HTCICC6403FUG/AM,0

HTCICC64 HITAG µ RO64 transponder IC Rev. 3.2 — 20 October 2014 176432 Product data sheet COMPANY PUBLIC 1. General description The HITAG product line is well known and established in the contactless identification market. Due to the open marketing strategy of NXP Semiconductors there are various manufacturers well established for both the transponder / cards as well as the Read/Write Devices. All of them supporting HITAG transponder IC’s. With the new HITAG µ RO64, NXP is addressing the low end LF market, by offering a preprogrammed, read only IC variant. The advantages of this transponder IC are:  proven HITAG performance  easy to assemble because of mega-bumps  low cost manufacturing because of preprogrammed TTF code The HITAG µ RO64 operates in a continuous TTF mode where it modulates the reader field with it’s preprogrammed 64-bit memory content. 2. Features and benefits 2.1 Features  Integrated circuit for contactless identification transponders and cards  Integrated resonance capacitor of 210 pF with  3% tolerance or 280 pF with 5% tolerance over full production  Frequency range 100 kHz to 150 kHz  64-bit preprogrammed TTF response  10 years data retention 2.2 Delivery types  Sawn, megabumped wafer, 150m, 8 inch, UV HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC 3. Ordering information Table 1. Ordering information Type number Package Name Description Type Version HTCICC6402FUG/AM Wafer sawn, megabumped wafer, 150 m, 8 inch, UV HITAG µ RO64, 210 pF - HTCICC6403FUG/AM Wafer sawn, megabumped wafer, 150 m, 8 inch, UV HITAG µ RO64, 280 pF - HTCICC64 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 © NXP Semiconductors N.V. 2014. All rights reserved. 2 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC 4. Block diagram The HITAG µ RO64 transponder IC requires no external power supply. The contactless interface generates the power supply and the system clock via the resonant circuitry by inductive coupling to the read/write device (RWD). The interface also demodulates data transmitted from the RWD to the HITAG µ RO64 transponder IC, and modulates the magnetic field for data transmission from the HITAG µ RO64 transponder IC to the RWD. Data are stored in a non-volatile memory (EEPROM). ANALOGUE RF INTERFACE DIGITAL CONTROL EEPROM VREG PAD VDD RECT ANTICOLLISION DEMOD READ/WRITE CONTROL data in TRANSPONDER Cres ACCESS CONTROL MOD data out EEPROM INTERFACE CONTROL R/W CLK PAD clock RF INTERFACE CONTROL SEQUENCER CHARGE PUMP 001aai334 Fig 1. HTCICC64 Product data sheet COMPANY PUBLIC Block diagram of HITAG µ RO64 transponder IC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 © NXP Semiconductors N.V. 2014. All rights reserved. 3 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC 5. Pinning information (4) (4) (3) (5) (2) (1) (1) (Y) LA LB (6) (6) (X) 001aaj823 Fig 2. Table 2. HITAG µ RO64 - Mega bumps bondpad locations HITAG µ RO64 - Mega bumps dimensions Description Dimension (X) chip size 550 m (Y) chip size 550 m (1) pad center to chip edge 100.5 m (2) pad center to chip edge 48.708 m (3) pad center to chip edge 180.5 m (4) pad center to chip edge 55.5 m (5) pad center to chip edge 48.508 m (6) pad center to chip edge 165.5 m Bump Size: LA, LB 294  164 m Remaining pads 60  60 m Note: All pads except LA and LB are electrically disconnected after dicing. HTCICC64 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 © NXP Semiconductors N.V. 2014. All rights reserved. 4 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC 6. Functional description 6.1 Memory organization The memory is preprogrammed as shown in Table 3. This data gets continuously sent back as soon as the transponder receives sufficient energy. Table 3. Memory organization HITAG µ RO64 TTF ID7 MSB LSB 1 1 1 1 1 1 1 1 TTF ID6 MSB LSB 1 VBit7 VBit6 VBit5 VBit4 P VBit7-4 VBit3 VBit2 TTF ID5 MSB LSB VBit 1 VBit0 P VBit3-0 DBit31 DBit30 DBit29 DBit28 P DBit31-28 TTF ID4 MSB LSB DBit27 DBit26 DBit25 DBit24 P DBit27-24 DBit23 DBit22 DBit21 TTF ID3 MSB DBit20 LSB P DBit23-20 DBit19 DBit18 DBit17 DBit16 P DBit19-16 DBit15 TTF ID2 MSB DBit14 LSB DBit13 DBit12 P DBit15-12 DBit11 DBit10 DBit9 DBit8 TTF ID1 MSB P DBit11-8 LSB DBit7 DBit6 DBit5 DBit4 P DBit7-4 DBit3 DBit2 TTF ID0 MSB DBit1 LSB DBit0 PDBit3-0 P Column 0: HTCICC64 Product data sheet COMPANY PUBLIC PColumn0 DBit31 DBit27 PColumn1 DBit23 PColumn2 DBit19 All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 DBit15 PColumn3 DBit11 Stopbit DBit7 DBit3 © NXP Semiconductors N.V. 2014. All rights reserved. 5 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC HTCICC64 Product data sheet COMPANY PUBLIC P Column 1: DBit30 DBit26 DBit22 DBit18 DBit14 DBit10 DBit6 DBit2 P Column 2: DBit29 DBit25 DBit21 DBit17 DBit13 DBit9 DBit5 DBit1 P Column 3: DBit28 DBit24 DBit20 DBit16 DBit12 DBit8 DBit4 DBit0 All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 © NXP Semiconductors N.V. 2014. All rights reserved. 