LMZ12003_1

LMZ12003 3A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage June 10, 2010 LMZ12003 3A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage Easy to use 7 pin package Performance Benefits ■ Operates at high ambient temperature with no thermal derating ■ High efficiency reduces system heat generation ■ Low radiated emissions (EMI) complies with EN55022 class B standard EN61000 4-3 ■ Passes 10V/m radiated immunity EMI test standard 30109086 TO-PMOD 7 Pin Package 10.16 x 13.77 x 4.57 mm (0.4 x 0.542 x 0.18 in) θJA = 20°C/W, θJC = 1.9°C/W RoHS Compliant System Performance Efficiency VIN = 12V VOUT = 5.0V Electrical Specifications ■ ■ ■ ■ ■ 18W maximum total power output Up to 3A output current Input voltage range 4.5V to 20V Output voltage range 0.8V to 6V Efficiency up to 92% Key Features ■ Integrated shielded inductor ■ Simple PCB layout ■ Flexible startup sequencing using external soft-start capacitor and precision enable UVLO and output short circuit 30109018 Thermal derating curve VIN = 12V VOUT = 5.0V ■ Protection against inrush currents and faults such as input ■ -40°C to 125°C junction temperature range ■ Single exposed pad and standard pinout for easy mounting and manufacturing ■ Fast transient response for FPGAs and ASICs ■ Low output voltage ripple ■ Pin-to-pin compatible family: LMZ14203/2/1 (42V max 3A, 2A, 1A) LMZ12003/2/1 (20V max 3A, 2A, 1A) ■ Fully Webench® Power Designer enabled 30109019 Radiated Emissions (EN 55022 Class B) from Evaluation Board Applications ■ ■ ■ ■ Point of load conversions from 5V and 12V input rail Time critical projects Space constrained high thermal requirement applications Negative output voltage applications (See AN-2027) 30109050 © 2010 National Semiconductor Corporation 301090 www.national.com LMZ12003 Simplified Application Schematic 30109001 Connection Diagram 30109009 Top View 7-Lead TO-PMOD Ordering Information Order Number LMZ12003TZ-ADJ LMZ12003TZX-ADJ LMZ12003TZE-ADJ Package Type TO-PMOD-7 TO-PMOD-7 TO-PMOD-7 NSC Package Drawing TZA07A TZA07A TZA07A Supplied As 250 Units on Tape and Reel 500 Units on Tape and Reel 45 Units in a Rail Pin Descriptions Pin 1 2 3 4 5 Name Description VIN RON EN GND SS Supply input — Nominal operating range is 4.5V to 20V . A small amount of internal capacitance is contained within the package assembly. Additional external input capacitance is required between this pin and exposed pad. On Time Resistor — An external resistor from VIN to this pin sets the on-time of the application. Typical values range from 25k to 124k ohms. Enable — Input to the precision enable comparator. Rising threshold is 1.18V nominal; 90 mV hysteresis nominal. Maximum recommended input level is 6.5V. Ground — Reference point for all stated voltages. Must be externally connected to EP. Soft-Start — An internal 8 µA current source charges an external capacitor to produce the soft-start function. This node is discharged at 200 µA during disable, over-current, thermal shutdown and internal UVLO conditions. www.national.com 2 LMZ12003 Pin 6 Name Description FB Feedback — Internally connected to the regulation, over-voltage, and short-circuit comparators. The regulation reference point is 0.8V at this input pin. Connected the feedback resistor divider between the output and ground to set the output voltage. Exposed Pad — Internally connected to pin 4. Used to dissipate heat from the package during operation. Must be electrically connected to pin 4 external to the package. 7 EP VOUT Output Voltage — Output from the internal inductor. Connect the output capacitor between this pin and exposed pad. EP 3 www.national.com LMZ12003 Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. VIN, RON to GND EN, FB, SS to GND Junction Temperature Storage Temperature Range -0.3V to 25V -0.3V to 7V 150°C -65°C to 150°C ESD Susceptibility(Note 2) For soldering specifications: see product folder at www.national.com and www.national.com/ms/MS/MS-SOLDERING.pdf ± 2 kV Operating Ratings (Note 1) 4.5V to 20V 0V to 6.5V −40°C to 125°C VIN EN Operation Junction Temperature Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are guaranteed through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12V, Vout = 1.8V