74LVC1G125GW/DG,12

Final Product Change Notification 201203008F01 Issue Date:         13-Jul-2013 Effective Date:    11-Oct-2013 Here’s your personalized quality information concerning products from NXP. For detailed information we invite you to view this notification online Management Summary Final announcement of products processed in PM70 transferred within NXP Nijmegen from ICN6 to ICN8 due to factory closure Change Category Wafer Fab process Wafer Fab materials Wafer Fab location Assembly Process Assembly Materials Assembly Location Product Marking Electrical spec./Test coverage Test Location Design Mechanical Specification Packing/Shipping/Labeling Transfer PM70 process from ICN6 to ICN8 within NXP Nijmegen (The Netherlands) Details of this Change Transfer within NXP Nijmegen (The Netherlands) from ICN6 (PM70 process) to ICN8 (PC125DMB process) - Process and products will be transferred in 2013, production ramp down and closure of ICN6 planned 1 January 2014 - No change in die layout, all masks are produced from the same GDS2 file - No change in ordering code 12NC's and product type number Why do we Implement this Change - Move production to 8" wafers - Capacity increase to address customer demand Identification of Affected Products Applied wafer fab is indicated on the third line of the product marking (top side) first character, if space permits: "U"= NXP ICN6 "T"= NXP ICN8 Product Availability Sample Information Samples are available upon request Requested customer engineering' samples based on the APCN 201203008A will be available type by type. Production Planned first shipment 05-Oct-2013 Impact - No impact - No change in data sheet, form, fit, function, quality or reliability anticipated Data Sheet Revision No impact to existing datasheet Disposition of Old Products Existing inventory will be shipped until depleted Related Notifications Notification Issue DateEffective DateTitle 201203008A27-JunTransfer PM70 process from ICN6 to ICN8 within NXP 2012 Nijmegen (The Netherlands) Timing and Logistics Your acknowledgement of this change, conform JEDEC JESD46 D, is expected till 12-Aug-2013. Contact and Support For all inquiries regarding the ePCN tool application or access issues, please contact NXP "Global Quality Support Team". For all Quality Notification content inquiries, please contact your local NXP Sales Support team. For specific questions on this notice or the products affected please contact our specialist directly: Name Emile Busink Position QA engineering Logic & Smart Analog e-mail address emile.busink@nxp.com At NXP Semiconductors we are constantly striving to improve our product and processes to ensure they reach the highest possible Quality Standards. Customer Focus, Passion to Win. NXP Quality Management Team. About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted unaudited revenue of $4.36 billion in 2012. You have received this email because you are a designated contact or subscribed to NXP’s Quallity Notifications. NXP shall not be held liable if this Notification is not correctly distributed within your organization. This message has been automatically distributed. Please do not reply. View Notification Subscription NXP | Privacy Policy | Terms of Use NXP Semiconductors High Tech Campus, 5656 AG Eindhoven, The Netherlands © 2006-2010 NXP Semiconductors. All rights reserved. Support