect only when the PPB pin is ON. There is a delay time of approximately 4 ms duration at the CSB pin.
Data Sheet S17462EJ4V0DS
17
μPD720114
USB Interface Block (1/4)
Parameter Low-speed Electrical Characteristics Rise time (10% to 90%) Fall time (90% to 10%) Differential rise and fall time matching Low-speed data rate Downstream facing port source jitter total (including frequency tolerance) (Figure 2-13): To next transition For paired transitions Downstream facing port differential receiver jitter total (including frequency tolerance) (Figure 2-15): To next transition For paired transitions Source SE0 interval of EOP (Figure 2-14) Receiver SE0 interval of EOP (Figure 2-14) Width of SE0 interval during differential transition Hub differential data delay (Figure 2-11) Hub differential driver jitter (including cable) (Figure 2-11): Downstream facing port To next transition For paired transitions Upstream facing port To next transition For paired transitions Data bit width distortion after SOP (Figure 2-11) Hub EOP delay relative to tHDD (Figure 2-12) Hub EOP output width skew (Figure 2-12) Full-speed Electrical Characteristics Rise time (10% to 90%) tFR CL = 50 pF, RS = 36 Ω CL = 50 pF, RS = 36 Ω (tFR/tFF) Average bit rate 4 20 ns tLEOPD tLHESK 0 −300 200 +300 ns ns tLUHJ1 tLUHJ2 tLSOP −45 −45 −60 +45 +45 +60 ns ns ns tLDHJ1 tLDHJ2 −45 −15 +45 +15 ns ns tLST tLHDD 210 300 ns ns tUJR1 tUJR2 tLEOPT tLEOPR −152 −200 1.25 670 +152 +200 1.5 ns ns tDDJ1 tDDJ2 −25 −14 +25 +14 ns ns tLR tLF tLRFM tLDRATHS CL = 200 pF to 600 pF CL = 200 pF to 600 pF (tLR/tLF)
Note
Symbol
Conditions
Min.
Max.
Unit
75 75 80 1.49925
300 300 125 1.50075
ns ns % Mbps
Average bit rate
μs
ns
Fall time (90% to 10%)
tFF
4
20
ns
Differential rise and fall time matching Full-speed data rate Frame interval
tFRFM tFDRATHS tFRAME
90 11.9940 0.9995
111.11 12.0060 1.0005
% Mbps ms
Note Excluding the first transition from the Idle state.
18
Data Sheet S17462EJ4V0DS
μPD720114
(2/4)
Parameter Symbol Conditions Min. Max. Unit
Full-speed Electrical Characteristics (Continued) Consecutive frame interval jitter Source jitter total (including frequency tolerance) (Figure 2-13): To next transition For paired transitions Source jitter for differential transition to SE0 transition (Figure 2-14) Receiver jitter (Figure 2-15): To Next Transition For Paired Transitions Source SE0 interval of EOP (Figure 2-14) Receiver SE0 interval of EOP (Figure 2-14) Width of SE0 interval during differential transition Hub differential data delay (Figure 2-11) (with cable) (without cable) Hub differential driver jitter (including cable) (Figure 2-11): To next transition For paired transitions Data bit width distortion after SOP (Figure 2-11) Hub EOP delay relative to tHDD (Figure 2-12) Hub EOP output width skew (Figure 2-12) High-speed Electrical Characteristics Rise time (10% to 90%) Fall time (90% to 10%) Driver waveform High-speed data rate Microframe interval Consecutive microframe interval difference tHSR tHSF See Figure 2-9. tHSDRAT tHSFRAM tHSRFI 479.760 124.9375 480.240 125.0625 4 highspeed Mbps 500 500 ps ps tHDJ1 tHDJ2 tFSOP −3 −1 −5 +3 +1 +5 ns ns ns tHDD1 tHDD2 70 44 ns ns tJR1 tJR2 tFEOPT tFEOPR tFST −18.5 −9 160 82 14 +18.5 +9 175 ns ns ns ns ns tDJ1 tDJ2 tFDEOP −3.5 −4.0 −2 +3.5 +4.0 +5 ns ns ns tRFI No clock adjustment Note 42 ns
tFEOPD tFHESK
0 −15
15 +15
ns ns
μs
Bit times
Data source jitter Receiver jitter tolerance Hub data delay (without cable)
See Figure 2-9. See Figure 2-4. tHSHDD 36 highspeed+4 ns Bit times
Hub data jitter Hub delay variation range
See Figure 2-4, Figure 2-9. tHSHDV 5 highspeed Bit times
Note Excluding the first transition from the Idle state.
