BAP55LX_10

BAP55LX Silicon PIN diode Rev. 2 — 16 December 2010 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD882T leadless ultra small plastic SMD package. 1.2 Features and benefits      High speed switching for RF signals Low diode capacitance Low forward resistance Very low series inductance For applications up to 3 GHz 1.3 Applications  RF attenuators and switches 2. Pinning information Table 1. Pin 1 2 Discrete pinning Description cathode anode 1 2 sym006 Simplified outline [1] Symbol Transparent top view [1] The marking bar indicates the cathode. 3. Ordering information Table 2. Ordering information Name BAP55LX Description leadless ultra small plastic package; 2 terminals; body 1  0.6  0.4 mm Version SOD882T Type number Package NXP Semiconductors BAP55LX Silicon PIN diode 4. Marking Table 3. BAP55LX Marking Marking code LC Type number 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF Ptot Tstg Tj Parameter reverse voltage forward current total power dissipation storage temperature junction temperature Tsp = 90 C Conditions Min 65 65 Max 50 100 135 +150 +150 Unit V mA mW C C 6. Thermal characteristics Table 5. Symbol Rth(j-sp) Thermal characteristics Parameter thermal resistance from junction to solder point Conditions Typ 78 Unit K/W 7. Characteristics Table 6. Characteristics Tamb = 25 C unless otherwise specified. Symbol VF IR Cd Parameter forward voltage reverse current diode capacitance Conditions IF = 50 mA VR = 20 V VR = 50 V see Figure 1; f = 1 MHz; VR = 0 V VR = 1 V VR = 20 V rD diode forward resistance see Figure 2; f = 100 MHz; IF = 0.5 mA IF = 1 mA IF = 10 mA IF = 100 mA 3.3 2.2 0.8 0.5 4.5 3.3 1.2 0.8     0.28 0.23 0.18 0.28 pF pF pF Min Typ 0.95 Max 1.1 10 100 Unit V nA nA BAP55LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 2 — 16 December 2010 2 of 9 NXP Semiconductors BAP55LX Silicon PIN diode Table 6. Characteristics …continued Tamb = 25 C unless otherwise specified. Symbol ISL Parameter isolation Conditions see Figure 3; VR = 0 V; f = 900 MHz f = 1800 MHz f = 2450 MHz Lins insertion loss see Figure 4; IF = 0.5 mA; f = 900 MHz f = 1800 MHz f = 2450 MHz Lins insertion loss see Figure 4; IF = 1 mA; f = 900 MHz f = 1800 MHz f = 2450 MHz Lins insertion loss see Figure 4; IF = 10 mA; f = 900 MHz f = 1800 MHz f = 2450 MHz Lins insertion loss see Figure 4; IF = 100 mA; f = 900 MHz f = 1800 MHz f = 2450 MHz L charge carrier life time when switched from IF = 10 mA to IR = 6 mA; RL = 100 ; measured at IR = 3 mA IF = 100 mA; f = 100 MHz 0.225 0.05 0.07 0.08 0.27 dB dB dB s 0.08 0.09 0.10 dB dB dB 0.17 0.18 0.19 dB dB dB 0.24 0.25 0.26 dB dB dB 19 14 12 dB dB dB Min Typ Max Unit LS series inductance - 0.4 - nH BAP55LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 2 — 16 December 2010 3 of 9 NXP Semiconductors BAP55LX Silicon PIN diode 400 Cd (fF) 300 001aag762 102 rD (Ω) 10 001aag763 200 1 100 0 0 5 10 15 VR (V) 20 10−1 10−1 1 10 If (mA) 102 f = 1 MHz; Tj = 25 C. f = 100 MHz; Tj = 25 C. Fig 1. Diode capacitance as a function of reverse voltage; typical values 0 ISL (dB) −10 001aag764 Fig 2. Forward resistance as a function of forward current; typical values 0 Lins (dB) −0.2 (4) (3) 001aag765 (1) (2) −0.4 −20 −0.6 −30 −0.8 −40 0 1000 2000 f (MHz) 3000 −1.0 0 1000 2000 f (MHz) 3000 Tamb = 25 C Diode zero biased and inserted in series with a 50  stripline circuit Tamb = 25 C (1) IF = 100 mA (2) IF = 10 mA (3) IF = 1 mA (4) IF = 0.5 mA Diode inserted in series with a 50  stripline circuit and biased via the analyzer Tee network Fig 3. Isolation of the diode as a function of frequency; typical values Fig 4. Insertion loss of the diode as a function of frequency; typical values BAP55LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 2 — 16 December 2010 4 of 9 NXP Semiconductors BAP55LX Silicon PIN diode 8. Package outline Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm (2 ×) w M SOD882T L1 (2×) A 1 2 b (2 ×) (2 ×) w e1 M B A A1 y E A D (1) B 0 DIMENSIONS (mm are the original dimensions) UNIT mm A 0.40 0.36 A1 max 0.04 b 0.55 0.45 D 0.65 0.55 E 1.05 0.95 e1 0.65 L1 0.30 0.22 w 0.1 y 0.03 0.5 scale 1 mm Note 1. The marking bar indicates the cathode OUTLINE VERSION SOD882T REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-12-14 06-04-12 Fig 5. Package outline SOD882T BAP55LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 2 — 16 December 2010 5 of 9 NXP Semiconductors BAP55LX Silicon PIN diode 9. Abbreviations Table 7. Acronym PIN SMD RF Abbreviations Description P-type, Intrinsic, N-type Surface Mounted Device Radio Frequency 10. Revision history Table 8. Revision history Release date 20101216 Data sheet status Product data sheet Product data sheet Change notice Supersedes BAP55LX v.1 Document ID BAP55LX v.2 Modifications: BAP55LX v.1 • Table 6: added minimum value for “charge carrier life time” 20070730 BAP55LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 2 — 16 December 2010 6 of 9 NXP Semiconductors BAP55LX Silicon PIN diode 11. Legal information 11.1 Data sheet status Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. © NXP B.V. 2010. All rights reserved. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or BAP55LX All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 16 December 2010 7 of 9 NXP Semiconductors BAP55LX Silicon PIN diode NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BAP55LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 2 — 16 December 2010 8 of 9 NXP Semiconductors BAP55LX Silicon PIN diode 13. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description . . . . . . . . . . . . . . . . . . . . . Features and benefits . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 2 5 6 6 7 7 7 7 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 December 2010 Document identifier: BAP55LX