JN5169-001-M03-2Z

JN5169-001-M0x-2 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Rev. 3.0 — 19 September 2016 Product data sheet 1. General description The JN5169-001-M0x-2 (with x = 0, 3 or 6) module family provides designers with a ready-made component that provides a fully integrated solution for applications, using the IEEE802.15.4 standard in the 2.4 GHz - 2.5 GHz ISM frequency band, including ZigBee 3.0 and ZigBee PRO stack with Home Automation, Light Link and Smart Energy profiles. The modules integrate all of the RF components required, removing the need to perform expensive RF design and test. Products can be designed by simply connecting sensors and switches to the module IO pins. The modules use NXP’s single chip IEEE802.15.4 wireless microcontroller, allowing designers to make use of the extensive chip development support material. Hence, this range of modules allows designers to bring wireless applications to market in the minimum time with significantly reduced development effort and cost. 3 variants are available: JN5169-001-M00-2, JN5169-001-M03-2 and JN5169-001-M06-2. All modules have FCC modular approval. The JN5169-001-M00-2 and JN5169-001-M03-2 are also CE-compliant and subject to a Notified Body Opinion. The variants available are described in the Table 1. 1.1 Regulatory Approvals The JN5169-001-M00-2 and JN5169-001-M03-2 have been tested against the requirements of the following European standards. • Radio EN 300 328 v 1.9.1 • EMC, EN 301 489-17 v 2.2.1, EN 62479 2010, EN 301 489-1 v 1.9.2 • Basic Safety Assessment (BSA) EN 60950-1:2006 A Notified Body statement of opinion for this standard is available on request. The High-power module with M06 suffix is not approved for use in Europe. Additionally, both module types have received FCC “Modular Approval”, in compliance with CFR 47 FCC part 15 regulations and in accordance to FCC public notice DA00-1407. The modular approvals notice and test reports are available on request. The JN5169-001-M06-2 module is subject to user proximity restrictions under FCC regulations; more specific information is available in Section 13.1.2. JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 2. Features and benefits 2.1 Benefits      Microminiature module solutions Ready to use in products Minimizes product development time No RF test required for systems Compliant with:  FCC 47CFR Part 15C  ETSI EN 300-328 V1.9  EN 301-489-17 V2.2.1  EN60950-1-2006  Temperature range: 40 C to +85 C  Lead-free and RoHS compliant 2.2 Features: modules  2.4 GHz IEEE 802.15.4, ZigBee 3.0 and ZigBee PRO stack with Home Automation, Light Link and Smart Energy compatible  JN5169-001-M00-2  Dimensions: 16 mm  30 mm  Integrated printed antenna  TX power 8.5 dBm/10 dBm  Receiver sensitivity –96 dBm  TX current 27.2 mA at 10 dBm  TX current 23.6 mA at 8.5 dBm  RX current 17.8 mA at maximum input level 10 dBm  RX current 16.2 mA at maximum input level 0 dBm  2.0 V/3.6 V operation  JN5169-001-M03-2  Dimensions: 16 mm  21 mm  Fl connector  TX power 8.5 dBm/10 dBm  Receiver sensitivity –96 dBm  TX current 27.2 mA at 10 dBm  TX current 23.6 mA at 8.5 dBm  RX current 17.8 mA at maximum input level 10 dBm  RX current 16.2 mA at maximum input level 0 dBm  2.0 V/3.6 V operation  JN5169-001-M06-2  Dimensions: 16 mm  30 mm  Fl connector  TX power 22 dBm  Receiver sensitivity –100 dBm  TX current 181 mA at 22 dBm JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 2 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules  RX current 22.8 mA at maximum input level 10 dBm  2.0 V/3.6 V operation 2.3 Features: microcontroller                  32-bit RISC CPU; 1 MHz to 32 MHz clock speed Variable instruction width for high coding efficiency Multi-stage instruction pipeline 512 kB Flash 32 kB RAM 4 kB EEPROM Data EEPROM with guaranteed 100 k write operations 2-wire I2C-bus compatible serial interface; can operate as either master or slave 5  PWM (4 timers, 1 timer/counter) 2 low-power sleep counters 2 UARTs SPI-bus Master and Slave port, 3 selects Supply voltage monitor with 8 programmable thresholds 6-input 10-bit ADC, comparator Battery and temperature sensors Watchdog and Supply Voltage Monitor (SVM) Up to 20 Digital IO (DIO) pins 3. Applications      Robust and secure low-power wireless applications ZigBee Smart Energy networks ZigBee Home Automation networks Toys and gaming peripherals Energy harvesting - for example, self-powered light switch 4. Overview The JN5169-001-M0x-2 family is a range of