BGS8324
HX
2Q
FN
12
WLAN LNA + Switch
1
Rev. 5 — 11 May 2020
Product data sheet
General description
The BGS8324 is, also known as the WLAN3001H, a fully integrated Low-Noise Amplifier
(LNA), and SP3T switch for Bluetooth path and transmit path. For WLAN applications
in the 2.4 GHz to 2.5 GHz ISM band. The BGS8324 is manufactured using NXPs high
performance QUBiC eighth generation SiGe:C technology. The BGS8324 couples bestin-class noise figure, linearity, and low insertion loss CMOS switches with the process
stability and ruggedness that are the hallmarks of SiGe technology. The BGS8324 has a
2.0 mm × 2.0 mm footprint HX2QFN12 package and a thickness of 300 μm.
2
Features and benefits
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
3
Intended for IEEE 802.11b/g/n WLAN application
Covers full ISM low band 2400 MHz to 2500 MHz
Noise figure = 2 dB
Gain 16 dB
High input 1 dB compression point Pi(1dB) of -6 dBm
High in band IP3i of 7 dBm
Supply voltage 2.7 V to 5.25 V
Stand-by mode current consumption at 8 μA for 3.3 V supply voltage
Optimized performance at a low supply current of 8.3 mA
Integrated concurrent 5 GHz notch filter
5 modes of operation (standby, high gain receive, bypass receive, transmit, and
Bluetooth modes)
Integrated matching for input and output
Requires only one supply decoupling capacitor
ElectroStatic Discharge (ESD) protection on all pins (HBM > 2 kV)
Small 12-pin leadless package 2 mm × 2 mm × 0.3 mm; 0.5 mm pitch
Applications
•
•
•
•
•
IEEE 802.11b/g/n WiFi, WLAN
Smartphones, tablets, netbooks, and other portable computing devices
Access points, routers, gateways
Wireless video
General-purpose Industrial, Scientific, and Medical (ISM) applications
BGS8324
NXP Semiconductors
WLAN LNA + Switch
4
Quick reference data
Table 1. Quick reference data
VCC = 3.3 V; Tamb = 25 °C; 50 Ω load, unless otherwise specified.
Symbol
Parameter
Conditions
RF performance at ANT-RX path in high-gain receive mode
Min
Typ
Max
Unit
-
8.3
12.0
mA
[1]
high-gain receive mode
[1]
ICC
supply current
Gtr
transducer power gain
13.7 16
18
dB
NF
noise figure
-
2
-
dB
Pi(1dB)
input power at 1 dB gain compression
-
-6
-
dBm
RLin
input return loss
-
12
-
dB
RLout
output return loss
-
12
-
dB
-
8
15
μA
-9
-6
-4
dB
-
0.8
-
dB
-
0.95 -
dB
in-band
RF performance at ANT-RX path in bypass receive-mode
ICC
supply current
Gtr
transducer power gain
bypass receive mode
RF performance at ANT-TX path in transmit mode
αins
insertion loss
αins
[1]
[1]
RF performance at ANT-BT path in Bluetooth mode
[1]
[1]
[1]
insertion loss
See Table 9 for the appropriate control signal settings.