Symbol Parameter Conditions Min (Note 3) Typ (Note 4) Max (Note 3) Units SYSTEM PARAMETERS Enable Control VEN VEN-HYS Soft-Start ISS ISS-DIS Current Limit ICL ON/OFF Timer tON-MIN tOFF VFB ON timer minimum pulse width OFF timer pulse width In-regulation feedback voltage VSS >+ 0.8V TJ = -40°C to 125°C IO = 3A VSS >+ 0.8V TJ = 25°C IO = 10 mA VFB-OV IFB IQ ISD TSD TSD-HYST θJA Feedback over-voltage protection threshold Feedback input bias current Non Switching Input Current Shut Down Quiescent Current Thermal Shutdown Thermal shutdown hysteresis Junction to Ambient VFB= 0.86V VEN= 0V Rising Falling 4 layer JEDEC Printed Circuit Board, 100 vias, No air flow 2 layer JEDEC Printed Circuit Board, No air flow θJC Δ VO ΔVO/ΔVIN ΔVO/ΔVIN www.national.com EN threshold trip point EN threshold hysteresis SS source current SS discharge current Current limit threshold VEN rising VEN falling VSS = 0V 1.1 1.18 90 1.25 V mV 5 8 -200 11 µA µA d.c. average VIN= 12V to 20V 3.2 4.2 5.25 A 150 260 0.773 0.793 0.813 ns ns V Regulation and Over-Voltage Comparator 0.784 0.800 0.816 0.92 5 1 25 165 15 19.3 21.5 1.9 8 VIN = 8V to 20V, IO= 3A VIN = 12V 4 V nA mA μA °C °C °C/W °C/W °C/W mV PP % mV/A Thermal Characteristics Junction to Case Output Voltage Ripple Line Regulation Load Regulation No air flow PERFORMANCE PARAMETERS .01 1.5 LMZ12003 Symbol η η Parameter Efficiency Efficiency Conditions VIN = 12V VO = 1.8V IO = 1A VIN = 12V VO = 1.8V IO = 3A Min (Note 3) Typ (Note 4) 87 77 Max (Note 3) Units % % Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics. Note 2: The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD-22-114. Note 3: Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate National’s Average Outgoing Quality Level (AOQL). Note 4: Typical numbers are at 25°C and represent the most likely parametric norm. Note 5: EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See AN-2024 and layout for information on device under test. Note 6: Theta JA measured on a 1.705” x 3.0” four layer board, with one ounce copper, thirty five 12 mil thermal vias, no air flow, and 1W power dissipation. Refer to PCB layout diagrams Typical Performance Characteristics Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Efficiency 6V Input @ 25°C Dissipation 6V Input @ 25°C 30109021 30109022 Efficiency 12V Input @ 25°C Dissipation 12V Input @ 25°C 30109003 30109004 5 www.national.com LMZ12003 Efficiency 6V Input @ 85°C Dissipation 6V Input @ 85°C 30109033 30109034 Efficiency 8V Input @ 85°C Dissipation 8V Input @ 85°C 30109040 30109041 Efficiency 12V Input @ 85°C Dissipation 12V Input @ 85°C 30109042 30109043 www.national.com 6 LMZ12003 Line and Load Regulation @ 25°C Output Ripple 12VIN 3.3VO 3A 20mV/div 1μSec/div 30109005 30109048 Transient Response 12VIN 3.3VO 0.6A to 3A Step Thermal Derating VOUT = 1.8V 30109006 30109051 Application Block Diagram 30109008 7 www.national.com LMZ12003 General Description The LMZ12003 SIMPLE SWITCHER power module is an easy-to-use step-down DC-DC solution capable of driving up to 3A load with exceptional power conversion efficiency, line and load regulation, and output accuracy. The LMZ12003 is available in an innovative package that enhances thermal performance and allows for hand or machine soldering. The LMZ12003 can accept an input voltage rail between 4.5V and 20V and deliver an adjustable and highly accurate output voltage as low as 0.8V. The LMZ12003 only requires three external resistors and four external capacitors to complete the power solution. The LMZ12003 is a reliable and robust design with the following protection features: thermal shutdown, input under-voltage lockout, output over-voltage protection, short-circuit protection, output current limit, and allows startup into a pre-biased output. A single resistor adjusts the switching frequency up to 1 MHz. rail rises at power-up. Applying the enable divider to the main input rail is often done in the case of higher input voltage systems where a lower boundary of operation should be established. In the case of sequencing supplies, the divider is connected to a rail that becomes active earlier in the powerup cycle than the LMZ12003 output rail. The two resistors should be chosen based on