ultra-low power, high performance surface mount modules targeted at IEEE 802.15.4, ZigBee 3.0 and ZigBee Home Automation, Light Link and Smart Energy networking applications, enabling users to realize products with minimum time to market and at the lowest cost. They remove the need for expensive and lengthy development of custom RF board designs and test suites. The modules use NXP’s JN5169 wireless microcontroller to provide a comprehensive solution with large memory, high CPU and radio performance and all RF components included. All that is required to develop and manufacture wireless control or sensing products is to connect a power supply and peripherals such as switches, actuators and sensors, considerably simplifying product development. 3 module variants are available: JN5169-001-M00-2 with an integrated printed antenna, JN5169-001-M03-2 and JN5169-001-M06-2 with a FL antenna connector. The JN5169-001-M06-2 also has a power amplifier and LNA for extended range. JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 3 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 5. Ordering information Table 1. Ordering information Type number Description FCCID JN5169-001-M00-2 Standard power, integrated printed antenna XXMJN5169M0V2 JN5169-001-M03-2 Standard power, FL connector XXMJN5169M3V2 JN5169-001-M06-2 High power, FL connector XXMJN5169M6V2 For further details, refer to the Wireless Connectivity area of the NXP web site Ref. 3. 6. Marking aaa-022822 (1) With x = 0, 3 or 6. Fig 1. Table 2. Product data sheet Marking code Line number Marking code Line 1 NXP Logo: B&W outline logo - 2D barcode (internal NXP usage) Line 2 part ID: JN5169-001-M0x-2, with x the module type, 0, 3 or 6 Line 3 serial number: NNNNN Line 4 JN5169M0x JN5169-001-M0x-2 package marking (top view) • • • • • Z: SSMC b: SPIL H: halogen free Y: year WW: week code Line 5 FFC ID = FCCID: XXMJN5169MxV2, with x the module type 0, 3 or 6 Line 6 IC ID = IC: 8764A-JN5169Mx, with x the module type 0, 3 or 6 All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 4 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules JN5169-001-M0x-2 modules meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force on 1 March 2007. 7. Block diagram integrated antenna µFL CONNECTOR external antenna external antenna WATCHDOG TIMER MATCHING M00 option MATCHING 2.4 GHz RADIO INCLUDING DIVERSITY VOLTAGE BROWNOUT PA/LNA SE2431 32-BIT RISC CPU 4kB EEPROM MATCHING POWER MANAGEMENT SPI-BUS MASTER AND SLAVE 2-WIRE SERIAL (MASTER/SLAVE) 4 X PWM PLUS TIMER 2 X UART 20 DIO PLUS 2 DO IEEE802.15.4 MAC ACCELERATOR M06 option XTAL FLASH 512 kB O-QPSK MODEM M03 option µFL CONNECTOR RAM 32 kB SLEEP COUNTER 6 CHAN 10 BIT ADC 128-BIT AES ENCRYPTION ACCELERATOR JN5169 BATTERY AND TEMP SENSORS POWER aaa-022823 Fig 2. Block diagram JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 5 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 8. Pinning information 8.1 Pinning ADC1 1 27 VREF/ADC2 DO0/SPICLK/PWM2 2 26 DIO17/SPISMISO/SIF_D/COMP1M/PWM4 DO1/SPIMISO/PWM3 3 25 DIO16/SPISMISO/SIF_CLK/COMP1P DIO18/SPIMOSI 4 24 DIO15(4) DIO19/SPISEL0 5 23 DIO14(3) DIO0/ADO/SPISEL1/ADC3 6 22 RESET_N DIO1/ADE/SPISEL2/ADC4/PC0 7 21 DIO13(2) DIO2/RFRX/TIM0CK_GT/ADC5 8 20 DIO12(1) VSS 18 VDD 17 DIO10/TIM0OUT/32KXTALOUT 16 DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN 15 DIO7/RXD0/JTAG_TDI/PWM3 13 DIO8/TIM0CK_GT/PC1/PWM4 14 DIO6/TXD0/JTAG_TDO/PWM2 12 DIO5/RTS0/JTAG_TMS/PWM1/PC1 11 19 DIO11/PWM1/TXD1 DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0 10 DIO3/RFTX/TIM0CAP/ADC6 9 Transparent top view aaa-022824 The same basic pin configuration applies for all module designs. However, DIO2 (pin 8) and DIO3 (pin 9) are not available on the JN5169-001-M06-2. (1) Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI. (2) Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO. (3) Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL. (4) Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK. Fig 3. Pin configuration 8.2 Pin description Table 3. Pin description Symbol Pin Type[1] Description ADC1 1 ADC1 — ADC input JN5169M0x Product data sheet I All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 6 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Table 3. Pin description …continued Symbol Pin Type[1] Description DO0/SPICLK/PWM2[2] 2 DO0 — DO0 O SPICLK — SPI-bus master clock output PWM2 — PWM2 output DO1/SPIMISO/PWM3[3] 3 I/O DO1 — DO1 SPIMISO — SPI-bus Master In, Slave Out input PWM3 — PWM3 output