Data Sheet S17462EJ4V0DS
19
μPD720114
(3/4)
Parameter Hub Event Timings Time to detect a downstream facing port connect event (Figure 2-17): Awake hub Suspended hub Time to detect a disconnect event at a hub’s downstream facing port (Figure 2-16) Duration of driving resume to a downstream port (only from a controlling hub) Time from detecting downstream resume to rebroadcast Duration of driving reset to a downstream facing port (Figure 2-18) Time to detect a long K from upstream Time to detect a long SE0 from upstream Duration of repeating SE0 upstream (for low-/full-speed repeater) Inter-packet delay (for high-speed) of packets traveling in same direction Inter-packet delay (for high-speed) of packets traveling in opposite direction Inter-packet delay for device/root hub response with detachable cable for highspeed Time of which a Chirp J or Chirp K must be continuously detected (filtered) by hub or device during Reset handshake Time after end of device Chirp K by which hub must start driving first Chirp K in the hub’s chirp sequence Time for which each individual Chirp J or Chirp K in the chirp sequence is driven downstream by hub during reset Time before end of reset by which a hub must end its downstream chirp sequence Time from internal power good to device pulling D+ beyond VIHZ (Figure 2-18) Debounce interval provided by USB system software after attach (Figure 2-18) Maximum duration of suspend averaging interval Period of idle bus before device can initiate resume Duration of driving resume upstream tDCHSE0 100 500 tDCHBIT 40 60 tWTDCH 100 tFILT 2.5 tDDIS 2.5 2.5 2.0 2000 12000 2.5 tDCNN Symbol Conditions Min. Max. Unit
μs μs μs
ms
tDRSMDN
20
tURSM
1.0
ms
tDRST
Only for a SetPortFeature (PORT_RESET) request
10
20
ms
tURLK tURLSE0 tURPSE0
2.5 2.5
100 10000 23
μs μs
FS Bit times Bit times Bit times
tHSIPDSD
88
tHSIPDOD
8
tHSRSPIPD1
192
Bit times
μs
μs
μs
μs
ms
tSIGATT
100
tATTDB
100
ms
tSUSAVGI
1
s
tWTRSM
5
ms
tDRSMUP
1
15
ms
20
Data Sheet S17462EJ4V0DS
μPD720114
(4/4)
Parameter Hub Event Timings (Continued) Resume recovery time tRSMRCY Remote-wakeup is enabled 10 ms Symbol Conditions Min. Max. Unit
Time to detect a reset from upstream for non high-speed capable devices Reset recovery time (Figure 2-18) Inter-packet delay for full-speed
tDETRST
2.5
10000
μs
ms Bit times
tRSTRCY tIPD 2
10
Inter-packet delay for device response with detachable cable for full-speed SetAddress() completion time Time to complete standard request with no data Time to deliver first and subsequent (except last) data for standard request Time to deliver last data for standard request Time for which a suspended hub will see a continuous SE0 on upstream before beginning the high-speed detection handshake Time a hub operating in non-suspended fullspeed will wait after start of SE0 on upstream before beginning the high-speed detection handshake Time a hub operating in high-speed will wait after start of SE0 on upstream before reverting to full-speed Time a hub will wait after reverting to fullspeed before sampling the bus state on upstream and beginning the high-speed will wait after start of SE0 on upstream before reverting to full-speed Minimum duration of a Chirp K on upstream from a hub within the reset protocol Time after start of SE0 on upstream by which a hub will complete its Chirp K within the reset protocol Time between detection of downstream chip and entering high-speed state Time after end of upstream Chirp at which hub reverts to full-speed default state if no downstream Chirp is detected
tRSPIPD1
6.5
Bit times ms ms
tDSETADDR tDRQCMPLTND
50 50
tDRETDATA1
500
ms
tDRETDATAN
50
ms
tFILTSE0
2.5
μs
tWTRSTFS
2.5
3000
ms
tWTREV
3.0
3.125
ms
tWTRSTHS
100
875
ms
tUCH
1.0
ms
tUCHEND
7.0
ms
tWTHS
500
μs
ms
tWTFS
1.0
2.5
Data Sheet S17462EJ4V0DS
21
