IMPORTANT NOTICE
Dear customer,
As from June 1st, 2007 NXP Semiconductors has acquired the LH7xxx ARM Microcontrollers from
Sharp Microelectronics. The following changes are applicable to the attached data sheet. In data
sheets where the previous Sharp or Sharp Corporation references remain, please use the new
links as shown below.
For www.sharpsma.com use www.nxp.com/microcontrollers
for indicated sales addresses use salesaddresses@nxp.com (email)
The copyright notice at the bottom of each page (or elsewhere in the document, depending on the
version)
- Copyright © (year) by SHARP Corporation.
is replaced with:
- © NXP B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via
e-mail or phone (details via salesaddresses@nxp.com). Thank you for your cooperation and
understanding, In addition to that the Annex A (attached hereto) is added to the document.
NXP Semiconductors
LH7A404
32-Bit System-on-Chip
Product data sheet
FEATURES
• Three Programmable Timers
• 32-bit ARM9TDMI™ RISC Core
– 16 kB Cache: 8 kB Instruction and 8 kB Data Cache
– MMU (Windows CE™ Enabled)
– Up to 266 MHz; See Table 1 for speed options
• Three UARTs, one with Classic IrDA (115 kbit/s)
• 80 kB On-Chip Static RAM
• MultiMediaCard Interface with Secure Digital
(MMC 2.11/SD 1.0)
• Vectored Interrupt Controller
• External Bus Interface
– Up to 133 MHz; See Table 1 for bus speed options
– Asynchronous and Synchronous interface RAM,
Flash, PC Card and CompactFlash
• Smart Card Interface (ISO7816)
• Four Pulse Width Modulators (PWMs)
• AC97 Codec Interface
• Smart Battery Monitor Interface
• Real Time Clock (RTC)
• Up to 64 General Purpose I/O Channels
• Clock and Power Management
– 32.768 kHz and 14.7456 MHz Oscillators
– Programmable PLL
• Watchdog Timer
• Programmable LCD Controller
– Up to 1,024 × 768 Resolution
– Supports STN, Color STN, AD-TFT, HR-TFT, TFT
– Up to 64 K-Colors and 15 Gray Shades
• Operating Voltage
– 1.8 V (200 MHz), 2.1 V (266 MHz) Core
– 3.3 V Input/Output (Except XTALIN is 1.8 V)
• JTAG Debug Interface and Boundary Scan
• 9 Channel, 10-bit A/D Converter
– Touch Screen Controller
– Brownout Detector
• DMA (12 Channels)
– External DMA Channels
– AC97
– MMC
– USB
• 5 V Tolerant Digital Inputs (excludes oscillator pins)
– Oscillator pins T19, T20, Y18, Y19: 1.8 V ± 10 %
• Operating Temperature: 40°C to +85°C
• 324-Ball LFBGA Package
DESCRIPTION
• USB 2.0 Full Speed Host (two downstream ports)
• USB 2.0 Full Speed Device
• Synchronous Serial Port (SSP)
– Motorola SPI™, Texas Instruments SSI, National
Semiconductor MICROWIRE™
• On-board Boot ROM
– Variety of Boot Modes: external ROM, NAND
Flash, Serial EEPROM, or XMODEM
• PS/2 Keyboard/Mouse Interface (KMI)
The advent of 3G technology opens up a wide range
of multimedia applications in mobile information appliances. The LH7A404 is designed from the ground up
with a 32-bit ARM922 Core to provide high processing
performance, low power consumption, and a high level
of integration. Features include 80 kB on-chip SRAM,
fully static design, power management unit, low voltage
(1.8 V Core, 3.3 V I/O) and on-chip PLL.
NOTE: Devices containing lead-free solder formulations have different reflow temperatures than leaded-solder formulations.
When using both solder formulations on the same PC board,
designers should consider the effect of different reflow temperatures on the overall PCB assembly process. (Refer to
www.nxp.com for an application note on recommended
soldering practices).
Table 1. LH7A404 Versions
PART NUMBER1
CORE CLOCK BUS CLOCK
LOW POWER CURRENT BY MODE
VERSION
LH7A404-N0F-092-xx2
266 MHz
133 MHz
Run = 228 mA (Typ.); Halt = 60 mA (Typ.);
Standby = 200 A (Typ.)
SOT1021-1
LH7A404-N0F-000-xx2
200 MHz
100 MHz
Run = 147 mA (Typ.); Halt = 41 mA (Typ.);
Standby = 70 A (Typ.)
SOT1021-1
NOTES:
1. Where ‘xx’ is a two digit revision number, e.g. B2; refer to
www.NXP.com for a list of all the active revisions
2. Lead-free part.
Product data sheet
1
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
LH7A404
14.7456 MHz 32.768 kHz
ARM 922T
OSCILLATOR, PLL1
and PLL2, POWER
MANAGEMENT, and
RESET CONTROL
REAL TIME
CLOCK
WATCHDOG
TIMER
BOOT
ROM
ASYNCHRONOUS
MEMORY
CONTROLLER
EXTERNAL
BUS
INTERFACE
PCMCIA/CF
CONTROLLER
VECTORED
INTERRUPT
CONTROLLER
BOOT
CONTROLLER
ADVANCED
PERIPHERAL
BUS BRIDGE
SYNCHRONOUS
MEMORY
CONTROLLER
LCD AHB
BUS
GENERAL
PURPOSE I/O
(64)
SYNCHRONOUS
SERIAL PORT
BATTERY
MONITOR
INTERFACE
UART (3)
IrDA
INTERFACE
80KB
SRAM
USB DEVICE
INTERFACE
COLOR LCD
CONTROLLER
DMA
CONTROLLER
MULTIMEDIACARD/
SECURE DIGITAL
INTERFACE
AC97
ADVANCED
LCD
INTERFACE (ALI)
CODEC
INTERFACE
USB HOST
INTERFACE
ADVANCED
HIGH-PERFORMANCE
BUS (AHB)
TIMER (3)
SMART CARD
INTERFACE
(ISO7816)
ADVANCED
PERPHERAL
BUS (APB)
PWM (2)
A/D
TOUCH SCREEN
CONTROLLER
PS2
KEYBOARD/MOUSE
INTERFACE
DC to DC
INTERFACE (2)
LH7A404-1
Figure 1. LH7A404 Block Diagram
2
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Table 2. LH7A404 Functional Pin List
LFBGA
SIGNAL
DESCRIPTION
RESET
STATE
STANDBY
STATE
OUTPUT
DRIVE I/O NOTES
E10
E11
H10
H11
K5
K8
K13
K16
L5
VDD
I/O Ring Power
VSS
I/O Ring Ground
VDDC
Core Power
L8
L13
L16
N10
N11
T10
T11
U18
J9
J10
J11
J12
K9
K10
K11
K12
L9
L10
L11
L12
M9
M10
M11
M12
T18
E7
E9
E14
G5
G16
P5
P16
T7
T12
T14
Product data sheet
3
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
Table 2. LH7A404 Functional Pin List (Cont’d)
LFBGA
SIGNAL
DESCRIPTION
RESET
STATE
STANDBY
STATE
OUTPUT
DRIVE I/O NOTES
E6
E15
F5
F16
J16
M5
VSSC
Core Ground
VDDA
Analog Power for PLL1 and PLL2
VSSA
Analog Ground for PLL1 and PLL2
R5
R16
T6
T15
Y17
W17
V16
U15
W16
VDDAD
Analog Power for A/D, Touch Screen Controller
V13
VSSAD
Analog Ground for A/D, Touch Screen Controller
D2
nPOR
Power on Reset
Input
Input
I
3
E1
nURESET
User Reset
Input
Input
I
3
F3
WAKEUP
Wake Up
Input
Input
I
3
F4
nPWRFL
Power Fail Signal
Input
Input
I
3
C1
nEXTPWR
External Power
Input
Input
I
3
C5
nRESETOUT
Reset Output to external devices. This pin carries the
same state as the internal SoC reset signal.
LOW
Y18
XTALIN
Y19
XTALOUT
T19
XTAL32IN
T20
XTAL32OUT
L2
4
12 mA
O
14.7456 MHz Crystal Oscillator pins. For an external
clock source, XTALIN can be used while XTALOUT is
left unconnected. XTALIN voltage is 1.8 V nominal.
32.768 kHz Real Time Clock, Crystal Oscillator pins.
To drive the device from an external clock source,
XTAL32IN can be used while XTAL32OUT is left
unconnected.
PGMCLK
Programmable Clock (14.7456 MHz MAX.)
LOW
LOW
8 mA
O
T16
CLKEN
External Oscillator Enable Output
LOW
LOW
8 mA
I/O
Y13
WIDTH0
Input
Input
I
3
W13
WIDTH1
Boot Width Pins. Used with the MEDCHG and INTBOOT bits for internal Boot ROM. On power up, the
values on these pins are latched to determine the
width and type of Boot device. Boot width can be 8-,
16-, or 32-bit. The pins must be pulled HIGH with a 33
k resistor.
3
E4
MEDCHG
Media Change bit; used at power on with INTBOOT
and WIDTHx pins to determine boot device.
Input
No Change
I
Y20
INTBOOT
When LOW, boot device is selected according to the
MEDCHG bit. When HIGH, the lower 64 kB addresses are mapped to the internal Boot ROM.
Input
No Change
I
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Table 2. LH7A404 Functional Pin List (Cont’d)
LFBGA
RESET
STATE
STANDBY
STATE
Data Bus
LOW
LOW
12 mA
I/O
Asynchronous Address Bus
HIGH
LOW
12 mA
O
SIGNAL
N19
D0
P20
D1
N18
D2
N20
D3
M16
D4
M18
D5
L18
D6
L17
D7
L19
D8
J19
D9
K17
D10
J18
D11
H19
D12
G20
D13
G19
D14
H17
D15
F19
D16
E20
D17
E19
D18
D20
D19
E18
D20
C20
D21
D18
D22
B20
D23
C18
D24
A20
D25
B18
D26
C16
D27
B17
D28
A18
D29
A17
D30
B15
D31
P17
A0
N16
A1
Product data sheet
DESCRIPTION
OUTPUT
DRIVE I/O NOTES
5
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
Table 2. LH7A404 Functional Pin List (Cont’d)
LFBGA
6
SIGNAL
N17
A2/SA0
M19
A3/SA1
M20
A4/SA2
L20
A5/SA3
M17
A6/SA4
K18
A7/SA5
K20
A8/SA6
K19
A9/SA7
J20
A10/SA8
H20
A11/SA9
J17
A12/SA10
H18
A13/SA11
RESET
STATE
STANDBY
STATE
Asynchronous Address Bus and
Synchronous Address Bus
LOW
LOW
12 mA
O
DESCRIPTION
OUTPUT
DRIVE I/O NOTES
F20
A14/SA12
G18
A15/SA13
H16
A16/SB0
• Asynchronous Address Bus
• Synchronous Device Bank Address 0
LOW
LOW
12 mA
O
F18
A17/SB1
• Asynchronous Address Bus
• Synchronous Device Bank Address 1
LOW
LOW
12 mA
O
G17
A18
F17
A19
Asynchronous Address Bus
LOW
LOW
12 mA
O
D19
A20
E17
A21
LOW
LOW
12 mA
O
C19
A22
LOW
LOW
12 mA
O
Asynchronous Address Bus
D17
A23
B19
A24
A16
A25
D15
A26
B14
A27
V18
nCS0
Asynchronous Memory Chip Select 0
HIGH
HIGH
12 mA
O
R19
nCS1
Asynchronous Memory Chip Select 1
HIGH
HIGH
12 mA
O
R18
nCS2
Asynchronous Memory Chip Select 2
HIGH
HIGH
12 mA
O
Asynchronous Address Bus
4
P19
nCS3
Asynchronous Memory Chip Select 3
HIGH
HIGH
12 mA
O
R20
nCS6
Asynchronous Memory Chip Select 6
HIGH
No Change
12 mA
O
R17
nCS7
Asynchronous Memory Chip Select 7
HIGH
No Change
12 mA
O
C12
nOE
Asynchronous Memory Output Enable
HIGH
HIGH
12 mA
O
12 mA
O
4
I
5
D12
nWE
Asynchronous Memory Write Enable
HIGH
HIGH
P18
nWAIT
Asynchronous Memory Wait; pull HIGH if unused
Input
No Change
C17
nSCS0
Synchronous Memory Chip Select 0
HIGH
HIGH
12 mA
I/O
A19
nSCS1
Synchronous Memory Chip Select 1
HIGH
HIGH
12 mA
I/O
D16
nSCS2
Synchronous Memory Chip Select 2
HIGH
HIGH
12 mA
I/O
E16
nSCS3
Synchronous Memory Chip Select 3
HIGH
HIGH
12 mA
I/O
B16
nSWE
Synchronous Memory Write Enable
HIGH
HIGH
12 mA
O
A14
SCKE0
Clock Enable 0 for Synchronous Memory
HIGH
No Change
12 mA
O
B13
SCKE1_2
Clock Enable 1 OR 2 for Synchronous Memory
HIGH
No Change
12 mA
O
4
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Table 2. LH7A404 Functional Pin List (Cont’d)
LFBGA
C14
SIGNAL
SCKE3
DESCRIPTION
Clock Enable 3 for Synchronous Memory
RESET
STATE
STANDBY
STATE
Depends on
MEDCHG
LOW
OUTPUT
DRIVE I/O NOTES
12 mA
I/O
D14
SCLK
Synchronous Memory Clock
LOW
No Change
20 mA
I/O
A13
nBLE0
Byte Lane Enable 0
HIGH
HIGH
12 mA
I/O
U9
nBLE1
Byte Lane Enable 1
HIGH
HIGH
12 mA
O
Y7
nBLE2
Byte Lane Enable 2
HIGH
HIGH
12 mA
O
C13
nBLE3
Byte Lane Enable 3
HIGH
HIGH
8 mA
O
C15
nCAS
Synchronous Memory Column Address Strobe
HIGH
HIGH
12 mA
I/O
Synchronous Memory Row Address Strobe
HIGH
HIGH
12 mA
I/O
Data Mask for Synchronous Memories
HIGH
No Change
12 mA
O
A15
nRAS
D13
DQM0
E13
DQM1
B12
DQM2
A12
DQM3
M2
PA0/
LCDVD16
• GPIO Port A0
• LCD Data pin 16
PA0: Input
No Change
8 mA
I/O
L4
PA1/
LCDVD17
• GPIO Port A1
• LCD Data pin 17
PA1: Input
No Change
8 mA
I/O
M3
PA2
M4
PA3
M1
PA4
GPIO Port A[6:2]
PAx: Input
No Change
8 mA
I/O
N3
PA5
N2
PA6
N1
PA7
• GPIO Port A7
• Boot Width Selection (See Table 6)
PA7: Input
No Change
8 mA
I/O
N4
PB0/UARTRX1
• GPIO Port B0
• UART1 Receive Data Input
PB0: Input
No Change
8 mA
I/O
P3
PB1/UARTTX3
• GPIO Port B1
• UART3 Transmit Data Out
PB1: Input
No Change
8 mA
I/O
P2
PB2/UARTRX3
• GPIO Port B2
• UART3 Receive Data In
PB2: Input
No Change
8 mA
I/O
P1
PB3/UARTCTS3
• GPIO Port B3
• UART3 Clear to Send
PB3: Input
No Change
8 mA
I/O
R3
PB4/UARTDCD3
• GPIO Port B4
• UART3 Data Carrier Detect
PB4: Input
No Change
8 mA
I/O
N5
PB5/UARTDSR3
• GPIO Port B5
• UART3 Data Set Ready
PB5: Input
No Change
8 mA
I/O
R2
PB6/SWID/SMBD
• GPIO Port B6
• Single Wire Data
• Smart Battery Data
PB6: Input
No Change
8 mA
I/O
R1
PB7/SMBCLK
• GPIO Port B7
• Smart Battery Clock
PB7: Input
No Change
8 mA
I/O
P4
PC0/UARTTX1
• GPIO Port C0
• UART1 Transmit Data Output
PC0: LOW
No Change
12 mA
I/O
T1
PC1
T2
PC2
T3
PC3
GPIO Port C[5:1]
PCx: LOW
No Change
12 mA
I/O
R4
PC4
U1
PC5
U2
PC6
GPIO Port C6
PC6: LOW
No Change
12 mA
I/O
Product data sheet
2
4
4
7
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
Table 2. LH7A404 Functional Pin List (Cont’d)
LFBGA
8
RESET
STATE
STANDBY
STATE
PC7: LOW
No Change
12 mA
I/O
PDx: LOW
LOW if
8-bit LCD
enabled; else
No Change
12 mA
I/O
• GPIO Port E[3:0]
• LCD Video Data Interface
PEx: Output
LOW if
8-bit LCD
enabled; else
No Change
12 mA
I/O
SIGNAL
V1
PC7
Y11
PD0/LCDVD8
U10
PD1/LCDVD9
W12
PD2/LCDVD10
V11
PD3/LCDVD11
W11
PD4/LCDVD12
U11
PD5/LCDVD13
V12
PD6/LCDVD14
Y12
PD7/LCDVD15
DESCRIPTION
GPIO Port C7
• GPIO Port D[7:0]
• LCD Video Data Interface
OUTPUT
DRIVE I/O NOTES
Y9
PE0/LCDVD4
W10
PE1/LCDVD5
V10
PE2/LCDVD6
T9
PE3/LCDVD7
D4
PE4/SCCLKIN
• GPIO Port E4
• Smart Card Push-Pull Mode Clock Input
PE4: Output
No Change
12 mA
I/O
C3
PE5/SCCLKEN
• GPIO Port E5
• Smart Card Push-Pull Mode External Clock
Buffer Enable
PE5: Output
No Change
12 mA
I/O
B2
PE6/SCIN
• GPIO Port E6
• Smart Card Push-Pull Mode Data Input
PE6: Output
No Change
12 mA
I/O
A1
PE7/SCDATEN
• GPIO Port E7
• Smart Card Push-Pull Mode Data Out External
Buffer Enable
PE7: Output
No Change
12 mA
I/O
A9
PF0/INT0
• GPIO Port F0
• Interrupt 0
PF0: Input
No Change
8 mA
I/O
3
D9
PF1/INT1
• GPIO Port F1
• Interrupt 1
PF1: Input
No Change
8 mA
I/O
3
A8
PF2/INT2
• GPIO Port F2
• Interrupt 2
PF2: Input
No Change
8 mA
I/O
3
C8
PF3/INT3
• GPIO Port F3
• Interrupt 3
PF3: Input
No Change
8 mA
I/O
3
B8
PF4/INT4
• GPIO Port F4
• Interrupt 4
PF4: Input
No Change
8 mA
I/O
3
D8
PF5/INT5/
SCDETECT
• GPIO Port F5
• Interrupt 5
• Smart Card Interface Card Detect Signal
PF5: Input
No Change
8 mA
I/O
3
A7
PF6/INT6/
PCRDY1
• GPIO Port F6
• Interrupt 6
• Ready for Card 1 for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode
PF6: Input
No Change
8 mA
I/O
3
E8
PF7/INT7/PCRDY2
• GPIO Port F7
• Interrupt 7
• Ready for Card 2 for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode
PF7: Input
No Change
8 mA
I/O
3
Y2
PG0/nPCOE
• GPIO Port G0
• Output Enable for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode
LOW
No Change
8 mA
I/O
W4
PG1/nPCWE
• GPIO Port G1
• Write Enable for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode
LOW
No Change
8 mA
I/O
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Table 2. LH7A404 Functional Pin List (Cont’d)
LFBGA
SIGNAL
DESCRIPTION
RESET
STATE
STANDBY
STATE
OUTPUT
DRIVE I/O NOTES
Y3
PG2/nPCIOR
• GPIO Port G2
• I/O Read Strobe for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode
LOW
No Change
8 mA
I/O
U5
PG3/nPCIOW
• GPIO Port G3
• I/O Write Strobe for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode
LOW
No Change
8 mA
I/O
T5
PG4/nPCREG
• GPIO Port G4
• Register Memory Access for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode
LOW
No Change
8 mA
I/O
PG5/nPCCE1
• GPIO Port G5
• Card Enable 1 for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode. This
signal and nPCCE2 are used by the PC Card for
decoding low and high byte accesses.