DIO18/SPIMOSI 4 I/O DIO18 — DIO18 SPIMOSI — SPI-bus Master Out Slave In output DIO19/SPISEL0 5 I/O DIO19 — DIO19 SPISEL0 — SPI-bus Master Select Output 0 DIO0/ADO/SPISEL1/ADC3 6 I/O DIO0 — DIO0 ADO — antenna diversity odd output SPISEL1 — SPI-bus master select output 1 ADC3 — ADC input: ADC3 DIO1/ADE/SPISEL2/ADC4/PC0 7 I/O DIO1 — DIO1 ADE — antenna diversity even output SPISEL2 — SPI-bus master select output 2 ADC4 — ADC input: ADC4 PC0 — pulse counter 0 input DIO2/RFRX/TIM0CK_GT/ADC5[4] 8 I/O DIO2 — DIO2 RFRX — radio receives control output TIM0CK_GT — timer0 clock/gate input ADC5 — ADC input: ADC5 DIO3/RFTX/TIM0CAP/ADC6[4] 9 I/O DIO3 — DIO3 RFTX — radio transmit control output TIM0CAP — timer0 capture input ADC6 — ADC input: ADC6 DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0 10 I/O DIO4 — DIO4 CTS0 — UART 0 clear to send input JTAG_TCK — JTAG CLK input TIM0OUT — timer0 PWM output PC0 — pulse counter 0 input DIO5/RTS0/JTAG_TMS/PWM1/PC1 11 I/O DIO5 — DIO5 RTS0 — UART 0 request to send output JTAG_TMS — JTAG mode select input PWM1 — PWM1 output PC1 — pulse counter 1 input DIO6/TXD0/JTAG_TDO/PWM2 12 I/O DIO6 — DIO6 TXD0 — UART 0 transmit data output JTAG_TDO — JTAG data output PWM2 — PWM2 data output JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 7 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Table 3. Pin description …continued Symbol Pin Type[1] Description DIO7/RXD0/JTAG_TDI/PWM3 13 DIO7 — DIO7 I/O RXD0 — UART 0 receive data input JTAG_TDI — JTAG data input PWM3 — PWM 3 data output DIO8/TIM0CK_GT/PC1/PWM4 14 I/O DIO8 — DIO8 TIM0CK_GT — timer0 clock/gate input PC1 — pulse counter1 input PWM4 — PWM 4 output DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN 15 I/O DIO9 — DIO9 TIM0CAP — Timer0 Capture input 32KXTALIN — 32 kHz External Crystal input RXD1 — UART1 Receive Data input 32KIN — 32 kHz External clock input DIO10/TIM0OUT/32KXTALOUT 16 I/O DIO10 — DIO10 TIM0OUT — Timer0 PWM Output 32KXTALOUT — 32 kHz External Crystal output VDD 17 P VDD — supply voltage VSS 18 GND ground DIO11/PWM1/TXD1 19 I/O DIO11 — DIO11 PWM1 — PWM1 output TXD1 — UART1 Transmit Data output DIO12[5] 20 I/O DIO12 — DIO12 PWM2 — PWM2 output CTS0 — UART0 clear to send input JTAG_TCK — JTAG CLK input ADO — antenna diversity odd output SPISMOSI — SPI-bus slave Master Out, Slave In input DIO13[6] 21 I/O DIO13 — DIO13 PWM3 — PWM3 output RTS0 — UART0 request to send output JTAG_TMS — JTAG mode select input ADE — antenna diversity even output SPISMISO — SPI-bus slave master in slave out output RESET_N 22 I RESET_N — reset input DIO14[7] 23 I/O DIO14 — DIO14 SIF_CLK — serial interface clock TXD0 — UART 0 transmit data output TXD1 — UART 1 transmit data output JTAG_TDO — JTAG data output SPISEL1 — SPI-bus master select output 1 SPISSEL — SPI-bus slave select input JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 8 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Table 3. Pin description …continued Symbol Pin Type[1] Description DIO15[8] 24 DIO15 — DIO15 I/O SIF_D — serial interface data RXD0 — UART 0 receive data input RXD1 — UART 1 receive data input JTAG_TDI — JTAG data input SPISEL2 — SPI-bus master select output 2 SPISCLK — SPI-bus slave clock input DIO16/SPISMOSI/SIF_CLK/COMP1P 25 I/O DIO16 — DIO16 COMP1P — comparator positive input SIF_CLK — Serial Interface clock SPISMOSI — SPI-bus Slave Master Out Slave In input DIO17/SPISMISO/SIF_D/COMP1M 26 I/O DIO17 — DIO17 COMP1M — COMP1M; comparator negative input SIF_D — Serial Interface Data SPISMISO — SPI-bus Slave Master In Slave Out output PWM4 — PWM 4 output VREF/ADC2 27 P VREF — analog peripheral reference voltage I ADC2 — ADC input 2 [1] P = power supply; G = ground; I = input, O = output; I/O = input/output. [2] JTAG programming mode: must be left floating high during reset to avoid entering JTAG programming mode. [3] UART programming mode: leave pin floating high during reset to avoid entering UART programming mode or hold it low to program. [4] Not available on the JN5169-001-M06-2 since they are used to control the front-end module. [5] Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI. [6] Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO. [7] Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL. [8] Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK. 9. Functional description 9.1 JN5169 single chip wireless microcontroller The JN5169-001-M0x-2 series is constructed around the JN5169-001 single chip wireless microcontroller, which includes the radio