5
Ordering information
Table 2. Ordering information
Type
number
Orederable part Package
number
Name
BGS8324
BGS8324Z
6
HX2QFN12
Description
Version
plastic, thermal enhanced super thin quad flat package; SOT1261-1
no leads; 12 terminals; body 2.0 mm x 2.0 mm x 0.3 mm
Marking
Type number
Marking code
BGS8324
24
YWW: Year & Week code
BGS8324
Product data sheet
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2 / 13
BGS8324
NXP Semiconductors
WLAN LNA + Switch
7
Functional diagram
GND
VCC
BT
VBT
LNA_EN
LNA
VRX
RX
ANT
GND
VTX
TX
GND
aaa-020014
Figure 1. Functional diagram
8
Pinning information
8.1 Pinning
ANT
VRX
VBT
BGS8324
terminal 1
index area
12
11
10
VTX
1
9
GND
TX
2
8
BT
GND
3
7
VCC
6
LNA_EN
5
RX
GND
4
aaa-020092
Transparent top view
Figure 2. Pin configuration
8.2 Pin description
Table 3. Pin description
BGS8324
Product data sheet
Symbol
Pin
Description
VTX
1
transmit mode control
TX
2
transmit input
GND
3, 4, 9, exposed die pad
ground
RX
5
receive output
LNA_EN
6
LNA enable
VCC
7
supply voltage
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BGS8324
NXP Semiconductors
WLAN LNA + Switch
9
Symbol
Pin
Description
BT
8
Bluetooth input / output
VBT
10
Bluetooth mode control
VRX
11
receive mode control
ANT
12
antenna input / output
Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
supply voltage
ICC
supply current
VI(VBT)
Conditions
Min
Max
Unit
-0.3
6
V
worst case up to P1dB
-
16
mA
input voltage on pin VBT
see Figure 1
-0.3
+4
V
VI(VRX)
input voltage on pin VRX
see Figure 1
-0.3
+4
V
VI(VTX)
input voltage on pin VTX
see Figure 1
-0.3
+4
V
VI(LNA_EN)
input voltage on pin LNA_EN
-0.3
+4
V
Pi(ANT)
input power-on pin ANT
high-gain receive mode
-
7
dBm
bypass receive mode
-
19
dBm
Pi(TX)
input power-on pin TX
CW; transmit mode
-
33
dBm
Pi(BT)
input power-on pin BT
CW; Bluetooth mode
-
22
dBm
Tamb
ambient temperature
-40
+85
°C
Tj
junction temperature
-40
+150
°C
Tstg
storage temperature
VESD
[1]
[2]
electrostatic discharge voltage
-40
+140
°C
human body model
[1]
-
±2000
V
charged device model
[2]
-
±500
V
According to ANSI/ESDA/JEDEC standard JS-001.
According to JEDEC standard JESD22-C101.
10 Recommended operating conditions
Table 5. Recommended operating conditions
Symbol
Parameter
f
frequency
VCC
supply voltage
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
[1]
Conditions
[1]
Min
Typ
Max
Unit
2400
-
2500
MHz
2.7
3.3
5.25
V
1.8
-
3.6
V
0
-
+0.4
V
VIH is the result of an input voltage on that specific pin between 1.8 V and VCC - 0.2 V and 3.6 V maximum.
BGS8324
Product data sheet
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BGS8324
NXP Semiconductors
WLAN LNA + Switch
11 Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from junction to ambient
Typ
Unit
250
K/W
12 Characteristics
Table 7. DC Characteristics
VCC = 3.3 V; Tamb = 25 °C; 50 Ω load, unless otherwise specified.
Symbol
Parameter
ICC
supply current
Ictrl(LNA_EN)
ton
toff
[1]
[2]
Conditions
Min
Typ
Max
Unit
high-gain receive mode
[1]
-
8.3
12
mA
bypass receive mode
[1]
-
8
15
μA
transmit mode
[1]
-
200
300
μA
Bluetooth mode
[1]
-
8
15
μA
standby mode
[1]
-
8
15
μA
control current on pin LNA_EN
-
20
30
μA
turn-on time
[2]
-
-
500
ns
turn-off time
[2]
-
-
500
ns
See Table 9 for the appropriate control signal settings.
From any of three operating modes to another and from 10 % or 90 % of control signal edge to 90 % output level.
1. See Table 9 for the appropriate control signal settings.
Table 8. RF Characteristics
VCC = 3.3 V; Tamb = 25 °C; 50 Ω load, unless otherwise specified. All measurements done on application board (decoupling
capacitor 100 nF placed near to VCC pin 7) with SMA connectors as reference plane.