the following ratio: RENT / RENB = (VIN UVLO / 1.18V) – 1 (1) The LMZ12003 demonstration and evaluation boards use 11.8kΩ for RENB and 32.4kΩ for RENT resulting in a rising UVLO of 4.5V. This divider presents 5.34V to the EN input when the divider input is raised to 20V. The EN pin is internally pulled up to VIN and can be left floating for always-on operation. OUTPUT VOLTAGE SELECTION Output voltage is determined by a divider of two resistors connected between VO and ground. The midpoint of the divider is connected to the FB input. The voltage at FB is compared to a 0.8V internal reference. In normal operation an on-time cycle is initiated when the voltage on the FB pin falls below 0.8V. The main MOSFET on-time cycle causes the output voltage to rise and the voltage at the FB to exceed 0.8V. As long as the voltage at FB is above 0.8V, on-time cycles will not occur. The regulated output voltage determined by the external divider resistors RFBT and RFBB is: VO = 0.8V * (1 + RFBT / RFBB) (2) Rearranging terms; the ratio of the feedback resistors for a desired output voltage is: RFBT / RFBB = (VO / 0.8V) - 1 (3) These resistors should be chosen from values in the range of 1.0 kohm to 10.0 kohm. For VO = 0.8V the FB pin can be connected to the output directly so long as an output preload resistor remains that draws more than 20uA. Converter operation requires this minimum load to create a small inductor ripple current and maintain proper regulation when no load is present. A feed-forward capacitor is placed in parallel with RFBT to improve load step transient response. Its value is usually determined experimentally by load stepping between DCM and CCM conduction modes and adjusting for best transient response and minimum output ripple. A table of values for RFBT , RFBB , CFF and RON is included in the applications schematic. SOFT-START CAPACITOR SELECTION Programmable soft-start permits the regulator to slowly ramp to its steady state operating point after being enabled, thereby reducing current inrush from the input supply and slowing the output voltage rise-time to prevent overshoot. Upon turn-on, after all UVLO conditions have been passed, an internal 8uA current source begins charging the external soft-start capacitor. The soft-start time duration to reach steady state operation is given by the formula: tSS = VREF * CSS / Iss = 0.8V * CSS / 8uA (4) This equation can be rearranged as follows: CSS = tSS * 8 μA / 0.8V (5) Use of a 0.022μF capacitor results in 2.2 msec soft-start duration. This is recommended as a minimum value. As the soft-start input exceeds 0.8V the output of the power stage will be in regulation. The soft-start capacitor continues 8 COT Control Circuit Overview Constant On Time control is based on a comparator and an on-time one shot, with the output voltage feedback compared with an internal 0.8V reference. If the feedback voltage is below the reference, the main MOSFET is turned on for a fixed on-time determined by a programming resistor RON. RON is connected to VIN such that on-time is reduced with increasing input supply voltage. Following this on-time, the main MOSFET remains off for a minimum of 260 ns. If the voltage on the feedback pin falls below the reference level again the on-time cycle is repeated. Regulation is achieved in this manner. Design Steps for the LMZ12003 Application The LMZ12003 is fully supported by Webench® and offers the following: Component selection, electrical and thermal simulations as well as the build-it board for a reduction in design time. The following list of steps can be used to manually design the LMZ12003 application. • Select minimum operating VIN with enable divider resistors • Program VO with divider resistor selection • Program turn-on time with soft-start capacitor selection • Select CO • Select CIN • Set operating frequency with RON • Determine module dissipation • Layout PCB for required thermal performance ENABLE DIVIDER, RENT AND RENB SELECTION The enable input provides a precise 1.18V band-gap rising threshold to allow direct logic drive or connection to a voltage divider from a higher enable voltage such as Vin. The enable input also incorporates 90 mV (typ) of hysteresis resulting in