system, a 32-bit RISC CPU, Flash, RAM and EEPROM memory and a range of analog and digital peripherals. The chip is described fully in JN5169 Wireless Microcontroller Datasheet (see Ref. 2). JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 9 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 9.2 Peripherals Table 4. Peripherals description Peripherals JN5169-001-M00-2 JN5169-001-M03-2 JN5169-001-M06-2 Notes Master SPI-bus port 3 selects 3 selects 3 selects 250 kHz - 16 MHz Slave SPI-bus port 1 1 1 250 kHz - 4 MHz UART 2 2 2 16550 compatible Two-wire serial I/F (compatible with SMbus and I2C-bus) 1 1 1 Up to 400 kHz timer 4 4 4 timer/counter 1 1 1 Programmable Sleep Timers 2 2 2 32 kHz clock Digital IO lines (multiplexed with UARTs, timers and SPI-bus selects) 20 20 18 DIO2 and DIO3 are not available on JN5169-001-M06-2 modules Analog-to-Digital converter 6 6 6 10-bit, up to 100 ks/s Programmable analog comparator 1 1 1 ultra low-power mode for sleep Internal temperature sensor 1 1 1 Internal battery sensor 1 1 1 PWM 16 MHz clock The performance of all peripherals is defined in the JN5169 Wireless Microcontroller Datasheet (see Ref. 2). NXP supplies all the development tools and networking stacks needed to enable end-product development to occur quickly and efficiently. These are all freely available from the NXP Wireless Connectivity (see Ref. 3). A range of evaluation/developer kits is also available, allowing products to be quickly bread boarded. Efficient development of software applications is enabled by the provision of a complete, unlimited, software developer kit. Together with the available libraries for the IEEE802.15.4 MAC and ZigBee 3.0 and ZigBee PRO network stacks, this package provides everything required to develop application code and to trial it with hardware representative of the final module. The modules can be user programmed both in development and in production using software supplied by NXP. Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This information is available on the NXP support website, together with many example applications, user guides, reference manuals and application notes. JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 10 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 10. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD VVREF/ADC2 Conditions Min Max Unit supply voltage 0.3 +3.6 V voltage on pin VREF/ADC2 0.3 VDD + 0.3 V V VADC1 voltage on pin ADC1 0.3 VDD + 0.3 V V VIO(dig) digital input/output voltage 0.3 VDD + 0.3 V V Tstg storage temperature 40 +150 C 11. Recommended operating conditions Table 6. Symbol Operating conditions Parameter VDD supply voltage Tamb ambient temperature [1] Conditions [1] standard range Min Max Unit 2 3.6 V 40 +85 C To reach the maximum TX power, 2.8 V is the minimum. 12. Characteristics 12.1 DC current Table 7. Active processing VDD = 2 V to 3.6 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions IDD supply current M00 radio in receive mode; maximum input level at 10 dBm radio in receive mode; maximum input level at 0 dBm Min Typ Max Unit - 17.8 - mA - 16.1 - mA radio in transmit mode 10 dBm [1] - 25 - mA radio in transmit mode 8.5 dBm [1] - 22.7 - mA M03 radio in receive mode; maximum input level at 10 dBm - 17.8 - mA radio in receive mode; maximum input level at 0 dBm - 16.1 - mA radio in transmit mode 10 dBm [1] - 25 - mA radio in transmit mode 8.5 dBm [1] - 22.7 - mA - 21.5 - mA - 153 - mA M06 radio in receive mode radio in transmit mode [1] [1] To reach the maximum TX power, VDD = 2.8 V is the minimum. JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 11 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Table 8. Sleep mode VDD = 2 V to 3.6 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IDD(IO) input/output supply current in sleep mode; with I/O and RC oscillator timer wake-up; Tamb = 25 C - 0.73 - A Min Typ Max Unit - 70 - nA Table 9. Deep sleep mode VDD = 2 V to 3.6 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol IDD [1] Parameter Conditions supply current deep sleep mode; measured at 25 C and VDD = 3.3 V [1] Waiting on chip RESET or I/O event. 