LOW
No Change
8 mA
I/O
Y4
PG6/nPCCE2
• GPIO Port G6
• Card Enable 2 for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode. This
signal and nPCCE1 are used by the PC Card for
decoding low and high byte accesses.
LOW
No Change
8 mA
I/O
W6
PG7/PCDIR
• GPIO Port G7
• Direction for PC Card (PCMCIA or CompactFlash)
in Single or Dual Card mode
LOW
No Change
8 mA
I/O
V6
PH0/PCRESET1
• GPIO Port H0
• Reset Card 1 for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode
PHx: Input
No Change
8 mA
I/O
PH1/CFA8/
PCRESET2
• GPIO Port H1
• Address Bit 8 for PC Card (CompactFlash) in
Single Card mode
• Reset Card 2 for PC Card (PCMCIA or
CompactFlash) in Dual Card mode
PHx: Input
No Change
8 mA
I/O
PH2/nPCSLOTE1
• GPIO Port H2
• Enable Card 1 for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode. This
signal is used for gating other control signals to the
appropriate PC Card.
PHx: Input
No Change
8 mA
I/O
U6
PH3/CFA9/
PCMCIAA25/
nPCSLOTE2
• GPIO Port H3
• Address Bit 9 for PC Card (CompactFlash) in Single
Card mode
• Address Bit 25 for PC Card (PCMCIA) in
Single Card mode
• Enable Card 2 for PC Card (PCMCIA or
CompactFlash) in Dual Card mode. Used for gating
other control signals to the appropriate PC Card.
PHx: Input
No Change
8 mA
I/O
W8
PH4/nPCWAIT1
• GPIO Port H4
• WAIT Signal for Card 1 for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode
PHx: Input
No Change
8 mA
I/O
Y6
PH5/CFA10/
PCMCIAA24/
nPCWAIT2
• GPIO Port H5
• Address Bit 10 for PC Card (CompactFlash) in Single Card mode
• Address Bit 24 for PC Card (PCMCIA) in Single
Card mode
• WAIT Signal for Card 2 for PC Card (PCMCIA or
CompactFlash) in Dual Card mode
PHx: Input
No Change
8 mA
I/O
V7
PH6/nAC97RESET
• GPIO Port H6
• AC97 Reset
PHx: Input
No Change
8 mA
I/O
W5
Y5
W7
Product data sheet
9
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
Table 2. LH7A404 Functional Pin List (Cont’d)
LFBGA
SIGNAL
DESCRIPTION
RESET
STATE
STANDBY
STATE
OUTPUT
DRIVE I/O NOTES
PHx: Input
No Change
8 mA
I/O
U7
PH7/
nPCSTATRE
• GPIO Port H7
• Status Read Enable for PC Card (PCMCIA or
CompactFlash) in Single or Dual Card mode
T4
LCDFP/LCDSPS
• LCD Frame Pulse
• ALI Reset Row Driver Counter
LOW
LOW if not in
ALI mode
12 mA
O
V2
LCDLP/
LCDHRLP
• LCD Linepulse
• ALI Latch Pulse
LOW
LOW if not in
ALI mode
12 mA
O
U3
LCDCLS
ALI Clock for Row Drivers
LOW
No Change
12 mA
O
V3
LCDSPL
ALI Start Pulse Left for reverse scanning
LOW
No Change
12 mA
O
U4
LCDUBL
ALI Up, Down signal for reverse scanning
LOW
No Change
12 mA
O
W1
LCDSPR
ALI Start Pulse Right for normal scanning
LOW
No Change
12 mA
O
V4
LCDLBR
ALI Output for reverse scanning
HIGH
No Change
12 mA
O
W2
LCDMOD
ALI MOD Signal used by the row driver
LOW
No Change
12 mA
O
V5
LCDPS
ALI Power Save
HIGH
No Change
12 mA
O
Y1
LCDVDDEN
ALI Power Sequence Control
LOW
No Change
12 mA
O
W3
LCDREV
ALI Reverse
HIGH
No Change
12 mA
O
U8
LCDCLKIN
External Clock Input for LCD controller
Input
No Change
V8
LCDVD0
T8
LCDVD1
W9
LCDVD2
LCD Video Data Interface
LOW
LOW
12 mA
O
Y8
LCDVD3
V9
LCDENAB/
LCDM
• LCD TFT Data Enable
• LCD STN AC Bias
LOW
LOW
12 mA
O
I
Y10
LCDDCLK
LCD Pixel Clock
LOW
LOW
12 mA
O
U17
USBDCP
USB Device Full Speed Pull-up Resistor Control
Input
Input
12 mA
I
U20
USBDP
USB Device Data Positive (Differential Pair)
Input
Input
12 mA
I/O
U19
USBDN
USB Device Data Negative (Differential Pair)
Input
Input
12 mA
I/O
W19
USBHDP0
USB Data Host Positive 0 (Differential Pair)
Input
HIGH
12 mA
I/O
W20
USBHDN0
USB Data Host Negative 0 (Differential Pair)
Input
LOW
12 mA
I/O
V19
USBHDP1
USB Data Host Positive 1 (Differential Pair)
Input
Input
12 mA
I/O
V20
USBHDN1
USB Data Host Negative 1 (Differential Pair)
Input
Input
12 mA
I/O
USBHPWR
USB Host Power; This pin is connected to the remote
USB Host Power Switch’s Enable pin. In response to
a fault condition, signalled on the nUSBHOVRCURR
pin, the LH7A404 can assert this pin, which causes
the power switch shut down.
LOW
No Change
12 mA
O
V17
nUSBHOVRCURR
USB Host Overcurrent; The overcurrent input is used
to indicate to the host a fault has occurred, resulting in
current limiting. The LH7A404 can be programmed to
cause the remote power switch to shut off by asserting USBHPWR in response to an nUSBHOVRCURR
assertion.
Input
Input
12 mA
I
D11
nPWME0
DC-DC Converter 0 PWM 0 Enable
Input
Input
8 mA
I/O
A10
nPWME1
DC-DC Converter 1 PWM 1 Enable
Input
Input
8 mA
I/O
C11
PWM0
DC-DC Converter 0 Output (Pulse Width Modulated)
LOW
Input
8 mA
I/O
T17
C10
PWM1
DC-DC Converter 1 Output (Pulse Width Modulated)
LOW
Input
8 mA
I/O
B9
PWM2
PWM Output 2
LOW
No Change
8 mA
O
D10
PWM3
PWM Output 3
LOW
No Change
C9
PWMSYNC
PWM Synchronizing Input for PWM2
Input
No Change
10
O
8 mA
I
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Table 2. LH7A404 Functional Pin List (Cont’d)
LFBGA
SIGNAL
DESCRIPTION
RESET
STATE
STANDBY
STATE
OUTPUT
DRIVE I/O NOTES
C7
ACBITCLK
• Audio Codec (AC97) Clock
• Audio Codec (ACI) Clock
Input
No Change
8 mA
I/O
B7
ACOUT
• Audio Codec (AC97) Output
• Audio Codec (ACI) Output
LOW
LOW
8 mA
O
A6
ACSYNC
• Audio Codec (AC97) Synchronization
• Audio Codec (ACI) Synchronization
LOW
LOW
8 mA
O
B6
ACIN
• Audio Codec (AC97) Input
• Audio Codec (ACI) Input
Input
No Change
8 mA
I/O
A5
MMCCLK
MultiMediaCard Clock (20 MHz MAX.)
LOW
LOW
8 mA
I/O
D7
MMCCMD
MultiMediaCard Command
Input
Input
8 mA
I/O
C6
MMCDATA0
MultiMediaCard Data 0
Input
Input
8 mA
I/O
B5
MMCDATA1
MultiMediaCard Data 1
Input
Input
8 mA
I/O
A4
MMCDATA2
MultiMediaCard Data 2
Input
Input
8 mA
I/O
B4
MMCDATA3
MultiMediaCard Data 3
Input
Input
8 mA
I/O
F2
UARTCTS2
UART2 Clear to Send Signal
Input
Input
8 mA
I/O
F1
UARTDCD2
UART2 Data Carrier Detect Signal
Input
Input
8 mA
I/O
G2
UARTDSR2
UART2 Data Set Ready Signal
Input
Input
8 mA
I/O
G3
UARTIRTX1
IrDA Transmit
LOW
No Change
8 mA
I/O
G1
UARTIRRX1
IrDA Receive
Input
Input
8 mA
I/O
H2
UARTTX2
UART2 Transmit Data Output
HIGH
No Change
8 mA
I/O
G4
UARTRX2
UART2 Receive Data Input
Input
Input
8 mA
I/O
K3
SSPCLK
Synchronous Serial Port Clock
LOW
LOW
8 mA
O
L1
SSPRX
Synchronous Serial Port Receive
Input
Input
8 mA
I/O
L3
SSPTX
Synchronous Serial Port Transmit
Input
Input
8 mA
I/O
K4
SSPFRM
Synchronous Serial Port Frame Sync
HIGH
HIGH
8 mA
O
J2
COL0
H4
COL1
H5
COL2
J1
COL3
J3
COL4
Keyboard Interface
HIGH
HIGH
8 mA
I/O
J4
COL5
J5
COL6
Battery OK
Input
Input
K2
COL7
E2
BATOK
I
3
I
3
D1
nBATCHG
Battery Change
Input
Input
U12
BATCNTL
Battery Control for A/D controller battery monitor
LOW
No Change
H1
KMIDAT
Keyboard/Mouse Data
Input
No Change
12 mA
I/O
H3
KMICLK
Keyboard/Mouse Clock
Input
No Change
12 mA
I/O
K1
TBUZ
Timer Buzzer Output (254 kHz MAX.)
LOW
LOW
8 mA
I/O
Y16
AN0/UL/X+
• ADC channel 0
• Touch Screen Controller Upper Left
• Touch Screen Controller X-plus
Input
Input
I
Y15
AN1/UR/X-
• ADC channel 1
• Touch Screen Controller Upper Right
• Touch Screen Controller X-minus
Input
Input
I
W14
AN2/LL/Y+
• ADC channel 2
• Touch Screen Controller Lower Left
• Touch Screen Controller Y-plus
Input
Input
I
Product data sheet
12 mA
O
11
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
Table 2. LH7A404 Functional Pin List (Cont’d)
LFBGA
SIGNAL
DESCRIPTION
RESET
STATE
STANDBY
STATE
OUTPUT
DRIVE I/O NOTES
U13
AN3/LR/Y-
• ADC channel 3
• Touch Screen Controller Lower Right
• Touch Screen Controller Y-minus
Input
Input
I
V14
AN4/WIPER
• ADC channel 4
• Wiper input from 5-wire Touch Screen
Input
Input
I
U14
VSS or VSSA
Connect pin to either VSS or VSSA
Input
Input
I
V15
AN6
ADC channel 6
Input
Input
I
W15
AN7
ADC channel 7
Input
Input
I
T13
AN8
ADC channel 8
Input
Input
I
Y14
AN9
ADC channel 9
Input
Input
I
E12
SCIO
Smart Card Interface I/O
LOW
LOW
12 mA
I/O
A11
SCCLK
Smart Card Interface Clock
LOW
LOW
12 mA
I/O
B11
nSCRESET
Smart Card Interface Reset
LOW
LOW
12 mA
O
B10
SCVCCEN
Smart Card Interface VCC Enable
LOW
No Change
12 mA
O
D6
CTCLKIN
Counter Timer Clock Input
Input
No Change
I
A3
DREQ0
DMA Request 0
Input
No Change
I
D5
DACK0
DMA Acknowledge 0
Input
No Change
12 mA
I/O
C4
DEOT0
DMA End of Transfer 0
Input
No Change
12 mA
I/O
B3
DREQ1
DMA Request 1
Input
No Change
A2
DACK1
DMA Acknowledge 1
Input
No Change
12 mA
I/O
E5
DEOT1
DMA End of Transfer 1
Input
No Change
12 mA
I/O
U16
nTEST0
Test Pin 0. Internal weak pull up to VDD. Status
latched at nPOR going HIGH. Pull LOW for JTAG
mode. Pull HIGH (or leave open) for Normal mode.
See Table 3.
Input with
pull-up
Input with
pull-up
I
W18
nTEST1
Test Pin 1. Internal weak pull up to VDD. Status
latched at nPOR going HIGH. Pull HIGH (or leave
open) for both JTAG and Normal mode. See Table 3.
Input with
pull-up
Input with
pull-up
I
TDI
JTAG Data In. Internal weak pull up to VDD.
Input
No Change
I
D3
C2
TCK
JTAG Clock. Internal weak pull up to VDD.
B1
TDO
JTAG Data Out
E3
TMS
JTAG Test Mode Select. Internal weak pull up to
VDD.
NOTES:
1. Signals beginning with ‘n’ are Active LOW.
2. The SCLK pin can source up to 12 mA and sink up to 20 mA.
See ‘DC Characteristics’.
3. Schmitt trigger input; see ’DC Specifications’, page 31 for triggers
points and hysteresis.
4. These pins have alternate NAND Flash functions during boot-up
when using the internal Boot ROM. Consult the Boot ROM
Chapter of the User’s Guide for more information.
5. The nWAIT pin must be pulled HIGH with a 33 k resistor to avoid
the possibility of the SMC inadvertently going into WAIT.
6. The internal pullup and pulldown resistance on all digital I/O pins
is 50K.
12
Input
No Change
High Z
No Change
Input
No Change
I
I
4 mA
3
O
I
Table 3. nTEST Pin Function
MODE
nTEST0
nTEST1
nURESET
JTAG
0
1
1
Normal
1
1
x
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Table 4. LCD Controller Pins
STN
LFBGA
PIN
RESET
STATE
LCD
SIGNAL
L4
PA1
LCDVD17
M2
PA0
LCDVD16
Y12
PD7
LCDVD15
MLSTN7
CLSTN7
Intensity
Intensity
MONO 4-BIT
SINGLE
PANEL
DUAL
PANEL
MONO 8-BIT
SINGLE
PANEL
DUAL
PANEL
COLOR
SINGLE
PANEL
TFT
DUAL
PANEL
AD-TFT/
HR-TFT
LOW
LOW
V12
PD6
LCDVD14
MLSTN6
CLSTN6
BLUE4
BLUE4
U11
PD5
LCDVD13
MLSTN5
CLSTN5
BLUE3
BLUE3
W11
PD4
LCDVD12
MLSTN4
CLSTN4
BLUE2
BLUE2
V11
PD3
LCDVD11
MLSTN3
CLSTN3
BLUE1
BLUE1
W12
PD2
LCDVD10
MLSTN2
CLSTN2
BLUE0
BLUE0
U10
PD1
LCDVD9
MLSTN1
CLSTN1
GREEN4
GREEN4
Y11
PD0
LCDVD8
CLSTN0
GREEN3
GREEN3
T9
PE3
LCDVD7
MLSTN3
MUSTN7
MUSTN7
CUSTN7
CUSTN7
GREEN2
GREEN2
MLSTN0
V10
PE2
LCDVD6
MLSTN2
MUSTN6
MUSTN6
CUSTN6
CUSTN6
GREEN1
GREEN1
W10
PE1
LCDVD5
MLSTN1
MUSTN5
MUSTN5
CUSTN5
CUSTN5
GREEN0
GREEN0
Y9
PE0
LCDVD4
MLSTN0
MUSTN4
MUSTN4
CUSTN4
CUSTN4
RED4
RED4
Y8
LCDVD3
LCDVD3
MUSTN3
MUSTN3
MUSTN3
MUSTN3
CUSTN3
CUSTN3
RED3
RED3
W9
LCDVD2
LCDVD2
MUSTN2
MUSTN2
MUSTN2
MUSTN2
CUSTN2
CUSTN2
RED2
RED2
T8
LCDVD1
LCDVD1
MUSTN1
MUSTN1
MUSTN1
MUSTN1
CUSTN1
CUSTN1
RED1
RED1
MUSTN0
MUSTN0
MUSTN0
MUSTN0
CUSTN0
CUSTN0
RED0
V8
LCDVD0
LCDVD0
U3
LCDCLS
LCDCLS
Y10
LCDDCLK
LCDDCLK
LCDDCLK
LCDDCLK
LCDDCLK
LCDDCLK
T4
LCDFP
LCDFP/
LCDSPS
LCDFP
LCDFP
LCDFP
LCDFP
LCDFP
V2
LCDLP
LCDLP/
LCDHRLP
LCDLP
LCDLP
LCDLP
LCDLP
LCDLP
W2
LCDMOD
LCDMOD
RED0
LCDCLS
LCDDCLK LCDDCLK
LCDDCLK
LCDDCLK
LCDFP
LCDFP
LCDSPS
LCDLP
LCDLP
LCDHRLP
LCDMOD
V5
LCDPS
LCDPS
LCDPS
W3
LCDREV
LCDREV
LCDREV
V3
LCDSPL
LCDSPL
LCDSPL
V4
LCDLBR
LCDLBR
LCDLBR
W1
LCDSPR
LCDSPR
LCDSPR
U4
LCDUBL
LCDUBL
LCDUBL
Y1
LCDVDDEN LCDVDDEN
U8
LCDCLKIN
LCDCLKIN
V9
LCDENAB
LCDENAB/
LCDM
LCDVDDEN
LCDCLKIN LCDCLKIN LCDCLKIN LCDCLKIN LCDCLKIN LCDCLKIN LCDCLKIN LCDCLKIN
LCDM
LCDM
LCDM
LCDM
LCDM
LCDM
LCDENAB
NOTES:
1. The Intensity bit is identically generated for all three colors.
2. MUSTN = Monochrome Upper Panel
MLSTN = Monochrome Lower Panel
CUSTN = Color Upper Panel
CLSTN = Color Lower Panel
Product data sheet
13
LH7A404
Table 5. LFBGA Numerical Pin List
LFBGA
14
32-Bit System-on-Chip
NXP Semiconductors
SIGNAL
Table 5. LFBGA Numerical Pin List (Cont’d)
SLEW
RATE
OUTPUT
DRIVE
LFBGA
SIGNAL
SLEW
RATE
OUTPUT
DRIVE
A1
PE7/SCDATEN
95 mV/ns
12 mA
C6
MMCDATA
110 mV/ns
8 mA
A2
DACK1
95 mV/ns
12 mA
C7
ACBITCLK
110 mV/ns
8 mA
C8
PF3/INT3
110 mV/ns
8 mA
110 mV/ns
8 mA
C9
PWMSYNC
A3
DREQ0
A4
MMCDATA2
A5
MMCCLK
110 mV/ns
8 mA
C10
PWM1
110 mV/ns
8 mA
A6
ACSYNC
110 mV/ns
8 mA
C11
PWM0
110 mV/ns
8 mA
A7
PF6/INT6/PCRDY1
110 mV/ns
8 mA
C12
nOE
95 mV/ns
12 mA
A8
PF2/INT2
110 mV/ns
8 mA
C13
nBLE3
110 mV/ns
8 mA
A9
PF0/INT0
110 mV/ns
8 mA
C14
SCKE3
95 mV/ns
12 mA
A10
nPWME1
95 mV/ns
12 mA
C15
nCAS
95 mV/ns
12 mA
A11
SCCLK
95 mV/ns
12 mA
C16
D27
95 mV/ns
12 mA
A12
DQM3
110 mV/ns
8 mA
C17
nSCS0
95 mV/ns
12 mA
A13
nBLE0
95 mV/ns
12 mA
C18
D24
95 mV/ns
12 mA
A14
SCKE0
95 mV/ns
12 mA
C19
A22
95 mV/ns
12 mA
A15
nRAS
95 mV/ns
12 mA
C20
D21
95 mV/ns
12 mA
A16
A25
95 mV/ns
12 mA
D1
nBATCHG
A17
D30
95 mV/ns
12 mA
D2
nPOR
A18
D29
95 mV/ns
12 mA
D3
TDI
A19
nSCS1
95 mV/ns
12 mA
D4
PE4/SCCLKIN
95 mV/ns
12 mA
A20
D25
95 mV/ns
12 mA
D5
DACK0
95 mV/ns
12 mA
B1
TDO
100 mV/ns
4 mA
D6
CTCLKIN
B2
PE6/SCIN
95 mV/ns
12 mA
D7
MMCCMD
110 mV/ns
8 mA
B3
DREQ1
D8
PF5/INT5/SCDETECT
110 mV/ns
8 mA
B4
MMCDATA3
110 mV/ns
8 mA
D9
PF1/INT1
110 mV/ns
8 mA
B5
MMCDATA1
110 mV/ns
8 mA
D10
PWM3
110 mV/ns
8 mA
B6
ACIN
110 mV/ns
8 mA
D11
nPWME0
110 mV/ns
8 mA
B7
ACOUT
110 mV/ns
8 mA
D12
nWE
95 mV/ns
12 mA
B8
PF4/INT4
110 mV/ns
8 mA
D13
DQM0
95 mV/ns
12 mA
B9
PWM2
110 mV/ns
8 mA
D14
SCLK
190 mV/ns
20 mA
B10
SCVCCEN
95 mV/ns
12 mA
D15
A26
95 mV/ns
12 mA
B11
nSCRESET
95 mV/ns
12 mA
D16
nSCS2
95 mV/ns
12 mA
B12
DQM2
95 mV/ns
12 mA
D17
A23
95 mV/ns
12 mA
B13
SCKE1_2
95 mV/ns
12 mA
D18
D22
95 mV/ns
12 mA
B14
A27
95 mV/ns
12 mA
D19
A20
95 mV/ns
12 mA
B15
D31
95 mV/ns
12 mA
D20
D19
95 mV/ns
12 mA
B16
nSWE
95 mV/ns
12 mA
E1
nURESET
B17
D28
95 mV/ns
12 mA
E2
BATOK
B18
D26
95 mV/ns
12 mA
E3
TMS
B19
A24
95 mV/ns
12 mA
E4
MEDCHG
B20
D23
95 mV/ns
12 mA
E5
DEOT1
95 mV/ns
12 mA
110 mV/ns
8 mA
C1
nEXTPWR
E6
VSSC
C2
TCK
E7
VDDC
C3
PE5/SCCLKEN
95 mV/ns
12 mA
E8
PF7/INT7/PCRDY2
C4
DEOT0
95 mV/ns
12 mA
E9
VDDC
C5
nRESETOUT
E10
VDD
Product data sheet
32-Bit System-on-Chip
Table 5. LFBGA Numerical Pin List (Cont’d)
LFBGA
SIGNAL
LH7A404
NXP Semiconductors
SLEW
RATE
OUTPUT
DRIVE
E11
VDD
E12
SCIO
95 mV/ns
12 mA
E13
DQM1
95 mV/ns
12 mA
E14
VDDC
Table 5. LFBGA Numerical Pin List (Cont’d)
LFBGA
SIGNAL
SLEW
RATE
OUTPUT
DRIVE
J4
COL5
100 mV/ns
8 mA
J5
COL6
100 mV/ns
8 mA
J9
VSS
J10
VSS
E15
VSSC
J11
VSS
E16
nSCS3
95 mV/ns
12 mA
J12
VSS
E17
A21
95 mV/ns
12 mA
J16
VSSC
E18
D20
95 mV/ns
12 mA
J17
A12/SA10
95 mV/ns
12 mA
E19
D18
95 mV/ns
12 mA
J18
D11
95 mV/ns
12 mA
E20
D17
95 mV/ns
12 mA
J19
D9
95 mV/ns
12 mA
F1
UARTDCD2
110 mV/ns
8 mA
J20
A10/SA8
95 mV/ns
12 mA
F2
UARTCTS2
110 mV/ns
8 mA
K1
TBUZ
110 mV/ns
8 mA
F3
WAKEUP
K2
COL7
100 mV/ns
8 mA
F4
nPWRFL
K3
SSPCLK
110 mV/ns
8 mA
110 mV/ns
8 mA
F5
VSSC
K4
SSPFRM
F16
VSSC
K5
VDD
F17
A19
95 mV/ns
12 mA
K8
VDD
F18
A17/SBANK1
95 mV/ns
12 mA
K9
VSS
F19
D16
95 mV/ns
12 mA
K10
VSS
F20
A14/SA12
95 mV/ns
12 mA
K11
VSS
G1
UARTIRRX1
110 mV/ns
8 mA
K12
VSS
G2
UARTDSR2
110 mV/ns
8 mA
K13
VDD
G3
UARTIRTX1
110 mV/ns
8 mA
K16
VDD
G4
UARTRX2
110 mV/ns
8 mA
K17
D10
95 mV/ns
12 mA
G5
VDDC
K18
A7/SA5
95 mV/ns
12 mA
G16
VDDC
K19
A9/SA7
95 mV/ns
12 mA
G17
A18
95 mV/ns
12 mA
K20
A8/SA6
95 mV/ns
12 mA
G18
A15/SA13
95 mV/ns
12 mA
L1
SSPRX
110 mV/ns
8 mA
G19
D14
95 mV/ns
12 mA
L2
PGMCLK
110 mV/ns
8 mA
G20
D13
95 mV/ns
12 mA
L3
SSPTX
110 mV/ns
8 mA
110 mV/ns
8 mA
H1
KMIDAT
95 mV/ns
12 mA
L4
PA1/LCDVD17
H2
UARTTX2
110 mV/ns
8 mA
L5
VDD
H3
KMICLK
95 mV/ns
12 mA
L8
VDD
H4
COL1
100 mV/ns
8 mA
L9
VSS
100 mV/ns
8 mA
L10
VSS
L11
VSS
H5
COL2
H10
VDD
H11
VDD
H16
A16/SBANK0
H17
D15
H18
A13/SA11
H19
D12
H20
A11/SA9
J1
COL3
J2
COL0
J3
COL4
Product data sheet
L12
VSS
12 mA
L13
VDD
95 mV/ns
12 mA
L16
VDD
95 mV/ns
12 mA
L17
D7
95 mV/ns
12 mA
95 mV/ns
12 mA
L18
D6
95 mV/ns
12 mA
95 mV/ns
12 mA
L19
D8
95 mV/ns
12 mA
100 mV/ns
8 mA
L20
A5/SA3
95 mV/ns
12 mA
100 mV/ns
8 mA
M1
PA4
110 mV/ns
8 mA
100 mV/ns
8 mA
M2
PA0/LCDVD16
110 mV/ns
8 mA
95 mV/ns
15
LH7A404
Table 5. LFBGA Numerical Pin List (Cont’d)
LFBGA
16
32-Bit System-on-Chip
NXP Semiconductors
SIGNAL
Table 5. LFBGA Numerical Pin List (Cont’d)
SLEW
RATE
OUTPUT
DRIVE
LFBGA
SIGNAL
SLEW
RATE
OUTPUT
DRIVE
M3
PA2
110 mV/ns
8 mA
T2
PC2
95 mV/ns
12 mA
M4
PA3
110 mV/ns
8 mA
T3
PC3
95 mV/ns
12 mA
M5
VSSC
T4
LCDFP/LCDSPS
95 mV/ns
12 mA
M9
VSS
T5
PG4/nPCREG
110 mV/ns
8 mA
M10
VSS
T6
VSSC
M11
VSS
T7
VDDC
M12
VSS
T8
LCDVD1
95 mV/ns
12 mA
M16
D4
95 mV/ns
12 mA
T9
PE3/LCDVD7
95 mV/ns
12 mA
M17
A6/SA4
95 mV/ns
12 mA
T10
VDD
M18
D5
95 mV/ns
12 mA
T11
VDD
M19
A3/SA1
95 mV/ns
12 mA
T12
VDDC
M20
A4/SA2
95 mV/ns
12 mA
T13
AN8
N1
PA7
110 mV/ns
8 mA
T14
VDDC
N2
PA6
110 mV/ns
8 mA
T15
VSSC
N3
PA5
110 mV/ns
8 mA
T16
CLKEN
110 mV/ns
8 mA
N4
PB0/UARTRX1
110 mV/ns
8 mA
T17
USBHPWR
95 mV/ns
12 mA
110 mV/ns
8 mA
T18
VSS
T19
XTAL32IN
N5
PB5/UARTDSR3
N10
VDD
N11
VDD
N16
A1
95 mV/ns
N17
A2/SA0
N18
D2
N19
N20
T20
XTAL32OUT
12 mA
U1
PC5
95 mV/ns
12 mA
95 mV/ns
12 mA
U2
PC6
95 mV/ns
12 mA
95 mV/ns
12 mA
U3
LCDCLS
95 mV/ns
12 mA
D0
95 mV/ns
12 mA
U4
LCDUBL
95 mV/ns
12 mA
D3
95 mV/ns
12 mA
U5
PG3/nPCIOW
110 mV/ns
8 mA
U6
PH3/CFA9/PCMCIAA25/
nPCSLOTE2
110 mV/ns
8 mA
U7
PH7/nPCSTATRE
110 mV/ns
8 mA
U8
LCDCLKIN
P1
PB3/UARTCTS3
110 mV/ns
8 mA
P2
PB2/UARTRX3
110 mV/ns
8 mA
P3
PB1/UARTTX3
110 mV/ns
8 mA
P4
PC0/UARTTX1
P5
VDDC
P16
VDDC
P17
A0
P18
nWAIT
P19
nCS3
95 mV/ns
95 mV/ns
95 mV/ns
12 mA
12 mA
12 mA
P20
D1
95 mV/ns
12 mA
R1
PB7/SMBCLK
110 mV/ns
8 mA
R2
PB6/SWID/SMBD
110 mV/ns
8 mA
R3
PB4/UARTDCD3
110 mV/ns
8 mA
R4
PC4
R5
VSSC
R16
VSSC
R17
nCS7
95 mV/ns
95 mV/ns
12 mA
12 mA
R18
nCS2
95 mV/ns
12 mA
R19
nCS1
95 mV/ns
12 mA
R20
nCS6
95 mV/ns
12 mA
T1
PC1
95 mV/ns
12 mA
U9
nBLE1
95 mV/ns
12 mA
U10
PD1/LCDVD9
95 mV/ns
12 mA
U11
PD5/LCDVD13
95 mV/ns
12 mA
U12
BATCTL
95 mV/ns
12 mA
U13
AN3/LR/Y-
U14
VSS or VSSA
U15
VSSA
U16
nTEST0
U17
USBDCP
U18
VDD
U19
USBDN
U20
USBDP
V1
PC7
95 mV/ns
12 mA
V2
LCDLP/LCDHRLP
95 mV/ns
12 mA
V3
LCDSPL
95 mV/ns
12 mA
V4
LCDLBR
95 mV/ns
12 mA
V5
LCDPS
95 mV/ns
12 mA
Product data sheet
32-Bit System-on-Chip
Table 5. LFBGA Numerical Pin List (Cont’d)
LFBGA
SIGNAL
LH7A404
NXP Semiconductors
Table 5. LFBGA Numerical Pin List (Cont’d)
SLEW
RATE
OUTPUT
DRIVE
LFBGA
SIGNAL
V6
PH0/PCRESET1
110 mV/ns
8 mA
W13
WIDTH1
V7
PH6/nAC97RESET
110 mV/ns
8 mA
W14
AN2/LL/Y+
V8
LCDVD0
95 mV/ns
12 mA
W15
AN7
V9
LCDENAB/LCDM
95 mV/ns
12 mA
W16
VDDAD
V10
PE2/LCDVD6
95 mV/ns
12 mA
W17
VDDA
V11
PD3/LCDVD11
95 mV/ns
12 mA
W18
nTEST1
V12
PD6/LCDVD14
95 mV/ns
12 mA
W19
USBHDP0
V13
VSSAD
W20
USBHDN0
SLEW
RATE
OUTPUT
DRIVE
V14
AN4/WIPER
Y1
LCDVDDEN
95 mV/ns
12 mA
V15
AN6
Y2
PG0/nPCOE
110 mV/ns
8 mA
V16
VSSA
Y3
PG2/nPCIOR
110 mV/ns
8 mA
V17
nUSBHOVRCURR
Y4
PG6/nPCCE2
110 mV/ns
8 mA
V18
nCS0
Y5
PH1/CFA8/PCRESET2
110 mV/ns
8 mA
V19
USBHDP1
Y6
110 mV/ns
8 mA
V20
USBHDN1
PH5/CFA10/PCMCIAA24/
nPCWAIT2
W1
LCDSPR
95 mV/ns
12 mA
Y7
nBLE2
95 mV/ns
12 mA
W2
LCDMOD
95 mV/ns
12 mA
Y8
LCDVD3
95 mV/ns
12 mA
Y9
PE0/LCDVD4
95 mV/ns
12 mA
Y10
LCDDCLK
95 mV/ns
12 mA
Y11
PD0/LCDVD8
95 mV/ns
12 mA
Y12
PD7/LCDVD15
95 mV/ns
12 mA
Y13
WIDTH0
Y14
AN9
Y15
AN1/UR/X-
95 mV/ns
12 mA
W3
LCDREV
95 mV/ns
12 mA
W4
PG1/nPCWE
110 mV/ns
8 mA
W5
PG5/nPCCE1
110 mV/ns
8 mA
W6
PG7/PCDIR
110 mV/ns
8 mA
W7
PH2/nPCSLOTE1
110 mV/ns
8 mA
W8
PH4/nPCWAIT1
110 mV/ns
8 mA
W9
LCDVD2
95 mV/ns
12 mA
W10
PE1/LCDVD5
95 mV/ns
12 mA
W11
PD4/LCDVD12
95 mV/ns
12 mA
W12
PD2/LCDVD10
95 mV/ns
12 mA
Product data sheet
Y16
AN0/UL/X+
Y17
VDDA
Y18
XTALIN
Y19
XTALOUT
Y20
INTBOOT
17
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
ROM
FLASH
1
2
3
4
5
6
7
8
9
*
0
#
SMART
CARD
SRAM
STN/TFT/
AD-TFT
GPIO
SSP
UART
SCI
TOUCH
SCREEN
CONTR.
SDRAM
LH7A404
MMC/SD
MULTIMEDIA
CARD
DMA
COMPACT
FLASH
CODEC
AC97
PC
CARD
PCMCIA
IR
DEVICE
HOST
BMI
DC to DC
USB
HOST
BATTERY
VOLTAGE
GENERATION
CIRCUITRY
LH7A404-2
Figure 2. Application Diagram
SYSTEM DESCRIPTIONS
ARM922T Processor
The LH7A404 microcontroller features the ARM922T
cached core with an Advanced High-performance Bus
(AHB) interface. The processor is a member of the
ARM9T family of processors. For more information, see
the ARM document, ‘ARM922T Technical Reference
Manual’, available on ARM’s website at www.arm.com.
Clock and State Controller
The clocking scheme in the LH7A404 is based
around two primary oscillator inputs. These are the
14.7456 MHz input crystal and the 32.768 kHz real time
clock oscillator; see Figure 3. The 14.7456 MHz oscillator supplies the main system clock domains for the
LH7A404. The 32.768 kHz oscillator controls the
power-down operations and real time clock peripheral.
The clock and state controller provides the clock gating
and frequency division necessary, and then supplies
the clocks to the processor and rest of the system. The
amount of clock gating that actually takes place
depends on the power saving mode selected.
18
The 32.768 kHz clock provides the source for the
Real Time Clock tree and power-down logic. This clock
is used for the power state control and is the only clock
in the LH7A404 that runs continuously. The 32.768 kHz
clock is divided down to 1 Hz for the Real Time Clock
counter using a ripple divider to save power.
The 14.7456 MHz source is used to generate the
main system clocks for the LH7A404. It is the source
for PLL1 and PLL2, the primary clock for the peripherals, and the source clock to the programmable clock
(PGM) divider.
PLL1 provides the main clock tree for the chip. It generates the following clocks: FCLK, HCLK, and PCLK.
FCLK is the clock that drives the ARM922T core.
HCLK is the main bus (AHB) clock, as such it clocks
all memory interfaces, bus arbitrators and the AHB
peripherals. HCLK is generated by dividing FCLK by 1,
2, 3, or 4. HCLK can be gated by the system to enable
low power operation.
PCLK is the peripheral bus (APB) clock. It is generated by dividing HCLK by either 2, 4, or 8.
PLL2 generates a fixed 48 MHz clock signal for the
USB peripheral.
Product data sheet
32-Bit System-on-Chip
Power Modes
Data Paths
The LH7A404 has three operational states: Run,
Halt, and Standby. During Run all clocks are hardware
enabled and the processor is clocked. In the Halt mode
the device is functioning, but the processor clock is
halted while it waits for an event such as a key press.
Standby equates to the computer being switched ‘off’,
i.e. no display (LCD disabled) and the main oscillator is
shut down.
Reset Modes
Three external signals can generate resets to the
LH7A404: nPOR (power on reset), nPWRFL (power
failure) and nURESET (user reset). If any of these are
active, a system reset is internally generated. An nPOR
reset performs a full system reset. The nPWRFL and
nURESET resets perform a full system reset except for
the SDRAM refresh control, SDRAM Global Configuration, SDRAM Device Configuration, and the RTC
peripheral registers. The SDRAM controller issues a
self-refresh command to external SDRAM before the
system enters an nPWRFL and nURESET reset. This
allows the system to maintain its Real Time Clock and
SDRAM contents. Upon release of Reset, the chip
enters Standby mode. Once in the Run mode the
PWRSR register can be interrogated to determine the
nature of the reset and the trigger source, after which
software can then take appropriate actions.
PLL1
14.7456 MHz
LH7A404
NXP Semiconductors
ƒIN
DIVIDE BY
PREDIV+2
MUST BE
BETWEEN
80 and 400 MHz
VCO
The data paths in the LH7A404 are:
• The AMBA AHB bus
• The AMBA APB bus
• The External Bus Interface
• The LCD AHB bus
• The DMA busses.
AMBA AHB BUS
The Advanced Microprocessor Bus Architecture
AHB (AMBA AHB) is a high speed 32-bit-wide data bus.
The AMBA AHB is for high-performance, high-clock-frequency system modules.
LH7A404 peripherals and memory with high bandwidth requirements are connected to the ARM922T
processor and other bus masters using a multi-master
AHB bus. These peripherals include the external memory interfaces, on-chip SRAM, LCD Controller (bus
master), DMA Controller (bus master), and USB Host
(bus master). Remaining peripherals reside on the
lower bandwidth Advanced Peripheral Bus (APB),
which is accessed from the AHB via the APB Bridge.
The APB Bridge is the only master on the APB, and its
operation is transparent to the user as it converts AHB
accesses into slower APB accesses automatically.
GATE
DIVIDE
BY 2PS
GCLK
FCLK
GATE
HCLKDIV
500 kHz
MIN.
32.768 kHz
RTC OSC
MAIN DIVIDER 1:
MAIN DIVIDER 2:
DIVIDE BY MAINDIV1+2 DIVIDE BY MAINDIV2+2
HCLK
PCLKDIV
RTC
HCLK_CPU
PCLK
32.768 kHz
LH7A404-6
Figure 3. Clock and State Controller Block Diagram
Product data sheet
19
LH7A404
NXP Semiconductors
AMBA APB BUS
The AMBA APB provides a lower-bandwidth bus for
peripherals accessed less frequently. This reduces the
loading on the AHB, allowing it to run faster to maximize system performance, while the APB can operate
at a lower clock rate to conserve power. The APB
Bridge is the only master on the APB. All AHB masters
can access APB peripherals via the ABP Bridge. The
APB clock frequency can be selected by software to
divide the clock speed of the AHB bus by 2, 4, or 8.