μPD720114
Figure 2-9. Transmit Waveform for Transceiver at DP/DM
Level 1
Point 3 Point 4
+400 mV Differential
Point 1
Point 2
0V Differential
Point 5
Point 6
Level 2 Unit Interval 0% 100%
−400 mV Differential
Figure 2-10. Transmitter Measurement Fixtures
Test Supply Voltage 15.8 Ω USB Connector Nearest Device VBUS D+ DGND 50 Ω Coax 50 Ω Coax + To 50 Ω Inputs of a High Speed Differential Oscilloscope, or 50 Ω Outputs of a High Speed Differential Data Generator −
15.8 Ω
143 Ω
143 Ω
22
Data Sheet S17462EJ4V0DS
μPD720114
Timing Diagram Figure 2-11. Hub Differential Delay, Differential Jitter, and SOP Distortion
Upstream End of Cable VSS
50% Point of Initial Swing
Upstream Port of Hub VSS
Crossover Point
Downstream Port of Hub VSS
Hub Delay Downstream tHDD1
Downstream Port of Hub VSS
Hub Delay Downstream tHDD2
50% Point of Initial Swing
A. Downstream Hub Delay with Cable
B. Downstream Hub Delay without Cable
Downstream Port of Hub VSS Upstream Port or End of Cable VSS
Crossover Point
Hub Delay Upstream tHDD1 tHDD2
Crossover Point
C. Upstream Hub Delay with or without Cable
Upstream end of cable
Upstream port
Downstream port Plug
Receptacle
Host or Hub
Hub
Function
Downstream signaling Upstream signaling
D. Measurement Points
Hub Differential Jitter: tHDJ1 = tHDDx(J) − tHDDx(K) or tHDDx(K) − tHDDx(J) Consecutive Transitions tHDJ2 = tHDDx(J) − tHDDx(J) or tHDDx(K) − tHDDx(K) Paired Transitions Bit after SOP Width Distortion (same as data jitter for SOP and next J transition): tFSOP = tHDDx(next J) − tHDDx(SOP) Low-speed timings are determined in the same way for: tLHDD, tLDHJ1, tLDJH2, tLUHJ1, tLUJH2, and tLSOP
Data Sheet S17462EJ4V0DS
23
μPD720114
Figure 2-12. Hub EOP Delay and EOP Skew
Upstream End of Cable VSS
50% Point of Initial Swing Upstream Port of Hub VSS tEOP- tEOP+ tEOP- tEOP+ Downstream Port of Hub VSS Crossover Point Extended
Downstream Port of Hub VSS A. Downstream EOP Delay with Cable
B. Downstream EOP Delay without Cable
Downstream Port of Hub VSS tEOPUpstream Port or End of Cable VSS
Crossover Point Extended
tEOP+ Crossover Point Extended
C. Upstream EOP Delay with or without Cable
EOP Delay: tFEOPD = tEOPy − tHDDx (tEOPy means that this equation applies to tEOP- and tEOP+) EOP Skew: tFHESK = tEOP+ − tEOPLow-speed timings are determined in the same way for: tLEOPD and tLHESK
24
Data Sheet S17462EJ4V0DS
μPD720114
Figure 2-13. USB Differential Data Jitter for Low-/full-speed
tPERIOD Differential Data Lines Crossover Points
Consecutive Transitions N × tPERIOD + txDJ1 Paired Transitions N × tPERIOD + txDJ2
Figure 2-14. USB Differential-to-EOP Transition Skew and EOP Width for Low-/full-speed
tPERIOD Differential Data Lines Crossover Point
Crossover Point Extended
Diff. Data-toSE0 Skew N × tPERIOD + txDEOP
Source EOP Width: tFEOPT tLEOPT Receiver EOP Width: tFEOPR tLEOPR
Figure 2-15. USB Receiver Jitter Tolerance for Low-/full-speed
tPERIOD Differential Data Lines
txJR
txJR1
txJR2
Consecutive Transitions N × tPERIOD + txJR1 Paired Transitions N × tPERIOD + txJR2
Data Sheet S17462EJ4V0DS
25
μPD720114
Figure 2-16. Low-/full-speed Disconnect Detection
D+/D− VIHZ (min)
VIL D−/D+ VSS tDDIS Device Disconnected Disconnect Detected
Figure 2-17. Full-/high-speed Device Connect Detection
D+ VIH
D− VSS tDCNN Device Connected Connect Detected
Figure 2-18. Power-on and Connection Events Timing
Hub port power OK Hub port power-on VBUS VIH (min) VIH D+ or D− Δt1
Attatch detected
Reset recovery time
≥ 4.01 V
t2SUSP
tDRST
USB system software reads device speed
tSIGATT tATTDB
tRSTRCY
26
Data Sheet S17462EJ4V0DS
μPD720114
3. PACKAGE DRAWINGS
• μPD720114GA-9EU-A
48-PIN PLASTIC TQFP (FINE PITCH) (7x7)
A B detail of lead end S P C D R
48 1 13 12
36 37
25 24
T
L U
Q
F G H I
M
J
K S N S M
NOTE
Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.