12.2 AC characteristics 12.2.1 Radio transceiver These modules meet all the requirements of the IEEE802.15.4 standard over 2.0 V to 3.6 V and offers the improved RF characteristics shown in Table 10. All RF characteristics are measured single ended. Table 10. RF port characteristics Single-ended; Impedance = 50 [1]; VDD = 2 V to 3.6 V; Tamb = 40C to +85C; unless otherwise specified. Symbol Parameter frange frequency range [1] Conditions Min Typ Max Unit 2.4 - 2.485 GHz With external matching inductors and assuming PCB layout. Table 11. Radio transceiver characteristics: +25 C VDD = 2 V to 3.6 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 96 - dBm Pi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity; supply current at 17.8 mA - 10 - dBm 1 % PER, measured as sensitivity; supply current at 16.2 mA - 0 - dBm RSSI variation 95 dBm to 10 dBm; available through JN5169M0x Integrated Peripherals API 4 - +4 dB SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 96 - dBm Pi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity; supply current at 17.8 mA - 10 - dBm 1 % PER, measured as sensitivity; supply current at 16.2 mA - 0 - dBm 95 dBm to 10 dBm; available through JN5169M0x Integrated Peripherals API 4 - +4 dB Receiver M00 RSSI M03 RSSI RSSI variation M06 JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 12 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Table 11. Radio transceiver characteristics: +25 C …continued VDD = 2 V to 3.6 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 100 - dBm Pi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity - 5 - dBm RSSI RSSI variation 100 dBm to 25 dBm; available through JN5169M0x Integrated Peripherals API 4 - +4 dB output power IDD = 27.2 mA [1] - 10 - dBm IDD = 23.6 mA [1] - 8.5 - dBm control range output power in 6 major steps and then 4 fine steps [2] - 42 - dB output power IDD = 27.2 mA [1] - 10 - dBm IDD = 23.6 mA [1] - 8.5 - dBm in 6 major steps and then 4 fine steps [2] - 42 - dB [1] - 22 - dBm Transmitter M00 Po Po(cr) M03 Po Po(cr) control range output power M06 Po output power [1] To reach the maximum TX power, 2.8 V is the minimum on VDD. [2] Up to an extra 2.5 dB of attenuation is available if required. 13. Application information 13.1 Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, according to Part 15 of the FCC Rules, see Ref. 4. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: • Reorient or relocate the receiving antenna • Increase the separation between the equipment and receiver • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected • Consult the dealer or an experienced radio/TV technician for help This device complies with Part 15 of the FCC Rules, see Ref. 4. Operation is subject to the following two conditions: 1. This device may not cause harmful interference JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 13 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 2. this device must accept any interference received, including interference that may cause undesired operation FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. Remark: FCC Radiation Exposure Statement: This portable equipment with its antenna complies with FCC’s RF radiation exposure limits set forth for an uncontrolled environment. To maintain compliance, follow the instructions below; 1. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 2. Avoid direct contact to the antenna, or keep it to a minimum while using this equipment. This transmitter module is authorized to be used in other devices only by OEM integrators under the following condition: The transmitter module must not be co-located with any other antenna or transmitter. As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). This applies to the JN5169-001-M00-2 and JN5169-001-M03-2 devices, the JN5169-001-M06-2 is a mobile device (see Section 13.1.2). 13.1.1 Antennas approved by FCC for use with JN5169-001-M0x-2 Table 12. Antennas description (FCC) Brand Model Number Description Gain (dBi) Connector type 1 Aveslink Technology, Inc E-0005-AC vertical- flying lead 2 RP-SMA 2 Aveslink Technology, Inc E-2411-GC vertical - swivel 2 RP-SMA 3 Aveslink Technology, Inc E-2410-CA vertical - bulkhead- flying lead 2 FL 4 Aveslink Technology, Inc E-2410-HA vertical- flying lead 2 FL 5 Aveslink Technology, Inc E-2410-GC vertical - swivel 2 RP-SMA 6 Aveslink Technology, Inc E-2820-CA vertical - bulkhead- flying lead 2 FL 7 Aveslink Technology, Inc E-2820-GC vertical - swivel 2 RP-SMA 8 Embedded Antenna Design FBKR35068-RS-KR vertical - knuckle antenna 2 RP-SMA 9 Nearson S131CL-L-PX-2450S vertical - knuckle-flying lead 2 FL 10 Laird Technologies WRR2400-IP04 vertical - knuckle-flying lead 1.5 FL 11 WRR2400-RPSMA vertical - knuckle-flying lead 1.3 RP-SMA 12 Aveslink Technology, Inc Laird Technologies E-6170-DA vertical - right angle 1 FL 13 Laird Technologies WCR2400-SMRP vertical - knuckle antenna 1 RP-SMA JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 14 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules This device has been designed to operate with the antennas listed above, and having a maximum gain of 2 dBi. Alternative vertical antennas may be used provided that the gain does not exceed 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 . 