EXTERNAL BUS INTERFACE (EBI)
The External Bus Interface (EBI) provides a 32-bitwide, high speed gateway to external memory devices.
The supported memory devices include:
• Asynchronous RAM/ROM/Flash
• Synchronous DRAM/Flash
• PCMCIA interfaces
• CompactFlash interfaces.
The EBI can be controlled by either the Asynchronous Memory Controller or Synchronous Memory Controller. There is an arbiter on the EBI input, with priority
given to the Synchronous Memory Controller interface.
LCD BUS
The LCD controller has its own local memory bus
that connects it to the system’s embedded memory and
external SDRAM. The function of this local data bus is
to allow the LCD controller to perform its video refresh
function without congesting the main AHB bus. This
leads to better system performance and lower power
consumption. There is an arbiter on both the embedded memory and the synchronous memory controller.
In both cases the LCD bus is given priority.
32-Bit System-on-Chip
USB HOST CONTROLLER DMA BUS
The USB Host Controller has its own DMA controller. It acts as another bus master on the AHB bus. It
does not interact with the non-USB DMA controller
except in bus arbitration.
Memory Map
The LH7A404 system has a 32-bit-wide address bus,
allowing addressing up to 4GB of memory. This memory space is subdivided into a number of memory
banks, shown in Figure 4. Four of these banks (each
256MB) are allocated to the Synchronous Memory
Controller. Eight banks (each 256MB) are allocated to
the Asynchronous Memory Controller. Two of these
eight banks are designed for PCMCIA systems. Part of
the remaining memory space is allocated to the embedded SRAM, and to the control registers of the AHB and
APB. The rest of the memory space is not used.
The LH7A404 can boot from both internal and external devices. The selection is determined by the value of
five pins at power-on reset as shown in Table 6. If booting is from an external device (with INTBOOT = 0),
refer to Table 7. When booting from external synchronous memory, bank 4 (nSCS3) is mapped into memory
location zero. When booting from external asynchronous memory, memory bank 0 (nSCS0) is mapped into
memory location zero.
Figure 4 shows the memory map of the LH7A404
system for the two boot modes.
Once the LH7A404 has booted, the boot code can
configure the ARM922T MMU to remap the low memory space to a location in RAM. This allows the user to
set the interrupt vector table.
DMA BUSES
The LH7A404 has a DMA system that connects the
higher speed/higher data volume APB peripherals
(MMC, USB Device and AC97) to the AHB bus. This
enables the efficient transfer of data between these
peripherals and external memory without the intervention of the ARM922T core.
20
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Table 6. Internal Boot Modes
GPIO
PA7
BOOT DEVICE
LATCHED
MEDCHG
External device
LATCHED
WIDTH1
LATCHED
WIDTH0
See Table 7
LATCHED
INTBOOT
0
8-bit interface, 3-byte address NAND Flash
0
0
0
0
1
8-bit interface, 4-byte address NAND Flash
0
0
0
1
1
8-bit interface, 5-byte address NAND Flash
0
0
1
0
1
16-bit interface, 3-byte address NAND Flash
1
0
0
0
1
16-bit interface, 4-byte address NAND Flash
1
0
0
1
1
16-bit interface, 5-byte address NAND Flash
1
0
1
0
1
XMODEM using UART2
0
1
0
0
1
0
1
0
1
1
0
0
1
1
1
0
1
1
1
1
1
0
1
1
1
1
1
x
x
1
2
I C EEPROM
Undefined
Table 7. External Boot Modes
BOOT MODE
MEDCHG
WIDTH1
WIDTH0
INTBOOT
8-bit ROM
0
0
0
0
16-bit ROM
0
0
1
0
32-bit ROM
0
1
0
0
Invalid: Do not allow this condition.
0
1
1
0
16-bit SynchFlash (Initializes device MODE Register)
1
0
0
0
16-bit SROM (Initializes device MODE Register)
1
0
1
0
32-bit SynchFlash (Initializes device MODE Register)
1
1
0
0
32-bit SROM (Initializes device MODE Register)
1
1
1
0
Boot from internal Boot ROM; see Table 6
x
x
x
1
Product data sheet
21
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
Vectored Interrupt Controller (VIC)
The LH7A404 has two VICs working together to
manage interrupt requests from on-chip and off-chip
sources. Each VIC performs these primary functions:
• Determine if an interrupt source is disabled or can
generate an FIQ or IRQ to the ARM core
• Prioritize up to 16 separate interrupt sources for
simultaneous and nested processing
• Obtain the address of the interrupt handler (vector)
for up to 16 interrupt sources
• Provide a default vector and a set of status registers
for up to 16 non-vectored sources. Software determines the priority of these interrupts.
Two VICs are daisy-chained together to support up
to 64 different interrupts, 32 of which are vectored. The
VIC supports both FIQ and IRQ interrupts. FIQ interrupts have a higher priority than IRQ interrupts. If two
interrupts with the same priority become active at the
same time, the priority must be resolved in software.
When an interrupt becomes active, the VIC generates
an FIQ or IRQ if the corresponding mask bit is set.
Interrupts are not latched in the VIC, but may latch on
a particular peripheral when applicable.
After a power-on reset, all mask register bits are
cleared, masking all interrupts. They must be set by
software after power-on reset to enable interrupts.
A vectored interrupt has improved latency as it provides direct information about where its service routine
is located and eliminates software arbitration needed
with a simple interrupt controller.
The VICs continue to operate in Halt and Standby
modes, so external interrupts may bring the chip out of
these low power modes.
External Bus Interface
The ARM922T, LCD controller, and DMA engine
have access to an external memory system. The LCD
controller has access to an internal frame buffer in
embedded SRAM and an extension buffer in Synchronous Memory for large displays. The processor and
DMA engine share the main system bus, providing
access to all external memory devices and the embedded SRAM frame buffer.
An arbitration unit ensures that control over the
External Bus Interface (EBI) is only granted when an
existing access has been completed. See Figure 4.
INTERNAL TO
THE LH7A404
ASYNCHRONOUS
MEMORY
CONTROLLER
(SMC)
DMA
CONTROLLER
ARBITER
ARM922T
EXTERNAL TO
THE LH7A404
SDRAM
SRAM
SDRAM
ROM
DATA
EXTERNAL
BUS
ADDRESS/
INTERFACE CONTROL
(EBI)
SYSTEM AHB BUS
LCD
CONTROLLER
LCD
MMU/DMA
EMBEDDED
SRAM
80KB
USB
HOST
SYNCHRONOUS
MEMORY
CONTROLLER
(SDMC)
LCD AHB BUS
LH7A404-8
Figure 4. External Bus Interface Block Diagram
22
Product data sheet
32-Bit System-on-Chip
NXP Semiconductors
LH7A404
Embedded SRAM
SDRAM (Synchronous) Memory Controller
The LH7A404 incorporates 80 kB of embedded
SRAM. This embedded memory is used for storing
code, data, or LCD frame data and is contiguous with
external SDRAM. The 80 kB is large enough to store a
QVGA frame (320 × 240) at 8 bits per pixel, equivalent
to 70 kB of information.
The SDRAM (Synchronous) Memory Controller provides a high speed memory interface to a wide variety of
synchronous memory devices, including Synchronous
DRAM, Synchronous Flash and Synchronous ROMs.
Locating the frame buffer on chip reduces the overall
power consumed by LH7A404 applications. Normally,
the system performs external accesses to acquire this
data. The LCD controller automatically uses an overflow frame buffer in SDRAM if a larger screen size is
required. This overflow buffer can be located on any
4 kB page boundary in SDRAM, allowing software to
set the MMU (in the LCD controller) page tables so the
two memory areas appear contiguous, allowing byte,
half-word, and word accesses.
Static Memory Controller (SMC)
The asynchronous Static Memory Controller (SMC)
provides an interface between the AMBA AHB system
bus and external (off-chip) memory devices.
The SMC simultaneously supports up to eight independently configurable memory banks. Each memory
bank can support:
• SRAM
• ROM
• Flash EPROM
• Burst ROM memory.
Each memory bank may use devices with either
8-, 16-, or 32-bit external memory data paths. The
memory controller is configured to support little-endian
operation only.
The memory banks can be configured to support:
• Non-burst read and write accesses only to highspeed CMOS static RAM
• Non-burst write accesses, nonburst read accesses
and asynchronous page mode read accesses to
fast-boot block flash memory.
The SMC has six main functions:
•
•
•
•
•
•
The key features of the controller are:
• LCD DMA port for high bandwidth
• Up to four Synchronous Memory banks can be independently set up
• Includes special configuration bits for Synchronous
ROM operation
• Includes ability to program Synchronous Flash
devices using write and erase commands
• On booting from Synchronous ROM, (and optionally
with Synchronous Flash), a configuration sequence is
performed before releasing the processor from reset
• Data is transferred between the controller and the
Synchronous DRAM in four-word bursts. Longer
transfers within the same page are concatenated,
forming a seamless burst
• Programmable for 16- or 32-bit data bus size
• Two reset domains enable Synchronous DRAM contents to be preserved over a ‘soft’ reset
• Power saving Synchronous Memory SCKE and
external clock modes provided.
Secure Digital/MultiMediaCard (MMC)
The SD Memory Card is a flash-based memory card
that meets the security, capacity, performance,
and environment requirements inherent in electronic
devices. The SD Memory Card host supports
MultiMediaCard (MMC) operation as well, and is compatible with MMC Cards.
The SD/MMC controller can be used as an MMC
card controller or as an SD Card controller, and supports the full SD/MMC bus protocol as defined in the
MMC system specification 2.11 provided by the MMC
Association and the ‘SD Memory Card Spec v1.0’ from
the SD Association.
Memory bank select
Access sequencing
Wait state generation
Byte lane write control
External bus interface
CompactFlash or PCMCIA interfacing.
Product data sheet
23
LH7A404
NXP Semiconductors
32-Bit System-on-Chip
SD/MMC INTERFACE DESCRIPTION
The SD/MMC controller uses the three-wire signal
bus (clock, command, and data) to input and output
data to and from the MMC, and to configure and
acquire status information from the card. The SD controller differs in that it has four data lines instead of one.
PROGRAMMABLE PARAMETERS
• Smart Card clock frequency
The SD/MMC bus lines can be divided into three
groups:
• Maximum time for first character of Answer to Reset
(ATR) reception checking
• Power supply: VSS1, VSS2, and VDD
• Maximum ATR character stream duration checking
• Data transfer group: MMCCMD, MMCDATA0,
MMCDATA1, MMCDATA2, MMCDATA3 (for MMC,
do not use MMCDATA1, MMCDATA2, MMCDATA3)
• Maximum time of receipt of first character of data
stream checking
• Clock: MMCCLK
• Character guard time
MMC CONTROLLER
The MMC controller implements MMC-specific functions, serves as the bus master for the MMC Bus and
implements the standard interface to the MMC (card
initialization, CRC generation and validation, command/response transactions, etc.).
• Block guard time
Smart Card Interface (SCI)
The SCI (ISO7816) connects to an external Smart
Card reader. The SCI can autonomously control data
transfer to and from the Smart Card. Transmit and
receive data FIFOs are provided to reduce the required
interaction between the CPU core and the peripheral.
• Communication baud rate
• Protocol convention
• Card activation/deactivation time
• Maximum time allowed between characters checking
•
• Transmit/receive character retry.
Direct Memory Access Controller (DMA)
The DMA Controller can be used to interface
streams from 20 internal peripherals to the system
memory using 10 fully-independent programmable
channels which consist of five M2P (transmit) channels
and five P2M (receive) channels.
The following peripherals may be allocated to the 10
channels:
• USB Device
SCI FEATURES
• Supports asynchronous T0 and T1 transmission
protocols
• Supports clock rate conversion factor F = 372, with
bit rate adjustment factors of D = 1, 2, or 4
• USB Host
• SD/MMC
• AC97
• UART1
• Eight-character-deep buffered Tx and Rx paths
• UART2
• Direct interrupts for Tx and Rx FIFO level monitoring
• UART3
• Interrupt status register
Each of the above peripherals contain one Tx and
one Rx channel, except the AC97, which contains three
Tx and Rx channels. These peripherals also have their
own bi-directional DMA bus, capable of simultaneously
transferring data in both directions. All memory transfers take place via the main system AHB bus.
• Hardware-initiated card deactivation sequence on
detection of card removal
• Software-initiated card deactivation sequence on
transaction complete
• Limited support for synchronous smart cards via registered input/output.
24
The DMA Controller can also be used to interface
streams from memory-to-memory (M2M) or memoryto-external peripheral (M2P) using two dedicated
M2M channels. External handshake signals are available to support memory-to-/from-external peripheral
(M2P/P2M) transfers. A software trigger is available for
M2M transfers only.
Product data sheet
32-Bit System-on-Chip
NXP Semiconductors
The DMA Controller features:
• Two dedicated channels for M2M and external
M2P/P2M
• Ten fully independent, programmable DMA controller internal M2P/P2M channels (5 Tx and 5 Rx)
• Channels assignable to one of a number of different
peripherals
• Independent source and destination address registers. Source and destination can be programmed
to auto-increment or not auto-increment for M2M
channels
• Two buffer descriptors per M2P and M2M channel to
avoid potential data under/over-flow due to software
introduced latency. A buffer refers to the area in system memory that is characterized by a buffer
descriptor, i.e., a start address and the length of the
buffer in bytes
• No AMBA wrapping bursts for DMA channels; only
incrementing bursts are supported
• Buffer size independent of the peripheral’s packet
size for the internal M2P channels. Transfers can
automatically switch between buffers
• Maskable interrupt generation
• Internal arbitration between DMA channels, plus
support for an AHB bus arbiter
• DMA data transfer sizes, byte, word and quad-word
data transfers are supported using a 16-byte data.
Maximum data transfer size per M2M channel is
programmable
• Per-channel clock gating reducing power in channels that have not been enabled by software. See
the ‘Clock and State Controller’ section.
A set of control and status registers are available to
the system processor for setting up DMA operations
and monitoring their status. System interrupts are generated when any/all of the DMA channels wish to
inform the processor to update the buffer descriptor.
The DMA controller can service 10 out of 20 possible
peripherals using the ten DMA channels, each with its
own peripheral DMA bus capable of simultaneously
transferring data in both directions.
The SD/MMC, UART[3:1], USB Device, and USB
Host peripherals can each use two DMA channels, one
for transmit and one for receive. The AC97 peripheral
can use six DMA channels (three transmit and three
receive) to allow different sample frequency data
queues to be handled with low software overhead.
LH7A404
The DMA controller includes an M2M transfer feature allowing block moves of data from one memory
address space to another with minimum of program
effort and time. An M2M software trigger capability is
provided. The DMA controller can also fill a block of
memory with data from a single location.
The DMA controller’s M2M channels can also be
used in M2P/P2M mode. A set of external handshake
signals, DREQ, DACK and TC/DEOT are provided for
each of two M2M channels.
DREQ (input) can be programmed edge or level
active, and active HIGH or LOW. The peripheral may
hold DREQ active for the duration of the block transfers
or may assert/deassert on each transfer.
DACK (output) can be programmed active HIGH or
LOW. DACK will assert and return to de-asserted with
each Read or Write, the timing coinciding with nOE or
nWE from the EBI.
TC/DEOT is a bidirectional signal with programmable direction and active polarity. When configured as an
Output, the DMA will assert Terminal Count (TC) on the
final transfer to coincide with the DACK, typically when
the byte count has expired. When configured as an
Input, the peripheral must assert DEOT concurrent with
DREQ for the final transfer in the block.
Transfer is terminated when DEOT is asserted by the
external peripheral or when the byte count expires,
whichever occurs first. Status bits indicate if the actual
byte count is equal to the programmed limit, and if the
count was terminated by peripheral asserting DEOT.
Terminating the transfer causes a DMA interrupt on that
channel and rollover to the ‘other’ buffer if so configured.
USB Device
The features of the USB are:
• Compliant with USB 2.0 Full Speed specification
• Provides a high-level interface that removes the
USB protocol details from firmware
• Compatible with both OpenHCI and Intel UHCI
standards
• Supports full-speed (12 Mbit/s) functions
• Supports Suspend and Resume signalling.
USB Host Controller
The features of the USB Host Controller are:
• Open Host Controller Interface Specification (OpenHCI) Rev. 1.0 Compliant
• Universal Serial Bus Specification 2.0 Full Speed
compatible
• Supports Low Speed and High Speed USB devices
• Root Hub has two Downstream Ports
• DMA functionality.
Product data sheet
25
LH7A404
NXP Semiconductors
Color LCD Controller
The LH7A404’s LCD Controller is programmable to
support up to 1,024 × 768, 16-bit color LCD panels. It
interfaces directly to STN, color STN, TFT, AD-TFT,
and HR-TFT panels. Unlike other LCD controllers, the
LH7A404’s LCD Controller saves an external timing
ASIC by incorporating the timing conversion logic for
thin LCD modules such as AD-TFT and HR-TFT.
The Color LCD Controller features support for:
• Up to 1,024 × 768 Resolution
• 16-bit Video Bus
• 16 bits-per-pixel (bpp) 5:5:5:1 or 5:6:5 direct color or
on-chip color palette for 1, 2, 4, and 8 bpp resolution
• STN, Color STN, AD-TFT, HR-TFT, TFT panels
– Single and Dual Scan STN panels
– Up to 15 Gray Shades (mono STN)
– Up to 3375 colors (color STN)
– Up to 64 k-Colors
– An on-chip SRAM frame buffer conserves bus
bandwidth and saves active power.
AC97 Codec Controller
The AC97 Codec controller includes a 5-pin serial
interface to an external audio codec. The AC97 link is a
bi-directional, fixed rate, serial Pulse Code Modulated
(PCM) digital stream, dividing each audio frame into 12
outgoing and 12 incoming data streams (slots), each
with 20-bit resolution per sample.
The AC97 controller contains logic that controls the
AC97 link to the audio codec and an interface to the
AMBA APB.
•
•
•
•
Its main features include:
Serial-to-parallel conversion for data received from
the external codec
Parallel-to-serial conversion for data transmitted to
the external codec
Reception/transmission of control and status information via the AMBA APB interface
Support for up to 4 simultaneous codec sampling
rates with its 4 transmit and 4 receive channels. The
transmit and receive paths are buffered with internal
FIFO memories, allowing data to be stored independently in both transmit and receive modes. Three of
the outgoing FIFOs can be written via either the APB
interface or with DMA channels 1-3.
Audio Codec Interface (ACI)
32-Bit System-on-Chip
The interface supports full duplex operation and the
transmit and receive paths are buffered with internal
FIFO memories allowing up to 16 bytes to be stored
independently in both transmit and receive modes.
The ACI includes a programmable frequency divider
that generates a common transmit and receive bit clock
output from the on-chip ACI clock input (ACBITCLK).
Transmit data values are output synchronous with the
rising edge of the bit clock output. Receive data values
are sampled on the falling edge of the bit clock output.
The start of a data frame is indicated by a synchronization output signal that is coincident with the bit clock.
Pulse Width Modulator (PWM)
The Pulse Width Modulator features:
• Configurable dual output
• Separate input clocks for each PWM output
• 16-bit resolution
• Programmable synchronous mode support allows
external input to start PWM
• Programmable pulse width (duty cycle), interval
(frequency), and polarity
– Static programming: when the PWM is stopped
– Dynamic programming: when the PWM is running
– Updates duty cycle, frequency, and polarity at
end of a PWM cycle
The PWM is a configurable dual-output, dual-clockinput AMBA slave module, and connects to the APB.
Synchronous Serial Port (SSP)
The SSP is a master-only interface for synchronous serial communication with peripheral devices
that have either Motorola SPI, National Semiconductor MICROWIRE, or Texas Instruments
Synchronous Serial Interfaces.