a falling threshold of 1.09V. The maximum recommended voltage into the EN pin is 6.5V. For applications where the midpoint of the enable divider exceeds 6.5V, a small zener can be added to limit this voltage. The function of this resistive divider is to allow the designer to choose an input voltage below which the circuit will be disabled. This implements the feature of programmable under voltage lockout. This is often used in battery powered systems to prevent deep discharge of the system battery. It is also useful in system designs for sequencing of output rails or to prevent early turn-on of the supply as the main input voltage www.national.com LMZ12003 charging until it reaches approximately 3.8V on the SS pin. Voltage levels between 0.8V and 3.8V have no effect on other circuit operation. Note that the following conditions will reset the soft-start capacitor by discharging the SS input to ground with an internal 200 μA current sink. • The enable input being “pulled low” • Thermal shutdown condition • Over-current fault • Internal Vcc UVLO (Approx 4V input to VIN) CO SELECTION None of the required CO output capacitance is contained within the module. At a minimum, the output capacitor must meet the worst case minimum ripple current rating of 0.5 * ILR P-P, as calculated in equation (19) below. Beyond that, additional capacitance will reduce output ripple so long as the ESR is low enough to permit it. A minimum value of 10 μF is generally required. Experimentation will be required if attempting to operate with a minimum value. Ceramic capacitors or other low ESR types are recommended. See AN-2024 for more detail. The following equation provides a good first pass approximation of CO for load transient requirements: CO≥ISTEP*VFB*L*VIN/ (4*VO*(VIN—VO)*VOUT-TRAN)(6) Solving: CO≥ 3A*0.8V*6.8μH*12V / (4*3.3V*( 12V — 3.3V)*33mV) ≥ 52μF (7) The LMZ12003 demonstration and evaluation boards are populated with a 100 uF 6.3V X5R output capacitor. Locations for extra output capacitors are provided. CIN SELECTION The LMZ12003 module contains an internal 0.47 µF input ceramic capacitor. Additional input capacitance is required external to the module to handle the input ripple current of the application. This input capacitance should be located in very close proximity to the module. Input capacitor selection is generally directed to satisfy the input ripple current requirements rather than by capacitance value. Worst case input ripple current rating is dictated by the equation: I(CIN(RMS)) ≊ 1 /2 * IO * √ (D / 1-D) (8) where D ≊ VO / VIN (As a point of reference, the worst case ripple current will occur when the module is presented with full load current and when VIN = 2 * VO). Recommended minimum input capacitance is 10uF X7R ceramic with a voltage rating at least 25% higher than the maximum applied input voltage for the application. It is also recommended that attention be paid to the voltage and temperature deratings of the capacitor selected. It should be noted that ripple current rating of ceramic capacitors may be missing from the capacitor data sheet and you may have to contact the capacitor manufacturer for this rating. If the system design requires a certain minimum value of input ripple voltage ΔVIN be maintained then the following equation may be used. CIN ≥ IO * D * (1–D) / fSW-CCM * ΔVIN(9) If ΔVIN is 1% of VIN for a 20V input to 3.3V output application this equals 200 mV and fSW = 400 kHz. Additional bulk capacitance with higher ESR may be required to damp any resonant effects of the input capacitance and parasitic inductance of the incoming supply lines. RON RESISTOR SELECTION Many designs will begin with a desired switching frequency in mind. For that purpose the following equation can be used. fSW(CCM) ≊ VO / (1.3 * 10-10 * RON) (10) This can be rearranged as RON ≊ VO / (1.3 * 10 -10 * fSW(CCM) (11) The selection of RON and fSW(CCM) must be confined by limitations in the on-time and off-time for the COT control section. The on-time of the LMZ12003 timer is determined by the resistor RON and the input voltage VIN. It is calculated as follows: tON = (1.3 * 10-10 * RON) / VIN (12) The inverse relationship of tON and VIN gives a nearly constant switching