74ABT541PW,118

INTEGRATED CIRCUITS 74ABT541 Octal buffer/line driver (3-State) Product specification Supersedes data of 1996 Sep 10 IC23 Data Handbook
     1998 Jan 16 Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 • ESD protection exceeds 2000 V per MIL STD 883 Method 3015 FEATURES • Octal bus interface • Functions similar to the ’ABT241 • Provides ideal interface and increases fan-out of MOS and 200 V per Machine Model • Live insertion/extraction permitted DESCRIPTION Microprocessors The 74ABT541 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. • Efficient pinout to facilitate PC board layout • 3-State buffer outputs sink 64mA and source 32mA • Power-up 3-State • Latch-up protection exceeds 500mA per Jedec JC40.2 Std 17 The 74ABT541 device is an octal buffer that is ideal for driving bus lines. The outputs are all capable of sinking 64mA and sourcing 32mA. The device features input and outputs on opposite sides of the package to facilitate printed circuit board layout. QUICK REFERENCE DATA SYMBOL CONDITIONS Tamb = 25°C; GND = 0V PARAMETER TYPICAL UNIT 2.9 ns tPLH tPHL Propagation delay An to Yn CL = 50pF; VCC = 5V CIN Input capacitance VI = 0V or VCC 4 pF COUT Output capacitance Outputs disabled; VO = 0V or VCC 7 pF ICCZ Total supply current Outputs disabled; VCC = 5.5V 500 nA ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 20-Pin Plastic DIP –40°C to +85°C 74ABT541 N 74ABT541 N SOT146-1 20-Pin plastic SO –40°C to +85°C 74ABT541 D 74ABT541 D SOT163-1 20-Pin Plastic SSOP Type II –40°C to +85°C 74ABT541 DB 74ABT541 DB SOT339-1 20-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT541 PW 74ABT541PW DH SOT360-1 PIN CONFIGURATION LOGIC SYMBOL OE0 OE1 OE0 1 20 VCC A0 2 19 OE1 1 19 2 18 3 17 Y0 A0 A1 3 18 Y0 A2 4 17 Y1 A3 5 16 Y2 A4 6 15 Y3 A5 7 14 Y4 A6 8 13 Y5 A7 9 12 Y6 11 Y7 Y1 A1 4 16 5 15 6 14 7 13 8 12 9 11 Y2 A2 Y3 A3 Y4 A4 Y5 A5 GND 10 A7 SA00202 1998 Jan 16 Y6 A6 Y7 SA00203 2 853-1458 18864 Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 LOGIC SYMBOL (IEEE/IEC) PIN DESCRIPTION & 1 EN 19 PIN NUMBER SYMBOL NAME AND FUNCTION 2, 3, 4, 5, 6, 7, 8, 9 A0 – A7 Data inputs 18, 17, 16, 15, 14, 13, 12, 11 Y0 – Y7 Data outputs 2 18 1, 19 OE0, OE1 Output enables 3 17 10 GND Ground (0V) 4 16 20 VCC Positive supply voltage 5 15 6 14 7 13 8 12 9 11 FUNCTION TABLE INPUTS SA00204 H L X Z OUTPUTS OE0 OE1 An Yn L L X H L L H X L H X X L H Z Z = High voltage level = Low voltage level = Don’t care = High impedance ”off” state ABSOLUTE MAXIMUM RATINGS1, 2 SYMBOL VCC IIK PARAMETER CONDITIONS RATING UNIT –0.5 to +7.0 V –18 mA –1.2 to +7.0 V VO < 0 –50 mA output in Off or High state –0.5 to +5.5 V output in Low state 128 mA –65 to 150 °C DC supply voltage DC input diode current VI < 0 voltage3 VI DC input IOK DC output diode current voltage3 VOUT DC output IOUT DC output current Tstg Storage temperature range NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 Jan 16 3 Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER LIMITS DC supply voltage UNIT Min Max 4.5 5.5 V 0 VCC V VI Input voltage VIH High-level input voltage VIL Low-level Input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA 0 5 ns/V –40 +85 °C 2.0 ∆t/∆v Input transition rise or fall rate Tamb Operating free-air temperature range V DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Min VIK Input clamp voltage Tamb = –40°C to +85°C Tamb = +25°C VCC = 4.5V; IIK = –18mA Typ Max –0.9 –1.2 Min UNIT Max –1.2 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V VCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 VOH High-level output voltage VOL Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V Input leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA Power-off leakage current VCC = 0.0V; VI or VO ≤ 4.5V ±5.0 ±100 ±100 µA Power-up/down 3-state output current3 VCC = 2.0V; VO = 0.5V; VI = GND or VCC; VOE = Don’t care ±5.0 ±50 ±50 µA IOZH 3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or VIH 5.0 50 50 µA IOZL 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or VIH –5.0 –50 –50 µA ICEX Output High leakage current VCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 µA II IOFF IPU/IPD IO Output current1 ICCH ICCL Quiescent supply current ICCZ ∆ICC Additional supply current per input pin2 VCC = 5.5V; VO = 2.5V –40 2.4 2.0 –40 V –100 –180 –180 mA VCC = 5.5V; Outputs High, VI = GND or VCC 0.5 250 250 µA VCC = 5.5V; Outputs Low, VI = GND or VCC 24 30 30 mA VCC = 5.5V; Outputs 3-State; VI = GND or VCC 0.5 250 250 µA Outputs enabled, one input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA Outputs 3-State, one data input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 50 50 µA Outputs 3-State, one enable input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. 3. This parameter is valid for any VCC between 0V and 2.1V with a transition time of up to 10msec. For VCC = 2.1V to VCC = 5V
10%, a transition time of up to 100µsec is permitted. 1998 Jan 16 4 Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 AC CHARACTERISTICS GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω LIMITS SYMBOL PARAMETER Tamb = +25°C VCC = +5.0V WAVEFORM Tamb = –40°C to +85°C VCC = +5.0V ±0.5V Min Typ Max Min Max UNIT tPLH tPHL Propagation delay An to Yn 1 1.0 1.0 2.6 2.9 4.1 4.2 1.0 1.0 4.6 4.6 ns tPZH tPZL Output enable time to High and Low level 2 1.1 2.1 3.1 4.4 4.8 5.9 1.1 2.1 5.3 6.4 ns tPHZ tPLZ Output disable time from High and Low level 2 2.1 1.7 5.1 4.7 6.6 6.2 2.1 1.7 7.1 6.7 ns AC WAVEFORMS VM = 1.5V, VIN = GND to 3.0V 3V 1.5V OEn INPUT 1.5V INPUT tPHL 1.5V Yn OUTPUT VOL TEST CIRCUIT AND WAVEFORMS 7V S1 Open GND 500 Ω Load Circuit TEST S1 tpd open tPLZ/tPZL 7V tPHZ/tPZH open DEFINITIONS Load capacitance includes jig and probe capacitance; CL = see AC CHARACTERISTICS for value. SA00012 1998 Jan 16 VOL + 0.3V VOL VOH VOH – 0.3V SA00206 Waveform 2. Waveforms Showing the 3-State Output Enable and Disable Times Waveform 1. Waveforms Showing the Input (An) to Output (Yn) Propagation Delays CL = 50 pF VM 3.5V 0V SA00028 500 Ω tPHZ tPZH OUTPUT From Output Under Test VM Yn OUTPUT VOH 1.5V tPLZ tPZL 0V tPLH VM VM 5 Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 DIP20: plastic dual in-line package; 20 leads (300 mil) 1998 Jan 16 6 SOT146-1 Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 SO20: plastic small outline package; 20 leads; body width 7.5 mm 1998 Jan 16 7 SOT163-1 Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm 1998 Jan 16 8 SOT339-1 Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm 1998 Jan 16 9 SOT360-1 Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 NOTES 1998 Jan 16 10 Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.  Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. 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     yyyy mmm dd 11 Date of release: 05-96 9397-750-03614