The SSP performs serial-to-parallel conversion on
data received from a peripheral. The transmit and
receive paths are buffered with internal FIFO memories
allowing up to eight 16-bit values to be stored independently in both transmit and receive modes. Serial data
is transmitted on SSPTXD and received on SSPRXD.
The LH7A404 SSP includes a programmable bit rate
clock divider and prescaler to generate the serial output
clock SCLK from the input clock SSPCLK. Bit rates are
supported to 2 MHz and beyond, subject to choice of
frequency for SSPCLK; the maximum bit rate will usually be determined by peripheral device’s capability.
The ACI provides:
• A digital serial interface to an off-chip 8-bit codec
• All the necessary clocks and timing pulses to perform serialization or de-serialization of the data
stream to, or from the codec device.
26
Product data sheet
32-Bit System-on-Chip
NXP Semiconductors
UART/IrDA
The LH7A404 contains three UARTs; UART1,
UART2, and UART3.
The UART performs:
• Serial-to-Parallel conversion on data received from
the peripheral device
• Parallel-to-Serial conversion on data transmitted to
the peripheral device.
The transmit and receive paths can both be routed
through the DMA separately or simultaneously, and are
buffered with internal FIFO memories. This allows up to
16 bytes to be stored independently in both transmit and
receive modes. The UART can generate:
• Four individually maskable interrupts from the
receive, transmit, and modem status logic blocks
• A single combined interrupt so that the output is
asserted if any of the individual interrupts are
asserted and unmasked.
If a framing, parity or break error occurs during
reception, the appropriate error bit is set and stored in
the FIFO. If an overrun condition occurs, the overrun
register bit is set immediately and the FIFO data is prevented from being overwritten. UART1 also supports
IrDA 1.0 (15.2 kbit/s).
The modem status input signals Clear to Send
(CTS), Data Carrier Detect (DCD) and Data Set Ready
(DSR) are supported on UART2 and UART3.
Timers
The LH7A404 includes three programmable timers.
Each of the timers can operate in two modes: free running and pre-scale. The timers are programmed using
four registers; Load, Value, Control, and Clear.
Two identical timers, Timer 1 (TC1) and Timer 2
(TC2), use clock sources of either 508 kHz or 2 kHz. The
clock source and mode are selectable by writing to the
appropriate bits in the system control register. Each
timer has a 16-bit read/write data register and a control
register. The timer is immediately loaded with the value
written to the data register. This value is then decremented on the next active clock edge to arrive after the
write. When the timer underflows, it immediately asserts
its appropriate interrupt.
Timer 3 (TC3) has the same basic operation, but is
clocked from a single 7.3728 MHz source. Once the
timer has been enabled and written to, it decrements
on the next rising edge of the 7.3728 MHz clock after
the data register has been updated.
LH7A404
FREE-RUNNING MODE
In free-running mode, the timer wraps around to
0xFFFF when it underflows and continues counting down.
PRE-SCALE MODE
In pre-scale (periodic) mode, the value written to
each timer is automatically re-loaded when the timer
underflows. This mode can be used to produce a programmable frequency to drive the buzzer or generate a
periodic interrupt.
Real Time Clock (RTC)
The RTC provides a basic alarm function or long
time-base counter. This is achieved by generating an
interrupt signal after counting for a programmed number of cycles of a real-time clock input. Counting in onesecond intervals is achieved by use of a 1 Hz clock
input to the RTC.
Keyboard and Mouse Interface (KMI)
The Keyboard and Mouse Interface has the
following features:
• IBM PS/2 or AT-compatible keyboard or mouse
interface
• Half-duplex, bidirectional synchronous serial interface using open-drain outputs for clock and data.
• Programmable 4-bit reference clock divider
• Polled or interrupt-driven mode
• Separately maskable transmit and receive interrupts
• Single combined interrupt output
• Odd parity generation and checking
• Register bits for override of keyboard clock and
data lines.
Additional test registers and modes are implemented
for functional verification and manufacturing test.
A/D Converter with Brownout Detector and
Touch Screen Controller
The LH7A404 includes an A/D Converter (ADC) with
integrated Touch Screen Controller (TSC) and brownout detector. The TSC is a complete interface to a
Touch Screen for portable personal devices. It combines the front-end biasing and control circuitry with
A/D conversion, reference generation, and digital interface functions to completely replace external ICs used
to implement this interface. The ADC features:
• A 10-bit A/D converter with integrated sample-andhold, fully differential, high impedance signal and reference inputs
• Active matrix for bias and control circuits necessary
for connection to external 4-, 5-, 7-, and 8-wire touch
panels, including pen pressure implementation
Product data sheet
27
LH7A404
NXP Semiconductors
32-Bit System-on-Chip
• Battery voltage sense in addition to normal direct
voltage inputs
DC-to-DC Converter
• A 9-channel multiplexer for routing user-selected
inputs to A/D
• Dual-drive PWM outputs with independent closed
loop feedback
• A 16 × 16 FIFO for 10-bit digital output of A/D
• Software programmable configuration of one of 8
output frequencies (each being a fixed division of the
input clock).
• A pen-down sensor to generate interrupts to the host
• Low-power circuitry and power control modes to
minimize on-chip power dissipation
• Conversion automation for flexibility while minimizing
CPU management and interrupt overhead
• A brownout detector with separate interrupt
Battery Monitor Interface (BMI)
The BMI is a serial communication interface specified for two types of battery monitors/gas gauges. The
first type employs a single wire interface. The second
interface employs a two-wire multi-master bus, implementing the Smart Battery System Specification.
If both interfaces are enabled at the same time, the
Single Wire Interface has priority.
SINGLE WIRE INTERFACE
The Single Wire Interface performs:
• Serial-to-parallel conversion on data received from
the peripheral device
• Parallel-to-serial conversion on data transmitted to
the peripheral device
• Data packet coding/decoding on data transfers
(incorporating Start/Data/Stop data packets)
The Single Wire interface uses a command-based
protocol in which the host initiates a data transfer by
sending a WriteData/Command word to the battery
monitor.
The features of the DC-DC Converter interface are:
• Software programmable configuration of duty cycle
from 0 to 15/16, in intervals of 1/16.
• Hardware-configured output polarity (for positive or
negative voltage generation) during power-on reset
via the polarity select inputs
• Dynamically switched PWM outputs to one of a pair
of preprogrammed frequency/duty cycle combinations via external pins.
Watchdog Timer (WDT)
The Watchdog Timer provides hardware protection
against malfunctions. It is a programmable timer that is
reset by software at regular intervals. Failure to reset
the timer will cause an FIQ interrupt. Failure to service
the FIQ interrupt generates a system reset.
Features of the WDT:
• Timing derived from the system clock
• 16 programmable time-out periods: 216 through 231
clock cycles
• Generates a system reset (resets LH7A404) or a
FIQ interrupt whenever a time-out period is reached
• Software enable, lockout, and counter-reset mechanisms add security against inadvertent writes
SMART BATTERY INTERFACE
The Smart Battery Interface performs:
• Protection mechanism guards against interruptservice-failure:
– The first WDT time-out triggers FIQ and asserts
nWDFIQ status flag
– If FIQ service routine fails to clear nWDFIQ, then
the next WDT time-out triggers a system reset.
• Serial-to-parallel conversion on data received from
the peripheral device
General Purpose I/O (GPIO)
• Parallel-to-serial conversion of data transmitted to
the peripheral device.
The Smart Battery Interface uses a two-wire multimaster bus (the SMBus), allowing multiple bus masters
to be connected to it. A master device initiates a bus
transfer and provides the clock signals. A slave device
can receive data provided by the master or it can provide data to the master. Since more than one device
may attempt to take control of the bus as a master,
SMBus provides an arbitration mechanism by relying
on the wired-AND connection of all SMBus interfaces
to the SMBus.
28
The GPIO has eight ports, each with a data register
and a data direction register. It also has added registers including Keyboard Scan, PINMUX, GPIO Interrupt Enable, INTYPE1/2, GPIOFEOI and PGHCON.
The data direction register determines whether a
port is configured as an input or an output while the
data register is used to read the value of the GPIO pins.
The GPIO Interrupt Enable, INTYPE[2:1], and the
GPIOFEOI registers control edge-triggered Interrupts
on Port F. The PINMUX register controls which signals
are from Port D and Port E when they are set as outputs, while the PGHCON controls the operations of
Port G and Port H.
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
ELECTRICAL SPECIFICATIONS
IMPORTANT: The LH7A404 is an electrostatic discharge (ESD) sensitive device. ESD protection circuitry internal to the LH7A404 has been
added to reduce ESD susceptibility. Appropriate ESD precautions are still required during handling to prevent degradation or
failure due to high electrostatic discharges. System design practices should be evaluated to prevent LH7A404 ESD voltages
from exceeding the maximum rated voltage as specified in this data sheet.
Absolute maximum ratings
PARAMETER
MINIMUM MAXIMUM
DC Core Supply Voltage (VDDC)
0.3 V
2.4 V
DC I/O Supply Voltage (VDD)
0.3 V
4.6 V
DC Analog Supply Voltage (VDDA)
0.3 V
2.4 V
DC Analog Supply Voltage (VDDAD)
0.3 V
4.6 V
5 V Tolerant Digital Input Pin Voltage
0.5 V
5.5 V
ESD, Human Body Model (Analog pins AN0 - AN9 rated at 500 V)
2 kV
ESD, Charged Device Model
1 kV
55°C
Storage Temperature
125°C
NOTE: These stress ratings are only for transient conditions. Operation at or beyond absolute
maximum rating conditions may affect reliability and cause permanent damage to the device.
Recommended operating conditions for LH7A404-N0E-000-xx/LH7A404-N0F-000-xx
PARAMETER
MINIMUM
TYPICAL
MAXIMUM NOTES
DC Core Supply Voltage (VDDC)
1.71 V
1.8 V
1.89 V
DC I/O Supply Voltage (VDD)
3.0 V
3.3 V
3.6 V
DC Analog Supply Voltage (VDDA)
1.71 V
1.8 V
1.89 V
DC A/D and TSC Supply Voltage (VDDAD)
3.0 V
3.3 V
3.6 V
Clock Frequency
10 MHz
1
200 MHz
Bus Clock Frequency
100 MHz
External Clock Input (XTALIN)
14 MHz
14.7456 MHz
20 MHz
External Clock Input (XTALIN) Voltage
1.71 V
1.8 V
1.89 V
Operating Temperature
40°C
25°C
+85°C
2
NOTES:
1. Core Voltage should never exceed I/O Voltage after initial power up. See “Power Supply Sequencing” on page 31.
2. Many of the peripherals do not operate properly at clock speeds other than 14.7456 MHz. Some
(such as USB) function only at 14.7456 MHz.
Product data sheet
29
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
Recommended Operating Conditions for LH7A404-N0E-092-xx/LH7A404-N0F-092-xx
PARAMETER
MINIMUM
TYPICAL
DC Core Supply Voltage (VDDC)
2.0 V
2.1 V
2.2 V
DC I/O Supply Voltage (VDD)
3.14 V
3.3 V
3.6 V
DC Analog Supply Voltage (VDDA)
2.0 V
2.1 V
2.2 V
DC A/D and TSC Supply Voltage (VDDAD)
3.0 V
3.3 V
3.6 V
Clock Frequency
10 MHz
MAXIMUM NOTES
1
266 MHz
Bus Clock Frequency
133 MHz
External Clock Input (XTALIN)
14 MHz
14.7456 MHz
20 MHz
External Clock Input (XTALIN) Voltage
1.71 V
1.8 V
1.89 V
Operating Temperature
40°C
25°C
+85°C
2
NOTES:
1. Core Voltage should never exceed I/O Voltage after initial power up. See “Power Supply Sequencing” on page 31.
2. Many blocks do not operate properly at speeds other than 14.7456 MHz. Some (such as USB) function only at 14.7456 MHz.
Table 8. Clock Frequency vs. Voltages (VDD) vs. Temperature*
PARAMETER
25°C
70°C
85°C
Clock Frequency (FCLK)
Clock Period (1/FCLK)
Clock Frequency (FCLK)
Clock Period (1/FCLK)
Clock Frequency (FCLK)
Clock Period (1/FCLK)
1.71 V
1.80 V
1.89 V
213 MHz
227 MHz
253 MHz
4.69 ns
4.41 ns
3.95 ns
205 MHz
220 MHz
236 MHz
4.88 ns
4.46 ns
2.36 ns
200 MHz
212 MHz
232 MHz
5.00 ns
4.72 ns
4.24 ns
NOTE: *LH7A404-N0E-000-xx and LH7A404-N0F-000-xx only. Table 8 is representative of a typical device.
Guaranteed values are in the Recommended Operating Conditions table.
255
250
245
FREQUENCY (MHz)
240
235
1.89 V (+5%)
230
225
220
215
1.80 V
210
205
200
25
35
45
55
65
75
1.71 V (-5%)
85
TEMP (°C)
LH7A404-182
Figure 5. Temperature/Voltage/Speed Chart (LH7A404-N0E-000-xx and LH7A404-N0F-000-xx Only)
30
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Power Supply Sequencing
NXP recommends that the 1.8 V power supply be
energized before the 3.3 V supply. If this is not possible, the 1.8 V supply may not lag the 3.3 V supply by
more than 100 s. If longer delay time is needed, it is
recommended that the voltage difference between the
two power supplies be within 1.5 V during power supply
ramp up.
To avoid a potential latchup condition, voltage
should be applied to input pins only after the device is
powered-on as described above.
DC/AC SPECIFICATIONS
The DC and AC specifications appears in the table
below. Parameters apply to all part numbers except
where noted.
DC Specifications
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
0.8
V
VIH
CMOS/Schmitt Trigger Input HIGH Voltage
VIL
CMOS/Schmitt Trigger Input LOW Voltage
VHST
Schmitt Trigger Hysteresis
0.25
V
VIL to VIH
CMOS Output HIGH Voltage, Output Drive 1
2.6
V
IOH = -2 mA
Output Drive 2
2.6
V
IOH = -4 mA
Output Drive 3
2.6
V
IOH = -8 mA
Output Drive 4 and 5
2.6
V
IOH = -12 mA
VOH
VOL
2.0
CONDITIONS
V
CMOS Output LOW Voltage, Output Drive 1
0.4
V
IOL = 2 mA
Output Drive 2
0.4
V
IOL = 4 mA
Output Drive 3
0.4
V
IOL = 8 mA
Output Drive 4
0.4
V
IOL = 12 mA
Output Drive 5
0.4
V
IOL = 20 mA
Input Leakage Current
-10
10
A
Input Leakage Current, with pullup resistors
-95
10
A
IOZ
Output Tri-state Leakage Current
-10
10
A
ISTARTUP
Startup Current
50
A
IIN
NOTE
CIN
Input Capacitance
4
pF
COUT
Output Capacitance
4
pF
1
1
VIN = VDD or GND
VOUT = VDD or GND
2
LH7A404-N0E-000-XX AND LH7A404-N0F-000-XX ONLY
IACTIVE
Active Current (Operating Current)
147
238
mA
3
IHALT
Halt Current
41
45
mA
4
ISTANDBY
Standby Current
70
A
5
LH7A404-N0E-092-XX AND LH7A404-N0F-092-XX ONLY
IACTIVE
Active Current (Operating Current)
IHALT
Halt Current
IHALT
Standby Current
228
370
mA
3
60
mA
4
200
A
5
NOTES:
1. Output Drive 5 can sink 20 mA of current, but sources 12 mA of current.
2. Current consumption until oscillators are stabilized.
3. See ’Current Consumption by Operating Mode’, page 34 for operating conditions.
4. Both oscillators running, LCD Active; all other peripherals stopped.
5. 32 kHz oscillator running; all other peripherals stopped.
Product data sheet
31
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
Analog-To-Digital Converter
Electrical Characteristics
Table 9 shows the derated specifications for
extended temperature operation. See Figure 6 for the
ADC transfer characteristics.
Table 9. ADC Electrical Characteristics
PARAMETER
MIN.
A/D Resolution
10
Throughput Conversion
17
Acquisition Time
3
Data Format
TYP.
MAX.
UNITS
10
Bits
CLK Cycles
NOTES
1
CLK Cycles
binary
2
Clk Frequency
500
5,000
ns
Differential Non-Linearity (DNL)
-0.99
+4.5
LSB
3
Integral Non-Linearity (INL)
-4.5
+4.5
LSB
4
Offset Error
+35
+50
mV
5
Gain Error
-4.0
4.0
LSB
Reference Voltage Output
1.85
2.0
2.15
V
VREF-
VSSA
VSSA
(VREF+) -1.0
V
6
VREF+
(VREF-) +1.0
VREF
VDDAD
V
6
Crosstalk between channels
Analog Input Voltage Range
-60
0
dB
VDDAD
V
Analog Input Current
5
A
Reference Input Current
5
A
Analog Input capacitance
15
pF
3.6
V
1000
A
Operating Supply Voltage
3.0
Operating Current, VDDAD
590
Standby Current, VDDAD
180
A
1
A
Stop Current, VDDAD
Brownout Trip Point (falling point)
2.36
Brownout Hysteresis
Operating Temperature
2.63
2.9
120
40
7
8
V
mV
85
°C
NOTES:
1. The analog section of the ADC takes 16 × A2DCLK cycles per conversion,
plus 1 × A2DCLK cycles to be made available in the PCLK domain. An additional
3 × PCLK cycles are required before being available on the APB.
2. Data out = 0000000000 when the analog input equals the negative reference.
Data out = 1111111111 when the analog input equals the positive reference.
3. Guaranteed monotonic.
4. INL calculated as deviation from ‘best fit’ line after subtracting offset/gain errors over the center
90 % of full scale output range.
5. DC voltage error for the transition voltage from code 511 (0x1FF) to 512 (0x200)
6. The internal voltage reference is driven to nominal value VREF = 2.0 V. Using the Reference Multiplexer,
alternative low impedance (RS < 500) voltages can be selected as reference voltages.
The range of voltages allowed are specified above.
7. The analog input pins can be driven anywhere between the power supply rails.
If the voltage at the input to the ADC exceeds VREF+ or is below VREF-, the A/D result will saturate appropriately
at positive or negative full scale. Trying to pull the analog input pins above or below the power supply rails will
cause protection diodes to be forward-biased, resulting in large current source/sink and possible damage to the ADC.
8. Bandgap and other low-bandwidth circuitry operating. All other ADC blocks shut down.
32
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
OFFSET GAIN
ERROR ERROR
1024
1023
1022
1021
1020
1019
1018
IDEAL
TRANSFER CURVE
9
8
CENTER OF A
STEP OF THE ACTUAL
TRANSFER CURVE
7
ACTUAL
TRANSFER CURVE
6
5
INTEGRAL
NON-LINEARITY
4
3
2
1
1
2
OFFSET
ERROR
3
4
5
6
7
8
9
1015 1016 1017 1018 1019 1020 1021 1022 1023 1024
LSB
DNL
LH7A404-154
Figure 6. ADC Transfer Characteristics
AC Test Conditions
PARAMETER
RATING
UNIT
DC I/O Supply Voltage (VDD)
3.0 to 3.6
V
DC Core Supply Voltage (VDDC)
1.7 to 1.9
V
Input Pulse Levels
VSS to 3
V
2
ns
VDD/2
V
Input Rise and Fall Times
Input and Output Timing Reference Levels
Product data sheet
33
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
CURRENT CONSUMPTION BY OPERATING MODE
Current consumption can depend on a number
of parameters. To make these data more usable, the
values presented in Table 11 were derived under the
conditions described here.
Maximum Specified Value
PERIPHERAL CURRENT CONSUMPTION
In addition to the modal current consumption, Table
10 shows the typical current consumption for each
of the on-board peripheral blocks. The values were
determined with the peripheral clock running at 200
MHz, typical conditions, and no I/O loads. This current
is supplied by the 1.8 V power supply.
