MC705P6ECPE

MC68HC705P6A Advance Information Data Sheet M68HC05 Microcontrollers MC68HC705P6A Rev. 2.1 9/2005 freescale.com This document contains certain information on a new product.Specifications and information herein are subject to change without notice. Blank MC68HC705P6A Advance Information Data Sheet To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information available, refer to: http://www.freescale.com/ The following revision history table summarizes changes contained in this document. For your convenience, the page number designators have been linked to the appropriate location. Revision History Date Revision Level November, 2001 Format update to current publication standards N/A 2.0 Figure 11-1. Mask Option Register (MOR) — Definition of bit 6 corrected. 92 September, 2005 2.1 Updated to meet Freescale identity guidelines. Description Page Number(s) Throughout Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. © Freescale Semiconductor, Inc., 2005. All rights reserved. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 3 Revision History MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 4 Freescale Semiconductor List of Chapters Chapter 1 General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Chapter 2 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Chapter 3 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Chapter 4 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Chapter 5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Chapter 6 Input/Output Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Chapter 7 Serial Input/Output Port (SIOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Chapter 8 Capture/Compare Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Chapter 9 Analog Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Chapter 10 EPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Chapter 11 Mask Option Register (MOR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Chapter 12 Central Processor Unit (CPU) Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Chapter 13 Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Chapter 14 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Chapter 15 Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Chapter 16 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 5 List of Chapters MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 6 Freescale Semiconductor Table of Contents Chapter 1 General Description 1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Functional Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3.1 VDD and VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3.2 OSC1 and OSC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3.2.1 Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3.2.2 Ceramic Resonator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3.2.3 External Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3.3 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3.4 PA0–PA7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3.5 PB5/SDO, PB6/SDI, and PB7/SCK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3.6 PC0-PC2, PC3/AD3, PC4/AD2, PC5/AD1, PC6/AD0, and PC7/VREFH . . . . . . . . . . . . . . . . 1.3.7 PD5 and PD7/TCAP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3.8 TCMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3.9 IRQ/VPP (Maskable Interrupt Request) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13 15 15 15 16 16 16 16 16 16 16 16 17 17 Chapter 2 Memory 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . User Mode Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bootloader Mode Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input/Output and Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EPROM/ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mask Option Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Computer Operating Properly (COP) Clear Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 19 19 19 19 19 24 25 Chapter 3 Operating Modes 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 User Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Bootloader Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4.1 STOP Instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4.1.1 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4.1.2 Halt Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4.2 WAIT Instruction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 COP Watchdog Timer Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 27 27 28 28 28 30 30 30 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 7 Table of Contents Chapter 4 Resets 4.1 4.2 4.3 4.3.1 4.3.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Reset (RESET) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal Resets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Computer Operating Properly (COP) Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 31 31 31 32 Chapter 5 Interrupts 5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 Interrupt Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2.1 Reset Interrupt Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2.2 Software Interrupt (SWI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2.3 Hardware Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2.3.1 External Interrupt (IRQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2.3.2 Input Capture Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2.3.3 Output Compare Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2.3.4 Timer Overflow Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 35 35 35 35 35 35 36 36 Chapter 6 Input/Output Ports 6.1 6.2 6.3 6.4 6.5 6.6 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port D. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I/O Port Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 37 38 38 39 39 Chapter 7 Serial Input/Output Port (SIOP) 7.1 7.2 7.2.1 7.2.2 7.2.3 7.3 7.3.1 7.3.2 7.3.3 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SIOP Signal Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Serial Clock (SCK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Serial Data Input (SDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Serial Data Output (SDO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SIOP Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SIOP Control Register (SCR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SIOP Status Register (SSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SIOP Data Register (SDR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 42 42 42 42 43 43 44 44 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 8 Freescale Semiconductor Table of Contents Chapter 8 Capture/Compare Timer 8.1 8.2 8.2.1 8.2.2 8.3 8.3.1 8.3.2 8.3.3 8.3.4 8.3.5 8.3.6 8.4 8.5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timer Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output Compare. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timer I/O Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timer Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timer Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timer Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Alternate Timer Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Capture Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output Compare Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timer During Wait/Halt Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timer During Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 46 46 46 46 47 48 49 49 50 50 51 51 Chapter 9 Analog Subsystem 9.1 9.2 9.2.1 9.2.2 9.2.3 9.3 9.4 9.4.1 9.4.2 9.4.3 9.5 9.6 9.7 9.8 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Analog Section. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ratiometric Conversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reference Voltage (VREFH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Accuracy and Precision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Conversion Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Conversion Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal versus External Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Multi-Channel Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A/D Status and Control Register (ADSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A/D Conversion Data Register (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A/D Subsystem Operation during Halt/Wait Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A/D Subsystem Operation during Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 53 53 53 53 53 53 54 54 54 54 55 56 56 Chapter 10 EPROM 10.1 10.2 10.3 10.4 10.5 10.6 10.7 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EPROM Erasing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EPROM Programming Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EPROM Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EPROM Programming Register (EPROG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EPROM Bootloader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Programming from an External Memory Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 57 57 57 57 59 59 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 9 Table of Contents Chapter 11 Mask Option Register (MOR) 11.1 11.2 11.3 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Mask Option Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 MOR Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Chapter 12 Central Processor Unit (CPU) Core 12.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.2.1 Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.2.2 Index Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.2.3 Stack Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.2.4 Program Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.2.5 Condition Code Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 67 67 68 68 68 68 Chapter 13 Instruction Set 13.1 13.2 13.2.1 13.2.2 13.2.3 13.2.4 13.2.5 13.2.6 13.2.7 13.2.8 13.3 13.3.1 13.3.2 13.3.3 13.3.4 13.3.5 13.4 13.5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indexed, 8-Bit Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indexed,16-Bit Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Relative . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Instruction Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Register/Memory Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Jump/Branch Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Opcode Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 71 71 71 71 72 72 72 72 72 73 73 74 75 76 76 77 82 Chapter 14 Electrical Specifications 14.1 14.2 14.3 14.4 14.5 14.6 14.7 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.0-Volt DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3-Volt DC Electrical Charactertistics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A/D Converter Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 85 85 85 86 87 88 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 10 Freescale Semiconductor Table of Contents 14.8 EPROM Programming Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 14.9 SIOP Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 14.10 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Chapter 15 Mechanical Specifications 15.1 15.2 15.3 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Plastic Dual In-Line Package (Case 710) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Small Outline Integrated Circuit Package (Case 751F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Chapter 16 Ordering Information 16.1 16.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 11 Table of Contents MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 12 Freescale Semiconductor Chapter 1 General Description 1.1 Introduction The MC68HC705P6A is an EPROM version of the MC68HC05P6 microcontroller. It is a low-cost combination of an M68HC05 Family microprocessor with a 4-channel, 8-bit analog-to-digital (A/D) converter, a 16-bit timer with output compare and input capture, a serial communications port (SIOP), and a computer operating properly (COP) watchdog timer. The M68HC05 CPU core contains 176 bytes of RAM, 4672 bytes of user EPROM, 239 bytes of bootloader ROM, and 21 input/output (I/O) pins (20 bidirectional, 1 input-only). This device is available in either a 28-pin plastic dual in-line (PDIP) or a 28-pin small outline integrated circuit (SOIC) package. A functional block diagram of the MC68HC705P6A is shown in Figure 1-1. 1.2 Features Features of the MC68HC705P6A include: • Low cost • M68HC05 core • 28-pin SOIC, PDIP, or windowed DIP package • 4672 bytes of user EPROM (including 48 bytes of page zero EPROM and 16 bytes of user vectors) • 239 bytes of bootloader ROM • 176 bytes of on-chip RAM • 4-channel 8-bit A/D converter • SIOP serial communications port • 16-bit timer with output compare and input capture • 20 bidirectional I/O lines and 1 input-only line • PC0 and PC1 high-current outputs • Single-chip, bootloader, and test modes • Power-saving stop, halt, and wait modes • Static EPROM mask option register (MOR) selectable options: – COP watchdog timer enable or disable – Edge-sensitive or edge- and level-sensitive external interrupt – SIOP most significant bit (MSB) or least significant bit (LSB) first – SIOP clock rates: OSC divided by 8, 16, 32, or 64 – Stop instruction mode, STOP or HALT – EPROM security external lockout – Programmable keyscan (pullups/interrupts) on PA0–PA7 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 13 General Description INTERNAL CPU CLOCK COP ÷2 CPU CONTROL ALU RESET M68HC05 CPU IRQ/VPP ÷4 OSC 16-BIT TIMER 1 INPUT CAPTURE 1 OUTPUT COMPARE PORT D LOGIC OSC 1 OSC 2 PD7/TCAP TCMP PD5 ACCUM PROGRAM COUNTER COND CODE REG 1 1 1H I NZC PC7/VREFH PC6/AD0 MUX A/ D CONVERTER 0 0 0 0 0 0 0 0 1 1 STK PNTR PORT C INDEX REG DATA DIRECTION REGISTER CPU REGISTERS PC5/AD1 PC4/AD2 PC3/AD3 PC2 PC1 PC0 SRAM — 176 BYTES BOOTLOADER ROM — 239 BYTES PB5/SDO PB6/SDI PB7/SCK PORT B AND SIOP REGISTERS AND LOGIC PA6 PA5 PORT A USER EPROM — 4672 BYTES DATA DIRECTION REG PA7 PA4 PA3 PA2 PA1 PA0 VDD VSS Figure 1-1. MC68HC705P6A Block Diagram NOTE A line over a signal name indicates an active low signal. For example, RESET is active high and RESET is active low. Any reference to voltage, current, or frequency specified in the following sections will refer to the nominal values. The exact values and their tolerances or limits are specified in Chapter 14 Electrical Specifications. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 14 Freescale Semiconductor Functional Pin Description 1.3 Functional Pin Description The following paragraphs describe the functionality of each pin on the MC68HC705P6A package. Pins connected to subsystems described in other chapters provide a reference to the chapter instead of a detailed functional description. 1.3.1 VDD and VSS Power is supplied to the MCU through VDD and VSS. VDD is connected to a regulated +5 volt supply and VSS is connected to ground. Very fast signal transitions occur on the MCU pins. The short rise and fall times place very high short-duration current demands on the power supply. To prevent noise problems, take special care to provide good power supply bypassing at the MCU. Use bypass capacitors with good high-frequency characteristics and position them as close to the MCU as possible. Bypassing requirements vary, depending on how heavily the MCU pins are loaded. 1.3.2 OSC1 and OSC2 The OSC1 and OSC2 pins are the control connections for the on-chip oscillator. The OSC1 and OSC2 pins can accept the following: 1. A crystal as shown in Figure 1-2(a) 2. A ceramic resonator as shown in Figure 1-2(a) 3. An external clock signal as shown in Figure 1-2(b) The frequency, fosc, of the oscillator or external clock source is divided by two to produce the internal bus clock operating frequency, fop. The oscillator cannot be turned off by software unless the MOR bit, SWAIT, is clear when a STOP instruction is executed. To VDD (or STOP) OSC1 MCU OSC2 To VDD (or STOP) OSC1 MCU OSC2 4.7 MΩ UNCONNECTED EXTERNAL CLOCK 37 pF (a) 37 pF Crystal or Ceramic Resonator Connections (b) External Clock Source Connections Figure 1-2. Oscillator Connections MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 15 General Description 1.3.2.1 Crystal The circuit in Figure 1-2(a) shows a typical oscillator circuit for an AT-cut, parallel resonant crystal. Follow the crystal manufacturer’s recommendations, as the crystal parameters determine the external component values required to provide maximum stability and reliable startup. The load capacitance values used in the oscillator circuit design should include all stray capacitances. Mount the crystal and components as close as possible to the pins for startup stabilization and to minimize output distortion. 