BGS8358Z

1 BGS8358 +;  62 WLAN LNA + Switch Rev. 4 — 18 January 2017 Product data sheet 1. General description The BGS8358 is, also known as the WLAN3001C, a fully integrated Low Noise Amplifier and SP2T switch for transmit path. For WLAN applications in the 4.9 GHz to 5.925 GHz ISM band. The BGS8358 is manufactured using NXPs high performance QUBiC eighth generation SiGe:C technology. The BGS8358 couples best-in-class noise figure, linearity and low insertion loss CMOS switches with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGS8358 has a 1.5 mm  1.5 mm footprint HX2SON8 package and a thickness of 300 m. 2. Features and benefits                Intended for IEEE 802.11a/n/ac WLAN application Covers full ISM high band 4900 MHz to 5925 MHz Noise figure (NF) = 2.3 dB Gain 12.5 dB High input 1 dB compression point Pi(1dB) of 0 dBm High in band IP3i of 10 dBm Supply voltage 2.7 V to 5.25 V Standby mode current consumption at 8A for 3.3 V supply voltage Integrated concurrent 2.4 GHz notch filter 4 modes of operation (standby, high gain receive, bypass receive and transmit modes) Optimized performance at low supply current of 9.5 mA Integrated matching for input and output Requires only one supply decoupling capacitor ElectroStatic Discharge (ESD) protection on all pins (HBM > 2 kV) Small 8-pin leadless package 1.5 mm  1.5 mm  0.3 mm; 0.4 mm pitch 3. Applications      IEEE 802.11a/n/ac WiFi, WLAN Smartphones, tablets, netbooks and other portable computing devices Access points, routers, gateways Wireless video General-purpose Industrial, Scientific and Medical (ISM) applications BGS8358 NXP Semiconductors WLAN LNA + Switch 4. Quick reference data Table 1. Quick reference data VCC = 3.3 V; Tamb = 25 C; 50  load, unless otherwise specified. Symbol Parameter Conditions RF performance at ANT-RX path in high-gain receive mode Min Typ Max Unit [1] ICC supply current - 9.5 12.5 mA Gtr transducer power gain high-gain receive mode 10 12.5 15 dB NF noise figure - 2.3 - dB Pi(1dB) input power at 1 dB gain compression - 0 - dBm RLin input return loss - 12 - dB RLout output return loss - 10 - dB - 8 15 A 11.5 8 6 dB - 0.75 - dB in-band RF performances at ANT-RX path in bypass receive mode ICC supply current Gtr transducer power gain [1] bypass receive mode RF performance at ANT-TX path in transmit mode [1] ins [1] insertion loss See Table 10 for the appropriate control signal settings 5. Ordering information Table 2. Ordering information Type number Package Name Description Version BGS8358 HX2SON8 plastic, thermal enhanced super thin small outline package; no leads; 8 terminals; body 1.5 x 1.5 x 0.3 mm SOT1260-1 6. Marking Table 3. Marking codes Type number Marking code BGS8358 58 YWW: Year & Week code BGS8358 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 18 January 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 2 of 12 BGS8358 NXP Semiconductors WLAN LNA + Switch 7. Functional diagram 7; 97; *1' 9&& /1$ $17 95; 5; /1$B(1 DDD Fig 1. Functional diagram 8. Pinning information 8.1 Pinning WHUPLQDO LQGH[DUHD %*6 $17   7; 95;   *1' 5;   97; /1$B(1   9&& DDD 7UDQVSDUHQWWRSYLHZ Fig 2. Pin configuration 8.2 Pin description Table 4. BGS8358 Product data sheet Pin description Symbol Pin Description ANT 1 antenna input / output VRX 2 receive mode control RX 3 receive output LNA_EN 4 LNA enable VCC 5 supply voltage All information provided in this document is subject to legal disclaimers. Rev. 4 — 18 January 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 3 of 12 BGS8358 NXP Semiconductors WLAN LNA + Switch Table 4. Pin description …continued Symbol Pin Description VTX 6 transmit mode control GND 7, exposed die pad ground TX 8 transmit input 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage 0.3 6 V ICC supply current worst case up to P1dB - 21 mA VI(VRX) VI(VTX) input voltage on pin VRX see Figure 1 0.3 4 V input voltage on pin VTX see Figure 1 0.3 4 V VI(LNA_EN) input voltage on pin LNA_EN 0.3 4 V Pi(ANT) input power-on pin ANT high gain receive mode - 7 dBm Pi(TX) input power-on pin TX bypass receive mode - 19 dBm CW; transmit mode - 33 dBm Tamb ambient temperature 40 +85 C Tstg storage temperature 40 +150 C Tj junction temperature VESD electrostatic discharge voltage 40 +150 C human body model [1] - 2000 V charged device model [2] - 500 V [1] According to ANSI/ESDA/JEDEC standard JS-001. [2] According to JEDEC standard JESD22-C101. 10. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter f frequency VCC supply voltage VIH HIGH-level input voltage VIL LOW-level input voltage [1] Conditions [1] Min Typ Max Unit 4900 - 5925 MHz 2.7 3.3 5.25 V 1.8 - 3.6 V 0 - +0.4 V VIH is the result of an input voltage on that specific pin between 1.8 V and VCC0.2 V and 3.6 V maximum. 11. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Rth(j-a) thermal resistance from junction to ambient BGS8358 Product data sheet Conditions All information provided in this document is subject to legal disclaimers. Rev. 4 — 18 January 2017 Typ Unit 250 K/W © NXP Semiconductors N.V. 2017. All rights reserved. 4 of 12 BGS8358 NXP Semiconductors WLAN LNA + Switch 12. Characteristics Table 8. DC Characteristics VCC = 3.3 V; Tamb = 25 C; 50  load, unless otherwise specified. All measurements done on application board (decoupling capacitor 100 nF placed near to VCC pin 5) with SMA connectors as reference plane. Symbol Parameter Conditions supply current ICC Min Typ high gain receive mode [1] Max Unit - bypass receive mode [1] - 9.5 12.5 mA 8 15 transmit mode [1] A standby mode [1] - 150 300 A - 8 15 A Ictrl(LNA_EN) control current on pin LNA_EN - 20 30 A ton turn-on time [2] - - 400 ns toff turn-off time [2] - - 400 ns [1] See Table 10 for the appropriate control signal settings. [2] From any of three operating modes to another and from 10 % or 90 % of control signal edge to 90 % output level. Table 9. RF Characteristics VCC = 3.3 V; Tamb = 25 C; 50  load, unless otherwise specified. All measurements done on application board (decoupling capacitor 100 nF placed near to VCC pin 5) with SMA connectors as reference plane. Symbol Parameter Conditions RF performance at ANT-RX path in high-gain receive mode Gtr transducer power gain Gp(flat) power gain flatness NF noise figure Pi(1dB) input power at 1 dB gain compression IP3i input third-order intercept point RLin input return loss RLout output return loss Min Typ Max Unit [1] 10 12.5 15 dB - - 0.5 dB - 2.3 - dB in-band - 0 - dBm 20 MHz tone spacing; Pi = 20 dBm in band - 10 - dBm - 12 - dB - 10 - dB 11.5 8 6 dB peak-to-peak over any 80 MHz band RF performance at ANT-RX path in bypass receive mode [1] Gtr transducer power gain Gp(flat) power gain flatness peak-to-peak over any 80 MHz band - - 0.5 dB Pi(1dB) input power at 1 dB gain compression in-band - 13 - dBm IP3i input third-order intercept point 20 MHz tone spacing; Pi = 3 dBm in band - 27 - dBm RLin input return loss absolute value of the S11 parameter - 8 - dB RLout output return loss absolute value of the S22 parameter - 10 - dB BGS8358 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 18 January 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 5 of 12 BGS8358 NXP Semiconductors WLAN LNA + Switch Table 9. RF Characteristics …continued VCC = 3.3 V; Tamb = 25 C; 50  load, unless otherwise specified. All measurements done on application board (decoupling capacitor 100 nF placed near to VCC pin 5) with SMA connectors as reference plane. Symbol Parameter Conditions RF performance at ANT-TX path in transmit Min Typ Max Unit mode[1] ins insertion loss - 0.75 - dB Gp(flat) power gain flatness peak-to-peak over any 80 MHz band - - 0.2 dB ISL isolation measured between pin RX and pin TX 28 - - dB Pi(1dB) input power at 1 dB gain compression in-band - 32 - dBm RLin input return loss - 15 - dB RLout output return loss - 20 - dB [1] See Table 10 for the appropriate control signal settings. Table 10. Control signal truth table Other modes than the ones given in this table are not