The values specified in the MAXIMUM column were
determined using these operating characteristics:
• All IP blocks either operating or enabled at maximum
frequency and size configuration
• Core operating at maximum power configuration
• All voltages at maximum specified values
Table 10. Peripheral Current Consumption
PERIPHERAL
TYPICAL
UNITS
AC97
1.3
mA
UART (each)
1.0
mA
0.005
mA
0.1
mA
5.4 (+1.0)
mA
RTC
• Nominal specified ambient temperature.
Timers (each)
Typical
LCD (+I/O)
The values in the TYPICAL column were determined
using a ‘typical’ application under ‘typical’ environmental
conditions and the following operating characteristics:
MMC
0.6
mA
SCI
23
mA
PWM (each)
45
A
BMI-SWI
1.0
mA
BMI-SBus
1.0
mA
• LINUX operating system running from SDRAM
• UART and AC97 peripherals operating; all other
peripherals as needed by the OS
• LCD enabled with 320 × 240 × 16-bit color, 60 Hz
refresh rate, data in SDRAM
SDRAM (+I/O)
1.5 (+14.8)
mA
USB Device (+PLL)
5.6 (+3.3)
mA
• I/O loads at nominal
ACI
0.8
mA
• Cache enabled
VIC
610
A
• FCLK = 200; HCLK = 100; PCLK = 50 MHz
KMI
38
A
• All voltages at typical values
USB Host
715
A
• Nominal case temperature.
ADC/TSC
590
A
Table 11. Current Consumption by Mode
SYMBOL PARAMETER FCLK = 200 MHz (TYP.) FCLK = 266 MHz (TYP.) UNITS
RUN MODE
ICORE
Core Current
132
199
mA
IIO
I/O Current
15
29
mA
HALT MODE (All Peripherals Disabled)
ICORE
Core Current
40
58
mA
IIO
I/O Current
1
2
mA
STANDBY MODE (Typical Conditions Only)
ICORE
Core Current
66
200
A
IIO
I/O Current
4
4
A
NOTES:
1. FCLK = 200 MHZ pertains to LH7A404-N0E-000-xx and LH7A404-N0F-000-xx
2. FCLK = 266 MHz pertains to LH7A404-N0E-092-xx and LH7A404-N0F-092-xx.
34
Product data sheet
32-Bit System-on-Chip
NXP Semiconductors
AC Specifications
All signals described in Table 12 relate to transitions following an internal reference clock signal.
The illustration in Figure 7 represents all cases of
these sets of measurement parameters.
The reference clock signals in this design are:
• HCLK, internal System Bus clock (‘C’ in timing data)
• PCLK, the Peripheral Bus clock
• SSPCLK, the Synchronous Serial Port clock
• UARTCLK, the UART Interface clock
• LCDDCLK, the LCD Data clock from the
LCD Controller
• ACBITCLK, the AC97 and ACI clock
• SCLK, the Synchronous Memory clock.
All signal transitions are measured from the 50 %
point of the clock to the 50 % point of the signal.
LH7A404
For outputs from the LH7A404, tOVXXX (e.g. tOVA)
represents the amount of time for the output to become
valid from the rising edge of the reference clock signal.
Maximum requirements for tOVXXX are shown in
Table 12.
The signal tOHXXX (e.g. tOHA) represents the
amount of time the output must be held valid after the
rising edge of the reference clock signal. Minimum
requirements for tOHXXX are listed in Table 12.
For inputs, tISXXX (e.g. tISD) represents the
amount of setup time the input signal must be valid after
a valid address bus, or rising edge of the peripheral
clock. Maximum requirements for tISXXX are shown in
Table 12.
The signal tIHXXX (e.g. tIHD) represents the
amount of time the output must be held valid following
the rising edge of the reference clock signal. Minimum
requirements are shown in Table 12.
REFERENCE
CLOCK
tOVXXX
tOHXXX
OUTPUT
SIGNAL (O)
tISXXX tIHXXX
INPUT
SIGNAL (I)
LH7A404-9
Figure 7. LH7A404 Signal Timing
Product data sheet
35
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
Table 12. AC Signal Characteristics
SIGNAL
TYPE
LOAD
SYMBOL
MIN.
MAX.
DESCRIPTION
NOTES
Output
50 pF
tRC
4 × tHCLK – 7.0 ns 4 × tHCLK + 7.5 ns Read Cycle Time
1
Output
50 pF
tWC
4 × tHCLK – 7.0 ns 4 × tHCLK + 7.5 ns Write Cycle Time
1
—
—
tWS
tHCLK ns
tHCLK ns
tDVWE
tHCLK – 6.0 ns
tDHWE
tDVBE
tDHBE
tHCLK – 7.0 ns
ASYNCHRONOUS MEMORY INTERFACE SIGNALS (+ [wait states × HCLK period])
A[27:0]
Output
50 pF
D[31:0]
Input
—
nWE
Output
Output
50 pF
50 pF
nBLE (Write)
Output
Output
50 pF
50 pF
Output
50 pF
SA[13:0]
Output
50 pF
A[17:16]/
SB[1:0]
Output
50 pF
Output
50 pF
D[31:0]
Input
nCAS
nRAS
Output
Output
—
50 pF
50 pF
1
tHCLK – 7.0 ns
tHCLK + 2.0 ns
Data Hold after Write Edge (nWE invalid)
1
tHCLK – 5.0 ns
tHCLK – 1.0 ns
Data Valid to nBLE Invalid
1
tHCLK + 3.0 ns
Data Hold after nBLE Invalid
1
15 ns
—
Data Setup to nCSx Invalid
1
0 ns
—
Data Hold to nCSx Invalid
1
tDSOE
15 ns
—
Data Setup to nOE Invalid
1
tDHOE
0 ns
—
Data Hold to nOE Invalid
1
tDSBE
15 ns
—
Data Setup to nBLE Invalid
1
tDHBE
0 ns
—
Data Hold to nBLE Invalid
1
2 × tHCLK – 3.0 ns 2 × tHCLK + 3.0 ns nCSx Width
1
tAVCS
tHCLK – 4.0 ns
tHCLK
tAHCS
tHCLK
tHCLK + 4.5 ns
Address Hold after nCSx Invalid
1
tWE
tHCLK – 2.0 ns
tHCLK + 1.0 ns
nWE Width
1
Address Valid to nCSx Valid
1
tAVWE
tHCLK – 4.0 ns
tHCLK ns
Address Valid to nWE Valid
tCSHWE
tHCLK – 1.0 ns
tHCLK + 2.0 ns
nCSx Hold after nWE Invalid
2 × tHCLK – 3.0 ns 2 × tHCLK + 3.0 ns nOE Width
1
1
1
tAVOE
tHCLK – 4.0 ns
tHCLK
tAHOE
tHCLK
tHCLK + 4.5 ns
tBEW
tHCLK – 5.0 ns
tHCLK
tAVBE
tHCLK – 2.0 ns
tHCLK
Address Valid to nBLE Valid
1
tCSHBE
tHCLK
tHCLK + 3.0 ns
nCSx Hold after nBLE Invalid
1
tBER
nBLE (Read)
Data Valid to Write Edge (nWE invalid)
tDSCS
tOE
nOE
1
tHCLK – 2.0 ns
tDHCS
tCS
nCS[7:0]
Wait State Width
Address Valid to nOE Valid
1
nBLE Width
1
2 × tHCLK – 5.0 ns 2 × tHCLK + 3.0 ns nBLE Width
tAVBE
tHCLK – 2.0 ns
tHCLK
tAHBE
tHCLK
tHCLK + 4.5 ns
1
Address Valid to nBLE Valid
1
Address Hold after nBLE Invalid
1
SYNCHRONOUS MEMORY INTERFACE SIGNALS (‘-092’ parts/’-000’ parts)
tOVA
—
5.5/7.5 ns
Address Valid
tOHA
1.5/1.5 ns
—
tOVB
—
5.5/7.5 ns
tOHD
1.5ns
tOVD
2 ns
tISD
1.5/2.5 ns
1
Address Hold after nOE Invalid
2
Address Hold
2
Bank Select Valid
2
—
Data Hold
2
5.5/7.5 ns
Data Valid
2
—
Data Setup
2
tIHD
1.0/1.5 ns
—
Data Hold
2
tOVCA
2 ns
5.5/7.5 ns
CAS Valid
2
tOHCA
1.5/2 ns
—
CAS Hold
2
tOVRA
2 ns
5.5/7.5 ns
RAS Valid
2
tOHRA
1.5/2 ns
—
tOVSDW
2 ns
5.5/7.5 ns
RAS Hold
2
Write Enable Valid
2
nSWE
Output
50 pF
tOHSDW
1.5/2 ns
—
Write Enable Hold
2
SCKE[1:0]
Output
50 pF
tOVC0
2 ns
5.5/7.5 ns
Clock Enable Valid
2
DQM[3:0]
Output
50 pF
tOVDQ
2 ns
5.5/7.5 ns
Data Mask Valid
2
nSCS[3:0]
Output
50 pF
tOVSC
2 ns
5.5/7.5 ns
Synchronous Chip Select Valid
2
tOHSC
1.5/2 ns
—
Synchronous Chip Select Hold
2
PCMCIA INTERFACE SIGNALS (+ [wait states × HCLK period])
nPCREG
36
Output
50 pF
tOVDREG
—
tHCLK + 5 ns
nREG Valid
tOHDREG
4 × tHCLK – 5 ns
—
nREG Hold
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Table 12. AC Signal Characteristics (Cont’d)
SIGNAL
TYPE
LOAD
Output
50 pF
Input
—
Output
50 pF
D[31:0]
nPCCE1
nPCCE2
nPCOE
nPCWE
PCDIR
Output
Output
Output
Output
50 pF
50 pF
50 pF
50 pF
SYMBOL
MIN.
MAX.
DESCRIPTION
tOVD
—
tHCLK + 5 ns
Data Valid
tOHD
4 × tHCLK – 6 ns
—
Data Hold
tISD
—
tHCLK - 10 ns
Data Setup Time
tIHD
4 × tHCLK – 5 ns
—
Data Hold Time
tOVCE1
—
tHCLK + 5 ns
tOHCE1
4 × tHCLK – 5 ns
—
Chip Enable 1 Hold
tOVCE2
—
tHCLK + 5 ns
Chip Enable 2 Valid
tOHCE2
4 × tHCLK – 5 ns
—
Chip Enable 2 Hold
tOVOE
—
tHCLK + 5 ns
Output Enable Valid
NOTES
Chip Enable 1 Valid
tOHOE
3 × tHCLK – 5 ns
—
Output Enable Hold
tOVWE
—
n × tHCLK + 5 ns
Write Enable Valid
tOHWE
3 × tHCLK – 5 ns
—
tOVPCD
—
tHCLK + 5 ns
Card Direction Valid
Write Enable Hold
tOHPCD
4 × tHCLK – 5 ns
—
Card Direction Hold
MMC INTERFACE SIGNALS
MMCCMD
MMCDATA
MMCDATA
MMCCMD
Output
Output
Input
Input
50 pF
50 pF
—
—
tOVCMD
—
½tcyc – 3 ns
MMC Command Valid
tOHCMD
½tcyc + 3 ns
—
MMC Command Hold
3
tOVDAT
—
½tcyc – 3 ns
MMC Data Valid
3
tOHDAT
½tcyc + 3 ns
—
MMC Data Hold
3
tISDAT
5 ns
—
MMC Data Setup
tIHDAT
5 ns
—
MMC Data Hold
tISCMD
5 ns
—
MMC Command Setup
5 ns
—
MMC Command Hold
tIHCMD
3
AC97 INTERFACE SIGNALS
ACOUT
ACIN
ACSYNC
Output
50 pF
Input
—
Output
50 pF
tOVAC97
—
½tcyc – 10 ns
AC97 Output Valid
4
tOHAC97
½tcyc + 10 ns
—
AC97 Output Hold
4
AC97 Input Setup
tISAC97
2.5 ns
—
tIHAC97
2.5 ns
—
tOVAC97
—
½tcyc – 10 ns
AC97 Synchronization Valid
4
tOHAC97
½tcyc + 10 ns
—
AC97 Synchronization Hold
4
AC97 Input Hold
SYNCHRONOUS SERIAL PORT (SSP)
SSPFRM
SSPTX
Output
Output
50 pF
50 pF
SSPRX
Input
—
SSPCLK
Output
50 pF
tOVFRM
—
10 ns
tOHFRM
5 ns
—
tOVTX
10 ns
SSP Frame Output Valid
SSP Frame Output Hold
SSP Transmit Valid
tOHTX
5 ns
—
SSP Transmit Hold
tISRX
14 ns
—
SSP Receive Setup
tIHRX
14 ns
—
SSP Receive Hold
tCLK
8.819 ms
271 ns
SSP Clock Period
AUDIO CODEC INTERFACE (ACI)
ACOUT
ACIN
Output
50 pF
Input
tOVD
—
15 ns
tOHD
10 ns
—
ACOUT delay from rising clock edge
ACOUT Hold
tIS
10 ns
—
ACIN Setup
tIH
2.5 ns
—
ACIN Hold
COLOR LCD CONTROLLER
LCDVD [17:0] Output
50 pF
tOV
—
3 ns
LCD Data Clock to Data Valid
NOTES:
1. Register BCRx:WST1 = 0b000
2. The ‘x/x’ in the MIN./MAX. indicates (LH7A404-N0E-092-xx and H7A404-N0F-092-xx)/
(LH7A404-N0E-000-xx and LH7A404-N0F-000-xx), respectively.
3. ‘tcyc’ is the period of one MMC Clock
4. ‘tcyc’ is the period of one AC97 Clock
5. ‘nC’ in the MIN./MAX. columns indicates the number of system clock (HCLK) periods after valid address
6. For Output Drive strength specifications, refer to Table 2
Product data sheet
37
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
SMC Waveforms
Figure 8 and Figure 9 show waveforms and timing
for an external asynchronous memory Write. Figure 10
and Figure 11 show the waveforms and timing for an
external asynchronous memory Read.
0
1
2
3
4
HCLK
tWC
A[27:0]
VALID ADDRESS
tDVWE,
tDVBE
D[31:0]
tDHWE,
tDHBE
VALID DATA
tCS
tAVCS
nCSx
tAHCS
nCS Valid
tAVWE
tWE
tCSHWE
nWE Valid
nWE
WRITE EDGE
tAVBE
nBLE
tBEW
tCSHBE
nBLE Valid
LH7A404-10
Figure 8. External Asynchronous Memory Write, Zero Wait States (BCRx:WST1 = 0b000)
38
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
0
1
2
3
4
5
6
7
8
HCLK
A[27:0]
VALID ADDRESS
D[31:0]
VALID DATA
nCSx
nCSx Valid
WRITE EDGE
nWE
nWE Valid
nBLE
nBLE Valid
WAIT
WAIT
WAIT
WAIT
STATE 1 STATE 2 STATE 3 STATE 4
0 WAIT STATE
tWS
tWS
tWS
tWS
LH7A404-189
Figure 9. External Asynchronous Memory Write, Four Wait States (BCRx:WST1 = 0b100)
Product data sheet
39
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
0
1
2
3
4
HCLK
tRC
tAHCS,
tAHOE, tAHBE
A[27:0]
VALID ADDRESS
VALID
DATA
D[31:0]
tDSCS
tAVCS
tCS
DATA
LATCHED
HERE
tDHCS
nCSx
nCS Valid
tDSOE
tAVOE
tOE
tDHOE
nOE
nOE Valid
tDSBE
tAVBE
tBER
tDHBE
nBLE
nBLE Valid
LH7A404-190
Figure 10. External Asynchronous Memory Read, Zero Wait States (BCRx:WST1 = 0b000)
40
Product data sheet
32-Bit System-on-Chip
0
LH7A404
NXP Semiconductors
1
2
3
4
5
6
7
8
9
10
HCLK
A[27:0]
VALID ADDRESS
nCS[3:0,
CS[7:6]
nCSx Valid
nOE
nOE Valid
nBLE
nBLE Valid
D[31:0]
VALID DATA
0 WAIT STATE,
DATA WOULD BE
LATCHED HERE
WAIT
WAIT
WAIT
WAIT
STATE 1 STATE 2 STATE 3 STATE 4
tWS
tWS
tWS
tWS
4 WAIT STATES,
DATA LATCHED
HERE
LH7A404-12
Figure 11. External Asynchronous Memory Read, Four Wait States (BCRx:WST1 = 0b100)
Product data sheet
41
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
TIMING FOR nWAIT SIGNALLING
In addition to being able to program the number of
Wait States, the SMC also can use nWAIT signalling to
extend transactions. When the nWAIT input is asserted,
the current transaction is held in suspense until nWAIT
is released, allowing slow memory or memory-mapped
peripherals time to complete the action.
Figure 12 through Figure 17 illustrate nWAIT
timing using different WST register settings and
circumstances.
tDD_nWAIT_nCS(x)
tDA_nCS(x)_nWAIT
tDD_nWAIT_nOE
nCS(x)
nOE
tA_nWAIT
nWAIT
SQ-4
SQ-3
SQ-2
SQ-1
SQ-0
HCLK
Transaction
Sequence
WSD-2
DELAY
WSD-1
DELAY
SQ-4
WSD-0 nWAIT
DELAY DELAY
SQ-3
nWAIT
DELAY
SQ-2
nWAIT
DELAY
SQ-1
nWAIT
DELAY
SQ-0
nWAIT
DELAY
END
CYCLE
NOTES:
SQ: nWAIT Sampled and Queued
SI: nWAIT Sampled and Ignored
LH7A404-203
Figure 12. nWAIT Read Sequence (BCRx:WST1 = 2); Minimum Wait State Example
PARAMETER
DESCRIPTION
tDA_nCS(x)_nWAIT
Delay from nCS(x) assertion to nWAIT assertion
tDD_nWAIT_nCS(x)
Delay from nWAIT deassertion to nCS(x) deassertion
tDD_nWAIT_nOE
Delay from nWAIT deassertion to nOE deassertion
tA_nWAIT
Assertion time of nWAIT
NOTES:
1. The timing relationship is specified as a cycle-based timing.
Variations caused by clock jitter, power rail noise, and I/O condtioning will cause these timings to vary nominally. It is recommended that designers add a small margin to avoid possible
corner-case conditions.
2. The Bank Configuration Register (BCRx:WST1) must have Read
Wait States set to a minimum of 2.
3. The number of HCLK periods that nWAIT lags assertion of nCSx
must be added to the minimum value for BCRx:WST1. For example, if nWAIT lags nCSx by 3 HCLK periods, the minimum setting
of BCRx:WST1 is 2 + 3, or a total of 5 as the minimum value for
BCRx:WST1.
42
MIN.
MAX.
UNIT 1
0
29
HCLK periods
4
HCLK periods
4
2
HCLK periods
HCLK periods
4. No nWAIT delay cycles are added for any nWAIT assertions that
occur prior to the beginning of the WSD-2 delay. These nWAIT
assertions are ignored.
5. Once the WSD-2 delay begins, one HCLK cycle is added to the
transaction each time nWAIT is sampled and queued (SQ-x). The
nWAIT cycles begin being added after the Wait State Countdown
reaches WSD-0.
6. Once nWAIT is sampled HIGH (de-asserted), the current memory
transaction is queued to complete.
7. Since static and dynamic memory cannot be accessed at the
same time, prolonged extension of an SMC transaction by either
Wait States or nWAIT delays can cause refresh failure for the
SDRAM, and may cause SDRAM data loss.