1.3.2.2 Ceramic Resonator In cost-sensitive applications, use a ceramic resonator in place of a crystal. Use the circuit in Figure 1-2(a) for a ceramic resonator and follow the resonator manufacturer’s recommendations, as the resonator parameters determine the external component values required for maximum stability and reliable starting. The load capacitance values used in the oscillator circuit design should include all stray capacitances. Mount the resonator and components as close as possible to the pins for startup stabilization and to minimize output distortion. 1.3.2.3 External Clock An external clock from another CMOS-compatible device can be connected to the OSC1 input, with the OSC2 input not connected, as shown in Figure 1-2(b). 1.3.3 RESET Driving this input low will reset the MCU to a known startup state. The RESET pin contains an internal Schmitt trigger to improve its noise immunity. Refer to Chapter 4 Resets. 1.3.4 PA0–PA7 These eight I/O pins comprise port A. The state of any pin is software programmable and all port A lines are configured as inputs during power-on or reset. Port A has mask-option register enabled interrupt capability with internal pullup devices selectable for any pin. Refer to Chapter 6 Input/Output Ports. 1.3.5 PB5/SDO, PB6/SDI, and PB7/SCK These three I/O pins comprise port B and are shared with the SIOP communications subsystem. The state of any pin is software programmable, and all port B lines are configured as inputs during power-on or reset. Refer to Chapter 6 Input/Output Ports and Chapter 7 Serial Input/Output Port (SIOP). 1.3.6 PC0-PC2, PC3/AD3, PC4/AD2, PC5/AD1, PC6/AD0, and PC7/VREFH These eight I/O pins comprise port C and are shared with the A/D converter subsystem. The state of any pin is software programmable and all port C lines are configured as inputs during power-on or reset. Refer to Chapter 6 Input/Output Ports and Chapter 9 Analog Subsystem. 1.3.7 PD5 and PD7/TCAP These two I/O pins comprise port D and one of them is shared with the 16-bit timer subsystem. The state of PD5 is software programmable and is configured as an input during power-on or reset. PD7 is always an input. It may be read at any time, regardless of which mode of operation the 16-bit timer is in. Refer to Chapter 6 Input/Output Ports and Chapter 8 Capture/Compare Timer. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 16 Freescale Semiconductor Functional Pin Description 1.3.8 TCMP This pin is the output from the 16-bit timer’s output compare function. It is low after reset. Refer to Chapter 8 Capture/Compare Timer. 1.3.9 IRQ/VPP (Maskable Interrupt Request) This input pin drives the asynchronous interrupt function of the MCU in user mode and provides the VPP programming voltage in bootloader mode. The MCU will complete the current instruction being executed before it responds to the IRQ interrupt request. When the IRQ/VPP pin is driven low, the event is latched internally to signify an interrupt has been requested. When the MCU completes its current instruction, the interrupt latch is tested. If the interrupt latch is set and the interrupt mask bit (I bit) in the condition code register is clear, the MCU will begin the interrupt sequence. Depending on the MOR LEVEL bit, the IRQ/VPP pin will trigger an interrupt on either a negative edge at the IRQ/VPP pin and/or while the IRQ/VPP pin is held in the low state. In either case, the IRQ/VPP pin must be held low for at least one tILIH time period. If the edge- and level-sensitive mode is selected (LEVEL bit set), the IRQ/VPP input pin requires an external resistor connected to VDD for wired-OR operation. If the IRQ/VPP pin is not used, it must be tied to the VDD supply. The IRQ/VPP pin input circuitry contains an internal Schmitt trigger to improve noise immunity. Refer to Chapter 5 Interrupts. NOTE If the voltage level applied to the IRQ/VPP pin exceeds VDD, it may affect the MCU’s mode of operation. See Chapter 3 Operating Modes. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 17 General Description MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 18 Freescale Semiconductor Chapter 2 Memory 2.1 Introduction The MC68HC705P6A utilizes 13 address lines to access an internal memory space covering 8 Kbytes. This memory space is divided into I/O, RAM, ROM, and EPROM areas. 2.2 User Mode Memory Map When the MC68HC705P6A is in the user mode, the 32 bytes of I/O, 176 bytes of RAM, 4608 bytes of user EPROM, 48 bytes of user page zero EPROM, 239 bytes of bootloader ROM, and 16 bytes of user vectors EPROM are all active as shown in Figure 2-1. 2.3 Bootloader Mode Memory Map Memory space is identical to the user mode. See Figure 2-1. 2.4 Input/Output and Control Registers Figure 2-2 and Figure 2-3 briefly describe the I/O and control registers at locations $0000–$001F. Reading unimplemented bits will return unknown states, and writing unimplemented bits will be ignored. 2.5 RAM The user RAM consists of 176 bytes (including the stack) at locations $0050 through $00FF. The stack begins at address $00FF. The stack pointer can access 64 bytes of RAM from $00FF to $00C0. NOTE Using the stack area for data storage or temporary work locations requires care to prevent it from being overwritten due to stacking from an interrupt or subroutine call. 2.6 EPROM/ROM There are 4608 bytes of user EPROM at locations $0100 through $12FF, plus 48 bytes in user page zero locations $0020 through $004F, and 16 additional bytes for user vectors at locations $1FF0 through $1FFF. The bootloader ROM and vectors are at locations $1F01 through $1FEF. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 19 Memory $0000 $001F $0020 $004F $0050 $00BF $00C0 $00FF $0100 I/O 32 BYTES USER EPROM 48 BYTES INTERNAL RAM 176 BYTES STACK 64 BYTES 0000 0031 0032 0079 0080 4863 4864 $1FEF $1FF0 $1FFF MASK OPTION REGISTERS BOOTLOADER ROM AND VECTORS 239 BYTES USER VECTORS EPROM 16 BYTES $001F 0255 0256 UNIMPLEMENTED 3071 BYTES $1EFE $1EFF $1F00 $1F01 I/O REGISTERS SEE Figure 2-2 0191 0192 USER EPROM 4608 BYTES $12FF $1300 $0000 7934 7935 7936 7937 COP CLEAR REGISTER(1) $1FF0 UNUSED $1FF1 UNUSED $1FF2 UNUSED $1FF3 UNUSED $1FF4 UNUSED $1FF5 UNUSED $1FF6 UNUSED $1FF7 TIMER VECTOR (HIGH BYTE) $1FF8 TIMER VECTOR (LOW BYTE) $1FF9 8175 8176 IRQ VECTOR (HIGH BYTE) $1FFA IRQ VECTOR (LOW BYTE) $1FFB 8191 SWI VECTOR (HIGH BYTE) $1FFC SWI VECTOR (LOW BYTE) $1FFD RESET VECTOR (HIGH BYTE) $1FFE RESET VECTOR (LOW BYTE) $1FFF Note 1. Writing zero to bit 0 of $1FF0 clears the COP watchdog timer. Reading $1FF0 returns user EPROM data. Figure 2-1. MC68HC705P6A User Mode Memory Map MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 20 Freescale Semiconductor EPROM/ROM PORT A DATA REGISTER $0000 PORT B DATA REGISTER $0001 PORT C DATA REGISTER $0002 PORT D DATA REGISTER $0003 PORT A DATA DIRECTION REGISTER $0004 PORT B DATA DIRECTION REGISTER $0005 PORT C DATA DIRECTION REGISTER $0006 PORT D DATA DIRECTION REGISTER $0007 UNIMPLEMENTED $0008 UMIMPLEMENTED $0009 SIOP CONTROL REGISTER $000A SIOP STATUS REGISTER $000B SIOP DATA REGISTER $000C RESERVED $000D UNIMPLEMENTED $000E UNIMPLEMENTED $000F UNIMPLEMENTED $0010 UNIMPLEMENTED $0011 TIMER CONTROL REGISTER $0012 TIMER STATUS REGISTER $0013 INPUT CAPTURE MSB $0015 INPUT CAPTURE LSB $0016 OUTPUT COMPARE MSB $0017 OUTPUT COMPARE LSB $0017 TIMER MSB $0018 TIMER LSB $0019 ALTERNATE COUNTER MSB $001A ALTERNATE COUNTER LSB $001B EPROM PROGRAMMING REGISTER $001C A/D CONVERTER DATA REGISTER $001D A/D CONVERTER CONTROL AND STATUS REGISTER $001E RESERVED $001F Figure 2-2. MC68HC705P6A I/O and Control Registers Memory Map MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 21 Memory Addr. $0000 $0001 $0002 $0003 $0004 $0005 $0006 Register Name Port A Data Register (PORTA) See page 37. Port B Data Register (PORTB) See page 38. Port C Data Register (PORTC) See page 38. Port D Data Register (PORTD) See page 39. Port A Data Direction Register (DDRA) See page 37. Port B Data Direction Register (DDRB) See page 38. Port C Data Direction Register (DDRC) See page 38. $0007 Port D Data Direction Register (DDRD) See page 39. $0008 Unimplemented $0009 Unimplemented $000A SIOP Control Register (SCR) See page 43. $000B $000C SIOP Status Register (SSR) See page 44. SIOP Data Register (SDR) See page 44. Read: Write: Bit 7 6 5 4 3 2 1 Bit 0 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 0 0 0 PC2 PC1 PC0 0 0 0 Reset: Read: Write: Unaffected by reset PB7 PB6 PB5 Reset: Read: Write: PC7 PC6 PC5 PC4 PC3 Unaffected by reset PD7 0 Write: PD5 Reset: Read: 0 Unaffected by reset Reset: Read: 0 1 0 Unaffected by reset DDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0 0 0 0 0 0 0 0 0 DDRB7 DDRB6 DDRB5 1 1 1 1 1 0 0 0 0 0 0 0 0 DDRC7 DDRC6 DDRC5 DDRC4 DDRC3 DDRC2 DDRC1 DDRC0 Reset: 0 0 0 0 0 0 0 0 Read: 0 0 0 0 0 0 0 Reset: 0 0 0 0 0 0 0 Read: 0 0 0 0 0 Write: Reset: Read: Write: Reset: Read: Write: Write: Write: SPE DDRD5 0 0 MSTR Reset: 0 0 0 0 0 0 0 0 Read: SPIF DCOL 0 0 0 0 0 0 0 0 0 0 0 0 0 0 SDR7 SDR6 SDR5 SDR4 SDR3 SSDR2 SDR1 SDR0 Write: Reset: Read: Write: Reset: Unaffected by reset = Unimplemented R = Reserved U = Undetermined Figure 2-3. I/O and Control Register Summary (Sheet 1 of 3) MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 22 Freescale Semiconductor EPROM/ROM Addr. Register Name $000D Reserved for Test $000E Unimplemented $000F Unimplemented $0010 Unimplemented $0011 Unimplemented $0012 Timer Control Register (TCR) See page 47. $0013 $0014 $0015 $0016 $0017 $0018 $0019 $001A Timer Status Register (TSR) See page 48. Input Capture Register MSB (ICRH) See page 50. Input Capture Register LSB (ICRL) See page 50. Output Compare Register MSB (OCRH) See page 50. Output Compare Register LSB (OCRL) See page 50. Timer Register MSB (TRH) See page 49. Timer Register LSB (TRL) See page 49. Alternate Timer Register MSB (ATRH) See page 49. Bit 7 6 5 4 3 2 1 Bit 0 R R R R R R R R ICIE OCIE TOIE 0 0 0 IEDG OLVL Reset: 0 0 0 0 0 0 U 0 Read: ICF OCF TOF 0 0 0 0 0 Read: Write: Write: Reset: U U U 0 0 0 0 0 Read: ICRH7 ICRH6 ICRH5 ICRH4 ICRH3 ICRH2 ICRH1 ICRH0 ICRL2 ICRL1 ICRL0 OCRH2 OCRH1 OCRH0 OCRL2 OCRL1 OCRL0 Write: Reset: Read: Unaffected by reset ICRL7 ICRL6 ICRL5 ICRL4 ICRL3 Write: Reset: Read: Write: Unaffected by reset OCRH7 OCRH6 OCRH5 Reset: Read: OCRH4 OCRH3 Unaffected by reset OCRL7 OCRL6 OCRL5 TRH7 TRH6 TRH5 TRH4 TRH3 TRH2 TRH1 TRH0 Reset: 1 1 1 1 1 1 1 1 Read: TRL7 TRL6 TRL5 TRL4 TRL3 TRL2 TRL1 TRL0 Reset: 1 1 1 1 1 1 0 0 Read: ACRH7 ACRH6 ACRH5 ACRH4 ACRH3 ACRH2 ACRH1 ACRH0 1 1 1 1 1 1 1 1 R = Reserved Write: Reset: Read: OCRL4 OCRL3 Unaffected by reset Write: Write: Write: Reset: = Unimplemented U = Undetermined Figure 2-3. I/O and Control Register Summary (Sheet 2 of 3) MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 23 Memory Addr. $001B $001C $001D Register Name Alternate Timer Register LSB (ATRL) See page 49. $001F Reserved for Test 5 4 3 2 1 Bit 0 ACRL5 ACRL4 ACRL3 ACRL2 ACRL1 ACRL0 Reset: 1 1 1 1 1 1 0 0 Read: 0 0 0 0 0 Reset: 0 0 0 0 0 0 0 0 Read: AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 CH2 CH1 CH0 Write: A/D Conversion Value Data Register (ADC) See page 55. $001E 6 ACRL6 Write: EPROM Programming Register (EPROG) See page 58. A/D Status and Control Register (ADSC) See page 54. Bit 7 ACRL7 Read: 0 ELAT EPGM Write: Reset: Unaffected by reset Read: CC Write: Reset: ADRC 0 ADON 0 0 0 0 0 0 0 0 0 R R R R R R R R R = Reserved = Unimplemented U = Undetermined Figure 2-3. I/O and Control Register Summary (Sheet 3 of 3) 2.7 Mask Option Register The mask option register (MOR) is a pair of EPROM bytes located at $1EFF and $1F00. It controls the programmable options on the MC68HC705P6A. See Chapter 11 Mask Option Register (MOR) for additional information. $1EFF Read: Write: Erased State: $1F00 Read: Write: Erased State: Bit 7 6 5 4 3 2 1 Bit 0 PA7PU PA6PU PA5PU PA4PU PA3PU PA2PU PA1PU PA0PU 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 SWAIT SPR1 SPR0 LSBF LEVEL COP 0 0 0 0 0 0 SECURE 0 0 = Unimplemented Figure 2-4. Mask Option Register (MOR) MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 24 Freescale Semiconductor Computer Operating Properly (COP) Clear Register 2.8 Computer Operating Properly (COP) Clear Register The computer operating properly (COP) watchdog timer is located at address $1FF0. Writing a logical 0 to bit zero of this location will clear the COP watchdog counter as described in 4.3.2 Computer Operating Properly (COP) Reset. $1FF0 Bit 7 6 5 4 3 2 1 Bit 0 Read: 0 0 0 0 0 0 0 0 Write: Reset: COPR 0 0 0 0 0 0 0 0 = Unimplemented Figure 2-5. COP Watchdog Timer Location MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 25 Memory MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 26 Freescale Semiconductor Chapter 3 Operating Modes 3.1 Introduction The MC68HC705P6A has two modes of operation that affect the pinout and architecture of the MCU: user mode and bootloader mode. The user mode is normally used for the application and the bootloader mode is used for programming the EPROM. The conditions required to enter each mode are shown in Table 3-1. The mode of operation is determined by the voltages on the IRQ/VPP and PD7/TCAP pins on the rising edge of the external RESET pin. Table 3-1. Operating Mode Conditions After Reset RESET Pin IRQ/VPP PD7/TCAP Mode VSS to VDD VSS to VDD Single chip VPP VDD Bootloader The mode of operation is also determined whenever the internal computer operating properly (COP) watchdog timer resets the MCU. When the COP timer expires, the voltage applied to the IRQ/VPP pin controls the mode of operation while the voltage applied to PD7/TCAP is ignored. The voltage applied to PD7/TCAP during the last rising edge on RESET is stored in a latch and used to determine the mode of operation when the COP watchdog timer resets the MCU. 3.2 User Mode The user mode allows the MCU to function as a self-contained microcontroller, with maximum use of the pins for on-chip peripheral functions. All address and data activity occurs within the MCU and are not available externally. User mode is entered on the rising edge of RESET if the IRQ/VPP pin is within the normal operating voltage range. The pinout for the user mode is shown in Figure 3-1. In the user mode, there is an 8-bit I/O port, a second 8-bit I/O port shared with the analog-to-digital (A/D) subsystem, one 3-bit I/O port shared with the serial input/output port (SIOP), and a 3-bit port shared with the 16-bit timer subsystem, which includes one general-purpose I/O pin. 3.3 Bootloader Mode The bootloader mode provides a means to program the user EPROM from an external memory device or host computer. This mode is entered on the rising edge of RESET if VPP is applied to the IRQ/VPP pin and VDD is applied to the PD7/TCAP pin. The user code in the external memory device must have data located in the same address space it will occupy in the internal MCU EPROM, including the mask option register (MOR) at $1EFF and $1F00. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 27 Operating Modes RESET 1 28 VDD IRQ/VPP 2 27 OSC1 PA7 3 26 OSC2 PA6 4 25 PD7/TCAP PA5 5 24 TCMP PA4 6 23 PD5 PA3 7 22 PC0 PA2 8 21 PC1 PA1 9 20 PC2 PA0 10 19 PC3/AD3 SDO/PB5 11 18 PC4/AD2 SDI/PB6 12 17 PC5/AD1 SCK/PB7 13 16 PC6/AD0 VSS 14 15 PC7/VREFH Figure 3-1. User Mode Pinout 3.4 Low-Power Modes The MC68HC705P6A is capable of running in a low-power mode in each of its configurations. The WAIT and STOP instructions provide three modes that reduce the power required for the MCU by stopping various internal clocks and/or the on-chip oscillator. The SWAIT bit in the MOR is used to modify the behavior of the STOP instruction from stop mode to halt mode. The flow of the stop, halt, and wait modes is shown in Figure 3-2. 3.4.1 STOP Instruction The STOP instruction can result in one of two modes of operation depending on the state of the SWAIT bit in the MOR. If the SWAIT bit is clear, the STOP instruction will behave like a normal STOP instruction in the M68HC05 Family and place the MCU in stop mode. If the SWAIT bit in the MOR is set, the STOP instruction will behave like a WAIT instruction (with the exception of a brief delay at startup) and place the MCU in halt mode. 3.4.1.1 Stop Mode Execution of the STOP instruction when the SWAIT bit in the MOR is clear places the MCU in its lowest power consumption mode. In stop mode, the internal oscillator is turned off, halting all internal processing, including the COP watchdog timer. Execution of the STOP instruction automatically clears the I bit in the condition code register so that the IRQ external interrupt is enabled. All other registers and memory remain unaltered. All input/output lines remain unchanged. The MCU can be brought out of stop mode only by an IRQ external interrupt or an externally generated RESET. When exiting stop mode, the internal oscillator will resume after a 4064 internal clock cycle oscillator stabilization delay. NOTE Execution of the STOP instruction when the SWAIT bit in the MOR is clear will cause the oscillator to stop, and, therefore, disable the COP watchdog timer. To avoid turning off the COP watchdog timer, stop mode should be changed to halt mode by setting the SWAIT bit in the MOR. See 3.5 COP Watchdog Timer Considerations for additional information. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 28 Freescale Semiconductor Low-Power Modes STOP MOR SWAIT BIT SET? HALT WAIT EXTERNAL OSCILLATOR ACTIVE AND INTERNAL TIMER CLOCK ACTIVE Y N STOP EXTERNAL OSCILLATOR, STOP INTERNAL TIMER CLOCK, RESET STARTUP DELAY Y STOP INTERNAL PROCESSOR CLOCK, CLEAR I BIT IN CCR STOP INTERNAL PROCESSOR CLOCK, CLEAR I BIT IN CCR EXTERNAL OSCILLATOR ACTIVE AND INTERNAL TIMER CLOCK ACTIVE EXTERNAL RESET? STOP INTERNAL PROCESSOR CLOCK, CLEAR I BIT IN CCR N EXTERNAL RESET? Y Y IRQ EXTERNAL INTERRUPT? N IRQ EXTERNAL INTERRUPT? N Y N N Y Y TIMER INTERNAL INTERRUPT? RESTART EXTERNAL OSCILLATOR, START STABILIZATION DELAY END OF STABILIZATION DELAY? Y COP INTERNAL RESET? Y Y Y RESTART INTERNAL PROCESSOR CLOCK 2. TIMER INTERNAL INTERRUPT? N N N 1. IRQ EXTERNAL INTERRUPT? N N Y EXTERNAL RESET? COP INTERNAL RESET? N FETCH RESET VECTOR OR SERVICE INTERRUPT A. STACK B. SET I BIT C. VECTOR TO INTERRUPT ROUTINE Figure 3-2. STOP/WAIT Flowcharts MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 29 Operating Modes 3.4.1.2 Halt Mode NOTE Halt mode is NOT designed for intentional use. Halt mode is only provided to keep the COP watchdog timer active in the event a STOP instruction is executed inadvertently. This mode of operation is usually achieved by invoking wait mode. Execution of the STOP instruction when the SWAIT bit in the MOR is set places the MCU in this low-power mode. Halt mode consumes the same amount of power as wait mode (both halt and wait modes consume more power than stop mode). In halt mode, the internal clock is halted, suspending all processor and internal bus activity. Internal timer clocks remain active, permitting interrupts to be generated from the 16-bit timer or a reset to be generated from the COP watchdog timer. Execution of the STOP instruction automatically clears the I bit in the condition code register, enabling the IRQ external interrupt. All other registers, memory, and input/output lines remain in their previous states. If the 16-bit timer interrupt is enabled, it will cause the processor to exit the halt mode and resume normal operation. The halt mode also can be exited when an IRQ external interrupt or external RESET occurs. When exiting the halt mode, the internal clock will resume after a delay of one to 4064 internal clock cycles. This varied delay time is the result of the halt mode exit circuitry testing the oscillator stabilization delay timer (a feature of the stop mode), which has been free-running (a feature of the wait mode). 3.4.2 WAIT Instruction The WAIT instruction places the MCU in a low-power mode which consumes more power than stop mode. In wait mode, the internal clock is halted, suspending all processor and internal bus activity. Internal timer clocks remain active, permitting interrupts to be generated from the 16-bit timer and reset to be generated from the COP watchdog timer. Execution of the WAIT instruction automatically clears the I bit in the condition code register, enabling the IRQ external interrupt. All other registers, memory, and input/output lines remain in their previous state. If the 16-bit timer interrupt is enabled, it will cause the processor to exit wait mode and resume normal operation. The 16-bit timer may be used to generate a periodic exit from wait mode. Wait mode may also be exited when an IRQ external interrupt or RESET occurs. 3.5 COP Watchdog Timer Considerations The COP watchdog timer is active in user mode of operation when the COP bit in the MOR is set. Executing the STOP instruction when the SWAIT bit in the MOR is clear will cause the COP to be disabled. Therefore, it is recommended that the STOP instruction be modified to produce halt mode (set bit SWAIT in the MOR) if the COP watchdog timer is required to function at all times. Furthermore, it is recommended that the COP watchdog timer be disabled for applications that will use the wait mode for time periods that will exceed the COP timeout period. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 30 Freescale Semiconductor Chapter 4 Resets 4.1 Introduction The MCU can be reset from three sources: one external input and two internal reset conditions. The RESET pin is a Schmitt trigger input as shown in Figure 4-1. The CPU and all peripheral modules will be reset by the RST signal which is the logical OR of internal reset functions and is clocked by PH1. RESET VDD OSC DATA ADDRESS POWER-ON RESET (POR) COP WATCHDOG (COPR) D RST RES DFF TO CPU AND PERIPHERALS PH1 Figure 4-1. Reset Block Diagram 4.2 External Reset (RESET) The RESET input is the only external reset and is connected to an internal Schmitt trigger. The external reset occurs whenever the RESET input is driven below the lower threshold and remains in reset until the RESET pin rises above the upper threshold. The upper and lower thresholds are given in Chapter 14 Electrical Specifications. 4.3 Internal Resets The two internally generated resets are the initial power-on reset (POR) function and the computer operating properly (COP) watchdog timer function. 4.3.1 Power-On Reset (POR) The internal POR is generated at power-up to allow the clock oscillator to stabilize. The POR is strictly for power turn-on conditions and should not be used to detect a drop in the power supply voltage. There is a 4064 internal clock cycle oscillator stabilization delay after the oscillator becomes active. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 31 Resets The POR will generate the RST signal and reset the MCU. If any other reset function is active at the end of this 4064 internal clock cycle delay, the RST signal will remain active until the other reset condition(s) end. 4.3.2 Computer Operating Properly (COP) Reset When the COP watchdog timer is enabled (COP bit in the MOR is set), the internal COP reset is generated automatically by a timeout of the COP watchdog timer. This timer is implemented with an 18-stage ripple counter that provides a timeout period of 65.5 ms when a 4-MHz oscillator is used. The COP watchdog counter is cleared by writing a logical 0 to bit zero at location $1FF0. The COP watchdog timer can be disabled by clearing the COP bit in the MOR or by applying 2 x VDD to the IRQ/VPP pin (for example, during bootloader). When the IRQ/VPP pin is returned to its normal operating voltage range (between VSS–VDD), the COP watchdog timer’s output will be restored if the COP bit in the mask option register (MOR) is set. The COP register is shared with the least significant byte (LSB) of an unused vector address as shown in Figure 4-2. Reading this location will return the programmed value of the unused user interrupt vector, usually 0. Writing to this location will clear the COP watchdog timer. Address: Read: $1FF0 Bit 7 6 5 4 3 2 1 0 0 0 0 0 0 0 Bit 0 0 COPR Write: = Unimplemented Figure 4-2. Unused Vector and COP Watchdog Timer When the COP watchdog timer expires, it will generate the RST signal and reset the MCU. If any other reset function is active at the end of the COP reset signal, the RST signal will remain in the reset condition until the other reset condition(s) end. When the reset condition ends, the MCU’s operating mode will be selected (see Table 3-1. Operating Mode Conditions After Reset). MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 32 Freescale Semiconductor Chapter 5 Interrupts 5.1 Introduction The MCU can be interrupted six different ways: 1. Non-maskable software interrupt instruction (SWI) 2. External asynchronous interrupt (IRQ) 3. Input capture interrupt (TIMER) 4. Output compare interrupt (TIMER) 5. Timer overflow interrupt (TIMER) 6. Port A interrupt (if selected via mask option register) Interrupts cause the processor to save the register contents on the stack and to set the interrupt mask (I bit) to prevent additional interrupts. Unlike reset, hardware interrupts do not cause the current instruction execution to be halted, but are considered pending until the current instruction is completed. When the current instruction is completed, the processor checks all pending hardware interrupts. If interrupts are not masked (I bit in the condition code register is clear) and the corresponding interrupt enable bit is set, the processor proceeds with interrupt processing. Otherwise, the next instruction is fetched and executed. The SWI is executed the same as any other instruction, regardless of the I-bit state. When an interrupt is to be processed, the CPU puts the register contents on the stack, sets the I bit in the CCR, and fetches the address of the corresponding interrupt service routine from the vector table at locations $1FF8 through $1FFF. If more than one interrupt is pending when the interrupt vector is fetched, the interrupt with the highest vector location shown in Table 5-1 will be serviced first. Table 5-1. Vector Addresses for Interrupts and Reset Register Flag Name N/A N/A Interrupts Reset CPU Interrupt Vector Address RESET $1FFE–$1FFF N/A N/A Software SWI $1FFC–$1FFD N/A N/A External Interrupt IRQ $1FFA–$1FFB TSR ICF Timer Input Capture TIMER $1FF8–$1FF9 TSR OCF Timer Output Compare TIMER $1FF8–$1FF9 TSR TOF Timer Overflow TIMER $1FF8–$1FF9 An RTI instruction is used to signify when the interrupt software service routine is completed. The RTI instruction causes the CPU state to be recovered from the stack and normal processing to resume at the next instruction that was to be executed when the interrupt took place. Figure 5-1 shows the sequence of events that occurs during interrupt processing. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 33 Interrupts FROM RESET Y IS I BIT SET? N IRQ INTERRUPT? Y CLEAR IRQ REQUEST LATCH N TIMER INTERRUPT? Y N STACK PC, X, A, CC SET I BIT IN CCR LOAD PC FROM: SWI: $1FFC, $1FFD IRQ: $1FFA-$1FFB TIMER: $1FF8-$1FF9 FETCH NEXT INSTRUCTION SWI INSTRUCTION? Y N RTI INSTRUCTION? Y RESTORE RESISTERS FROM STACK CC, A, X, PC N EXECUTE INSTRUCTION Figure 5-1. Interrupt Processing Flowchart MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 34 Freescale Semiconductor Interrupt Types 5.2 Interrupt Types The interrupts fall into three categories: reset, software, and hardware. 5.2.1 Reset Interrupt Sequence The reset function is not in the strictest sense an interrupt; however, it is acted upon in a similar manner as shown in Figure 5-1. A low-level input on the RESET pin or internally generated RST signal causes the program to vector to its starting address which is specified by the contents of memory locations $1FFE and $1FFF. The I bit in the condition code register is also set. The MCU is configured to a known state during this type of reset as previously described in Chapter 4 Resets. 5.2.2 Software Interrupt (SWI) The SWI is an executable instruction. It is also a non-maskable interrupt since it is executed regardless of the state of the I bit in the CCR. As with any instruction, interrupts pending during the previous instruction will be serviced before the SWI opcode is fetched. The interrupt service routine address for the SWI instruction is specified by the contents of memory locations $1FFC and $1FFD. 5.2.3 Hardware Interrupts All hardware interrupts are maskable by the I bit in the CCR. If the I bit is set, all hardware interrupts (internal and external) are disabled. Clearing the I bit enables the hardware interrupts. Four hardware interrupts are explained in the following subsections. 5.2.3.1 External Interrupt (IRQ) The IRQ/VPP pin drives an asynchronous interrupt to the CPU. An edge detector flip-flop is latched on the falling edge of IRQ/VPP. If either the output from the internal edge detector flip-flop or the level on the IRQ/VPP pin is low, a request is synchronized to the CPU to generate the IRQ interrupt. If the LEVEL bit in the mask option register is clear (edge-sensitive only), the output of the internal edge detector flip-flop is sampled and the input level on the IRQ/VPP pin is ignored. The interrupt service routine address is specified by the contents of memory locations $1FFA and $1FFB. If the port A interrupts are enabled by the MOR, they generate external interrupts identically to the IRQ/VPP pin. NOTE The internal interrupt latch is cleared nine internal clock cycles after the interrupt is recognized (immediately after location $1FFA is read). Therefore, another external interrupt pulse could be latched during the IRQ service routine. Another interrupt will be serviced if the IRQ pin is still in a low state when the RTI in the service routine is executed. 5.2.3.2 Input Capture Interrupt The input capture interrupt is generated by the 16-bit timer as described in Chapter 8 Capture/Compare Timer. The input capture interrupt flag is located in register TSR and its corresponding enable bit can be found in register TCR. The I bit in the CCR must be clear for the input capture interrupt to be enabled. The interrupt service routine address is specified by the contents of memory locations $1FF8 and $1FF9. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 35 Interrupts 5.2.3.3 Output Compare Interrupt The output compare interrupt is generated by a 16-bit timer as described in Chapter 8 Capture/Compare Timer. The output compare interrupt flag is located in register TSR and its corresponding enable bit can be found in register TCR. The I bit in the CCR must be clear for the output compare interrupt to be enabled. The interrupt service routine address is specified by the contents of memory locations $1FF8 and $1FF9. 5.2.3.4 Timer Overflow Interrupt The timer overflow interrupt is generated by the 16-bit timer as described in Chapter 8 Capture/Compare Timer. The timer overflow interrupt flag is located in register TSR and its corresponding enable bit can be found in register TCR. The I bit in the CCR must be clear for the timer overflow interrupt to be enabled. This internal interrupt will vector to the interrupt service routine located at the address specified by the contents of memory locations $1FF8 and $1FF9. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 36 Freescale Semiconductor Chapter 6 Input/Output Ports 6.1 Introduction In the user mode, 20 bidirectional I/O lines are arranged as two 8-bit I/O ports (ports A and C), one 3-bit I/O port (port B), and one 1-bit I/O port (port D). These ports are programmable as either inputs or outputs under software control of the data direction registers (DDRs). Port D also contains one input-only pin. 6.2 Port A Port A is an 8-bit bidirectional port, which does not share any of its pins with other subsystems (see Figure 6-1). The port A data register is located at address $0000 and its data direction register (DDR) is located at address $0004. The contents of the port A data register are indeterminate at initial power up and must be initialized by user software. Reset does not affect the data registers, but does clear the DDRs, thereby setting all of the port pins to input mode. Writing a 1 to a DDR bit sets the corresponding port pin to output mode. Port A has mask option register enabled interrupt capability with an internal pullup device NOTE The keyscan (pullup/interrupt) feature available on port A is NOT available in the ROM device, MC68HC05P6. VDD PULLUP MASK OPTION REGISTER READ $0004 WRITE $0004 RESET (RST) WRITE $0000 DATA DIRECTION REGISTER BIT DATA REGISTER BIT OUTPUT I/O PIN READ $0000 INTERNAL HC05 DATA BUS TO IRQ INTERRUPT SYSTEM Figure 6-1. Port A I/O and Interrupt Circuitry MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 37 Input/Output Ports 6.3 Port B Port B is a 3-bit bidirectional port which can share pins PB5–PB7 with the SIOP communications subsystem. The port B data register is located at address $0001 and its data direction register (DDR) is located at address $0005. The contents of the port B data register are indeterminate at initial powerup and must be initialized by user software. Reset does not affect the data registers, but clears the DDRs, thereby setting all of the port pins to input mode. Writing a 1 to a DDR bit sets the corresponding port pin to output mode (see Figure 6-2). Port B may be used for general I/O applications when the SIOP subsystem is disabled. The SPE bit in register SPCR is used to enable/disable the SIOP subsystem. When the SIOP subsystem is enabled, port B registers are still accessible to software. Writing to either of the port B registers while a data transfer is under way could corrupt the data. See Chapter 7 Serial Input/Output Port (SIOP) for a discussion of the SIOP subsystem. READ $0005 WRITE $0005 RESET (RST) WRITE $0001 DATA DIRECTION REGISTER BIT DATA REGISTER BIT OUTPUT I/O PIN READ $0001 INTERNAL HC05 DATA BUS Figure 6-2. Port B I/O Circuitry 6.4 Port C Port C is an 8-bit bidirectional port which can share pins PC3–PC7 with the A/D subsystem. The port C data register is located at address $0002 and its data direction register (DDR) is located at address $0006. The contents of the port C data register are indeterminate at initial powerup and must be initialized by user software. Reset does not affect the data registers, but clears the DDRs, thereby setting all of the port pins to input mode. Writing a 1 to a DDR bit sets the corresponding port pin to output mode (see Figure 6-3). Port C may be used for general I/O applications when the A/D subsystem is disabled. The ADON bit in register ADSC is used to enable/disable the A/D subsystem. Care must be exercised when using pins PC0–PC2 while the A/D subsystem is enabled. Accidental changes to bits that affect pins PC3–PC7 in the data or DDR registers will produce unpredictable results in the A/D subsystem. See Chapter 9 Analog Subsystem. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 38 Freescale Semiconductor Port D READ $0006 WRITE $0006 RESET (RST) DATA DIRECTION REGISTER BIT WRITE $0002 DATA REGISTER BIT OUTPUT I/O PIN READ $0002 INTERNAL HC05 DATA BUS Figure 6-3. Port C I/O Circuitry 6.5 Port D Port D is a 2-bit port with one bidirectional pin (PD5) and one input-only pin (PD7). Pin PD7 is shared with the 16-bit timer. The port D data register is located at address $0003 and its data direction register (DDR) is located at address $0007. The contents of the port D data register are indeterminate at initial powerup and must be initialized by user software. Reset does not affect the data registers, but clears the DDRs, thereby setting PD5 to input mode. Writing a 1 to DDR bit 5 sets PD5 to output mode (see Figure 6-4). Port D may be used for general I/O applications regardless of the state of the 16-bit timer. Since PD7 is an input-only line, its state can be read from the port D data register at any time. READ $0007 WRITE $0007 RESET (RST) DATA DIRECTION REGISTER BIT WRITE $0003 DATA REGISTER BIT OUTPUT I/O PIN READ $0003 INTERNAL HC05 DATA BUS Figure 6-4. Port D I/O Circuitry 6.6 I/O Port Programming Each pin on port A through port D (except pin 7 of port D) can be programmed as an input or an output under software control as shown in Table 6-1, Table 6-2, Table 6-3, and Table 6-4. The direction of a pin is determined by the state of its corresponding bit in the associated port data direction register (DDR). A pin is configured as an output if its corresponding DDR bit is set to a logic 1. A pin is configured as an input if its corresponding DDR bit is cleared to a logic 0. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 39 Input/Output Ports Table 6-1. Port A I/O Functions DDRA I/O Pin Mode Accesses to DDRA @ $0004 Accesses to Data Register @ $0000 Read/Write Read Write 0 IN, Hi-Z DDRA0–DDRA7 I/O Pin See Note 1 OUT DDRA0–DDRA7 PA0–PA7 PA0–PA7 Note: Does not affect input, but stored to data register Table 6-2. Port B I/O Functions DDRB I/O Pin Mode Accesses to DDRB @ $0005 Accesses to Data Register @ $0001 Read/Write Read Write 0 IN, Hi-Z DDRB5–DDRB7 I/O Pin See Note 1 OUT DDRB5–DDRB7 PB5–PB7 PB5–PB7 Note: Does not affect input, but stored to data register Table 6-3. Port C I/O Functions DDRC I/O Pin Mode Accesses to DDRC @ $0006 Accesses to Data Register @ $0002 Read/Write Read Write 0 IN, Hi-Z DDRC0–DDRC7 I/O Pin See Note 1 OUT DDRC0–DDRC7 PC0–PC7 PC0–PC7 Note: Does not affect input, but stored to data register Table 6-4. Port D I/O Functions DDRD I/O Pin Mode Accesses to DDRD @ $0007 Accesses to Data Register @ $0003 Read/Write Read Write 0 IN, Hi-Z DDRD5 I/O Pin See Note 1 1 OUT DDRD5 PD5 PD5 Notes: 1. Does not affect input, but stored to data register 2. PD7 is input only NOTE To avoid generating a glitch on an I/O port pin, data should be written to the I/O port data register before writing a logic 1 to the corresponding data direction register. At power-on or reset, all DDRs are cleared, which configures all port pins as inputs. The DDRs are capable of being written to or read by the processor. During the programmed output state, a read of the data register will actually read the value of the output data latch and not the level on the I/O port pin. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 40 Freescale Semiconductor Chapter 7 Serial Input/Output Port (SIOP) 7.1 Introduction The simple synchronous serial I/O port (SIOP) subsystem is designed to provide efficient serial communications between peripheral devices or other MCUs. The SIOP is implemented as a 3-wire master/slave system with serial clock (SCK), serial data input (SDI), and serial data output (SDO). A block diagram of the SIOP is shown in Figure 7-1. A mask programmable option determines whether the SIOP is MSB or LSB first. The SIOP subsystem shares its input/output pins with port B. When the SIOP is enabled (SPE bit set in register SCR), port B DDR and data registers are modified by the SIOP. Although port B DDR and data registers can be altered by application software, these actions could affect the transmitted or received data. HCO5 INTERNAL BUS SPE 76 54 3210 7 6 54 3210 BAUD CONTROL STATUS RATE REGISTER $0A GENERATOR 76543210 8-BIT SDO SHIFT REGISTER $0B REGISTER $0C I/O SDO/PB5 CONTROL SDI LOGIC SCK SDI/PB6 SCK/PB7 INTERNAL CPU CLOCK Figure 7-1. SIOP Block Diagram MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 41 Serial Input/Output Port (SIOP) 7.2 SIOP Signal Format The SIOP subsystem is software configurable for master or slave operation. No external mode selection inputs are available (for instance, slave select pin). 7.2.1 Serial Clock (SCK) The state of the SCK output normally remains a logic 1 during idle periods between data transfers. The first falling edge of SCK signals the beginning of a data transfer. At this time, the first bit of received data may be presented at the SDI pin and the first bit of transmitted data is presented at the SDO pin (see Figure 7-2). Data is captured at the SDI pin on the rising edge of SCK. The transfer is terminated upon the eighth rising edge of SCK. The master and slave modes of operation differ only by the sourcing of SCK. In master mode, SCK is driven from an internal source within the MCU. In slave mode, SCK is driven from a source external to the MCU. The SCK frequency is dependent upon the SPR0 and SPR1 bits located in the mask option register. Refer to 11.2 Mask Option Register for a description of available SCK frequencies. BIT 0 BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 BIT 6 BIT 7 BIT 6 BIT 7 SDO SCK 100 ns 100 ns SDI BIT 0 BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 Figure 7-2. SIOP Timing Diagram 7.2.2 Serial Data Input (SDI) The SDI pin becomes an input as soon as the SIOP subsystem is enabled. New data may be presented to the SDI pin on the falling edge of SCK.However, valid data must be present at least 100 nanoseconds before the rising edge of SCK and remain valid for 100 nanoseconds after the rising edge of SCK. See Figure 7-2. 7.2.3 Serial Data Output (SDO) The SDO pin becomes an output as soon as the SIOP subsystem is enabled. Prior to enabling the SIOP, PB5 can be initialized to determine the beginning state. While the SIOP is enabled, PB5 cannot be used as a standard output since that pin is connected to the last stage of the SIOP serial shift register. Mask option register bit LSBF permits data to be transmitted in either the MSB first format or the LSB first format. Refer to 11.2 Mask Option Register for MOR LSBF programming information. On the first falling edge of SCK, the first data bit will be shifted out to the SDO pin. The remaining data bits will be shifted out to the SDO pin on subsequent falling edges of SCK. The SDO pin will present valid data at least 100 nanoseconds before the rising edge of the SCK and remain valid for 100 nanoseconds after the rising edge of SCK. See Figure 7-2. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 42 Freescale Semiconductor SIOP Registers 7.3 SIOP Registers The SIOP is programmed and controlled by the SIOP control register (SCR) located at address $000A, the SIOP status register (SSR) located at address $000B, and the SIOP data register (SDR) located at address $000C. 7.3.1 SIOP Control Register (SCR) This register is located at address $000A and contains two bits. Figure 7-3 shows the position of each bit in the register and indicates the value of each bit after reset. Address: $000A Bit 7 Read: 0 Write: Reset: 0 6 SPE 0 5 0 0 4 MSTR 0 3 2 1 Bit 0 0 0 0 0 0 0 0 0 = Unimplemented Figure 7-3. SIOP Control Register (SCR) SPE — Serial Peripheral Enable When set, the SPE bit enables the SIOP subsystem such that SDO/PB5 is the serial data output, SDI/PB6 is the serial data input, and SCK/PB7 is a serial clock input in the slave mode or a serial clock output in the master mode. Port B DDR and data registers can be manipulated as usual (except for PB5); however, these actions could affect the transmitted or received data. The SPE bit is readable at any time. However, writing to the SIOP control register while a transmission is in progress will cause the SPIF and DCOL bits in the SIOP status register (see below) to operate incorrectly. Therefore, the SIOP control register should be written once to enable the SIOP and then not written to until the SIOP is to be disabled. Clearing the SPE bit while a transmission is in progress will 1) abort the transmission, 2) reset the serial bit counter, and 3) convert the port B/SIOP port to a general-purpose I/O port. Reset clears the SPE bit. MSTR — Master Mode Select When set, the MSTR bit configures the serial I/O port for master mode. A transfer is initiated by writing to the SDR. Also, the SCK pin becomes an output providing a synchronous data clock dependent upon the oscillator frequency. When the device is in slave mode, the SDO and SDI pins do not change function. These pins behave exactly the same in both the master and slave modes. The MSTR bit is readable and writeable at any time regardless of the state of the SPE bit. Clearing the MSTR bit will abort any transfers that may have been in progress. Reset clears the MSTR bit as well as the SPE bit, disabling the SIOP subsystem. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 43 Serial Input/Output Port (SIOP) 7.3.2 SIOP Status Register (SSR) This register is located at address $000B and contains two bits. Figure 7-4 shows the position of each bit in the register and indicates the value of each bit after reset. Address: Read: $000B Bit 7 6 5 4 3 2 1 Bit 0 SPIF DCOL 0 0 0 0 0 0 0 0 0 0 0 0 0 Write: Reset: 0 = Unimplemented Figure 7-4. SIOP Status Register (SSR) SPIF — Serial Port Interface Flag SPIF is a read-only status bit that is set on the last rising edge of SCK and indicates that a data transfer has been completed. It has no effect on any future data transfers and can be ignored. The SPIF bit is cleared by reading the SSR followed by a read or write of the SDR. If the SPIF is cleared before the last rising edge of SCK, it will be set again on the last rising edge of SCK. Reset clears the SPIF bit. DCOL — Data Collision DCOL is a read-only status bit which indicates that an illegal access of the SDR has occurred. The DCOL bit will be set when reading or writing the SDR after the first falling edge of SCK and before SPIF is set. Reading or writing the SDR during this time will result in invalid data being transmitted or received. The DCOL bit is cleared by reading the SSR (when the SPIF bit is set) followed by a read or write of the SDR. If the last part of the clearing sequence is done after another transfer has started, the DCOL bit will be set again. Reset clears the DCOL bit. 7.3.3 SIOP Data Register (SDR) This register is located at address $000C and serves as both the transmit and receive data register. Writing to this register will initiate a message transmission if the SIOP is in master mode. The SIOP subsystem is not double buffered and any write to this register will destroy the previous contents. The SDR can be read at any time; however, if a transfer is in progress, the results may be ambiguous and the DCOL bit will be set. Writing to the SDR while a transfer is in progress can cause invalid data to be transmitted and/or received. Figure 7-5 shows the position of each bit in the register. This register is not affected by reset. Address: Read: Write: Reset: $000C Bit 7 6 5 4 3 2 1 Bit 0 SD7 SD6 SD5 SD4 SD3 SD2 SD1 SD0 Unaffected by reset Figure 7-5. Serial Port Data Register (SDR) MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 44 Freescale Semiconductor Chapter 8 Capture/Compare Timer 8.1 Introduction This section describes the operation of the 16-bit capture/compare timer. Figure 8-1 shows the structure of the capture/compare subsystem. INTERNAL BUS HIGH LOW BYTE BYTE INTERNAL PROCESSOR CLOCK 8-BIT BUFFER ³³³ $16 $17 OUTPUT COMPARE REGISTER ÷4 HIGH BYTE 16-BIT FREE RUNNING COUNTER LOW BYTE $18 $19 HIGH LOW BYTE BYTE INPUT $14 CAPTURE $15 REGISTER COUNTER $1A ALTERNATE $1B REGISTER OUTPUT COMPARE CIRCUIT TIMER STATUS ICF OCF TOF $13 REG. OVERFLOW DETECT CIRCUIT EDGE DETECT CIRCUIT OUTPUT LEVEL REG. D Q CLK C TIMER CONTROLRESET ICIE OCIE TOIE IEDG OLVL REG. $12 INTERRUPT CIRCUIT OUTPUT LEVEL (TCMP) EDGE INPUT (TCAP) Figure 8-1. Capture/Compare Timer Block Diagram MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 45 Capture/Compare Timer 8.2 Timer Operation The core of the capture/compare timer is a 16-bit free-running counter. The counter provides the timing reference for the input capture and output compare functions. The input capture and output compare functions provide a means to latch the times at which external events occur, to measure input waveforms, and to generate output waveforms and timing delays. Software can read the value in the 16-bit free-running counter at any time without affecting the counter sequence. Because of the 16-bit timer architecture, the I/O registers for the input capture and output compare functions are pairs of 8-bit registers. Because the counter is 16 bits long and preceded by a fixed divide-by-4 prescaler, the counter rolls over every 262,144 internal clock cycles. Timer resolution with a 4-MHz crystal is 2 µs. 8.2.1 Input Capture The input capture function is a means to record the time at which an external event occurs. When the input capture circuitry detects an active edge on the TCAP pin, it latches the contents of the timer registers into the input capture registers. The polarity of the active edge is programmable. Latching values into the input capture registers at successive edges of the same polarity measures the period of the input signal on the TCAP pin. Latching values into the input capture registers at successive edges of opposite polarity measures the pulse width of the signal. 8.2.2 Output Compare The output compare function is a means of generating an output signal when the 16-bit counter reaches a selected value. Software writes the selected value into the output compare registers. On every fourth internal clock cycle the output compare circuitry compares the value of the counter to the value written in the output compare registers. When a match occurs, the timer transfers the programmable output level bit (OLVL) from the timer control register to the TCMP pin. The programmer can use the output compare register to measure time periods, to generate timing delays, or to generate a pulse of specific duration or a pulse train of specific frequency and duty cycle on the TCMP pin. 8.3 Timer I/O Registers The following I/O registers control and monitor timer operation: • Timer control register (TCR) • Timer status register (TSR) • Timer registers (TRH and TRL) • Alternate timer registers (ATRH and ATRL) • Input capture registers (ICRH and ICRL) • Output compare registers (OCRH and OCRL) MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 46 Freescale Semiconductor Timer I/O Registers 8.3.1 Timer Control Register The timer control register (TCR), shown in Figure 8-2, performs these functions: • Enables input capture interrupts • Enables output compare interrupts • Enables timer overflow interrupts • Controls the active edge polarity of the TCAP signal • Controls the active level of the TCMP output Address: Read: Write: Reset: $0012 Bit 7 6 5 ICIE OCIE TOIE 0 0 0 = Unimplemented 4 3 2 0 0 0 0 0 0 1 Bit 0 IEDG OLVL U 0 U = Undetermined Figure 8-2. Timer Control Register (TCR) ICIE — Input Capture Interrupt Enable This read/write bit enables interrupts caused by an active signal on the TCAP pin. Resets clear the ICIE bit. 1 = Input capture interrupts enabled 0 = Input capture interrupts disabled OCIE — Output Compare Interrupt Enable This read/write bit enables interrupts caused by an active signal on the TCMP pin. Resets clear the OCIE bit. 1 = Output compare interrupts enabled 0 = Output compare interrupts disabled TOIE — Timer Overflow Interrupt Enable This read/write bit enables interrupts caused by a timer overflow. Reset clear the TOIE bit. 1 = Timer overflow interrupts enabled 0 = Timer overflow interrupts disabled IEDG — Input Edge The state of this read/write bit determines whether a positive or negative transition on the TCAP pin triggers a transfer of the contents of the timer register to the input capture register. Resets have no effect on the IEDG bit. 1 = Positive edge (low to high transition) triggers input capture 0 = Negative edge (high to low transition) triggers input capture OLVL — Output Level The state of this read/write bit determines whether a logic 1 or logic 0 appears on the TCMP pin when a successful output compare occurs. Resets clear the OLVL bit. 1 = TCMP goes high on output compare 0 = TCMP goes low on output compare MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 47 Capture/Compare Timer 8.3.2 Timer Status Register The timer status register (TSR), shown in Figure 8-3, contains flags to signal the following conditions: • An active signal on the TCAP pin, transferring the contents of the timer registers to the input capture registers • A match between the 16-bit counter and the output compare registers, transferring the OLVL bit to the TCMP pin • A timer roll over from $FFFF to $0000 Address: Read: $0013 Bit 7 6 5 4 3 2 1 Bit 0 ICF OCF TOF 0 0 0 0 0 U U U 0 0 0 0 0 Write: Reset: = Unimplemented U = Undetermined Figure 8-3. Timer Status Register (TSR) ICF — Input Capture Flag The ICF bit is set automatically when an edge of the selected polarity occurs on the TCAP pin. Clear the ICF bit by reading the timer status register with ICF set and then reading the low byte ($0015) of the input capture registers. Resets have no effect on ICF. OCF — Output Compare Flag The OCF bit is set automatically when the value of the timer registers matches the contents of the output compare registers. Clear the OCF bit by reading the timer status register with OCF set and then reading the low byte ($0017) of the output compare registers. Resets have no effect on OCF. TOF — Timer Overflow Flag The TOF bit is set automatically when the 16-bit counter rolls over from $FFFF to $0000. Clear the TOF bit by reading the timer status register with TOF set, and then reading the low byte ($0019) of the timer registers. Resets have no effect on TOF. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 48 Freescale Semiconductor Timer I/O Registers 8.3.3 Timer Registers The timer registers (TRH and TRL), shown in Figure 8-4, contains the current high and low bytes of the 16-bit counter. Reading TRH before reading TRL causes TRL to be latched until TRL is read. Reading TRL after reading the timer status register clears the timer overflow flag (TOF). Writing to the timer registers has no effect. Address: Read: TRH — $0018 Bit 7 6 5 4 3 2 1 Bit 0 TRH7 TRH6 TRH5 TRH4 TRH3 TRH2 TRH1 TRH0 1 1 1 1 1 1 1 1 Bit 7 6 5 4 3 2 1 Bit 0 1 1 1 1 1 1 0 0 Write Reset: Address: TRL — $0019 Write: Reset: = Unimplemented Figure 8-4. Timer Registers (TRH and TRL) 8.3.4 Alternate Timer Registers The alternate timer registers (ATRH and ATRL), shown in Figure 8-5, contain the current high and low bytes of the 16-bit counter. Reading ATRH before reading ATRL causes ATRL to be latched until ATRL is read. Reading ATRL has no effect on the timer overflow flag (TOF). Writing to the alternate timer registers has no effect. Address: Read: ATRH — $001A Bit 7 6 5 4 3 2 1 Bit 0 ACRH7 ACRH6 ACRH5 ACRH4 ACRH3 ACRH2 ACRH1 ACRH0 1 1 1 1 1 1 1 1 Bit 7 6 5 4 3 2 1 Bit 0 1 1 1 1 1 1 0 0 Write: Reset: Address: ATRL — $001B Write: Reset: = Unimplemented Figure 8-5. Alternate Timer Registers (ATRH and ATRL) NOTE To prevent interrupts from occurring between readings of ATRH and ATRL, set the interrupt flag in the condition code register before reading ATRH, and clear the flag after reading ATRL. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 49 Capture/Compare Timer 8.3.5 Input Capture Registers When a selected edge occurs on the TCAP pin, the current high and low bytes of the 16-bit counter are latched into the input capture registers. Reading ICRH before reading ICRL inhibits further capture until ICRL is read. Reading ICRL after reading the status register clears the input capture flag (ICF). Writing to the input capture registers has no effect. Address: Read: ICRH — $0014 Bit 7 6 5 4 3 2 1 Bit 0 ICRH7 ICRH6 ICRH5 ICRH4 ICRH3 ICRH2 ICRH1 ICRH0 2 1 Bit 0 Write: Unaffected by reset Address: ICRL — $0015 Bit 7 6 5 4 3 Write: Unaffected by reset = Unimplemented Figure 8-6. Input Capture Registers (ICRH and ICRL) NOTE To prevent interrupts from occurring between readings of ICRH and ICRL, set the interrupt flag in the condition code register before reading ICRH, and clear the flag after reading ICRL. 8.3.6 Output Compare Registers When the value of the 16-bit counter matches the value in the output compare registers, the planned TCMP pin action takes place. Writing to OCRH before writing to OCRL inhibits timer compares until OCRL is written. Reading or writing to OCRL after the timer status register clears the output compare flag (OCF). Address: Write: Read: OCRH — $0016 Bit 7 6 5 4 3 2 1 Bit 0 OCRH7 OCRH6 OCRH5 OCRH4 OCRH3 OCRH2 OCRH1 OCRH0 2 1 Bit 0 Unaffected by reset Address: OCRL — $0017 Bit 7 6 5 4 3 Read: Unaffected by reset Figure 8-7. Output Compare Registers (OCRH and OCRL) MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 50 Freescale Semiconductor Timer During Wait/Halt Mode To prevent OCF from being set between the time it is read and the time the output compare registers are updated, use this procedure: 1. Disable interrupts by setting the I bit in the condition code register. 2. Write to OCRH. Compares are now inhibited until OCRL is written. 3. Clear bit OCF by reading timer status register (TSR). 4. Enable the output compare function by writing to OCRL. 5. Enable interrupts by clearing the I bit in the condition code register. 8.4 Timer During Wait/Halt Mode The CPU clock halts during the wait (or halt) mode, but the timer remains active. If interrupts are enabled, a timer interrupt will cause the processor to exit the wait mode. 8.5 Timer During Stop Mode In the stop mode, the timer stops counting and holds the last count value if STOP is exited by an interrupt. If STOP is exited by RESET, the counters are forced to $FFFC. During STOP, if at least one valid input capture edge occurs at the TCAP pins, the input capture detect circuit is armed. This does not set any timer flags or wake up the MCU, but if an interrupt is used to exit stop mode, there is an active input capture flag and data from the first valid edge that occurred during the stop mode. If reset is used to exit stop mode, then no input capture flag or data remains, even if a valid input capture edge occurred. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 51 Capture/Compare Timer MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 52 Freescale Semiconductor Chapter 9 Analog Subsystem 9.1 Introduction The MC68HC705P6A includes a 4-channel, multiplexed input, 8-bit, successive approximation analog-to-digital (A/D) converter. The A/D subsystem shares its inputs with port C pins PC3–PC7. 9.2 Analog Section The following paragraphs describe the operation and performance of analog modules within the analog subsystem. 9.2.1 Ratiometric Conversion The A/D converter is ratiometric, with pin VREFH supplying the high reference voltage. Applying an input voltage equal to VREFH produces a conversion result of $FF (full scale). Applying an input voltage equal to VSS produces a conversion result of $00. An input voltage greater than VREFH will convert to $FF with no overflow indication. For ratiometric conversions, VREFH should be at the same potential as the supply voltage being used by the analog signal being measured and referenced to VSS. 9.2.2 Reference Voltage (VREFH) The reference supply for the A/D converter shares pin PC7 with port C. The low reference is tied to the VSS pin internally. VREFH can be any voltage between VSS and VDD; however, the accuracy of conversions is tested and guaranteed only for VREFH = VDD. 9.2.3 Accuracy and Precision The 8-bit conversion result is accurate to within ±1 1/2 LSB, including quantization; however, the accuracy of conversions is tested and guaranteed only with external oscillator operation. 9.3 Conversion Process The A/D reference inputs are applied to a precision digital-to-analog converter. Control logic drives the D/A and the analog output is successively compared to the selected analog input which was sampled at the beginning of the conversion cycle. The conversion process is monotonic and has no missing codes. 9.4 Digital Section The following paragraphs describe the operation and performance of digital modules within the analog subsystem. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 53 Analog Subsystem 9.4.1 Conversion Times Each input conversion requires 32 internal clock cycles, which must be at a frequency equal to or greater than 1 MHz. 9.4.2 Internal versus External Oscillator If the internal clock is 1 MHz or greater (i.e., external oscillator 2 MHz or greater), the internal RC oscillator must be turned off and the external oscillator used as the conversion clock. If the MCU internal clock frequency is less than 1 MHz (2 MHz external oscillator), the internal RC oscillator (approximately 1.5 MHz) must be used for the A/D converter clock. The internal RC clock is selected by setting the ADRC bit in the ADSC register. When the internal RC oscillator is being used, these limitations apply: 1. Since the internal RC oscillator is running asynchronously with respect to the internal clock, the conversion complete bit (CC) in register ADSC must be used to determine when a conversion sequence has been completed. 2. Electrical noise will slightly degrade the accuracy of the A/D converter. The A/D converter is synchronized to read voltages during the quiet period of the clock driving it. Since the internal and external clocks are not synchronized, the A/D converter will occasionally measure an input when the external clock is making a transition. 9.4.3 Multi-Channel Operation An input multiplexer allows the A/D converter to select from one of four external analog signals. Port C pins PC3 through PC6 are shared with the inputs to the multiplexer. 9.5 A/D Status and Control Register (ADSC) The ADSC register reports the completion of A/D conversion and provides control over oscillator selection, analog subsystem power, and input channel selection. See Figure 9-1. Address: $001E Bit 7 Read: CC Write: Reset: 0 6 5 ADRC ADON 0 0 4 3 0 0 0 0 2 1 Bit 0 CH2 CH1 CH0 0 0 0 = Unimplemented Figure 9-1. A/D Status and Control Register (ADSC) CC — Conversion Complete This read-only status bit is set when a conversion sequence has completed and data is ready to be read from the ADC register. CC is cleared when the ADSC is written to or when data is read from the ADC register. Once a conversion has been started, conversions of the selected channel will continue every 32 internal clock cycles until the ADSC register is written to again. During continuous conversion operation, the ADC register will be updated with new data, and the CC bit set every 32 internal clock cycles. Also, data from the previous conversion will be overwritten regardless of the state of the CC bit. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 54 Freescale Semiconductor A/D Conversion Data Register (ADC) ADRC — RC Oscillator Control When ADRC is set, the A/D subsystem operates from the internal RC oscillator instead of the internal clock. The RC oscillator requires a time, tRCON, to stabilize before accurate conversion results can be obtained. See 9.2.2 Reference Voltage (VREFH) for more information. ADON — A/D Subsystem On When the A/D subsystem is turned on (ADON = 1), it requires a time, tADON, to stabilize before accurate conversion results can be attained. CH2–CH0 — Channel Select Bits CH2, CH1, and CH0 form a 3-bit field which is used to select an input to the A/D converter. Channels 0–3 correspond to port C input pins PC6–PC3. Channels 4–6 are used for reference measurements. Channel 7 is reserved. If a conversion is attempted with channel 7 selected, the result will be $00. Table 9-1 lists the inputs selected by bits CH0-CH3. If the ADON bit is set and an input from channels 0–4 is selected, the corresponding port C pin’s DDR bit will be cleared (making that port C pin an input). If the port C data register is read while the A/D is on and one of the shared input channels is selected using bit CH0–CH2, the corresponding port C pin will read as a logic 0. The remaining port C pins will read normally. To digitally read a port C pin, the A/D subsystem must be disabled (ADON = 0), or input channels 5–7 must be selected. Table 9-1. A/D Multiplexer Input Channel Assignments Channel Signal 0 AD0 — port C, bit 6 1 AD1 — port C, bit 5 2 AD2 — port C, bit 4 3 AD3 — port C, bit 3 4 VREFH — port C, bit 7 5 (VREFH + VSS)/2 6 VSS 7 Reserved for factory test 9.6 A/D Conversion Data Register (ADC) This register contains the output of the A/D converter. See Figure 9-2. Address: $001D Read: Bit 7 6 5 4 3 2 1 Bit 0 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 Write: Reset: Unaffected by reset = Unimplemented Figure 9-2. A/D Conversion Value Data Register (ADC) MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 55 Analog Subsystem 9.7 A/D Subsystem Operation during Halt/Wait Modes The A/D subsystem continues normal operation during wait and halt modes. To decrease power consumption during wait or halt mode, the ADON and ADRC bits in the A/D status and control register should be cleared if the A/D subsystem is not being used. 9.8 A/D Subsystem Operation during Stop Mode When stop mode is enabled, execution of the STOP instruction will terminate all A/D subsystem functions. Any pending conversion is aborted. When the oscillator resumes operation upon leaving stop mode, a finite amount of time passes before the A/D subsystem stabilizes sufficiently to provide conversions at its rated accuracy. The delays built into the MC68HC705P6A when coming out of stop mode are sufficient for this purpose. No explicit delays need to be added to the application software. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 56 Freescale Semiconductor Chapter 10 EPROM 10.1 Introduction The user EPROM consists of 48 bytes of user page zero EPROM from $0020 to $004F, 4608 bytes of user EPROM from $0100 to $12FF, the two MOR reset values located at $1EFF and $1F00, and 16 bytes of user vectors EPROM from $1FF0 to $1FFF. The bootloader ROM and vectors are located from $1F01 to $1FEF. 10.2 EPROM Erasing NOTE Only parts packaged in a windowed package may be erased. Others are one-time programmable and may not be erased by UV exposure. The MC68HC705P6A can be erased by exposure to a high-intensity ultraviolet (UV) light with a wavelength of 2537 angstroms. The recommended dose (UV intensity multiplied by exposure time) is 15 Ws/cm2. UV lamps without shortwave filters should be used, and the EPROM device should be positioned about one inch from the UV lamp. An erased EPROM byte will read as $00. 10.3 EPROM Programming Sequence The bootloader software goes through a complete write cycle of the EPROM including the MOR. This is followed by a verify cycle which continually branches in a loop if an error is found. A sample routine to program a byte of EPROM is shown in Table 10-1. NOTE To avoid damage to the MCU, VDD must be applied to the MCU before VPP. 10.4 EPROM Registers Three registers are associated with the EPROM: the EPROM programming register (EPROG) and the two mask option registers (MOR). The EPROG register controls the actual programming of the EPROM bytes and the MOR. The MOR registers control the six mask options found on the ROM version of this MCU (MC68HC05P6), the EPROM security feature, and eight additional port A interrupt options. 10.5 EPROM Programming Register (EPROG) This register is used to program the EPROM array. Only the ELAT and EPGM bits are available. Table 10-1 shows the location of each bit in the EPROG register and the state of these bits coming out of reset. All the bits in the EPROG register are cleared by reset. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 57 EPROM Address $001C Read: Bit 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 Write: Reset: 2 ELAT 0 1 0 Bit 0 EPGM 0 0 = Unimplemented Figure 10-1. EPROM Programming Register (EPROG) EPGM — EPROM Program Control If the EPGM bit is set, programming power is applied to the EPROM array. If the EPGM bit is cleared, programming power is removed from the EPROM array. The EPGM bit cannot be set unless the ELAT bit is set already. Whenever the ELAT bit is cleared, the EPGM bit is cleared also. Both the EPGM and the ELAT bit cannot be set using the same write instruction. Any attempt to set both the EPGM and ELAT bit on the same write instruction cycle will result in the ELAT bit being set and the EPGM bit being cleared. The EPGM bit is a read-write bit and can be read at any time. The EPGM bit is cleared by reset. ELAT— EPROM Latch Control If the ELAT bit is set, the EPROM address and data bus are configured for programming to the array. If the ELAT bit is cleared, the EPROM address and data bus are configured for normal reading of data from the array. When the ELAT bit is set, the address and data bus are latched in the EPROM array when a subsequent write to the array is made. Data in the EPROM array cannot be read if the ELAT bit is set. Whenever the ELAT bit is cleared, the EPGM bit is cleared also. Both the EPGM and the ELAT bit cannot be set using the same write instruction. Any attempt to set both the EPGM and ELAT bit on the same write instruction cycle will result in the ELAT bit being set and the EPGM bit being cleared. The ELAT bit is a read-write bit and can be read at any time. The ELAT bit is cleared by reset. To program a byte of EPROM, manipulate the EPROG register as follows: 1. Set the ELAT bit in the EPROG register. 