Symbol Parameter
Conditions
RF performance at ANT-RX path in high-gain receive mode
Min
Typ
Max
Unit
13.7
16
18
dB
-
-
0.5
dB
-
2.0
-
dB
[1]
Gtr
transducer power gain
Gp(flat)
power gain flatness
NF
noise figure
Pi(1dB)
input power at 1 dB gain compression
in-band
-
-6
-
dBm
IP3i
input third-order intercept point
20 MHz tone spacing; Pi = -20 dBm
-
7
-
dBm
RLin
input return loss
-
12
-
dB
RLout
output return loss
-
12
-
dB
-9
-6
-4
dB
peak-to-peak over any 40 MHz band
RF performance at ANT-RX path in bypass receive-mode
[1]
Gtr
transducer power gain
Gp(flat)
power gain flatness
peak-to-peak over any 40 MHz band
-
-
0.5
dB
Pi(1dB)
input power at 1 dB gain compression
in-band
-
11.5
-
dBm
IP3i
input third-order intercept point
20 MHz tone spacing; Pi = -3 dBm
-
22.5
-
dBm
RLin
input return loss
BGS8324
Product data sheet
9
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dB
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BGS8324
NXP Semiconductors
WLAN LNA + Switch
Symbol Parameter
RLout
Conditions
Min
output return loss
insertion loss
Gp(flat)
power gain flatness
ISL
Max
14
RF performance at ANT-TX path in transmit mode
αins
Typ
Unit
dB
[1]
-
0.8
-
dB
peak-to-peak over any 40 MHz band
-
-
0.2
dB
isolation
measured between pin RX and pin TX
30
-
-
dB
Pi(1dB)
input power at 1 dB gain compression
in-band
-
32
-
dBm
RLin
input return loss
RLout
output return loss
RF performance at ANT-BT path in Bluetooth mode
αins
insertion loss
Gp(flat)
power gain flatness
Pi(1dB)
input power at 1 dB gain compression
RLin
input return loss
RLout
output return loss
15
dB
15
dB
[1]
-
0.95
-
dB
peak-to-peak over any 40 MHz band
-
-
0.2
dB
in-band
-
20
-
dBm
RF performance at ANT-BT path + ANT-RX path in concurrent mode
16
dB
15
dB
[1]
αins
insertion loss
ANT-BT path
-
5
-
dB
Gtr
transducer power gain
ANT-RX path
-
12.5
-
dB
[1]
See Table 9 for the appropriate control signal settings.
12.1 Control signal thruth table
Table 9. Control signal truth table
Other modes than the ones given in this table are not allowed.
Control signal setting
Mode of operation
Mode name
VBT
VRX
VTX
LNA_EN
SP3T switch
pin 10
pin 11
pin 1
pin 6
ANT-RX
ANT-TX
ANT-BT
HIGH
HIGH
LOW
HIGH
ON
OFF
ON
ON
concurrent mode
LOW
HIGH
LOW
HIGH
ON
OFF
OFF
ON
high-gain receive mode
LOW
HIGH
LOW
LOW
ON
OFF
OFF
OFF
bypass receive mode
LOW
LOW
HIGH
LOW
OFF
ON
OFF
OFF
transmit mode
HIGH
LOW
LOW
LOW
OFF
OFF
ON
OFF
Bluetooth mode
LOW
LOW
LOW
LOW
OFF
OFF
OFF
OFF
Standby mode
BGS8324
Product data sheet
LNA
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BGS8324
NXP Semiconductors
WLAN LNA + Switch
13 Application information
bluetooth input/output
100 nF
GND
BT
VCC
VBT
LNA_EN
LNA
VRX
ANT
RX
2.4 GHz receive
GND
VTX
TX
GND
2.4 GHz transmit
aaa-020093
Figure 3. Application diagram
BGS8324
Product data sheet
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BGS8324
NXP Semiconductors
WLAN LNA + Switch
14 Package outline
HX2QFN12: plastic, thermal enhanced super thin quad flat package; no leads;
12 terminals; body 2.0 x 2.0 x 0.3 mm
SOT1261-1
X
B
D
A
terminal 1
index area
E
A
A1
seating plane
e1
e
L1
C
b
4
C A B
C
v
w
6
y1 C
y
L
3
7
e
e2
Eh
1
terminal 1
index area
9
12
k
10
Dh
0
1
Dimensions: (mm are the orginal dimensons)
Unit
mm
A
A1
b
D(1)
max 0.33 0.05 0.25 2.05
nom 0.30 0.02 0.20 2.00
min 0.28 0.00 0.15 1.95
Dh
2 mm
scale
E(1)
1.10 2.05
1.00 2.00
0.85 1.95
Eh
e
e1
e2
1.10
1.00
0.85
0.5
1.0
1.0
k
L
L1
v
w
y
y1
0.35 0.10
0.25 0.25 0.05 0.07 0.05 0.05 0.05
0.20 0.15 0.00
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
SOT1261-1
References
IEC
JEDEC
JEITA
sot1261-1_po
European
projection
Issue date
16-01-14
16-01-15
MO-255
Figure 4. Package outline SOT1261-1 (HX2QFN12)
BGS8324
Product data sheet
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BGS8324
NXP Semiconductors
WLAN LNA + Switch
14.1 Footprint and solder information
Footprint information for reflow soldering of HX2QFN12 package
SOT1261-1
2.5
2.3
1.5
1.4
1.3
0.5
0.5
0.3 0.35
0.3 0.25
0.2 0.25
0.3
2.5 1.3
0.2 0.8
1
1.5
0.25
0.3
0.2
0.8
0.25
occupied area
solder resist
solder lands
solder paste
1
Dimensions in mm
Issue date
14-08-05
16-04-13
sot1261-1_fr
Figure 5. Footprint and solder information
15 Handling information
15.1 Moisture sensitivity
Table 10. Moisture sensitivity level
Test methodology
Class