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
tDD_nWAIT_nCS(x)
tDA_nCS(x)_nWAIT
tDD_nWAIT_nOE)
nCS(x)
nOE
tA_nWAIT
nWAIT
SI
SI
SQ-4
SQ-3
SQ-2
SQ-1
SQ-0
HCLK
Transaction
Sequence
WSD-4
DELAY
WSD-3
DELAY
WSD-2
DELAY
WSD-1
DELAY
WSD-0
DELAY
SQ-4
nWAIT
DELAY
SQ-3
nWAIT
DELAY
SQ-2
nWAIT
DELAY
SQ-1
nWAIT
DELAY
SQ-0
nWAIT
DELAY
END
CYCLE
NOTES:
SQ: nWAIT Sampled and Queued
SI: nWAIT Sampled and Ignored
LH7A404-204
Figure 13. nWAIT Read Sequence (BCRx:WST1 = 4); Ignored and Queued nWAIT Delays
tDA_nCS(x)_nWAIT
nCS(x)
nOE
tA_nWAIT
nWAIT
SI
SI
HCLK
Transaction
Sequence
NOTES:
SQ: nWAIT Sampled and Queued
SI: nWAIT Sampled and Ignored
WSD-4
DELAY
WSD-3
DELAY
WSD-2
DELAY
WSD-1
DELAY
WSD-0
DELAY
END
CYCLE
LH7A404-205
Figure 14. nWAIT Read Sequence (BCRx:WST1 = 4); nWAIT Has No Effect On Current Transaction
Product data sheet
43
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
tDD_nWAIT_nCS(x)
tDA_nCS(x)_nWAIT
tDD_nWAIT_nWE
nCS(x)
nWE
tA_nWAIT
nWAIT
SQ-4
SQ-3
SQ-2
SQ-1
SQ-0
HCLK
Transaction
Sequence
WSD-2
DELAY
WSD-1
DELAY
WSD-0
DELAY
SQ-4
nWAIT
DELAY
SQ-3
nWAIT
DELAY
SQ-2
nWAIT
DELAY
SQ-1
nWAIT
DELAY
SQ-0
nWAIT
DELAY
END
CYCLE
NOTES:
SQ: nWAIT Sampled and Queued
SI: nWAIT Sampled and Ignored
LH7A404-206
Figure 15. nWAIT Write Sequence (BCRx:WST1 = 2); Minimum Wait State Example
PARAMETER
DESCRIPTION
MIN.
MAX.
UNIT1
0
29
HCLK periods
tIDA_nCS(x)_nWAIT
Delay from nCS(x) assertion to nWAIT assertion
tDD_nWAIT_nCS(x)
Delay from nWAIT deassertion to nCS(x) deassertion
4
HCLK periods
tDD_nWAIT_nWE
Delay from nWAIT deassertion to nWE deassertion
3
HCLK periods
tA_nWAIT
Assertion time of nWAIT
2
HCLK periods
NOTES:
1. The timing relationship is specified as a cycle-based timing. Variations caused by clock jitter,
power rail noise, and I/O condtioning will cause these timings to vary nominally. It is recommended that
designers add a small margin to avoid possible corner-case conditions.
2. The Bank Configuration Register (BCRx:WST1) must have Write Wait States set to a minimum of 2.
3. The number of HCLK periods that nWAIT lags assertion of nCSx must be added to the minimum value
for BCRx:WST1. For example, if nWAIT lags nCSx by 3 HCLK periods, the minimum setting of BCRx:WST1
is 2 + 3, or a total of 5 as the minimum value for BCRx:WST1.
4. No nWAIT delay cycles are added for any nWAIT assertions that occur prior to the beginning of the WSD-2 delay. These
nWAIT assertions are ignored.
5. Once the WSD-2 delay begins, one HCLK cycle is added to the transaction each time nWAIT is
sampled and queued (SQ-x). The nWAIT cycles begin being added after the Wait State Countdown reaches WSD-0.
6. Once nWAIT is sampled HIGH (de-asserted), the current memory transaction is queued to complete.
7. Since static and dynamic memory cannot be accessed at the same time, prolonged extension of
an SMC transaction by either Wait States or nWAIT delays can cause refresh failure for the SDRAM,
and may cause SDRAM data loss.
44
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
tDD_nWAIT_nCS(x)
tDA_nCS(x)_nWAIT
tDD_nWAIT_nWE
nCS(x)
nWE
tA_nWAIT
nWAIT
SI
SI
SQ-4
SQ-3
SQ-2
SQ-1
SQ-0
HCLK
Transaction
Sequence
WSD-4
DELAY
WSD-3
DELAY
WSD2
DELAY
WSD-1
DELAY
WSD-0
DELAY
SQ-4
nWAIT
DELAY
SQ-3
nWAIT
DELAY
SQ-2
nWAIT
DELAY
SQ-1
nWAIT
DELAY
SQ-0
nWAIT
DELAY
END
CYCLE
NOTES:
SQ: nWAIT Sampled and Queued
SI: nWAIT Sampled and Ignored
LH7A404-207
Figure 16. nWAIT Write Sequence (BCRx:WST1 = 4); Ignored and Queued nWAIT Delays
Product data sheet
45
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
tDA_nCS(x)_nWAIT
nCS(x)
nWE
tA_nWAIT
nWAIT
SI
SI
HCLK
Transaction
Sequence
WSD-4
DELAY
WSD-3
DELAY
WSD-2
DELAY
WSD-1
DELAY
WSD-0
DELAY
END
CYCLE
NOTES:
SQ: nWAIT Sampled and Queued
SI: nWAIT Sampled and Ignored
LH7A404-208
Figure 17. nWAIT Write Sequence (BCRx:WST1 = 4); nWAIT Has No Effect On Current Transaction
46
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Synchronous Memory Controller Waveforms
Figure 18 shows the waveform and timing for a Synchronous Burst Read (page already open). Figure 19
shows the waveform and timing for synchronous memory to activate a bank and Write.
SCLK
tOHXXX
SDRAMcmd
READ
tOVB
tOVXXX
SA[13:0],
SBANK[1:0]
tOVA
BANK,
COLUMN
tISD tIHD
D[31:0]
NOTES:
1. SDRAMcmd is the combination of nRAS, nCAS, nSDWE, and nSDCSx.
2. tOVXXX represents tOVRA, tOVCA, tOVSDW, or tOVSC.
3. tOHXXX represents tOHRA, tOHCA, tOHSDW, or tOHSC.
4. nDQM is static LOW.
5. SDCKE is static HIGH.
DATA n + 2
DATA n
DATA n + 1
DATA n + 3
LH7A404-13
Figure 18. Synchronous Burst Read
SCLK
tOVC
SCKE
tOVXXX
tOHXXX
ACTIVE
SDRAMcmd
WRITE
tOHA
SA[13:0],
SB[1:0]
BANK,
ROW
BANK,
COLUMN
tOVA
DATA
D[31:0]
NOTES:
1. SDRAMcmd is the combination of nRAS, nCAS, nSWE, and nSCSx.
2. tOVXXX represents tOVRA, tOVCA, tOVSVW, or tOVSC. Refer to the AC timing table.
3. tOHXXX represents tOHRA, tOHCA, tOHSVW, or tOHSC.
tOVD
tOHD
LH7A400-24
Figure 19. Synchronous Bank Activate and Write
Product data sheet
47
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
SSP Waveforms
The Synchronous Serial Port (SSP) supports three
data frame formats:
SSPFRM signal marks the beginning and end of a
frame.
• National Semiconductor MICROWIRE
Figure 20 and Figure 21 show Texas Instruments
synchronous serial frame format, Figure 22 through
Figure 29 show the Motorola SPI format, and Figure 30
and Figure 31 show National Semiconductor’s MICROWIRE data frame format.
Each frame format is between 4 and 16 bits in
length, depending upon the programmed data size.
Each data frame is transmitted beginning with the
Most Significant Bit (MSB) i.e. ‘big endian’. For all
three formats, the SSP serial clock is held LOW (inactive) while the SSP is idle. The SSP serial clock transitions only during active transmission of data. The
For Texas Instruments SSI format, the SSPFRM pin
is pulsed prior to each frame’s transmission for one
serial clock period beginning at its rising edge. For this
frame format, both the SSP and the external slave
device drive their output data on the rising edge of the
clock and latch data from the other device on the falling
edge. See Figure 20 and Figure 21.
• Texas Instruments SSI
• Motorola SPI
tCLK
SSPCLK
SSPFRM
tOHFRM
tISRX
SSPTX/
SSPRX
MSB
tOVFRM
LSB
4 to 16 BITS
LH7A404-24a
Figure 20. Texas Instruments Synchronous Serial Frame Format (Single Transfer)
SSPCLK
SSPFRM
SSPTXD/
SSPRXD
MSB
LSB
4 to 16 BITS
LH7A404-25
Figure 21. Texas Instruments Synchronous Serial Frame Format (Continuous Transfer)
48
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
For Motorola SPI, the serial frame pin (SSPFRM) is
active LOW. The SPO and SPH bits in SSP Control
Register 0 determine SSPCLK and SSPFRM operation
in single and continuous modes. See Figures 22
through 29.
SSPCLK
nSSPFRM
SSPRXD
LSB
MSB
Q
4 to 16 BITS
MSB
SSPTXD
LSB
NOTE: Q is undefined.
LH7A404-26
Figure 22. Motorola SPI Frame Format (Single Transfer) with SPO = 0 and SPH = 0
SSPCLK
nSSPFRM
SSPTXD/
SSSRXD
LSB
LSB
MSB
MSB
4 to 16 BITS
LH7A404-27
Figure 23. Motorola SPI Frame Format (Continuous Transfer) with SPO = 0 and SPH = 0
SSPCLK
nSSPFRM
SSPRXD
Q
LSB
MSB
Q
4 to 16 BITS
SSPTXD
NOTE: Q is undefined.
MSB
LSB
LH7A404-28
Figure 24. Motorola SPI Frame Format (Single Transfer) with SPO = 0 and SPH = 1
Product data sheet
49
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
SSPCLK
nSSPFRM
SSPTXD/
SSSRXD
LSB
MSB
LSB
MSB
4 to 16 BITS
LH7A404-29
Figure 25. Motorola SPI Frame Format (Continuous Transfer) with SPO = 0 and SPH = 1
SSPCLK
nSSPFRM
SSPTXD/
SSSRXD
LSB
MSB
LSB
MSB
4 to 16 BITS
LH7A404-30
Figure 26. Motorola SPI Frame Format (Continuous Transfer) with SPO = 1 and SPH = 1
SSPCLK
nSSPFRM
SSPRXD
LSB
MSB
Q
4 to 16 BITS
SSPTXD
NOTE: Q is undefined.
MSB
LSB
LH7A404-31
Figure 27. Motorola SPI Frame Format (Single Transfer) with SPO = 1 and SPH = 0
50
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
SSPCLK
nSSPFRM
SSPTXD/
SSPRXD
LSB
MSB
LSB
MSB
4 to 16 BITS
LH7A404-32
Figure 28. Motorola SPI Frame Format (Continuous Transfer) with SPO = 1 and SPH = 0
SSPCLK
nSSPFRM
SSPRXD
Q
MSB
LSB
Q
4 to 16 BITS
SSPTXD
NOTE: Q is undefined.
MSB
LSB
LH7A404-33
Figure 29. Motorola SPI Frame Format (Single Transfer) with SPO = 1 and SPH = 1
Product data sheet
51
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
For National Semiconductor MICROWIRE format,
the serial frame pin (SSPFRM) is active LOW. Both the
SSP and external slave device drive their output data
on the falling edge of the clock, and latch data from the
other device on the rising edge of the clock. Unlike the
full-duplex transmission of the other two frame formats,
the National Semiconductor MICROWIRE format utilizes a master-slave messaging technique that operates in half-duplex. When a frame begins in this mode,
an 8-bit control message is transmitted to the off-chip
slave. During this transmission no incoming data is
received by the SSP. After the message has been sent,
the external slave device decodes the message. After
waiting one serial clock period after the last bit of the 8bit control message was received it responds by returning the requested data. The returned data can be 4 to
16 bits in length, making the total frame length between
13 to 25 bits. See Figure 30 and Figure 31.
SSPCLK
nSSPFRM
SSPTXD
MSB
LSB
8-BIT CONTROL
SSPRXD
0
LSB
MSB
4 to 16 BITS
OUTPUT DATA
LH7A404-34
Figure 30. MICROWIRE Frame Format (Single Transfer)
SSPCLK
nSSPFRM
SSPTXD
LSB
MSB
LSB
8-BIT CONTROL
SSPRXD
0
MSB
LSB
MSB
4 to 16 BITS
OUTPUT DATA
LH7A404-35
Figure 31. MICROWIRE Frame Format (Continuous Transfers)
52
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
tCLK
SSPCLK
(Programmable
CLOCK phase)
CLOCK
PHASE 1
CLOCK
PHASE 2
tOVTX
tOHTX
BITn
OUTPUT
SSPTX
tISRX
BITn-1
OUTPUT
tIHRX
BITn
INPUT
SSPRX
tOVFRM
BITn-1
INPUT
tOHFRM
SSPFRM
(Programmable
FRAME phase
and duration)
LH7A404-199
Figure 32. General SSP Timing
Product data sheet
53
LH7A404
NXP Semiconductors
32-Bit System-on-Chip
PC Card (PCMCIA) Waveforms
Figure 33 shows the waveforms for PCMCIA Read
transactions and Figure 34 shows the waveforms and
timing for Write transactions. Figure 35 shows the precharge, access, and hold timing relationships.
PRECHARGE ACCESS
HOLD
TIME
TIME
TIME
(See Note 1) (See Note 1) (See Note 1)
HCLK
A[25:0]
ADDRESS
nPCREG
tOVDREG
tOHDREG
nPCCEx
(See Note 2)
tOVCEx
tOHCEx
PCDIR
tOVPCD
tOHPCD
DATA
D[31:0]
tISD
tIHD
nPCOE/
nPCIOR
tOVOE
tOHOE
NOTES:
1. Precharge time, access time, and hold
time are programmable wait-state times.
2.
nPCCE1 nPCCE2
0
0
1
1
0
1
0
1
TRANSFER TYPE
Common Memory
Attribute Memory
I/O
None
LH7A404-15
Figure 33. PCMCIA Read Transfer
54
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
PRECHARGE ACCESS
HOLD
TIME
TIME
TIME
(See Note 1) (See Note 1) (See Note 1)
HCLK
A[25:0]
ADDRESS
nPCREG
tOVDREG
tOHDREG
nPCCEx
(See Note 2)
tOVCEx
tOHCEx
PCDIR
tOVPCD
D[15:0]
DATA
tOVD
tOHD
nPCWE/
nPCIOW
tOVWE
tOHWE
NOTES:
1. Precharge time, access time, and hold
time are programmable wait-state times.
2.
nPCCE1 nPCCE2
0
0
0
1
1
0
1
1
TRANSFER TYPE
Common Memory
Attribute Memory
I/O
None
LH7A404-16
Figure 34. PCMCIA Write Transfer
ACCESS
nPCWE,
nPCOE,
nPCIOW,
nPCIOR
PRECHARGE
HOLD
nCSx
LH7A404-194
Figure 35. PCMCIA Precharge, Access, and Hold Waveform
Product data sheet
55
LH7A404
NXP Semiconductors
32-Bit System-on-Chip
MMC Interface Waveforms
AC97 Interface Waveforms
Figure 36 shows the waveforms and timing for an
MMC command or data Write. Figure 37 shows the waveforms and timing for an MMC command or data Read.
Figure 38 shows the waveforms and timing for the
AC97 interface Data Setup and Hold.
MMCCLK
tMMCCLK
MMCCMD
tOVCMD
tOHCMD
tOVDAT
tOHDAT
MMCDATA
LH7A404-19
Figure 36. MMC Command/Data Write
MMCCLK
MMCCMD
tISCMD tIHCMD
MMCDATA
tISDAT tIHDAT
LH7A404-20
Figure 37. MMC Command/Data Read
tACBITCLK
ACBITCLK
tOVAC97
tOHAC97
ACOUT/ACSYNC
tISAC97 tIHAC97
ACIN
LH7A404-21
Figure 38. AC97 Data Setup and Hold
56
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Audio Codec Interface (ACI) Timing
Color LCD Controller Waveforms
The timing for the Audio Codec Interface are shown
in Figure 39 and Figure 40. Transmit data is clocked on
the rising edge of ACBITCLK (whether transmitted by
the LH7A404 ACI or by the external codec chip);
receive data is clocked on the falling edge. This allows
full-speed, full duplex operation.
Figure 41 shows the Valid Output Setup Time for
LCD data. Timing diagrams for each CLCDC mode are
represented in Figure 42 through Figure 47.
ACBITCLK
tOVD
tOHD
ACSYNC/ACOUT
ACIN
tIS
tIH
LH7A404-178
Figure 39. ACI Signal Timing
ACBITCLK
ACSYNC
BIT
ACIN
7
6
5
4
3
2
1
0
7
6
ACIN
SAMPLED ON
FALLING EDGE
LH7A404-153
Figure 40. ACI Data Stream
LCDDCLK
tOV
LCDVD
(SoC Output)
DATA VALID
LH7A404-198
Figure 41. CLCDC Valid Output Data Time
Product data sheet
57
58
LCDDCLK IS
SUPPRESSED
DURING LCDLLP
TIMING0:HSW
2.
Circled numbers are LH7A404 pin numbers.
ENUMERATED
IN 'LCDDCLKS'
HORIZONTAL
BACK PORCH
TIMING0:HBP
D001 D002
DNNN
ONE 'LINE' OF LCD DATA
D....
16 × (TIMING0:PPL+1)
ENUMERATED
IN 'LCDDCLKS'
HORIZONTAL
FRONT PORCH
TIMING0:HFP
LH7A404-98
NXP Semiconductors
NOTES:
1. The active data lines will vary with the type
of STN panel: 4-bit, 8-bit, Color or Mono.
LCDVD
(LCD DATA)
(See Note 1)
Y10 LCDDCLK
(PANEL DATA CLOCK)
TIMING2:PCD
TIMING2:BCD
TIMING2:IPC
TIMING2:CPL
V2 LCDLP
(LINE SYNC PULSE)
TIMING2:IHS
CLCDC CLOCK
(INTERNAL)
TIMING2: CSEL
TIMING2: BCD
1 STN HORIZONTAL LINE
LH7A404
32-Bit System-on-Chip
Figure 42. STN Horizontal Timing
Product data sheet
Product data sheet
LCDVDDEN
(DISPLAY ENABLE)
LCDENAB
(AC BIAS)
LCDTiming2:ACB
LCDTiming2: IOE
LCDTiming1: VSW = 0
2.
Circled numbers are LH7A404 pin numbers.
NOTES:
1. Signal polarities may vary for some displays.
PIXEL DATA AND
HORIZONTAL
CONTROL
SIGNALS FOR
ONE FRAME
T4 LCDFP
(FRAME PULSE)
LCDTiming1: IVS
V9
Y10 LCDDCLK
(PANEL DATA CLOCK)
LCDTiming2:PCD
LCDTiming2: BCD
LCDTiming2: IPC
Y1
VSS
VDD
DISPLAY-DEPENDENT
TURN-ON DELAY
ENUMERATED IN
HORIZONTAL 'LINES'
BACK PORCH
LCDTiming1: VBP = 0
SEE 'STN HORIZONTAL
TIMING DIAGRAM'
ALL 'LINES' FOR ONE FRAME
LCDTiming1: LPP
AC BIAS ACTIVE
PANEL DATA CLOCK ACTIVE
PANEL LOGIC ACTIVE
PANEL NEGATIVE HIGH-VOLTAGE SUPPLY ACTIVE
PANEL POSITIVE HIGH-VOLTAGE SUPPLY ACTIVE
1 STN FRAME
ENUMERATED IN
HORIZONTAL 'LINES'
FRONT PORCH
LCDTiming1: VFP
LH7A404-97
DISPLAY-DEPENDENT
TURN-OFF DELAY
32-Bit System-on-Chip
NXP Semiconductors
LH7A404
Figure 43. STN Vertical Timing
59
60
Circled numbers are LH7A404 pin numbers.