13.1.2 High-power module usage limitation The high-power module variants are classified as ‘mobile’ device pursuant with FCC § 2.1091 and must not be used at a distance of < 20 cm (8”) from any people. This applies to the JN5169-001-M06-2 module type (XXMJN5169M6V2). Remark: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual for the end product must include the following information in a prominent location; “To comply with FCC’s RF radiation exposure requirements, the antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.” 13.1.3 FCC end product labeling The final ‘end product’ should be labeled in a visible area with the following: “Contains TX FCC ID: XXMJN5169M0V2, XXMJN5169M3V2 or XXMJN5169M6V2” to reflect the version of the module being used inside the product. 13.2 European R&TTE Directive 1999/5/EC statement JN5169-001-M00-2 and JN5169-001-M03-2 are compliant with ETSI EN 300 328 V1.9, EMC, EN 301 489-17 v2.1.1 (2009-02) and the Basic Safety Assessment (BSA) EN 60950-1:2006 (2006-06) and are subject to a Notified Body Opinion. These modules are approved for use with the antennas listed in the following table. The JN5169-001-M06-2 module is not approved for use in Europe. Alternative vertical antennas may be used provided that the gain does not exceed 2 dBi. Table 13. Antennas description (R&TTE) Brand Model Number Description Gain (dBi) Connector type 1 Aveslink Technology, Inc E-0005-AC vertical- flying lead 2 RP-SMA 2 Aveslink Technology, Inc E-2411-GC vertical - swivel 2 RP-SMA 3 Aveslink Technology, Inc E-2410-CA vertical - bulkhead- flying lead 2 FL 4 Aveslink Technology, Inc E-2410-HA vertical- flying lead 2 FL 5 Aveslink Technology, Inc E-2410-GC vertical - swivel 2 RP-SMA JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 15 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Table 13. Antennas description (R&TTE) …continued Brand Model Number Description Gain (dBi) Connector type 6 Aveslink Technology, Inc E-2820-CA vertical - bulkhead- flying lead 2 FL 7 Aveslink Technology, Inc E-2820-GC vertical - swivel 2 RP-SMA 8 Embedded Antenna Design FBKR35068-RS-KR vertical - knuckle antenna 2 RP-SMA 9 Nearson S131CL-L-PX-2450S vertical - knuckle-flying lead 2 FL 10 Laird Technologies WRR2400-IP04 vertical - knuckle-flying lead 1.5 FL 11 WRR2400-RPSMA vertical - knuckle-flying lead 1.3 RP-SMA Laird Technologies 12 Aveslink Technology, Inc E-6170-DA Vertical - right angle 1 FL 13 Laird Technologies WCR2400-SMRP Vertical - knuckle antenna 1 RP-SMA JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 16 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 14. Footprint and PCB placement 14.1 Footprint information for reflow soldering 16 1.27 Ø1 2.54 1.5 2.54 3.30 Dimensions in mm 1 aaa-022825 All modules have the same footprint. Fig 4. Footprint information for reflow soldering of modules 14.2 Optimal PCB placement of the module JN5169-001-M00-2 The JN5169-001-M00-2 module features an optimised, low cost, integrated, inverted F, printed PCB antenna. The antenna has a vertically polarised near omnidirectional radiation pattern and up to 1.6 dBi of peak gain. The PCB design has been elongated in order to increase the ground plane area which increases the antenna efficiency. This allows stand alone operation without any additional ground plane however care must be taken when mounting this module onto another PCB. The area around the antenna must be kept clear of conductors or other metal objects for an absolute minimum of 20 mm. This is true for all layers of the PCB and not just the top layer. Any conductive objects close to the antenna could severely disrupt the antenna pattern resulting in deep nulls and high directivity in some directions. The Figure 5 shows various possible scenarios. The top 3 scenarios are correct; groundplane may be placed beneath JN5169-001-M00-2 modules as long as it does not protrude beyond the edge of the top layer ground plane on the module PCB. The bottom 3 scenarios are incorrect; the left-hand side example because there is groundplane underneath the antenna, the