allowed. Control signal setting[1] Mode of operation Mode name VRX VTX LNA_EN SP2T switch LNA (pin 2) (pin 6) (pin 4) ANT-RX ANT-TX HIGH LOW HIGH ON OFF ON high-gain receive mode HIGH LOW LOW ON OFF OFF bypass receive mode LOW HIGH LOW OFF ON OFF transmit mode LOW LOW LOW OFF OFF OFF standby mode 13. Application information *+]WUDQVPLW S) 7; *1' 97; 9&& 5; /1$B(1 /1$ $17 95; *+]UHFHLYH DDD Fig 3. BGS8358 Product data sheet Application information All information provided in this document is subject to legal disclaimers. Rev. 4 — 18 January 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 6 of 12 BGS8358 NXP Semiconductors WLAN LNA + Switch 14. Package outline +;621SODVWLFWKHUPDOHQKDQFHGVXSHUWKLQVPDOORXWOLQHSDFNDJHQROHDGV WHUPLQDOVERG\[[PP 627 ; % ' $ $ ( $ VHDWLQJSODQH WHUPLQDO LQGH[DUHD GHWDLO; H Y Z E H & $ % & & \ & H /  \  / WHUPLQDO LQGH[DUHD (K N   'K   VFDOH 'LPHQVLRQVPPDUHWKHRULJLQDOGLPHQVLRQV 8QLW PP $ $ E ' PD[     QRP     PLQ     'K PP (       (K H H      N / / Y Z \ \             1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 2XWOLQH YHUVLRQ 627 Fig 4. 5HIHUHQFHV ,(& -('(& -(,7$ VRWBSR (XURSHDQ SURMHFWLRQ ,VVXHGDWH   02 Package outline SOT1260-1 (HX2SON8) BGS8358 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 18 January 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 7 of 12 BGS8358 NXP Semiconductors WLAN LNA + Switch 15. Handling information 15.1 Moisture sensitivity Table 11. Moisture sensitivity level Test methodology Class JESD-22-A113 1 15.2 ElectroStatic Discharge (ESD) CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 16. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal–Oxide Semiconductor CW Continuous Wave ESD ElectroStatic Discharge HBM Human Body Model ISM Industrial, Scientific and Medical LAN Local Area Network LNA Low-Noise Amplifier MMIC Monolithic Microwave Integrated Circuit SiGe:C Silicon Germanium Carbon SP2T Single Pole 2 Throw WLAN Wireless Local Area Network BGS8358 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 18 January 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 8 of 12 BGS8358 NXP Semiconductors WLAN LNA + Switch 17. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes BGS8358 v.4 20170118 Product data sheet - BGS8358 v.3 Modifications: Section 1 on page 1: added WLAN3001C according to our new naming convention BGS8358 v.3 20161215 Modifications: BGS8358 v.2 Modifications: BGS8358 v.1 BGS8358 Product data sheet • 20161115 • • • • Product data sheet - BGS8358 v.2 - BGS8358 v.1 Table 3 on page 2 extended table information Product data sheet Table 1 on page 2: the typ value for RLout has been changed to 10 dB Table 8 on page 5: the typ value for ICC transmit mode has been changed to 150 A Table 9 on page 5: the typ value for RLout has been changed to 10 dB Table 9 on page 5: the min value for Gtr has been changed to 11.5 dB 20151117 Preliminary data sheet - All information provided in this document is subject to legal disclaimers. Rev. 4 — 18 January 2017 - © NXP Semiconductors N.V. 2017. All rights reserved. 9 of 12 BGS8358 NXP Semiconductors WLAN LNA + Switch 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BGS8358 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 4 — 18 January 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 10 of 12 BGS8358 NXP Semiconductors WLAN LNA + Switch Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BGS8358 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 18 January 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 11 of 12 BGS8358 NXP Semiconductors WLAN LNA + Switch 20. Contents 1 2 3 4 5 6 7 8 8.1 8.2 9 10 11 12 13 14 15 15.1 15.2 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Handling information. . . . . . . . . . . . . . . . . . . . . 8 Moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . 8 ElectroStatic Discharge (ESD) . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2017. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 18 January 2017 Document identifier: BGS8358