LCDTiming0:HSW
ENUMERATED
IN 'LCDDCLKS'
HORIZONTAL
BACK PORCH
LCDTiming0:HBP
D001 D002
DNNN
ONE 'LINE' OF LCD DATA
D....
LCDTiming0:PPL
ENUMERATED
IN 'LCDDCLKS'
HORIZONTAL
FRONT PORCH
LCDTiming0:HFP
LH7A404-96
NXP Semiconductors
NOTE:
LCDVD
(LCD DATA)
GPIO PINMUX:PDOCON
GPIO PINMUX:PEOCON
GPIO PEDDR
Y10 LCDDCLK
(PANEL DATA CLOCK)
LCDTiming2:PCD
LCDTiming2:BCD
LCDTiming2:IPC
LCDTiming2:CPL
V2 LCDLP
(HORIZ. SYNC PULSE)
LCDTiming2:IHS
CLCDC CLOCK
(INTERNAL)
LCDTiming2: CSEL
LCDTiming2: BCD
1 TFT HORIZONTAL LINE
LH7A404
32-Bit System-on-Chip
Figure 44. TFT Horizontal Timing
Product data sheet
Product data sheet
Y1 LCDVDDEN
(DISPLAY ENABLE
FOR HIGH-VOLTAGE
SUPPLIES)
LCDENAB
(DATA ENABLE)
LCDTiming2:ACB
LCDTiming2: IOE
LCDTiming1: VSW
ENUMERATED IN
HORIZONTAL 'LINES'
BACK PORCH
LCDTiming1: VBP
3.
Circled numbers are LH7A404 pin numbers.
NOTES:
1. Signal polarties may vary for some displays.
2. The use of HR-CLP for high-voltage power control is optional on some TFT panels.
PIXEL DATA AND
HORIZONTAL
CONTROL
SIGNALS FOR
ONE FRAME
T4 LCDFP
(VERTICAL SYNC PULSE)
LCDTiming1: IVS
V9
SEE 'TFT HORIZONTAL
TIMING DIAGRAM'
ALL 'LINES' FOR ONE FRAME
LCDTiming1: LPP
DATA ENABLE
PANEL DATA CLOCK ACTIVE
PANEL LOGIC ACTIVE
PANEL NEGATIVE HIGH-VOLTAGE SUPPLY ACTIVE
VSS
Y10 LCDDCLK
(PANEL DATA CLOCK)
LCDTiming2:PCD
LCDTiming2: BCD
LCDTiming2: IPC
See
Note 2
PANEL POSITIVE HIGH-VOLTAGE SUPPLY ACTIVE
1 TFT FRAME
VDD
DISPLAY-DEPENDENT
TURN-ON DELAY
ENUMERATED IN
HORIZONTAL 'LINES'
FRONT PORCH
LCDTiming1: VFP
LH7A404-95
DISPLAY
DEPENDENT
TURN-OFF DELAY
32-Bit System-on-Chip
NXP Semiconductors
LH7A404
Figure 45. TFT Vertical Timing
61
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
1 AD-TFT or HR-TFT HORIZONTAL LINE
CLCDC CLOCK
(INTERNAL)
PERIPHCLKSEL2:LCSRC
PERIPHCLKCTRL2:LCDCLK
LCDCLKPRESCALE:LCDPSVAL
(SHOWN FOR REFERENCE)
TIMING0:HSW
INPUTS TO THE
ALI FROM THE CLCDC
LCDLP
(HORIZONTAL SYNC PULSE)
LCDDCLK
(PANEL DATA CLOCK)
TIMING2:PCD
TIMING2:BCD
TIMING2:IPC
TIMING2:CPL
LCDVD[17:0]
16 × (TIMING0:PPL+1)
001 002 003 004 005 006 007 008
320
PIXEL DATA
TIMING0:HSW +
TIMING0:HBP
LCDENAB
(INTERNAL DATA ENABLE)
Y10 LCDDCLK
(DELAYED FOR HR-TFT)
LCDVD[17:0]
(DELAYED FOR HR-TFT)
001 002 003 004 005 006
317 318 319 320
1 LCDDCLK
OUTPUTS FROM THE
ALI TO THE PANEL
ALITIMING2:SPLDEL
V3 LCDSPL
(LINE START PULSE LEFT)
1 LCDDCLK
ALITIMING1:LPDEL
V2 LCDLP
(HORIZONTAL SYNC PULSE)
ALITIMING1:PSCLS
ALITIMING2:PS2CLS2
U3 LCDCLS
V5 LCDPS
ALITIMING1:REVDEL
W3 LCDREV
NOTE:
Circled numbers are LH7A404 pin numbers.
LH7A404-188
Figure 46. AD-TFT and HR-TFT Horizontal Timing
LCDTiming1:VSW
T4
LCDSPS
(Vertical Sync)
1.5 µs - 4 µs
V2
LCDHRLP
(Horizontal Sync)
LCDVD
(LCD Data)
2x H-LINE
V3 LCDSPL
LH7A404-78
Figure 47. AD-TFT and HR-TFT Timing
62
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Clock and State Controller
(CSC) Waveforms
Figure 48 shows the behavior of the LH7A404 when
coming out of Reset or Power-On. Table 13 gives the
timing parameters.
At Power-On, nPOR must be held LOW until the
32.768 kHz oscillator is stable, and must be deasserted
at least two 1 Hz clock periods before the WAKEUP
signal is asserted. Once the 14.7456 MHz oscillator is
stable, the PLLs require 250 µs to lock.
On transition from Standby to Run (including a Cold
Boot), the Wakeup pin must not be asserted for two 1
Hz clock periods after assertion of nPOR to allow time
for sampling BATOK and nEXTPWR. The delay
prevents a false ‘battery good’ indication caused by
alkaline battery recovery that can immediately follow a
battery-low switch off.
nRESETOUT Timing Sequence
Timing for the nRESETOUT sequence is shown for
each of the three reset triggers (nPOR, nURESET, and
nPWRFL) in Figure 49 through Figure 51, and timing
values are presented in Table 14 through Table 16.
Table 13. Reset AC Timing
PARAMETER
DESCRIPTION
MIN. MAX.
UNIT
tOSC32 (32 kHz)
32.768 kHz Oscillator Stabilization Time after Power On*
550
ms
tOSC14 (14 MHz)
14.7456 MHz Oscillator Stabilization Time after WAKEUP
2.5
ms
NOTE: *VDDC = VDDCmin
VDDCmin
VDDC
XTAL32
tOSC32
WAKEUP
tOSC14
XTAL14
nPOR
LH7A404-22
Figure 48. PLL Start-up
NOTE: *The timing relationship is specified as a cycle-based timing. Due to variations in crystal input clock jitter,
power rail noise and I/O conditioning these timings will vary marginally. It is recommended that designers
Product data sheet
63
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
tDD_nPOR_WKUP
tDA_nPOR_CLKEN
tDA_nPOR_nRSTO
tDD_nPOR_nRSTO
tA_WKUP
tDA_WKUP_CLKEN
nPOR
TRIGGER
POINT
WAKEUP
nRESETOUT
CLKEN
LH7A404-202
Figure 49. nRESETOUT Timing for nPOR Trigger
Table 14. nRESETOUT Timing Values for nPOR Trigger
SIGNAL
MIN.
TYP.
MAX.
UNITS
DESCRIPTION
tDA_nPOR_nRSTO
30
ns
nPOR to nRESETOUT assertion delay
tDD_nPOR_nRSTO
30
ns
nPOR to nRESETOUT deassertion delay
tDD_nPOR_WKUP
2
1 Hz Periods*
tA_WKUP
4
XTAL32 Periods*
tDA_nPOR_CLKEN
tDA_WKUP_CLKEN
2
30
ns
4
XTAL32 Periods*
nPOR deassertion to WAKEUP assert delay
WAKEUP assertion time
nURESET assertion to CLKEN deassertion delay
WAKEUP to CLKEN assertion delay
add some timing margin to avoid any possible corner case condition.
NOTE: *The timing relationship is specified as a cycle-based timing. Due to variations in crystal input clock jitter,
power rail noise and I/O conditioning these timings will vary marginally. It is recommended that designers
64
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
tDD_nURESET_WKUP
tA_nURESET
tDA_nURESET_CLKEN
tDA_nURESET_nRSTO
tDD_nURESET_nRSTO
tA_WKUP
tDA_WKUP_CLKEN
nURESET
TRIGGER
POINT
WAKEUP
nRESETOUT
CLKEN
LH7A404-201
Figure 50. nRESETOUT Timing for nURESET Trigger
Table 15. nRESETOUT Timing Values for nURESET Trigger
SIGNAL
MIN.
tDA_nURESET_nRSTO
TYP.
MAX.
UNITS
DESCRIPTION
2
4
XTAL32 Periods*
nURESET to nRESETOUT assertion delay
tDD_nURESET_nRSTO
0
2
XTAL32 Periods*
nURESET to nRESETOUT deassertion delay
tA_nURESET
4
XTAL32 Periods*
nURESET assertion time
tDD_nURESET_WKUP
2
XTAL32 Periods*
nURESET deassertion to WAKEUP assertion delay
tA_WKUP
4
XTAL32 Periods*
WAKEUP assertion time
tDA_nURESET_CLKEN
2
4
XTAL32 Periods*
nURESET assertion to CLKEN deassertion delay
tDA_WKUP_CLKEN
2
4
XTAL32 Periods*
WAKEUP to CLKEN assertion delay
add some timing margin to avoid any possible corner case condition.
NOTE: *The timing relationship is specified as a cycle-based timing. Due to variations in crystal input clock jitter,
power rail noise and I/O conditioning these timings will vary marginally. It is recommended that designers
Product data sheet
65
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
tDD_nPWRFL_WKUP
tA_nPWRFL
tDA_nPWRFL_CLKEN
tDA_nPWRFL_nRSTO
tA_WKUP
tDA_WKUP_CLKEN
tA_nRSTO
nPWRFL
TRIGGER
POINT
WAKEUP
nRESETOUT
CLKEN
LH7A404-200
Figure 51. nRESETOUT Timing for nPWRFL Trigger
Table 16. nRESETOUT Timing Values for nPWRFL Trigger
SIGNAL
tDA_nPWRFL_nRSTO
MIN.
TYP.
2
tA_nRSTO
MAX.
UNITS*
4
XTAL32 Periods
nPWRFL to nRESETOUT assertion delay
2
DESCRIPTION
XTAL32 Periods
nRESETOUT assertion time
tA_nPWRFL
4
XTAL32 Periods
nPWRFL assertion time
tDD_nPWRFL_WKUP
2
1 Hz Periods
tA_WKUP
4
XTAL32 Periods
WAKEUP assertion time
nPWRFL deassertion to WAKEUP assertion delay
tDA_nPWRFL_CLKEN
2
4
XTAL32 Periods
nPWRFL assertion to CLKEN deassertion delay
tDA_WKUP_CLKEN
2
4
XTAL32 Periods
WAKEUP to CLKEN assertion delay
add some timing margin to avoid any possible corner case condition.
66
Product data sheet
32-Bit System-on-Chip
LH7A404
NXP Semiconductors
Reference Oscillator Circuit Design
Figure 52 and Figure 53 show a reference oscillator
design for both the 32.768 kHz and 14.7456 MHz clocks.
Low Operating Temperatures and
Noise Immunity
The junction temperature, Tj, is the operating temperature of the transistors in the integrated circuit. The
switching speed of the CMOS circuitry within the SoC
depends partly on Tj, and the lower the operating temperature, the faster the CMOS circuits will switch.
Increased switching noise generated by faster switching circuits could affect the overall system stability. The
amount of switching noise is directly affected by the
application executed on the SoC.
NXP suggests that users implementing a system to
meet the full 40°C to +85°C specification use an external oscillator rather than a crystal to drive the system
clock input of the System-on-Chip. This change from
crystal to oscillator will increase the robustness (ie,
noise immunity of the clock input to the SoC).
ENABLE
INTERNAL TO
THE LH7A404
EXTERNAL TO
THE LH7A404
XTALIN
Y1
XTALOUT
32.768 kHz
R1
18 MΩ
NOTES:
1. Y1 is a parallel-resonant type crystal. (See table)
2. The nominal values for C1 and C2 shown are for
a crystal specified at 12.5 pF load capacitance (CL).
3. The values for C1 and C2 are dependent upon
the cystal's specified load capacitance and PCB
stray capacitance.
4. R1 must be in the circuit.
5. Ground connections should be short and return
to the ground plane which is connected to the
processor's core ground pins.
6. Tolerance for R1, C1, C2 is ≤ 5%.
C1
15 pF
C2
18 pF
GND
GND
REFERENCE CRYSTAL SPECIFICATIONS
PARAMETER
DESCRIPTION
32.768 kHz Crystal
Tolerance
Aging
Load Capacitance
ESR (MAX.)
Drive Level
Reference crystal
Parallel Mode
±30 ppm
±3 ppm
12.5 pF
50 kΩ
1.0 µW (MAX.)
MTRON SX1555 or equivalent
LH7A404-168
Figure 52. 32.768 kHz External Oscillator Components and Schematic
Product data sheet
67
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
ENABLE
INTERNAL TO
THE LH7A404
EXTERNAL TO
THE LH7A404
XTALIN
Y1
XTALOUT
14.7456 MHz
R1
1 MΩ
C1
18 pF
C2
22 pF
GND
GND
REFERENCE CRYSTAL SPECIFICATIONS
NOTES:
1. Y1 is a parallel-resonant type crystal. (See table)
2. The nominal values for C1 and C2 shown are for
a crystal specified at 18 pF load capacitance (CL).
3. The values for C1 and C2 are dependent upon
the cystal's specified load capacitance and PCB
stray capacitance.
4. R1 must be in the circuit.
5. Ground connections should be short and return
to the ground plane which is connected to the
processor's core ground pins.
6. Tolerance for R1, C1, C2 is ≤ 5%.
PARAMETER
DESCRIPTION
14.7456 MHz Crystal
Tolerance
Stability
Aging
Load Capacitance
ESR (MAX.)
Drive Level
Reference crystal
(AT-Cut) Parallel Mode
±50 ppm
±100 ppm
±5 ppm
18 pF
40 Ω
100 µW (MAX.)
MTRON SX2050 or equivalent
LH7A404-167
Figure 53. 14.7456 MHz External Oscillator Components and Schematic
68
Product data sheet
32-Bit System-on-Chip
NXP Semiconductors
Printed Circuit Board Layout Practices
LH7A404 POWER SUPPLY DECOUPLING
The LH7A404 has separate power and ground pins
for different internal circuitry sections. The VDD and
VSS pins supply power to I/O buffers, while VDDC and
VSSC supply power to the core logic, and VDDA/VSSA
supply analog power to the PLLs.
Each of the VDD and VDDC pins must be provided
with a low impedance path to the corresponding board
power supply. Likewise, the VSS and VSSC pins must be
provided with a low impedance path to the board ground.
Each power supply must be decoupled to ground
using at least one 0.1 F high frequency capacitor
located as close as possible to a VDDx-VSSx pin pair
on each of the four sides of the chip. If room on the circuit board allows, add one 0.01 F high frequency
capacitor near each VDDx-VSSx pair on the chip.
To be effective, the capacitor leads and associated
circuit board traces connecting to the chip VDDx-VSSx
pins must be kept to less than half an inch (12.7 mm)
per capacitor lead. There must be one bulk 10 F
capacitor for each power supply placed near one side
of the chip.
REFERENCE PLL, VDDA, VSSA FILTER
The VDDA pins supply power to the chip PLL circuitry. VSSA is the ground return path for the PLL circuit. NXP recommends a low-pass filter attached as
shown in Figure 54. The values of the inductor and
capacitors are not critical. The low-pass filter prevents
high frequency noise from adversely affecting the PLL
circuits. The distance from the IC pin to the high frequency capacitor should be as short as possible.
VDDC
(SOURCE)
LH7A404
UNUSED INPUT SIGNAL CONDITIONING
Floating input signals can cause excessive power
consumption. Unused inputs without internal pull-up or
pull-down resistors should be pulled up or down externally, to tie the signal to its inactive state. NXP recommends using no larger than 33 k.
Some GPIO signals may default to inputs. If the pins
that carry these signals are unused, software can program these signals as outputs, eliminating the need for
pull-ups or pull-downs. Power consumption may be
higher than expected until software completes programming the GPIO. Some LH7A404 inputs have internal pull-ups or pull-downs. If unused, these inputs do
not require external conditioning.
OTHER CIRCUIT BOARD LAYOUT PRACTICES
All outputs have fast rise and fall times. Printed circuit trace interconnection length must therefore be
reduced to minimize overshoot, undershoot and reflections caused by transmission line effects of these fast
output switching times. This recommendation particularly applies to the address and data buses.
When considering capacitance, calculations must
consider all device loads and capacitances due to the
circuit board traces. Capacitance due to the traces will
depend upon a number of factors, including the trace
width, dielectric material the circuit board is made from
and proximity to ground and power planes.
Attention to power supply decoupling and printed circuit board layout becomes more critical in systems with
higher capacitive loads. As these capacitive loads
increase, transient currents in the power supply and
ground return paths also increase.
VDDC
LH7A404
10 µH
VDDAx
+
22 µF
0.1 µF
VSSAx
LH7A404-169
Figure 54. VDDA, VSSA Filter Circuit
Product data sheet
69
LH7A404
32-Bit System-on-Chip
NXP Semiconductors
PACKAGE SPECIFICATIONS
LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls
A
B
D
SOT1021-1
ball A1
index area
E
A2
A
A1
detail X
e1
e
∅v
∅w
b
1/2 e
C
C A B
C
M
M
y
y1 C
Y
W
V
U
T
e
R
P
N
M
L
e2
K
J
1/2 e
H
G
F
E
D
C
B
A
ball A1
index area
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
0
X
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
A2
b
D
E
e
e1
e2
v
w
y
y1
mm
1.7
0.4
0.3
1.35
1.15
0.5
0.4
17.1
16.9
17.1
16.9
0.8
15.2
15.2
0.15
0.08
0.12
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
07-07-07
07-07-07
SOT1021-1
Figure 55. Package outline SOT1021-1 (LFBGA324)
70
Product data sheet
IMPORTANT NOTICE
Dear customer,
As from June 1st, 2007 NXP Semiconductors has acquired the LH7xxx ARM Microcontrollers from
Sharp Microelectronics. The following changes are applicable to the attached data sheet. In data
sheets where the previous Sharp or Sharp Corporation references remain, please use the new
links as shown below.
For www.sharpsma.com use www.nxp.com/microcontrollers
for indicated sales addresses use salesaddresses@nxp.com (email)
The copyright notice at the bottom of each page (or elsewhere in the document, depending on the
version)
- Copyright © (year) by SHARP Corporation.
is replaced with:
- © NXP B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via
e-mail or phone (details via salesaddresses@nxp.com). Thank you for your cooperation and
understanding, In addition to that the Annex A (attached hereto) is added to the document.
NXP Semiconductors
32-Bit System-on-Chip
NXP Semiconductors
LH7A404
REVISION HISTORY
Table 17. Revision history
Document ID
LH7A404_N_2
Modifications:
Release date Data sheet status
20080307
Product data sheet
Change notice
-
Supersedes
LH7A404_N_1
-
LH7A404 V1-5 12-1-2006
• Changed status from ‘Preliminary’ to ‘Product’
• Fig. 19; replaced with correct figure.
• Fig. 20; added timing symbols.
LH7A404_N_1 20070716
Preliminary data
sheet
Modifications:
• First NXP version based on the LH7A404 data sheet of 20061201
Product data sheet
71
LH7A404
NXP Semiconductors
32-Bit System-on-Chip
1. Legal information
1.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
1.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the full
data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the Product
data sheet.
1.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance with
the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
72
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party customer(s).
NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
Product data sheet
LH7A404
NXP Semiconductors
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use of
the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
1.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
2. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
© NXP B.V. 2008. All rights reserved.
32-Bit System-on-Chip
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