frequency as VIN is varied. RON should be selected such that the on-time at maximum VIN is greater than 150 ns. The on-timer has a limiter to ensure a minimum of 150 ns for tON. This limits the maximum operating frequency, which is governed by the following equation: fSW(MAX) = VO / (VIN(MAX) * 150 nsec) (13) This equation can be used to select RON if a certain operating frequency is desired so long as the minimum on-time of 150 ns is observed. The limit for RON can be calculated as follows: RON ≥ VIN(MAX) * 150 nsec / (1.3 * 10 -10) (14) If RON calculated in (11) is less than the minimum value determined in (14) a lower frequency should be selected. Alternatively, VIN(MAX) can also be limited in order to keep the frequency unchanged. Additionally note, the minimum off-time of 260 ns limits the maximum duty ratio. Larger RON (lower FSW) should be selected in any application requiring large duty ratio. Discontinuous Conduction and Continuous Conduction Modes At light load the regulator will operate in discontinuous conduction mode (DCM). With load currents above the critical conduction point, it will operate in continuous conduction mode (CCM). When operating in DCM the switching cycle begins at zero amps inductor current; increases up to a peak value, and then recedes back to zero before the end of the off-time. Note that during the period of time that inductor current is zero, all load current is supplied by the output capacitor. The next on-time period starts when the voltage on the at the FB pin falls below the internal reference. The switching frequency is lower in DCM and varies more with load current as compared to CCM. Conversion efficiency in DCM is maintained since conduction and switching losses are reduced with the smaller load and lower switching frequency. Operating frequency in DCM can be calculated as follows: fSW(DCM)≊VO*(VIN-1)*6.8μH*1.18*1020*IO/(VIN–VO)*RON2 (15) In CCM, current flows through the inductor through the entire switching cycle and never falls to zero during the off-time. The switching frequency remains relatively constant with load current and line voltage variations. The CCM operating frequency can be calculated using equation 7 above. Following is a comparison pair of waveforms of the showing both CCM (upper) and DCM operating modes. CIN≥ 3A * 3.3V/20V * (1– 3.3V/20V) / (400000 * 0.200 V) ≥ 5.2μF 9 www.national.com LMZ12003 CCM and DCM Operating Modes VIN = 12V, VO = 3.3V, IO = 3A/0.4A 2 μsec/div PIC-LOSS for the application being designed. In this application it is 2.25W θCA< (125 — 85) / 2.25W —1.9 = 15.8 To reach θCA = 15.8, the PCB is required to dissipate heat effectively. With no airflow and no external heat, a good estimate of the required board area covered by 1 oz. copper on both the top and bottom metal layers is: Board Area_cm2 > 500°C x cm2/W / θJC (19) As a result, approximately 31 square cm of 1 oz copper on top and bottom layers is required for the PCB design. The PCB copper heat sink must be connected to the exposed pad. Approximately thirty six, 10 mils (254 μm) thermal vias spaced 59 mils (1.5 mm) apart must connect the top copper to the bottom copper. For an example of a high thermal performance PCB layout, refer to the demo board application note AN-2024. PC BOARD LAYOUT GUIDELINES PC board layout is an important part of DC-DC converter design. Poor board layout can disrupt the performance of a DCDC converter and surrounding circuitry by contributing to EMI, ground bounce and resistive voltage drop in the traces. These can send erroneous signals to the DC-DC converter resulting in poor regulation or instability. Good layout can be implemented by following a few simple design rules. 