JESD-22-A113
1
BGS8324
Product data sheet
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BGS8324
NXP Semiconductors
WLAN LNA + Switch
15.2 ElectroStatic Discharge (ESD)
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe
precautions for handling electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5,
JESD625-A or equivalent standards.
16 Abbreviations
Table 11. Abbreviations
Acronym
Description
CMOS
Complementary Metal–Oxide Semiconductor
CW
Continuous Wave
ESD
ElectroStatic Discharge
HBM
Human Body Model
ISM
Industrial, Scientific and Medical
LAN
Local Area Network
LNA
Low-Noise Amplifier
MMIC
Monolithic Microwave Integrated Circuit
SiGe:C
Silicon Germanium Carbon
SMA
SubMiniature version A
SP3T
Single Pole 3 Throw
WLAN
Wireless Local Area Network
17 Revision history
Table 12. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGS8324 v.5
20200511
Product data sheet
CIN
BGS8324 v.4
Modifications:
• added footprint and solder information
• added Orderable part number to the Ordering information table
BGS8324 v.4
20170118
Modifications:
• Section 1: added WLAN3001H according to our new naming convention
BGS8324 v.3
20161215
Modifications:
• Section 6: extended table information
BGS8324 v.2
20160621
Modifications:
• Data sheet status changed from Preliminary data sheet to Product data sheet
BGS8324 v.1
20151221
BGS8324
Product data sheet
Product data sheet
Product data sheet
-
Product data sheet
Preliminary data sheet
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Rev. 5 — 11 May 2020
BGS8324 v.3
BGS8324 v.2
BGS8324 v.1
-
-
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10 / 13
BGS8324
NXP Semiconductors
WLAN LNA + Switch
18 Legal information
18.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
BGS8324
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
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BGS8324
NXP Semiconductors
WLAN LNA + Switch
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
BGS8324
Product data sheet
applications to automotive specifications and standards, customer (a) shall
use the product without NXP Semiconductors’ warranty of the product for
such automotive applications, use and specifications, and (b) whenever
customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
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BGS8324
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WLAN LNA + Switch
Contents
1
2
3
4
5
6
7
8
8.1
8.2
9
10
11
12
12.1
13
14
14.1
15
15.1
15.2
16
17
18
General description ............................................ 1
Features and benefits .........................................1
Applications .........................................................1
Quick reference data .......................................... 2
Ordering information .......................................... 2
Marking .................................................................2
Functional diagram ............................................. 3
Pinning information ............................................ 3
Pinning ............................................................... 3
Pin description ................................................... 3
Limiting values .................................................... 4
Recommended operating conditions ................ 4
Thermal characteristics ......................................5
Characteristics .................................................... 5
Control signal thruth table ................................. 6
Application information ......................................7
Package outline ...................................................8
Footprint and solder information ........................ 9
Handling information .......................................... 9
Moisture sensitivity ............................................ 9
ElectroStatic Discharge (ESD) .........................10
Abbreviations .................................................... 10
Revision history ................................................ 10
Legal information .............................................. 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2020.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 May 2020
Document identifier: BGS8324
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