2. Write the desired data to the desired EPROM address. 3. Set the EPGM bit in the EPROG register for the specified programming time, t . EPGM 4. Clear the ELAT and EPGM bits in the EPROG register. This sequence is also shown in the sample program listing in Table 10-1. Table 10-1. EPROM Programming Routine 001C 0055 0700 0000 00D0 00D0 00D2 00D4 00D6 00D9 00DB 00DD 00DF EPROG DATA EPROM EPGM ORG A6 02 B7 1C A6 55 C7 07 00 10 1C AD 03 3F 1C 81 EQU $1C EQU $55 EQU $700 EQU $00 $D0 LDA #$04 STA EPROG LDA #DATA STA EPROM BSET EPGM, EPROG BSR DELAY CLR EPROG RTS PROGRAMMING REG DATA VALUE A SAMPLE EPROM ADX EPGM BIT IN EPROG REG SET LAT BIT IN EPROG DATA BYTE WRITE IT TO EPROM LOC TURN ON PGM VOLTAGE WAIT 4 ms MINIMUM CLR LAT AND PGM BITS MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 58 Freescale Semiconductor EPROM Bootloader 10.6 EPROM Bootloader Three port pins are associated with bootloader control functions: PC3, PC4, and PC6. Table 10-2 summarizes their functionality. Table 10-2. Bootloader Control Pins PC6 PC4 PC3 Mode 1 1 1 Program/verify 1 1 0 Verify only 1 0 0 Dump MCU EPROM to port A 10.7 Programming from an External Memory Device In this programming mode, PC5 must be connected to VSS. PC4 and PC3 are used to select the programming mode. The programming circuit shown in Figure 10-2 uses an external 12-bit counter to address the memory device containing the code to be copied. This counter requires a clock and a reset function. The 12-bit counter can address up to 4 Kbytes of memory, which means that a port pin has to be used to address the remaining 4 K of the 8-K memory space. The following procedure explains how to use the programming circuit shown in Figure 10-2 to copy a user program from an external memory device into the MCU’s EPROM: 1. Program a 2764-type EPROM device with the desired instructions and data. Code programmed into the 2764 must appear at the same addresses desired in the MC68HC705P6A. Therefore, the page zero code must start at $0020 and end at $004F, the main body of code must start at $0100 and end at $12FF, and the user vectors must start at $1FF0 and end at $1FFF. NOTE The MOR data must appear at $1EFF and $1F00. 2. Install the programmed 2764 device into the programming circuit. 3. Install the MC68HC705P6A to be programmed into the programming circuit. 4. Set the PROGRAM and/or VERIFY switches for the desired operation (an open switch is the active state) and close the RESET switch to hold the MCU in reset. 5. Make sure that the VPP source is OFF. 6. Apply the VDD source to the programming circuit. 7. Apply the VPP source to the programming circuit. 8. Open the RESET switch to allow the MCU to come out of reset and begin execution of the software in its internal bootloader ROM. 9. Wait for programming and/or verification to complete (about 40 seconds). The PROGRAM LED will light during programming and the VERIFY LED will light if verification was requested and was successful. 10. When complete, close the RESET switch to force the MCU into the reset state. 11. Turn off the VPP source. 12. Turn off the VDD source. 13. Remove device(s). MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 59 EPROM PROGRAM 2764 TYPE EPROM INSTALL EPROM INTO PROGRAMMER PROGRAMMING? INSTALL MC68HC705P6A INTO PROGRAMMER N Y PROGRAMMING? WAIT FOR PROGRAMMING LED TO TURN ON AND OFF. N Y OPEN PROGRAM SWITCH CLOSE PROGRAM SWITCH VERIFYING? N Y VERIFYING? WAIT FOR 30 SECONDS N Y OPEN VERIFY SWITCH CLOSE VERIFY SWITCH N IS VERIFY LED LIT? CLOSE RESET SWITCH Y MAKE SURE VPP IS OFF VERIFICATION FAILED VERIFICATION COMPLETE TURN VDD ON CLOSE RESET SWITCH TURN VPP ON TURN OFF VPP OPEN RESET SWITCH TURN OFF VDD REMOVE DEVICES Figure 10-2. MC68HC705P6A EPROM Programming Flowchart MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 60 Freescale Semiconductor Programming from an External Memory Device V DD MC68HC705P6A VPP IRQ/VPP 10 kΩ 2764 PD7/TCAP MC74HC4040 VDD OSC1 PGM 2 MHz OSC2 20 pF 10 MΩ 20 pF VDD 10 kΩ RESET RESET PB5 A12 PA7 D7 PA6 D6 PA5 D5 PA4 D4 PA3 D3 PA2 D2 PA1 D1 PA0 D0 1 µF VDD CE A11 Q12 A10 Q11 A9 Q10 A8 Q9 A7 Q8 A6 Q7 A5 Q6 A4 Q5 A3 Q4 A2 Q3 A1 Q2 A0 Q1 OE V RST DD CLK 10 kΩ PC6 PC1 PROG PB7 PC2 330 Ω V DD 10 kΩ VERF V DD 10 kΩ PGM PB6 PC3 330 Ω PC5 VFY PC4 V = 5.0 V DD V = 16.5 V PP Figure 10-3. MC68HC705P6A EPROM Programming Schematic Diagram MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 61 EPROM MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 62 Freescale Semiconductor Chapter 11 Mask Option Register (MOR) 11.1 Introduction The mask option register (MOR) contains two bytes of EPROM used to enable or disable each of the features controlled by mask options on the MC68HC05P6 (a ROM version of the MC68HC705P6A). The seven programmable options on the MC68HC705P6A are: 1. COP watchdog timer (enable or disable) 2. IRQ triggering (edge- or edge- and level-sensitive) 3. SIOP data bit order (most significant bit or least significant bit first) 4. SIOP clock rate (OSC divided by 8, 16, 32, or 64) 5. Stop instruction mode (stop mode or halt mode) 6. Secure EPROM from external reading 7. Keyscan interrupt/pullups on PA0–PA7 11.2 Mask Option Register Mask options are programmed into the mask option register (MOR) by the firmware in the bootloader ROM. See Figure 11-1. Address: $1EFF Read: Write: Erased State: Bit 7 6 5 4 3 2 1 Bit 0 PA7PU PA6PU PA5PU PA4PU PA3PU PA2PU PA1PU PA0PU 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0 SWAIT SPR1 SPR0 LSBF LEVEL COP 0 0 0 0 0 0 Address: $1F00 Bit 7 Read: Write: Erased State: SECURE 0 0 = Unimplemented Figure 11-1. Mask Option Register (MOR) COP — COP Watchdog Enable Setting the COP bit will enable the COP watchdog timer. The COP will reset the MCU if the timeout period is reached before the COP watchdog timer is cleared by the application software and the voltage applied to the IRQ/VPP pin is between VSS and VDD. Clearing the COP bit will disable the COP watchdog timer regardless of the voltage applied to the IRQ/VPP pin. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 63 Mask Option Register (MOR) LEVEL — IRQ Edge Sensitivity If the LEVEL bit is clear, the IRQ/VPP pin will only be sensitive to the falling edge of the signal applied to the IRQ/VPP pin. If the LEVEL bit is set, the IRQ/VPP pin will be sensitive to both the falling edge of the input signal and the logic low level of the input signal on the IRQ/VPP pin. LSBF — SIOP Least Significant Bit First If the LSBF bit is set, the serial data to and from the SIOP will be transferred least significant bit first. If the LSBF bit is clear, the serial data to and from the SIOP will be transferred most significant bit first. SPR0 and SPR1 — SIOP Clock Rate The SPR0 and SPR1 bits determine the clock rate used to transfer the serial data to and from the SIOP. The various clock rates available are given in Table 11-1. Table 11-1. SIOP Clock Rate SPR1 SPR0 SIOP Master Clock 0 0 fosc ÷ 64 0 1 fosc ÷ 32 1 0 fosc ÷ 16 1 1 fosc ÷ 8 SWAIT — STOP Instruction Mode Setting the SWAIT bit will prevent the STOP instruction from stopping the on-board oscillator. Clearing the SWAIT bit will permit the STOP instruction to stop the on-board oscillator and place the MCU in stop mode. Executing the STOP instruction when SWAIT is set will place the MCU in halt mode. See 3.4.1 STOP Instruction for additional information. SECURE — Security State(1) If SECURE bit is set, the EPROM is locked. PA(0:7)PU — Port A Pullups/Interrupt Enable/Disable If any PA(0:7)PU is selected, that pullup/interrupt is enabled. The interrupt sensitivity will be selected via the LEVEL bit in the same way as the IRQ pin. NOTE The port A pullup/interrupt function is NOT available on the ROM device, MC68HC05P6. 1. No security feature is absolutely secure. However, Freescale’s strategy is to make reading or copying the EPROM/OTPROM difficult for unauthorized users. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 64 Freescale Semiconductor MOR Programming 11.3 MOR Programming The contents of the MOR should be programmed in bootloader mode using the hardware shown in Figure 10-2. MC68HC705P6A EPROM Programming Flowchart. In order to allow programming, all the implemented bits in the MOR are essentially read-write bits in bootloader mode as shown in Figure 11-1. The programming of the MOR is the same as user EPROM. 1. Set the ELAT bit in the EPROG register. 2. Write the desired data to the desired MOR address. 3. Set the EPGM bit in the EPROG. 4. Wait for the programming time (tEPGM). 5. Clear the ELAT and EPGM bits in the EPROG. 6. Remove the programming voltage from the IRQ/VPP pin. A sample routine to program a byte of EPROM is shown in Table 11-2. Once the MOR bits have been programmed, the options are not loaded into the MOR registers until the part is reset. Table 11-2. MOR Programming Routine 001C 00FF 0023 1EFF 1F00 0000 EPROG DATA2 DATA1 MOR2 MOR1 EPGM 00E0 00E0 00E2 00E4 00E6 00E9 00EB 00ED 00EF A6 B7 A6 C7 12 AD 3F 81 04 1C FF 1E FF 1C 03 1C EQU EQU EQU EQU EQU EQU $1C $FF #23 $1EFF $1F00 $00 ORG $E0 LDA STA LDA STA BSET BSR CLR RTS #$04 EPROG #DATA2 MOR2 EPGM,EPROG DELAY EPROG PROGRAMMING REG SAMPLE MOR VALUES MOPR ADDRESSES EPGM BIT IN EPROG REG SET ELAT BIT IN EPGM REG AT $1C DATA BYTE WRITE IT TO MOR LOC TURN ON PGM VOLTAGE WAIT 4 ms MINIMUM CLR EPGM REGISTER MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 65 Mask Option Register (MOR) MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 66 Freescale Semiconductor Chapter 12 Central Processor Unit (CPU) Core 12.1 Introduction The MC68HC705P6A has an 8-K memory map. Therefore, it uses only the lower 13 bits of the address bus. In the following discussion, the upper three bits of the address bus can be ignored. Also, the STOP instruction can be modified to place the MCU in either the normal stop mode or the halt mode by means of a MOR bit. All other instructions and registers behave as described in this section. 12.2 Registers The MCU contains five registers which are hard-wired within the CPU and are not part of the memory map. These five registers are shown in Figure 12-1 and are described in the following paragraphs. 7 15 14 13 12 11 10 9 8 0 0 0 0 0 0 0 0 1 6 5 4 3 2 1 0 ACCUMULATOR A INDEX REGISTER X STACK POINTER 1 SP PROGRAM COUNTER CONDITION CODE REGISTER 1 1 PC 1 H I N Z C CC HALF-CARRY BIT (FROM BIT 3) INTERRUPT MASK NEGATIVE BIT ZERO BIT CARRY BIT Figure 12-1. MC68HC05 Programming Model 12.2.1 Accumulator The accumulator is a general-purpose 8-bit register as shown in Figure 12-1. The CPU uses the accumulator to hold operands and results of arithmetic calculations or non-arithmetic operations. The accumulator is unaffected by a reset of the device. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 67 Central Processor Unit (CPU) Core 12.2.2 Index Register The index register shown in Figure 12-1 is an 8-bit register that can perform two functions: • Indexed addressing • Temporary storage In indexed addressing with no offset, the index register contains the low byte of the operand address, and the high byte is assumed to be $00. In indexed addressing with an 8-bit offset, the CPU finds the operand address by adding the index register contents to an 8-bit immediate value. In indexed addressing with a 16-bit offset, the CPU finds the operand address by adding the index register contents to a 16-bit immediate value. The index register can also serve as an auxiliary accumulator for temporary storage. The index register is unaffected by a reset of the device. 12.2.3 Stack Pointer The stack pointer shown in Figure 12-1 is a 16-bit register internally. In devices with memory maps less than 64 Kbytes, the unimplemented upper address lines are ignored. The stack pointer contains the address of the next free location on the stack. During a reset or the reset stack pointer (RSP) instruction, the stack pointer is set to $00FF. The stack pointer is then decremented as data is pushed onto the stack and incremented as data is pulled from the stack. When accessing memory, the 10 most significant bits are permanently set to 0000000011. The six least significant register bits are appended to these 10 fixed bits to produce an address within the range of $00FF to $00C0. Subroutines and interrupts may use up to 64 ($40) locations. If 64 locations are exceeded, the stack pointer wraps around and writes over the previously stored information. A subroutine call occupies two locations on the stack and an interrupt uses five locations. 12.2.4 Program Counter The program counter shown in Figure 12-1 is a 16-bit register internally. In devices with memory maps less than 64 Kbytes, the unimplemented upper address lines are ignored. The program counter contains the address of the next instruction or operand to be fetched. Normally, the address in the program counter increments to the next sequential memory location every time an instruction or operand is fetched. Jump, branch, and interrupt operations load the program counter with an address other than that of the next sequential location. 12.2.5 Condition Code Register The CCR shown in Figure 12-1 is a 5-bit register in which four bits are used to indicate the results of the instruction just executed. The fifth bit is the interrupt mask. These bits can be individually tested by a program, and specific actions can be taken as a result of their state. The condition code register should be thought of as having three additional upper bits that are always ones. Only the interrupt mask is affected by a reset of the device. The following paragraphs explain the functions of the lower five bits of the condition code register. H — Half Carry Bit When the half-carry bit is set, it means that a carry occurred between bits 3 and 4 of the accumulator during the last ADD or ADC (add with carry) operation. The half-carry bit is required for binary-coded decimal (BCD) arithmetic operations. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 68 Freescale Semiconductor Registers I — Interrupt Mask Bit When the interrupt mask is set, the internal and external interrupts are disabled. Interrupts are enabled when the interrupt mask is cleared. When an interrupt occurs, the interrupt mask is automatically set after the CPU registers are saved on the stack, but before the interrupt vector is fetched. If an interrupt request occurs while the interrupt mask is set, the interrupt request is latched. Normally, the interrupt is processed as soon as the interrupt mask is cleared. A return from interrupt (RTI) instruction pulls the CPU registers from the stack, restoring the interrupt mask to its state before the interrupt was encountered. After any reset, the interrupt mask is set and can only be cleared by the clear I bit (CLI), STOP, or WAIT instructions. N — Negative Bit The negative bit is set when the result of the last arithmetic operation, logical operation, or data manipulation was negative. (Bit 7 of the result was a logic one.) The negative bit can also be used to check an often-tested flag by assigning the flag to bit 7 of a register or memory location. Loading the accumulator with the contents of that register or location then sets or clears the negative bit according to the state of the flag. Z — Zero Bit The zero bit is set when the result of the last arithmetic operation, logical operation, data manipulation, or data load operation was zero. C — Carry/Borrow Bit The carry/borrow bit is set when a carry out of bit 7 of the accumulator occurred during the last arithmetic operation, logical operation, or data manipulation. The carry/borrow bit is also set or cleared during bit test and branch instructions and during shifts and rotates. This bit is not set by an INC or DEC instruction. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 69 Central Processor Unit (CPU) Core MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 70 Freescale Semiconductor Chapter 13 Instruction Set 13.1 Introduction The MCU instruction set has 62 instructions and uses eight addressing modes. The instructions include all those of the M146805 CMOS Family plus one more: the unsigned multiply (MUL) instruction. The MUL instruction allows unsigned multiplication of the contents of the accumulator (A) and the index register (X). The high-order product is stored in the index register, and the low-order product is stored in the accumulator. 