UPG2409T6X-E2-A

DATA SHEET GaAs INTEGRATED CIRCUIT μPG2409T6X HIGH POWER SPDT SWITCH FOR WiMAX TM DESCRIPTION The μPG2409T6X is a GaAs MMIC high power SPDT (Single Pole Double Throw) switch which were designed for WiMAX. This device can operate frequency from 0.05 to 6.0 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6X) package. And this package is suitable for high-density surface mounting. FEATURES • Switch control voltage • Low insertion loss : Vcont (H) = 3.0 V TYP. : Vcont (L) = 0 V TYP. : Lins = 0.45 dB TYP. @ f = 2.5 GHz : Lins = 0.55 dB TYP. @ f = 3.8 GHz : Lins = 0.65 dB TYP. @ f = 6.0 GHz • High isolation : ISL = 30 dB TYP. @ f = 2.5 GHz : ISL = 30 dB TYP. @ f = 3.8 GHz : ISL = 27 dB TYP. @ f = 6.0 GHz • Handling power : Pin (1 dB) = +36.0 dBm TYP. @ f = 0.05 to 6.0 GHz • High-density surface mounting : 6-pin plastic TSON (T6X) package (1.5 × 1.5 × 0.37 mm) APPLICATIONS • WiMAX and wireless LAN (IEEE802.11a/b/g/n) ORDERING INFORMATION Part Number Order Number Package 6-pin plastic TSON (T6X) (Pb-Free) Marking G5R Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 3 kpcs/reel μPG2409T6X-E2 μPG2409T6X-E2-A Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPG2409T6X Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10773EJ01V0DS (1st edition) Date Published July 2009 NS Printed in Japan 2009 μPG2409T6X PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 1 6 RF1 1 GND 2 (Top View) Vcont1 6 6 RFC 5 5 Vcont2 4 4 (Bottom View) 1 Pin No. 1 2 3 2 Pin Name RF1 GND RF2 Vcont2 RFC Vcont1 G5R Vcont1 High Low Parameter Parameter 2 5 4 3 RF2 4 3 3 5 6 Remark Exposed pad : GND SW TRUTH TABLE Vcont2 Low High RFC-RF1 ON OFF RFC-RF2 OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Symbol Vcont Pin TA Tstg Ratings +6.0 Note Unit V dBm °C °C Switch Control Voltage Input Power Operating Ambient Temperature Storage Temperature +36 −45 to +85 −55 to +150 Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Symbol f Vcont (H) Vcont (L) MIN. 0.05 2.7 −0.2 −0.1 TYP. − 3.0 0 0 MAX. 6.0 3.3 0.2 0.1 Unit GHz V V V Operating Frequency Switch Control Voltage (H) Switch Control Voltage (L) Control Voltage Difference ΔVcont (H), ΔVcont (L)Note Note ΔVcont (H) = Vcont1 (H) − Vcont2 (H) ΔVcont (L) = Vcont1 (L) − Vcont2 (L) 2 Data Sheet PG10773EJ01V0DS μPG2409T6X ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 8 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Insertion Loss 4 Insertion Loss 5 Isolation 1 Isolation 2 Isolation 3 Isolation 4 Isolation 5 Return Loss 1 Return Loss 2 Return Loss 3 Return Loss 4 0.1 dB Loss Compression Input Power Note 3 Symbol Lins1 Lins2 Lins3 Lins4 Lins5 ISL1 ISL2 ISL3 ISL4 ISL5 RL1 RL2 RL3 RL4 Pin (0.1 dB) Test Conditions f = 0.05 to 0.5 GHz f = 0.5 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.8 GHz f = 3.8 to 6.0 GHz f = 0.05 to 0.5 GHz f = 0.5 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.8 GHz f = 3.8 to 6.0 GHz f = 0.05 to 0.5 GHz f = 0.5 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 6.0 GHz f = 0.5 to 6.0 GHz Note 2 Note 1 Note 1 Note 1 MIN. − − − − − − 25 25 25 22 − 15 15 10 − TYP. 0.35 0.40 0.45 0.55 0.65 30 30 30 30 27 20 20 20 15 +34.0 MAX. − 0.65 0.70 0.80 0.90 − − − − − − − − − − Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB dBm Note 2 Note 2 Note 2 1 dB Loss Compression Input Power Note 4 Pin (1 dB) f = 0.05 to 0.5 GHz f = 0.5 to 6.0 GHz Note 1 − +34.0 − − − − − +36.0 +36.0 70 70 +60 0.1 100 − − − − − 10 250 dBm dBm dBc dBc dBm Note 2 2nd Harmonics 3rd Harmonics Input 3rd Order Intercept Point Switch Control Current Switch Control Speed 2f0 3f0 IIP3 Icont tSW f = 2.5 GHz, Pin = +30 dBm f = 2.5 GHz, Pin = +30 dBm f = 2.5 GHz No RF input 50% CTL to 90/10% RF μA ns Notes 1. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 2. DC blocking capacitors = 56 pF at f = 0.5 to 2.0 GHz 3. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 4. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. Caution It is necessary to use DC blocking capacitors with this device. Data Sheet PG10773EJ01V0DS 3 μPG2409T6X EVALUATION CIRCUIT 1 000 pF C1 RF1 1 Vcont1 6 2 RFC 5 3 C1 Note RF2 C1 4 Vcont2 1 000 pF Note C1 : 0.05 to 0.5 GHz 1 000 pF : 0.5 to 2.0 GHz : 2.0 to 6.0 GHz 56 pF 8 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. APPLICATION INFORMATION C1 Switch C1 C1 LESD • C1 are DC blocking capacitors external to the device. The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. 4 Data Sheet PG10773EJ01V0DS μPG2409T6X TYPICAL CHARACTERISTICS (TA = +25°C, DC blocking capacitors = 8 pF, unless otherwise specified) RFC-RF1/RF2 INSERTION LOSS vs. FREQUENCY 0.0 –0.1 Vcont (H) = 3.0 V –10 0 Vcont (H) = 3.0 V RFC-RF1/RF2 ISOLATION vs. FREQUENCY Insertion Loss Lins (dB) –0.2 –0.3 –0.4 –0.5 –0.6 –0.7 –0.8 –0.9 –1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Isolation ISL (dB) –20 –30 –40 –50 –60 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Frequency f (GHz) Frequency f (GHz) RFC RETURN LOSS vs. FREQUENCY 0 Vcont (H) = 3.0 V –5 RF1/RF2 RETURN LOSS vs. FREQUENCY 0 Vcont (H) = 3.0 V –5 Return Loss RL (dB) –15 –20 –25 –30 –35 –40 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Return Loss RL (dB) –10 –10 –15 –20 –25 –30 –35 –40 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Frequency f (GHz) Frequency f (GHz) RFC-RF1/RF2 INSERTION LOSS, Icont vs. SWITCH CONTROL VOLTAGE (H) –0.2 1.0 0 –10 RFC-RF1/RF2 ISOLATION vs. SWITCH CONTROL VOLTAGE (H) Insertion Loss Lins (dB) –0.4 Lins –0.6 f = 2.5 GHz 0.8 Switch Control Current Icont (μA) Isolation ISL (dB) –20 f = 6.0 GHz –30 2.5 GHz –40 –50 –60 2.0 0.6 6.0 GHz –0.8 0.4 –1.0 Icont (No RF input) 2.5 3.0 0.2 –1.2 2.0 0.0 3.5 2.5 3.0 3.5 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. Data Sheet PG10773EJ01V0DS 5 μPG2409T6X RFC RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) 0 –5 Return Loss RL (dB) Return Loss RL (dB) RF1/RF2 RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) 0 –5 –10 –15 –20 –25 –30 –35 2.5 GHz f = 6.0 GHz –10 –15 –20 –25 –30 –35 –40 2.0 2.5 3.0 3.5 2.5 GHz f = 6.0 GHz –40 2.0 2.5 3.0 3.5 Switch Control Voltage (H) Vcont (H) (V) 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) Switch Control Voltage (H) Vcont (H) (V) RFC-RF1/RF2 INSERTION LOSS, Icont vs. INPUT POWER –0.2 f = 2.5 GHz Insertion Loss Lins (dB) RFC-RF1/RF2 Pin (0.1 dB) vs. SWITCH CONTROL VOLTAGE (H) 38 f = 2.5 GHz 36 34 32 30 28 26 2.0 5 Lins 3.3 V Switch Control Current Icont (μA) –0.4 4 –0.6 Vcont (H) = 2.7 V –0.8 3.0 V 3 2 3.3 V 3.0 V 2.7 V –1.0 Icont –1.2 15 20 25 30 35 1 0 40 2.5 3.0 3.5 Input Power Pin (dBm) Switch Control Voltage (H) Vcont (H) (V) –30 Vcont (H) = 3.0 V –40 Vcont (L) = 0 V f = 2.5 GHz –50 –60 –70 –80 –90 –100 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Input Power Pin (dBm) 2f0 3f0 Output Power Pout (dBm) 3rd Order Intermoduration Distortion IM3 (dBm) RFC-RF1/RF2 2f0, 3f0 vs. INPUT POWER RFC-RF1/RF2 OUTPUT POWER, IM3 vs. INPUT POWER 80 60 40 Pout 20 0 –20 –40 –60 –80 0 10 20 IM3 Vcont (H) = 3.0 V Vcont (L) = 0 V f = 2.5 GHz 40 50 60 70 80 2nd Harmonics 2f0 (dBc) 3rd Harmonics 3f0 (dBc) 30 Input Power Pin (1 Tone) (dBm) Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10773EJ01V0DS μPG2409T6X MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) MOUNTING PAD 0.3 0.5 0.3 1.0 0.3 0.2 0.3 SOLDER MASK 0.475 0.25 0.475 0.35 0.55 0.15 0.25 Solder thickness : 0.08 mm Remark The mounting pad and solder mask layouts in this document is for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. 0.5 0.5 0.5 0.5 Data Sheet PG10773EJ01V0DS 7 μPG2409T6X PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (T6X) (UNIT: mm) (Top View) 1.5±0.1 (Side View) (Bottom View) 0.3±0.07 (0.24) 0.5±0.06 1.5±0.1 0.08 MIN. 0.37+0.03 –0.05 0.2+0.07 –0.05 0.2±0.1 A A 0.7±0.1 Remark A>0 ( ) : Reference value 8 Data Sheet PG10773EJ01V0DS 1.2±0.1 μPG2409T6X RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Condition Symbol IR260 For soldering Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10773EJ01V0DS 9 μPG2409T6X WiMAX is a trademark or a registered trademark of the WiMAX Forum. • T he information in this document is current as of July, 2009. The information is subject to change without notice. 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GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.