30109012 The approximate formula for determining the DCM/CCM boundary is as follows: IDCB≊VO*(VIN–VO)/(2*6.8 μH*fSW(CCM)*VIN) (16) Following is a typical waveform showing the boundary condition. Transition Mode Operation VIN = 12V, VO = 3.3V, IO = 0.5 A 2 μsec/div 30109011 30109014 The inductor internal to the module is 6.8 μH. This value was chosen as a good balance between low and high input voltage applications. The main parameter affected by the inductor is the amplitude of the inductor ripple current (ILR). ILR can be calculated with: ILR P-P=VO*(VIN- VO)/(6.8µH*fSW*VIN) (17) Where VIN is the maximum input voltage and fSW is determined from equation 10. If the output current IO is determined by assuming that IO = IL, the higher and lower peak of ILR can be determined. Be aware that the lower peak of ILR must be positive if CCM operation is required. POWER DISSIPATION AND BOARD THERMAL REQUIREMENTS For the design case of VIN = 12V, VO = 3.3V, IO = 3A, TAMB (MAX) = 85°C , and TJUNCTION = 125°C, the device must see a thermal resistance from case to ambient of less than: θCA< (TJ-MAX — TAMB(MAX)) / PIC-LOSS - θJC (18) Given the typical thermal resistance from junction to case to be 1.9 °C/W .Use the 85°C power dissipation curves in the Typical Performance Characteristics section to estimate the 1. Minimize area of switched current loops. From an EMI reduction standpoint, it is imperative to minimize the high di/dt current paths during PC board layout. The high current loops that do not overlap have high di/dt content that will cause observable high frequency noise on the output pin if the input capacitor CIN1 is placed a distance away for the LMZ12003. Therefore physically place CIN1 asa close as possible to the LMZ12003 VIN and GND exposed pad. This will minimize the high di/dt area and reduce radiated EMI. Additionally, grounding for both the input and output capacitor should consist of a localized top side plane that connects to the GND exposed pad (EP). 2. Have a single point ground. The ground connections for the feedback, soft-start, and enable components should be routed to the GND pin of the device. This prevents any switched or load currents from flowing in the analog ground traces. If not properly handled, poor grounding can result in degraded load regulation or erratic output voltage ripple behavior. Provide the single point ground connection from pin 4 to EP. 3. Minimize trace length to the FB pin. Both feedback resistors, RFBT and RFBB, and the feed forward capacitor CFF, should be located close to the FB pin. Since the FB node is high impedance, maintain the copper area as small as possible. The trace are from RFBT, RFBB, and CFF www.national.com 10 LMZ12003 should be routed away from the body of the LMZ12003 to minimize noise. 4. Make input and output bus connections as wide as possible. This reduces any voltage drops on the input or output of the converter and maximizes efficiency. To optimize voltage accuracy at the load, ensure that a separate feedback voltage sense trace is made to the load. Doing so will correct for voltage drops and provide optimum output accuracy. 5. Provide adequate device heat-sinking. Use an array of heat-sinking vias to connect the exposed pad to the ground plane on the bottom PCB layer. If the PCB has a plurality of copper layers, these thermal vias can also be employed to make connection to inner layer heat-spreading ground planes. For best results use a 6 x 6 via array with minimum via diameter of 10mils (254 μm) thermal vias spaced 59mils (1.5 mm). Ensure enough copper area is used for heatsinking to keep the junction temperature below 125°C. THERMAL PROTECTION The junction temperature of the LMZ12003 should not be allowed to exceed its maximum ratings. Thermal protection is implemented by an internal Thermal Shutdown circuit which activates at 165 °C (typ) causing the device to enter a low power standby state. In this state the main MOSFET remains off causing VO to fall, and additionally the CSS capacitor is discharged to ground. Thermal protection helps prevent catastrophic failures for accidental device overheating. When the junction temperature falls back below 145 °C (typ Hyst = 20 °C) the SS pin is released, VO rises smoothly, and normal operation resumes. Applications requiring maximum output current especially those at high input voltage may require application derating at elevated temperatures. ZERO COIL CURRENT DETECTION The current of the lower (synchronous) MOSFET is monitored by a zero coil current detection circuit which inhibits the synchronous MOSFET when its current reaches zero until the next on-time. This circuit enables the DCM operating mode, which improves efficiency at light loads. PRE-BIASED STARTUP