13.2 Addressing Modes The CPU uses eight addressing modes for flexibility in accessing data. The addressing modes provide eight different ways for the CPU to find the data required to execute an instruction. The eight addressing modes are: • Inherent • Immediate • Direct • Extended • Indexed, no offset • Indexed, 8-bit offset • Indexed, 16-bit offset • Relative 13.2.1 Inherent Inherent instructions are those that have no operand, such as return from interrupt (RTI) and stop (STOP). Some of the inherent instructions act on data in the CPU registers, such as set carry flag (SEC) and increment accumulator (INCA). Inherent instructions require no operand address and are one byte long. 13.2.2 Immediate Immediate instructions are those that contain a value to be used in an operation with the value in the accumulator or index register. Immediate instructions require no operand address and are two bytes long. The opcode is the first byte, and the immediate data value is the second byte. 13.2.3 Direct Direct instructions can access any of the first 256 memory locations with two bytes. The first byte is the opcode, and the second is the low byte of the operand address. In direct addressing, the CPU automatically uses $00 as the high byte of the operand address. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 71 Instruction Set 13.2.4 Extended Extended instructions use three bytes and can access any address in memory. The first byte is the opcode; the second and third bytes are the high and low bytes of the operand address. When using the Freescale assembler, the programmer does not need to specify whether an instruction is direct or extended. The assembler automatically selects the shortest form of the instruction. 13.2.5 Indexed, No Offset Indexed instructions with no offset are 1-byte instructions that can access data with variable addresses within the first 256 memory locations. The index register contains the low byte of the effective address of the operand. The CPU automatically uses $00 as the high byte, so these instructions can address locations $0000–$00FF. Indexed, no offset instructions are often used to move a pointer through a table or to hold the address of a frequently used RAM or I/O location. 13.2.6 Indexed, 8-Bit Offset Indexed, 8-bit offset instructions are 2-byte instructions that can access data with variable addresses within the first 511 memory locations. The CPU adds the unsigned byte in the index register to the unsigned byte following the opcode. The sum is the effective address of the operand. These instructions can access locations $0000–$01FE. Indexed 8-bit offset instructions are useful for selecting the kth element in an n-element table. The table can begin anywhere within the first 256 memory locations and could extend as far as location 510 ($01FE). The k value is typically in the index register, and the address of the beginning of the table is in the byte following the opcode. 13.2.7 Indexed,16-Bit Offset Indexed, 16-bit offset instructions are 3-byte instructions that can access data with variable addresses at any location in memory. The CPU adds the unsigned byte in the index register to the two unsigned bytes following the opcode. The sum is the effective address of the operand. The first byte after the opcode is the high byte of the 16-bit offset; the second byte is the low byte of the offset. Indexed, 16-bit offset instructions are useful for selecting the kth element in an n-element table anywhere in memory. As with direct and extended addressing, the Freescale assembler determines the shortest form of indexed addressing. 13.2.8 Relative Relative addressing is only for branch instructions. If the branch condition is true, the CPU finds the effective branch destination by adding the signed byte following the opcode to the contents of the program counter. If the branch condition is not true, the CPU goes to the next instruction. The offset is a signed, two’s complement byte that gives a branching range of –128 to +127 bytes from the address of the next location after the branch instruction. When using the Freescale assembler, the programmer does not need to calculate the offset, because the assembler determines the proper offset and verifies that it is within the span of the branch. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 72 Freescale Semiconductor Instruction Types 13.3 Instruction Types The MCU instructions fall into the following five categories: • Register/memory instructions • Read-modify-write instructions • Jump/branch instructions • Bit manipulation instructions • Control instructions 13.3.1 Register/Memory Instructions These instructions operate on CPU registers and memory locations. Most of them use two operands. One operand is in either the accumulator or the index register. The CPU finds the other operand in memory. Table 13-1. Register/Memory Instructions Instruction Mnemonic Add Memory Byte and Carry Bit to Accumulator ADC Add Memory Byte to Accumulator ADD AND Memory Byte with Accumulator AND Bit Test Accumulator BIT Compare Accumulator CMP Compare Index Register with Memory Byte CPX EXCLUSIVE OR Accumulator with Memory Byte EOR Load Accumulator with Memory Byte LDA Load Index Register with Memory Byte LDX Multiply MUL OR Accumulator with Memory Byte ORA Subtract Memory Byte and Carry Bit from Accumulator SBC Store Accumulator in Memory STA Store Index Register in Memory STX Subtract Memory Byte from Accumulator SUB MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 73 Instruction Set 13.3.2 Read-Modify-Write Instructions These instructions read a memory location or a register, modify its contents, and write the modified value back to the memory location or to the register. NOTE Do not use read modify-write operations on write-only registers. Table 13-2. Read-Modify-Write Instructions Instruction Mnemonic Arithmetic Shift Left (Same as LSL) ASL Arithmetic Shift Right ASR Bit Clear BCLR(1) Bit Set BSET(1) Clear Register CLR Complement (One’s Complement) COM Decrement DEC Increment INC Logical Shift Left (Same as ASL) LSL Logical Shift Right LSR Negate (Two’s Complement) NEG Rotate Left through Carry Bit ROL Rotate Right through Carry Bit ROR Test for Negative or Zero TST(2) 1. Unlike other read-modify-write instructions, BCLR and BSET use only direct addressing. 2. TST is an exception to the read-modify-write sequence because it does not write a replacement value. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 74 Freescale Semiconductor Instruction Types 13.3.3 Jump/Branch Instructions Jump instructions allow the CPU to interrupt the normal sequence of the program counter. The unconditional jump instruction (JMP) and the jump-to-subroutine instruction (JSR) have no register operand. Branch instructions allow the CPU to interrupt the normal sequence of the program counter when a test condition is met. If the test condition is not met, the branch is not performed. The BRCLR and BRSET instructions cause a branch based on the state of any readable bit in the first 256 memory locations. These 3-byte instructions use a combination of direct addressing and relative addressing. The direct address of the byte to be tested is in the byte following the opcode. The third byte is the signed offset byte. The CPU finds the effective branch destination by adding the third byte to the program counter if the specified bit tests true. The bit to be tested and its condition (set or clear) is part of the opcode. The span of branching is from –128 to +127 from the address of the next location after the branch instruction. The CPU also transfers the tested bit to the carry/borrow bit of the condition code register. Table 13-3. Jump and Branch Instructions Instruction Mnemonic Branch if Carry Bit Clear BCC Branch if Carry Bit Set BCS Branch if Equal BEQ Branch if Half-Carry Bit Clear BHCC Branch if Half-Carry Bit Set BHCS Branch if Higher BHI Branch if Higher or Same BHS Branch if IRQ Pin High BIH Branch if IRQ Pin Low BIL Branch if Lower BLO Branch if Lower or Same BLS Branch if Interrupt Mask Clear BMC Branch if Minus BMI Branch if Interrupt Mask Set BMS Branch if Not Equal BNE Branch if Plus BPL Branch Always BRA Branch if Bit Clear Branch Never Branch if Bit Set BRCLR BRN BRSET Branch to Subroutine BSR Unconditional Jump JMP Jump to Subroutine JSR MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 75 Instruction Set 13.3.4 Bit Manipulation Instructions The CPU can set or clear any writable bit in the first 256 bytes of memory, which includes I/O registers and on-chip RAM locations. The CPU can also test and branch based on the state of any bit in any of the first 256 memory locations. Table 13-4. Bit Manipulation Instructions Instruction Bit Clear Mnemonic BCLR Branch if Bit Clear BRCLR Branch if Bit Set BRSET Bit Set BSET 13.3.5 Control Instructions These instructions act on CPU registers and control CPU operation during program execution. Table 13-5. Control Instructions Instruction Mnemonic Clear Carry Bit CLC Clear Interrupt Mask CLI No Operation NOP Reset Stack Pointer RSP Return from Interrupt RTI Return from Subroutine RTS Set Carry Bit SEC Set Interrupt Mask SEI Stop Oscillator and Enable IRQ Pin STOP Software Interrupt SWI Transfer Accumulator to Index Register TAX Transfer Index Register to Accumulator TXA Stop CPU Clock and Enable Interrupts WAIT MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 76 Freescale Semiconductor Instruction Set Summary 13.4 Instruction Set Summary Table 13-6 is an alphabetical list of all M68HC05 instructions and shows the effect of each instruction on the condition code register. ADD #opr ADD opr ADD opr ADD opr,X ADD opr,X ADD ,X AND #opr AND opr AND opr AND opr,X AND opr,X AND ,X ASL opr ASLA ASLX ASL opr,X ASL ,X  —    IMM DIR EXT IX2 IX1 IX 2 A9 ii B9 dd 3 C9 hh ll 4 D9 ee ff 5 4 E9 ff 3 F9  —    IMM DIR EXT IX2 IX1 IX 2 AB ii BB dd 3 CB hh ll 4 DB ee ff 5 4 EB ff 3 FB — —   — IMM DIR EXT IX2 IX1 IX 2 A4 ii B4 dd 3 C4 hh ll 4 D4 ee ff 5 4 E4 ff 3 F4 38 48 58 68 78 dd — —    DIR INH INH IX1 IX DIR INH INH IX1 IX 37 47 57 67 77 dd REL Effect on CCR Description H I N Z C A ← (A) + (M) + (C) Add with Carry A ← (A) + (M) Add without Carry A ← (A) ∧ (M) Logical AND Arithmetic Shift Left (Same as LSL) C 0 b7 ASR opr ASRA ASRX ASR opr,X ASR ,X Arithmetic Shift Right BCC rel Branch if Carry Bit Clear b0 C b7 — —    b0 PC ← (PC) + 2 + rel ? C = 0 ff 5 3 3 6 5 5 3 3 6 5 24 rr 3 DIR (b0) DIR (b1) DIR (b2) DIR (b3) — — — — — DIR (b4) DIR (b5) DIR (b6) DIR (b7) 11 13 15 17 19 1B 1D 1F dd dd dd dd dd dd dd dd 5 5 5 5 5 5 5 5 PC ← (PC) + 2 + rel ? C = 1 — — — — — REL 25 rr 3 Mn ← 0 — — — — — ff Cycles Opcode ADC #opr ADC opr ADC opr ADC opr,X ADC opr,X ADC ,X Operation Address Mode Source Form Operand Table 13-6. Instruction Set Summary (Sheet 1 of 6) BCLR n opr Clear Bit n BCS rel Branch if Carry Bit Set (Same as BLO) BEQ rel Branch if Equal PC ← (PC) + 2 + rel ? Z = 1 — — — — — REL 27 rr 3 BHCC rel Branch if Half-Carry Bit Clear PC ← (PC) + 2 + rel ? H = 0 — — — — — REL 28 rr 3 BHCS rel Branch if Half-Carry Bit Set PC ← (PC) + 2 + rel ? H = 1 — — — — — REL 29 rr 3 BHI rel Branch if Higher PC ← (PC) + 2 + rel ? C ∨ Z = 0 — — — — — REL 22 rr 3 BHS rel Branch if Higher or Same REL 24 rr 3 PC ← (PC) + 2 + rel ? C = 0 — — — — — MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 77 Instruction Set Address Mode Opcode Operand Cycles Table 13-6. Instruction Set Summary (Sheet 2 of 6) BIH rel Branch if IRQ Pin High PC ← (PC) + 2 + rel ? IRQ = 1 — — — — — REL 2F rr 3 BIL rel Branch if IRQ Pin Low PC ← (PC) + 2 + rel ? IRQ = 0 — — — — — REL 2E rr 3 A5 B5 C5 D5 E5 F5 ii dd hh ll ee ff ff 2 3 4 5 4 3 Source Form Operation BIT #opr BIT opr BIT opr BIT opr,X BIT opr,X BIT ,X Bit Test Accumulator with Memory Byte BLO rel Branch if Lower (Same as BCS) BLS rel Branch if Lower or Same Description Effect on CCR H I N Z C IMM DIR EXT IX2 IX1 IX (A) ∧ (M) — —   — PC ← (PC) + 2 + rel ? C = 1 — — — — — REL 25 rr 3 PC ← (PC) + 2 + rel ? C ∨ Z = 1 — — — — — REL 23 rr 3 BMC rel Branch if Interrupt Mask Clear PC ← (PC) + 2 + rel ? I = 0 — — — — — REL 2C rr 3 BMI rel Branch if Minus PC ← (PC) + 2 + rel ? N = 1 — — — — — REL 2B rr 3 BMS rel Branch if Interrupt Mask Set PC ← (PC) + 2 + rel ? I = 1 — — — — — REL 2D rr 3 BNE rel Branch if Not Equal PC ← (PC) + 2 + rel ? Z = 0 — — — — — REL 26 rr 3 BPL rel Branch if Plus PC ← (PC) + 2 + rel ? N = 0 — — — — — REL 2A rr 3 BRA rel Branch Always PC ← (PC) + 2 + rel ? 1 = 1 — — — — — REL 20 rr 3 01 03 05 07 09 0B 0D 0F dd rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr 5 5 5 5 5 5 5 5 BRCLR n opr rel Branch if Bit n Clear BRN rel PC ← (PC) + 2 + rel ? 1 = 0 Branch Never BRSET n opr rel Branch if Bit n Set BSET n opr PC ← (PC) + 2 + rel ? Mn = 0 Set Bit n DIR (b0) DIR (b1) DIR (b2) DIR (b3) — — — —  DIR (b4) DIR (b5) DIR (b6) DIR (b7) — — — — — 21 rr 3 PC ← (PC) + 2 + rel ? Mn = 1 DIR (b0) DIR (b1) DIR (b2) DIR (b3) — — — —  DIR (b4) DIR (b5) DIR (b6) DIR (b7) REL 00 02 04 06 08 0A 0C 0E dd rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr 5 5 5 5 5 5 5 5 Mn ← 1 DIR (b0) DIR (b1) DIR (b2) DIR (b3) — — — — — DIR (b4) DIR (b5) DIR (b6) DIR (b7) 10 12 14 16 18 1A 1C 1E dd dd dd dd dd dd dd dd 5 5 5 5 5 5 5 5 PC ← (PC) + 2; push (PCL) SP ← (SP) – 1; push (PCH) SP ← (SP) – 1 PC ← (PC) + rel — — — — — REL AD rr 6 BSR rel Branch to Subroutine CLC Clear Carry Bit C←0 — — — — 0 INH 98 2 CLI Clear Interrupt Mask I←0 — 0 — — — INH 9A 2 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 78 Freescale Semiconductor Instruction Set Summary CMP #opr CMP opr CMP opr CMP opr,X CMP opr,X CMP ,X COM opr COMA COMX COM opr,X COM ,X CPX #opr CPX opr CPX opr CPX opr,X CPX opr,X CPX ,X DEC opr DECA DECX DEC opr,X DEC ,X EOR #opr EOR opr EOR opr EOR opr,X EOR opr,X EOR ,X INC opr INCA INCX INC opr,X INC ,X JMP opr JMP opr JMP opr,X JMP opr,X JMP ,X JSR opr JSR opr JSR opr,X JSR opr,X JSR ,X DIR INH INH IX1 IX 3F 4F 5F 6F 7F dd — —    IMM DIR EXT IX2 IX1 IX 2 A1 ii B1 dd 3 C1 hh ll 4 D1 ee ff 5 4 E1 ff 3 F1 — —   1 DIR INH INH IX1 IX 33 43 53 63 73 — —    IMM DIR EXT IX2 IX1 IX 2 A3 ii B3 dd 3 C3 hh ll 4 D3 ee ff 5 4 E3 ff 3 F3 — —   — DIR INH INH IX1 IX 3A 4A 5A 6A 7A — —   — IMM DIR EXT IX2 IX1 IX 2 A8 ii B8 dd 3 C8 hh ll 4 D8 ee ff 5 4 E8 ff 3 F8 — —   — DIR INH INH IX1 IX 3C 4C 5C 6C 7C — — — — — DIR EXT IX2 IX1 IX BC dd 2 CC hh ll 3 DC ee ff 4 EC ff 3 FC 2 — — — — — DIR EXT IX2 IX1 IX BD dd 5 CD hh ll 6 DD ee ff 7 6 ED ff 5 FD Effect on CCR H I N Z C M ← $00 A ← $00 X ← $00 M ← $00 M ← $00 Clear Byte Compare Accumulator with Memory Byte Complement Byte (One’s Complement) Compare Index Register with Memory Byte (A) – (M) M ← (M) = $FF – (M) A ← (A) = $FF – (A) X ← (X) = $FF – (X) M ← (M) = $FF – (M) M ← (M) = $FF – (M) (X) – (M) M ← (M) – 1 A ← (A) – 1 X ← (X) – 1 M ← (M) – 1 M ← (M) – 1 Decrement Byte EXCLUSIVE OR Accumulator with Memory Byte A ← (A) ⊕ (M) M ← (M) + 1 A ← (A) + 1 X ← (X) + 1 M ← (M) + 1 M ← (M) + 1 Increment Byte Unconditional Jump PC ← Jump Address Jump to Subroutine PC ← (PC) + n (n = 1, 2, or 3) Push (PCL); SP ← (SP) – 1 Push (PCH); SP ← (SP) – 1 PC ← Effective Address — — 0 1 — ff dd ff dd ff dd ff Cycles Description Operand CLR opr CLRA CLRX CLR opr,X CLR ,X Operation Opcode Source Form Address Mode Table 13-6. Instruction Set Summary (Sheet 3 of 6) 5 3 3 6 5 5 3 3 6 5 5 3 3 6 5 5 3 3 6 5 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 79 Instruction Set LDX #opr LDX opr LDX opr LDX opr,X LDX opr,X LDX ,X LSL opr LSLA LSLX LSL opr,X LSL ,X 2 A6 ii B6 dd 3 C6 hh ll 4 D6 ee ff 5 4 E6 ff 3 F6 A ← (M) — —   — IMM DIR EXT IX2 IX1 IX 2 AE ii BE dd 3 CE hh ll 4 DE ee ff 5 4 EE ff 3 FE X ← (M) Load Index Register with Memory Byte 38 48 58 68 78 dd — —    DIR INH INH IX1 IX Logical Shift Left (Same as ASL) C 0 b7 DIR INH INH IX1 IX 34 44 54 64 74 dd MUL Unsigned Multiply 0 — — — 0 INH 42 — —    DIR INH INH IX1 IX 30 40 50 60 70 INH 9D b0 0 C b7 X : A ← (X) × (A) NEG opr NEGA NEGX NEG opr,X NEG ,X Negate Byte (Two’s Complement) NOP No Operation — — 0   b0 M ← –(M) = $00 – (M) A ← –(A) = $00 – (A) X ← –(X) = $00 – (X) M ← –(M) = $00 – (M) M ← –(M) = $00 – (M) — — — — — A ← (A) ∨ (M) Logical OR Accumulator with Memory Rotate Byte Left through Carry Bit C b7 ROR opr RORA RORX ROR opr,X ROR ,X Rotate Byte Right through Carry Bit RSP Reset Stack Pointer dd ff — —   — 39 49 59 69 79 dd — —    DIR INH INH IX1 IX DIR INH INH IX1 IX 36 46 56 66 76 dd INH 9C — — — — — 5 3 3 6 5 5 3 3 6 5 2 AA BA CA DA EA FA — —    5 3 3 6 5 1 1 IMM DIR EXT IX2 IX1 IX b0 SP ← $00FF ff ii dd hh ll ee ff ff b0 C b7 ff Cycles Description Load Accumulator with Memory Byte Logical Shift Right ROL opr ROLA ROLX ROL opr,X ROL ,X — —   — IMM DIR EXT IX2 IX1 IX Effect on CCR H I N Z C LSR opr LSRA LSRX LSR opr,X LSR ,X ORA #opr ORA opr ORA opr ORA opr,X ORA opr,X ORA ,X Opcode LDA #opr LDA opr LDA opr LDA opr,X LDA opr,X LDA ,X Operation Address Mode Source Form Operand Table 13-6. Instruction Set Summary (Sheet 4 of 6) ff ff 2 3 4 5 4 3 5 3 3 6 5 5 3 3 6 5 2 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 80 Freescale Semiconductor Instruction Set Summary      INH 80 9 — — — — — INH 81 6 A ← (A) – (M) – (C) — —    IMM DIR EXT IX2 IX1 IX 2 A2 ii B2 dd 3 C2 hh ll 4 D2 ee ff 5 4 E2 ff 3 F2 Description RTI Return from Interrupt SP ← (SP) + 1; Pull (CCR) SP ← (SP) + 1; Pull (A) SP ← (SP) + 1; Pull (X) SP ← (SP) + 1; Pull (PCH) SP ← (SP) + 1; Pull (PCL) RTS Return from Subroutine SP ← (SP) + 1; Pull (PCH) SP ← (SP) + 1; Pull (PCL) Effect on CCR SBC #opr SBC opr SBC opr SBC opr,X SBC opr,X SBC ,X Subtract Memory Byte and Carry Bit from Accumulator SEC Set Carry Bit C←1 — — — — 1 INH 99 SEI Set Interrupt Mask I←1 — 1 — — — INH 9B STA opr STA opr STA opr,X STA opr,X STA ,X Store Accumulator in