ITEM A B C D F G H I J K L M N P Q R S T U
MILLIMETERS 9.0 ± 0.2 7.0 ± 0.2 7.0 ± 0.2 9.0 ± 0.2 0.75 0.75 0.22 + 0.05 − 0.04 0.10 0.5 (T.P.) 1.0 ± 0.2 0.5 0.17 + 0.03 − 0.07 0.08 1.0 ± 0.1 0.1 ± 0.05 +4° 3 °− 3 ° 1.27 MAX. 0.25 ( T.P.) 0.6 ± 0.15 P48GA-50-9EU-1
Data Sheet S17462EJ4V0DS
27
μPD720114
• μPD720114GA-YEU-A
48-PIN PLASTIC TQFP (FINE PITCH)(7x7)
HD D detail of lead end
36 37
25 24 c
A3
θ
E HE L1
L Lp
48 1 ZE ZD b x
M
13 12
(UNIT:mm) ITEM D DIMENSIONS 7.00 ± 0.20 7.00 ± 0.20 9.00 ± 0.20 9.00 ± 0.20 1.20 MAX. 0.10 ± 0.05 1.00 ± 0.05 0.25 0.22 ± 0.05 0.145 + 0.055 − 0.045 0.50 0.60 ± 0.15 1.00 ± 0.20 3° +5° −3° 0.50 0.08 0.08 0.75 0.75 P48GA-50-YEU
e S A A2
E HD HE A A1 A2 A3 b
S
c L
y
S
A1
Lp L1
θ
e x y ZD ZE
NOTE Each lead centerline is located within 0.08 mm of its true position at maximum material condition.
28
Data Sheet S17462EJ4V0DS
μPD720114
4. RECOMMENDED SOLDERING CONDITIONS
The μPD720114 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) • μPD720114GA-9EU-A: 48-pin plastic TQFP (Fine pitch) (7 × 7) • μPD720114GA-YEU-A: 48-pin plastic TQFP (Fine pitch) (7 × 7)
Soldering Method Infrared reflow Soldering Conditions Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less (220 °C or higher), Maximum allowable number of reflow processes: 3, Exposure limit afterwards), Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Non-heat-resistant trays, such as magazine and taping trays, cannot be baked before unpacking. Partial heating method Pin temperature: 300°C or below, Heat time: 3 seconds or less (per each side of the device) , Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. –
Note
Symbol IR60-107-3
: 7 days (10 to 72 hours pre-backing is required at 125C°
Note The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a relative humidity of 20 to 65% after dry-pack package is opened.
Data Sheet S17462EJ4V0DS
29
μPD720114
[MEMO]
30
Data Sheet S17462EJ4V0DS
μPD720114
N OTES FOR CMOS DEVICES
1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (MAX) and VIH (MIN). 2 HANDLING OF UNUSED INPUT PINS Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications governing the device. 3 PRECAUTION AGAINST ESD A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor devices. 4 STATUS BEFORE INITIALIZATION Power-on does not necessarily define the initial status of a MOS device. Immediately after the power source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the reset signal is received. A reset operation must be executed immediately after power-on for devices with reset functions. 5 POWER ON/OFF SEQUENCE In the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. When switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. Use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. The correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. 6 INPUT OF SIGNAL DURING POWER OFF STATE Do not input signals or an I/O pull-up power supply while the device is not powered. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Input of signals during the power off state must be judged separately for each device and according to related specifications governing the device.
Data Sheet S17462EJ4V0DS
31
μPD720114
ECOUSB is a trademark of NEC Electronics Corporation.
• T he information in this document is current as of June, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
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