The LMZ12003 will properly start up into a pre-biased output. This startup situation is common in multiple rail logic applications where current paths may exist between different power rails during the startup sequence. The following scope capture shows proper behavior during this event. Pre-Biased Startup Additional Features OUTPUT OVER-VOLTAGE COMPARATOR The voltage at FB is compared to a 0.92V internal reference. If FB rises above 0.92V the on-time is immediately terminated. This condition is known as over-voltage protection (OVP). It can occur if the input voltage is increased very suddenly or if the output load is decreased very suddenly. Once OVP is activated, the top MOSFET on-times will be inhibited until the condition clears. Additionally, the synchronous MOSFET will remain on until inductor current falls to zero. CURRENT LIMIT Current limit detection is carried out during the off-time by monitoring the current in the synchronous MOSFET. Referring to the Functional Block Diagram, when the top MOSFET is turned off, the inductor current flows through the load, the PGND pin and the internal synchronous MOSFET. If this current exceeds 4.2A (typical) the current limit comparator disables the start of the next on-time period. The next switching cycle will occur only if the FB input is less than 0.8V and the inductor current has decreased below 4.2A. Inductor current is monitored during the period of time the synchronous MOSFET is conducting. So long as inductor current exceeds 4.2A, further on-time intervals for the top MOSFET will not occur. Switching frequency is lower during current limit due to the longer off-time. It should also be noted that current limit is dependent on both duty cycle and temperature as illustrated in the graphs in the typical performance section. 30109025 11 www.national.com LMZ12003 Evaluation Board Schematic Diagram 30109007 Ref Des U1 Cin1 Cin2 CO1 CO2 RFBT RFBB RON RENT RENB CFF CSS Description SIMPLE SWITCHER ® 1 µF, 50V, X7R 10 µF, 50V, X7R 1 µF, 50V, X7R 100 µF, 6.3V, X7R 1.37 kΩ 1.07 kΩ 32.4 kΩ 32.4 kΩ 11.8 kΩ 22 nF, ±10%, X7R, 16V 22 nF, ±10%, X7R, 16V Case Size TO-PMOD-7 1206 1210 1206 1210 0603 0603 0603 0603 0603 0603 0603 Case Size National Semiconductor Taiyo Yuden Taiyo Yuden Taiyo Yuden Taiyo Yuden Vishay Dale Vishay Dale Vishay Dale Vishay Dale Vishay Dale TDK TDK Manufacturer P/N LMZ12003 TZ UMK316B7105KL-T UMK325BJ106MM-T 'UMK316B7105KL-T JMK325BJ10CR7MM-T CRCW06031K37FKEA CRCW06031K07FKEA CRCW060332K4FKEA CRCW060332K4FKEA CRCW060311k8FKEA C1608X7R1H223K C1608X7R1H223K www.national.com 12 LMZ12003 30109016 30109017 13 www.national.com LMZ12003 Physical Dimensions inches (millimeters) unless otherwise noted 7-Lead TZA Package NS Package Number TZA07A www.national.com 14 LMZ12003 Notes 15 www.national.com LMZ12003 3A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: www.national.com Products Amplifiers Audio Clock and Timing Data Converters Interface LVDS Power Management Switching Regulators LDOs LED Lighting Voltage References PowerWise® Solutions Temperature Sensors PLL/VCO www.national.com/amplifiers www.national.com/audio www.national.com/timing www.national.com/adc www.national.com/interface www.national.com/lvds www.national.com/power www.national.com/switchers www.national.com/ldo www.national.com/led www.national.com/vref www.national.com/powerwise WEBENCH® Tools App Notes Reference Designs Samples Eval Boards Packaging Green Compliance Distributors Quality and Reliability Feedback/Support Design Made Easy Design Support www.national.com/webench www.national.com/appnotes www.national.com/refdesigns www.national.com/samples www.national.com/evalboards www.national.com/packaging www.national.com/quality/green www.national.com/contacts www.national.com/quality www.national.com/feedback www.national.com/easy www.national.com/solutions www.national.com/milaero www.national.com/solarmagic www.national.com/training Applications & Markets Mil/Aero PowerWise® Design University Serial Digital Interface (SDI) www.national.com/sdi www.national.com/wireless www.national.com/tempsensors SolarMagic™ THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. 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