middle example because there is insufficient clearance around the antenna (it is best to have no conductors anywhere near the antenna), finally the right-hand example has a battery’s metal casing in the recommended keep out area. JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 17 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules aaa-024222 Fig 5. PCB placement of the JN5169-001-M00-2 modules 14.3 Reflow Profile For reflow soldering, it is recommended to follow the reflow profile in Figure 6 as a guide, as well as the paste manufacturer’s guidelines on peak flow temperature, soak times, time above liquid and ramp rates. aaa-024461 250 Temperature (°C) 200 150 100 50 0 0 Fig 6. JN5169M0x Product data sheet 20 40 60 80 100 120 140 160 180 200 220 240 260 280 Time (seconds) Guide for reflow profile of JN5169-001-M0x-2 All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 18 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Table 14. Recommended solder reflow profile Temperature range (°C) Target time range (s) from 25 to ~160 between 90 and ~130 from 160 to ~220 between 30 and ~60 from 220 to ~230 between 20 and ~50 from 230 to ~peak between 10 and ~20 from 25 to ~peak between 150 and ~260 14.4 Soldering paste and cleaning NXP does not recommend use of a solder paste that requires the module and PCB assembly to be cleaned (rinsed in water) for the following reasons: • Solder flux residues and water can be trapped by the PCB, can or components and result in short circuits NXP recommends use of a 'no clean' solder paste for all its module products. JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 19 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 15. Package outline 16 30 1.27 2.54 2.54 3.30 Thickness: 3.5 mm Dimensions in mm Fig 7. aaa-022826 Package outline JN5169-001-M00-2 16 10.85 2.53 1.27 21 2.54 2.54 3.30 Thickness: 3.5 mm Dimensions in mm Fig 8. JN5169M0x Product data sheet aaa-022827 Package outline JN5169-001-M03-2 All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 20 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 16 8 2.81 30 1.27 2.54 2.54 3.30 Thickness: 3.5 mm Dimensions in mm Fig 9. aaa-022828 Package outline JN5169-001-M06-2 16. Abbreviations Table 15. JN5169M0x Product data sheet Abbreviations Acronym Description AC Alternating Current ADC Analog-to-Digital Converter API Application Program Interface CE Conformity European CPU Central Processing Unit DC Direct Current DIO Digital Input Output EEPROM Electrically Erasable Programmable Read-Only Memory FCC Federal Communication Commission ID IDentification IO Input Output ISM Industrial, Scientific and Medical radio bands JTAG Joint Test Action Group LNA Low Noise Amplifier All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 21 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Table 15. Abbreviations …continued Acronym Description MAC Media Access Control OEM Original Equipment Manufacturer PC Pulse Counter PCB Printed-Circuit Board PER Packet Error Rate PRO PROtocol PWM Pulse-Width Modulation TX Transmit R&TTE Radio And Terminal Telecommunication Equipment RAM Random Access Memory RC Resistance-Capacitance RF Radio Frequency RISC Reduced Instruction Set Computing RoHS Restriction of Hazardous Substance RSSI Received Signal Strength Indicator RX Receive UART Universal Asynchronous Receiver Transmitter 17. References JN5169M0x Product data sheet [1] IEEE Std 802.15.4-2003 — IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs). [2] JN5169 — JN5169 wireless microcontroller data sheet. [3] Wireless Connectivity — http://www.nxp.com/products/interface-and-connectivity/wireless-connectivity:WIRE LESS-CONNECTIVITY [4] Part 15 of the FCC Rules — http://www.ecfr.gov/cgi-bin/text-idx?SID=d01e00935bfcb0d53b914e7c8e63f383&no de=47:1.0.1.1.16&rgn=div5 All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 22 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 18. Revision history Table 16. Revision history Document ID Release date Data sheet status Change notice Supersedes JN5169-001-M0x-2 v3.0 20160919 Product data sheet - JN5169-001-M0x-2 v2.0 Modifications: • • • • • • • • • • • • • • • Section 1 updated. Section 2 updated. Section 4 updated. Section 6 updated. Figure 2 updated. Figure 3 updated. Table 7 updated. Table 9 updated. Table 11 updated. Table 12 updated. Table 13 updated. Section 14 updated. Section 14.3 added. Section 14.4 added. Section 17 updated. JN5169-001-M0x-2 v2.0 20160530 Preliminary data sheet - JN5169-001-M0x-2 v1.1 JN5169-001-M0x-2 v1.1 20160524 Objective data sheet - JN5169-001-M0x-2 v1.0 JN5169-001-M0x-2 v1.0 20160513 Objective data sheet - - Modifications: JN5169M0x Product data sheet • initial version. All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 23 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 19. Legal information 19.