6 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC 7. Protocol timing 7.1 HITAG µ RO64 transponder waiting time before transmitting data in TTF mode Fig 3. HITAG µ RO64 transponder waiting time before transmitting data in TTF mode After switching on the powering field, the HITAG µ RO64 transponder waits a time tTTF before transmitting data. HTCICC64 Product data sheet COMPANY PUBLIC Symbol Parameter Min Typ Max Unit tTTF T0 = 1/125 kHz = 8 s 250 304 400 T0 All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 © NXP Semiconductors N.V. 2014. All rights reserved. 7 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC 8. Limiting values Table 4. Limiting values[1][2] In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Tstg storage temperature VESD electrostatic discharge voltage II(max) maximum input current Tj junction temperature Min Max Unit 55 +125 C JEDEC JESD 22-A114-AB Human Body Model 2 - kV IN1-IN2   20 mApeak 40 +85 C [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. [2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions should be taken to avoid applying values greater than the rated maxima 9. Characteristics Table 5. Characteristics Symbol Parameter foper operating frequency II input current VIN1-IN2 input voltage 4 5 6 Vpeak Ci input capacitance between IN1-IN2 VIN1-IN2 = 0.5 Vrms [2][3] 203.7 210 216.3 pF Ci input capacitance between IN1-IN2 VIN1-IN2 = 0.5 Vrms [2][4] 266 280 294 pF [1] Conditions IN1-IN2 Min Typ Max Unit 100 125 150 kHz - -  10 mApeak Typical ratings are not guaranteed. Values are at 25C. [2] Measured with an HP4285A LCR meter at 125 kHz/room temperature (25C) [3] Integrated Resonance Capacitor: 210 pF  3 % [4] Integrated Resonance Capacitor: 280 pF  5% HTCICC64 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 © NXP Semiconductors N.V. 2014. All rights reserved. 8 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC 10. Abbreviations Table 6. HTCICC64 Product data sheet COMPANY PUBLIC Abbreviations Abbreviation Definition AC Anticollision Code ASK Amplitude Shift Keying BC Bi-phase Code BPLC Binary Pulse Length Coding CRC Cyclic Redundancy Check DSFID Data Storage Format Identifier EEPROM Electrically Erasable Programmable Memory EOF End Of Frame ICR Integrated Circuit Reference number LSB Least Significant Bit LSByte Least Significant Byte m Modulation Index MC Manchester Code MFC integrated circuit Manufacturer Code MSB Most Significant Bit MSByte Most Significant Byte MSN Manufacturer Serial Number NA No Access NOB Number Of Block NOP Number Of Pages NOS Number Of Slots NSS Number Of Sensors OTP One Time Programmable PID Product Identifier PWD Password RFU Reserved for Future Use RND Random Number RO Read Only RTF Reader Talks First R/W Read/Write RWD Read/Write Device SOF Start of Frame TTF Transponder Talks First UID Unique Identifier All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 © NXP Semiconductors N.V. 2014. All rights reserved. 9 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC 11. References [1] 1. Application note — AN10214, HITAG Coil Design Guide, Transponder IC BU-ID Doc.No.: 0814**1 ** ... BU ID document version number HTCICC64 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 © NXP Semiconductors N.V. 2014. All rights reserved. 10 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC 12. Revision history Table 7: Revision history Document ID Release date HTCICC64 v. 3.2 20141020 Modifications: 176431 Modifications: 176430 HTCICC64 Product data sheet COMPANY PUBLIC • Change notice Supersedes Product data sheet - 176431 Section 13 “Legal information”: License statement “ICs with HITAG functionality” removed 20090724 • Data sheet status Product data sheet - 176430 - - Section 6.1 “Memory organization”: update Table 3 20090716 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 © NXP Semiconductors N.V. 2014. All rights reserved. 11 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. HTCICC64 Product data sheet COMPANY PUBLIC Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 © NXP Semiconductors N.V. 2014. All rights reserved. 12 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. HITAG — is a trademark of NXP Semiconductors N.V. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com HTCICC64 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 20 October 2014 176432 © NXP Semiconductors N.V. 2014. All rights reserved. 13 of 14 HTCICC64 NXP Semiconductors HITAG µ RO64 transponder IC 15. Tables Table 1. Table 2. Table 3. Table 4. Ordering information . . . . . . . . . . . . . . . . . . . . . .2 HITAG µ RO64 - Mega bumps dimensions . . . .4 Memory organization HITAG µ RO64 . . . . . . . .5 Limiting values[1][2] . . . . . . . . . . . . . . . . . . . . . . .8 Table 5. Table 6. Table 7: Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 16. Figures Fig 1. Fig 2. Block diagram of HITAG µ RO64 transponder IC .3 HITAG µ RO64 - Mega bumps bondpad locations.4 Fig 3. HITAG µ RO64 transponder waiting time before transmitting data in TTF mode . . . . . . . . . . . . . . . 7 17. Contents 1 2 2.1 2.2 3 4 5 6 6.1 7 7.1 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Delivery types . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Memory organization . . . . . . . . . . . . . . . . . . . . 5 Protocol timing . . . . . . . . . . . . . . . . . . . . . . . . . 7 HITAG µ RO64 transponder waiting time before transmitting data in TTF mode . . . . . . . . . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 October 2014 176432