Memory STOP Stop Oscillator and Enable IRQ Pin STX opr STX opr STX opr,X STX opr,X STX ,X SUB #opr SUB opr SUB opr SUB opr,X SUB opr,X SUB ,X Store Index Register In Memory Subtract Memory Byte from Accumulator SWI Software Interrupt TAX Transfer Accumulator to Index Register TST opr TSTA TSTX TST opr,X TST ,X Test Memory Byte for Negative or Zero M ← (A) — —   — DIR EXT IX2 IX1 IX B7 C7 D7 E7 F7 — 0 — — — INH 8E Cycles H I N Z C Opcode Operation Address Mode Source Form Operand Table 13-6. Instruction Set Summary (Sheet 5 of 6) 2 2 dd hh ll ee ff ff 4 5 6 5 4 2 dd hh ll ee ff ff 4 5 6 5 4 — —   — DIR EXT IX2 IX1 IX BF CF DF EF FF — —    IMM DIR EXT IX2 IX1 IX 2 A0 ii B0 dd 3 C0 hh ll 4 D0 ee ff 5 4 E0 ff 3 F0 PC ← (PC) + 1; Push (PCL) SP ← (SP) – 1; Push (PCH) SP ← (SP) – 1; Push (X) SP ← (SP) – 1; Push (A) — 1 — — — SP ← (SP) – 1; Push (CCR) SP ← (SP) – 1; I ← 1 PCH ← Interrupt Vector High Byte PCL ← Interrupt Vector Low Byte INH 83 1 0 — — — — — INH 97 2 — —   — DIR INH INH IX1 IX 3D 4D 5D 6D 7D M ← (X) A ← (A) – (M) X ← (A) (M) – $00 dd ff 4 3 3 5 4 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 81 Instruction Set WAIT A C CCR dd dd rr DIR ee ff EXT ff H hh ll I ii IMM INH IX IX1 IX2 M N n Transfer Index Register to Accumulator A ← (X) Stop CPU Clock and Enable Interrupts Accumulator Carry/borrow flag Condition code register Direct address of operand Direct address of operand and relative offset of branch instruction Direct addressing mode High and low bytes of offset in indexed, 16-bit offset addressing Extended addressing mode Offset byte in indexed, 8-bit offset addressing Half-carry flag High and low bytes of operand address in extended addressing Interrupt mask Immediate operand byte Immediate addressing mode Inherent addressing mode Indexed, no offset addressing mode Indexed, 8-bit offset addressing mode Indexed, 16-bit offset addressing mode Memory location Negative flag Any bit opr PC PCH PCL REL rel rr SP X Z # ∧ ∨ ⊕ () –( ) ← ? :  — H I N Z C — — — — — INH 9F 2 — 0 — — — INH 8F 2 Effect on CCR Cycles Description Opcode TXA Operation Address Mode Source Form Operand Table 13-6. Instruction Set Summary (Sheet 6 of 6) Operand (one or two bytes) Program counter Program counter high byte Program counter low byte Relative addressing mode Relative program counter offset byte Relative program counter offset byte Stack pointer Index register Zero flag Immediate value Logical AND Logical OR Logical EXCLUSIVE OR Contents of Negation (two’s complement) Loaded with If Concatenated with Set or cleared Not affected 13.5 Opcode Map See Table 13-7. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 82 Freescale Semiconductor Freescale Semiconductor Table 13-7. Opcode Map Bit Manipulation DIR DIR MSB LSB 0 1 2 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 3 4 5 6 7 8 9 A B C D E F 0 1 Branch REL DIR 2 3 Read-Modify-Write INH INH IX1 4 5 6 IX 7 5 5 3 5 3 3 6 5 BRSET0 BSET0 BRA NEG NEGA NEGX NEG NEG 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 1 5 5 3 BRCLR0 BCLR0 BRN 3 DIR 2 DIR 2 REL 1 5 5 3 11 BRSET1 BSET1 BHI MUL 3 DIR 2 DIR 2 REL 1 INH 5 5 3 5 3 3 6 5 BRCLR1 BCLR1 BLS COM COMA COMX COM COM 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 1 5 5 3 5 3 3 6 5 BRSET2 BSET2 BCC LSR LSRA LSRX LSR LSR 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 BRCLR2 BCLR2 BCS/BLO 3 DIR 2 DIR 2 REL 5 5 3 5 3 3 6 5 BRSET3 BSET3 BNE ROR RORA RORX ROR ROR 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRCLR3 BCLR3 BEQ ASR ASRA ASRX ASR ASR 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRSET4 BSET4 BHCC ASL/LSL ASLA/LSLA ASLX/LSLX ASL/LSL ASL/LSL 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRCLR4 BCLR4 BHCS ROL ROLA ROLX ROL ROL 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRSET5 BSET5 BPL DEC DECA DECX DEC DEC 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 BRCLR5 BCLR5 BMI 3 DIR 2 DIR 2 REL 5 5 3 5 3 3 6 5 BRSET6 BSET6 BMC INC INCA INCX INC INC 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 4 3 3 5 4 BRCLR6 BCLR6 BMS TST TSTA TSTX TST TST 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 BRSET7 BSET7 BIL 3 DIR 2 DIR 2 REL 1 5 6 3 3 5 3 5 5 CLR CLR CLRX CLRA CLR BIH BCLR7 BRCLR7 IX 1 IX1 1 INH 2 INH 1 DIR 1 REL 2 DIR 2 3 DIR 2 REL = Relative IX = Indexed, No Offset IX1 = Indexed, 8-Bit Offset IX2 = Indexed, 16-Bit Offset 8 9 9 RTI INH 6 RTS INH 2 2 2 10 SWI INH 2 2 2 2 1 1 1 1 1 1 1 2 TAX INH 2 CLC INH 2 2 SEC INH 2 2 CLI INH 2 2 SEI INH 2 2 RSP INH 2 NOP INH 2 2 STOP INH 2 2 TXA WAIT INH INH 1 IMM DIR A B 2 SUB IMM 2 2 CMP IMM 2 2 SBC IMM 2 2 CPX IMM 2 2 AND IMM 2 2 BIT IMM 2 2 LDA IMM 2 2 2 EOR IMM 2 2 ADC IMM 2 2 ORA IMM 2 2 ADD IMM 2 2 6 BSR REL 2 2 LDX 2 IMM 2 2 MSB LSB LSB of Opcode in Hexadecimal 0 Register/Memory EXT IX2 3 SUB DIR 3 3 CMP DIR 3 3 SBC DIR 3 3 CPX DIR 3 3 AND DIR 3 3 BIT DIR 3 3 LDA DIR 3 4 STA DIR 3 3 EOR DIR 3 3 ADC DIR 3 3 ORA DIR 3 3 ADD DIR 3 2 JMP DIR 3 5 JSR DIR 3 3 LDX DIR 3 4 STX DIR 3 0 C 4 SUB EXT 3 4 CMP EXT 3 4 SBC EXT 3 4 CPX EXT 3 4 AND EXT 3 4 BIT EXT 3 4 LDA EXT 3 5 STA EXT 3 4 EOR EXT 3 4 ADC EXT 3 4 ORA EXT 3 4 ADD EXT 3 3 JMP EXT 3 6 JSR EXT 3 4 LDX EXT 3 5 STX EXT 3 D 5 SUB IX2 2 5 CMP IX2 2 5 SBC IX2 2 5 CPX IX2 2 5 AND IX2 2 5 BIT IX2 2 5 LDA IX2 2 6 STA IX2 2 5 EOR IX2 2 5 ADC IX2 2 5 ORA IX2 2 5 ADD IX2 2 4 JMP IX2 2 7 JSR IX2 2 5 LDX IX2 2 6 STX IX2 2 IX1 IX E F 4 SUB IX1 1 4 CMP IX1 1 4 SBC IX1 1 4 CPX IX1 1 4 AND IX1 1 4 BIT IX1 1 4 LDA IX1 1 5 STA IX1 1 4 EOR IX1 1 4 ADC IX1 1 4 ORA IX1 1 4 ADD IX1 1 3 JMP IX1 1 6 JSR IX1 1 4 LDX IX1 1 5 STX IX1 1 MSB LSB 3 SUB 0 IX 3 1 CMP IX 3 SBC IX 3 CPX 2 3 IX 3 4 AND IX 3 BIT 5 IX 3 6 LDA IX 4 7 STA IX 3 EOR 8 IX 3 9 ADC IX 3 A ORA IX 3 ADD B IX 2 C JMP IX 5 JSR IX 3 LDX D E IX 4 F STX IX MSB of Opcode in Hexadecimal 5 Number of Cycles BRSET0 Opcode Mnemonic 3 DIR Number of Bytes/Addressing Mode 83 Opcode Map INH = Inherent IMM = Immediate DIR = Direct EXT = Extended Control INH INH Instruction Set MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 84 Freescale Semiconductor Chapter 14 Electrical Specifications 14.1 Introduction This section contains the electrical and timing specifications. 14.2 Maximum Ratings Maximum ratings are the extreme limits to which the MCU can be exposed without permanently damaging it. The MCU contains circuitry to protect the inputs against damage from high static voltages; however, do not apply voltages higher than those shown in the table below. Keep VIn and VOut within the range VSS ≤ (VIn or VOut) ≤ VDD. Connect unused inputs to the appropriate voltage level, either VSS or VDD. Rating(1) Symbol Value Unit Supply voltage VDD –0.3 to +7.0 V Input voltage VIn VSS –0.3 to VDD +0.3 V Bootloader mode (IRQ/VPP pin only) VIn VSS –0.3 to 2 x VDD +0.3 V I 25 mA Tstg –65 to +150 °C Current drain per pin excluding VDD and VSS Storage temperature range 1. Voltages are referenced to VSS. NOTE This device is not guaranteed to operate properly at the maximum ratings. Refer to 14.5 5.0-Volt DC Electrical Characteristics and 14.6 3.3-Volt DC Electrical Charactertistics for guaranteed operating conditions. 14.3 Operating Temperature Range Characteristic Operating temperature range MC68HC705P6A (standard) MC68HC705P6AC (extended) Symbol Value TL to TH 0 to +70 –40 to +85 Unit Symbol Value Unit θJA 60 60 °C/W TA °C 14.4 Thermal Characteristics Characteristic Thermal resistance PDIP SOIC MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 85 Electrical Specifications 14.5 5.0-Volt DC Electrical Characteristics Characteristic(1) Symbol Min Typ(2) Max Unit VOL VOH — VDD –0.1 — — 0.1 — V VOH VDD –0.8 VDD –0.8 — — — — V VOL — — — — 0.4 0.4 V Input high voltage PA0:7, PB5:7, PC0:7, PD5, TCAP/PD7, IRQ/VPP, RESET, OSC1 VIH 0.7 x VDD — VDD V Input low voltage PA0:7, PB5:7, PC0:7, PD5, TCAP/PD7, IRQ/VPP, RESET, OSC1 VIL VSS — 0.2 x VDD V — — — 4.0 2.0 1.3 7.0 4.0 2.0 mA mA mA — — — 2 — — 30 50 100 µA µA µA Output voltage ILoad = 10.0 µA ILoad = –10.0 µA Output high voltage (ILoad = –0.8 mA) PA0:7, PB5:7, PC2:7, PD5, TCMP (ILoad = –5.0 mA) PC0:1 Output low voltage (ILoad = 1.6 mA) PA0:7, PB5:7, PC2:7, PD5, TCMP (ILoad = 10 mA) PC0:1 Supply current(3), (4) Run Wait(5) (A/D converter on) Wait(5) (A/D converter off) Stop(6) 25°C 0°C to +70°C (standard) –40°C to +85°C (extended) IDD I/O ports high-z leakage current PA0:7, PB5:7, PC0:7, PD5, TCAP/PD7 IIL — — ±10.0 µA A/D ports hi-z leakage current PC3:7 IOZ — — ±1.0 µA Input current RESET, IRQ/VPP, OSC1, PD7/TCAP IIn — — ±1.0 µA Input pullup current PA0:7 (with pullup enabled) IIn 175 385 750 µA COut CIn — — — — 12 8 pF Capaitance Ports (as input or output) RESET, IRQ/VPP 1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = –40°C to +85°C, unless otherwise noted. All values shown refelect pre-silicon estimates. 2. Typical values at midpoint of voltage range, 25°C only. 3. Run (Operating) IDD, Wait IDD: To be measured using external square wave clock source (fosc = 4.2 MHz), all inputs 0.2 V from rail; no dc loads, less than 50 pF on all outputs, CL = 20 pF on OSC2. 4. Wait, Stop IDD: All ports configured as inputs, VIL = 0.2 V, VIH = VDD –0.2 V. 5. Wait IDD will be affected linearly by the OSC2 capacitance. 6. Stop IDD to be measured with OSC1 = VSS. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 86 Freescale Semiconductor 3.3-Volt DC Electrical Charactertistics 14.6 3.3-Volt DC Electrical Charactertistics Characteristic(1) Symbol Min Typ(2) Max Unit VOL VOH — VDD –0.1 — — 0.1 — V VOH VDD –0.3 VDD –0.3 — — — — V VOL — — — — 0.3 0.3 V Input high voltage PA0:7, PB5:7, PC0:7, PD5, TCAP/PD7, IRQ/VPP, RESET, OSC1 VIH 0.7 x VDD — VDD V Input low voltage PA0:7, PB5:7, PC0:7, PD5, TCAP/PD7, IRQ/VPP, RESET, OSC1 VIL VSS — 0.2 x VDD V — — — 1.8 1.0 0.6 2.5 1.4 1.0 mA mA mA — — — 2 — — 20 40 50 µA µA µA Output voltage ILoad = 10.0 µA ILoad = –10.0 µA Output high voltage (ILoad = –0.2 mA) PA0:7, PB5:7, PC2:7, PD5, TCMP (ILoad = –1.2 mA) PC0:1 Output low voltage (ILoad = 0.4 mA) PA0:7, PB5:7, PC2:7, PD5, TCMP (ILoad = 2.5 mA) PC0:1 Supply current(3), (4) Run Wait(5) (A/D converter on) Wait(5) (A/D converter off) Stop(6) 25°C 0°C to +70°C (standard) –40°C to +85°C (extended) IDD I/O ports high-z leakage current PA0:7, PB5:7, PC0:7, PD5, TCAP/PD7 IIL — — ±10.0 µA A/D ports hi-z leakage current PC3:7 IOZ — — ±1.0 µA Input current RESET, IRQ/VPP, OSC1, PD7/TCAP IIn — — ±1.0 µA Input pullup current PA0:7 (with pullup enabled) IIn 75 175 350 µA COut CIn — — — — 12 8 pF Capaitance Ports (as input or output) RESET, IRQ/VPP 1. VDD = 3.3 Vdc ± 0.3 Vdc, VSS = 0 Vdc, TA = –40°C to +85°C, unless otherwise noted. All values shown reflect pre-silicon estimates. 2. Typical values at midpoint of voltage range, 25°C only. 3. Run (Operating) IDD, Wait IDD: To be measured using external square wave clock source (fosc = 4.2 MHz), all inputs 0.2 V from rail; no dc loads, less than 50 pF on all outputs, CL = 20 pF on OSC2. 4. Wait, Stop IDD: All ports configured as inputs, VIL = 0.2 V, VIH = VDD –0.2 V. 5. Wait IDD will be affected linearly by the OSC2 capacitance. 6. Stop IDD to be measured with OSC1 = VSS. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 87 Electrical Specifications 14.7 A/D Converter Characteristics Characteristic(1) Min Max Unit Resolution 8 8 Bits Absolute accuacy (VDD ≥ VREFH > 4.0) — ± 1 1/2 LSB VSS VSS VREFH VDD V Input leakage AD0, AD1, AD2, AD3 VREFH — — ±1 ±1 µA Conversion time MCU external oscillator Internal RC oscillator — — 32 32 tcyc µs Conversion range VREFH Monotonicity Comments Including quanitization A/D accuracy may decrease proportionately as VREFH is reduced below 4.0 Includes sampling time Inherent (within total error) Zero input reading 00 01 Hex Vin = 0 V Full-scale reading FE FF Hex Vin = VREFH Sample time MCU external oscillator Internal RC oscillator — — 12 12 tcyc µs Input capacitance — 12 pF VSS VREFH V A/D on current stabilization time — 100 µs tADON A/D ports hi-z leakage current (PC3:7) — ±1 µA IOZ Analog input voltage 1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = –40°C to +85°C, unless otherwise noted. 14.8 EPROM Programming Characteristics Characteristic Symbol Min Typ Max Unit Programming voltage IRQ/VPP VPP 16.25 16.5 16.75 V Programming current IRQ/VPP IPP — 5.0 10 mA tEPGM 4 — — ms Programming time per byte MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 88 Freescale Semiconductor SIOP Timing 14.9 SIOP Timing Number Characteristic Symbol Min Max Unit Operating frequency Master Slave fop(m) fop(s) 0.25 dc 0.25 0.25 fop 1 Cycle time Master Slave tcyc(m) tcyc(s) 4.0 — 4.0 4.0 tcyc 2 SCK low time tcyc 932 — ns 3 SDO data valid time tv — 200 ns 4 SDO hold time tho 0 — ns 5 SDI setup time ts 100 — ns 6 SDI hold time th 100 — ns t1 t2 SCK t5 SDI BIT 0 t3 SDO BIT 1 ... 6 t6 BIT 7 t4 BIT 0 BIT 1 ... 6 BIT 7 Figure 14-1. SIOP Timing Diagram MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 89 Electrical Specifications 14.10 Control Timing Characteristic(1) Symbol Min Max Unit Frequency of operation Crystal option External clock option fOSC — DC 4.2 4.2 MHz Internal operating frequency Crystal (fOSC ÷ 2) External clock (fOSC ÷ 2) fOP — DC 2.1 2.1 MHz Cycle time tCYC 476 — ns Crystal oscillator startup time tOXOV — 100 ms Stop mode recovery startup time (crystal oscillator) tILCH — 100 ms RESET pulse width tRL 1.5 — tCYC Interrupt pulse width low (edge-triggered) tILIH 125 — ns Interrupt pulse period(2) tILIL Note 2 — tCYC tOH, tOL 200 — ns tADON Q 100 µs OSC1 pulse width A/D On current stabilization time 1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = –40°C to +125°C, unless otherwise noted 2. The minimum period, tILIL, should not be less than the number of cycle times it takes to execute the interrupt service routine plus 19 tCYC. MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 90 Freescale Semiconductor Freescale Semiconductor tVDDR V V DD DD THRESHOLD (1-2 V TYPICAL) MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 (2) OSC1 4064 tcyc t INTERNAL PROCESSOR (1) CLOCK cyc INTERNAL ADDRESS BUS(1) 1FFE 1FFF INTERNAL DATA (1) BUS NEW PCH NEW PCL NEW PC NEW PC 1FFE 1FFE 1FFE OP CODE 1FFE 1FFF PCH PCL NEW PC NEW PC OP CODE tRL RESET NOTE 3 Notes: 1. Internal timing signal and bus information are not available externally. 2. OSC1 line is not meant to represent frequency. It is only used to represent time. 3. The next rising edge of the internal clock following the rising edge of RESET initiates the reset sequence. 91 Control Timing Figure 14-2. Power-On Reset and External Reset Timing Diagram Electrical Specifications MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 92 Freescale Semiconductor Chapter 15 Mechanical Specifications 15.1 Introduction The MC68HC705P6A is available in either a 28-pin plastic dual in-line (PDIP) or a 28-pin small outline integrated circuit (SOIC) package. 15.2 Plastic Dual In-Line Package (Case 710) 28 NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25mm (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 15 B 1 14 A L C N H G F D K SEATING PLANE M J DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 36.45 37.21 13.72 14.22 5.08 3.94 0.36 0.56 1.02 1.52 2.54 BSC 1.65 2.16 0.38 0.20 3.43 2.92 15.24 BSC 0° 15° 0.51 1.02 INCHES MIN MAX 1.435 1.465 0.540 0.560 0.155 0.200 0.014 0.022 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.015 0.115 0.135 0.600 BSC 0° 15° 0.020 0.040 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 93 Mechanical Specifications 15.3 Small Outline Integrated Circuit Package (Case 751F) -A28 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 15 14X -B1 P 0.010 (0.25) M B M 14 28X D 0.010 (0.25) M T A S B M S R X 45° C -T26X -T- G K SEATING PLANE F J DIM A B C D F G J K M P R MILLIMETERS MIN MAX 17.80 18.05 7.60 7.40 2.65 2.35 0.49 0.35 0.90 0.41 1.27 BSC 0.32 0.23 0.29 0.13 8° 0° 10.05 10.55 0.75 0.25 INCHES MIN MAX 0.701 0.711 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 8° 0° 0.395 0.415 0.010 0.029 MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 94 Freescale Semiconductor Chapter 16 Ordering Information 16.1 Introduction This section contains ordering information for the available package types. 16.2 MC Order Numbers The following table shows the MC order numbers for the available package types. MC Order Number MC68HC705P6ACP(1) (extended) (2) MC68HC705P6ACDW (extended) Operating Temperature Range –40°C to 85°C –40°C to 85°C 1. P = Plastic dual in-line package 2. DW = Small outline integrated circuit (SOIC) package MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 Freescale Semiconductor 95 Ordering Information MC68HC705P6A Advance Information Data Sheet, Rev. 2.1 96 Freescale Semiconductor blank How to Reach Us: Home Page: www.freescale.com RoHS-compliant and/or Pb- free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb- free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. E-mail: support@freescale.com For information on Freescale.s Environmental Products program, go to http://www.freescale.com/epp. USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MC68HC705P6A Rev. 2.1, 9/2005 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. 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