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 19.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. JN5169M0x Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 24 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 25 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 21. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Ordering information . . . . . . . . . . . . . . . . . . . . .4 Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .6 Peripherals description . . . . . . . . . . . . . . . . . .10 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . 11 Operating conditions . . . . . . . . . . . . . . . . . . . . 11 Active processing . . . . . . . . . . . . . . . . . . . . . . 11 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Deep sleep mode . . . . . . . . . . . . . . . . . . . . . . 12 RF port characteristics . . . . . . . . . . . . . . . . . . 12 Radio transceiver characteristics: +25 °C . . . . 12 Antennas description (FCC) . . . . . . . . . . . . . . 14 Antennas description (R&TTE) . . . . . . . . . . . . 15 Recommended solder reflow profile . . . . . . . . 19 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23 22. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. JN5169-001-M0x-2 package marking (top view) . .4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .6 Footprint information for reflow soldering of modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 PCB placement of the JN5169-001-M00-2 modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Guide for reflow profile of JN5169-001-M0x-2 . . .18 Package outline JN5169-001-M00-2 . . . . . . . . . .20 Package outline JN5169-001-M03-2 . . . . . . . . . .20 Package outline JN5169-001-M06-2 . . . . . . . . . .21 JN5169M0x Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 19 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 26 of 27 JN5169-001-M0x-2 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 23. Contents 1 1.1 2 2.1 2.2 2.3 3 4 5 6 7 8 8.1 8.2 9 9.1 9.2 10 11 12 12.1 12.2 12.2.1 13 13.1 General description . . . . . . . . . . . . . . . . . . . . . . 1 Regulatory Approvals . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Benefits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Features: modules . . . . . . . . . . . . . . . . . . . . . . 2 Features: microcontroller . . . . . . . . . . . . . . . . . 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 6 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6 Functional description . . . . . . . . . . . . . . . . . . . 9 JN5169 single chip wireless microcontroller. . . 9 Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 Recommended operating conditions. . . . . . . 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11 DC current . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 AC characteristics. . . . . . . . . . . . . . . . . . . . . . 12 Radio transceiver . . . . . . . . . . . . . . . . . . . . . . 12 Application information. . . . . . . . . . . . . . . . . . 13 Federal Communication Commission Interference Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13.1.1 Antennas approved by FCC for use with JN5169-001-M0x-2 . . . . . . . . . . . . . . . . . . . . . 14 13.1.2 High-power module usage limitation. . . . . . . . 15 13.1.3 FCC end product labeling . . . . . . . . . . . . . . . . 15 13.2 European R&TTE Directive 1999/5/EC statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14 Footprint and PCB placement . . . . . . . . . . . . 17 14.1 Footprint information for reflow soldering . . . . 17 14.2 Optimal PCB placement of the module JN5169-001-M00-2. . . . . . . . . . . . . . . . . . . . . 17 14.3 Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . 18 14.4 Soldering paste and cleaning . . . . . . . . . . . . . 19 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 17 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24 19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24 19.2 19.3 19.4 20 21 22 23 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 24 25 25 26 26 27 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 September 2016 Document identifier: JN5169M0x