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by MC88LV926/D
SEMICONDUCTOR TECHNICAL DATA
Low Skew CMOS PLL 68060
Clock Driver
The MC88LV926 Clock Driver utilizes phase–locked loop technology
to lock its low skew outputs’ frequency and phase onto an input reference
clock. It is designed to provide clock distribution for CISC microprocessor
or single processor RISC systems. The RST_IN/RST_OUT(LOCK) pins
provide a processor reset function designed specifically for the
MC68/EC/LC030/040/060 microprocessor family. To support the 68060
processor, the 88LV926 operates from a 3.3V as well as a 5.0V supply.
MC88LV926
LOW SKEW CMOS PLL
68060 CLOCK DRIVER
The PLL allows the high current, low skew outputs to lock onto a single
clock input and distribute it with essentially zero delay to multiple
locations on a board. The PLL also allows the MC88LV926 to multiply a
low frequency input clock and distribute it locally at a higher (2X) system
frequency.
• 2X_Q Output Meets All Requirements of the 50 and 66MHz 68060
Microprocessor PCLK Input Specifications
•
•
•
•
Low Voltage 3.3V VCC
•
•
•
•
SYNC Input Frequency Range From 5MHZ to 2X_Q FMax/4
20
1
Three Outputs (Q0–Q2) With Output–Output Skew 1500
V
DC CHARACTERISTICS (TA = 0°C to 70°C; VCC = 3.3V ± 0.3V)4
Symbol
Parameter
VCC
Guaranteed Limits
Unit
VIH
Minimum High Level Input Voltage4
3.0
3.3
2.0
2.0
V
VOUT = 0.1V or
VCC – 0.1V
VIL
Minimum Low Level Input Voltage
3.0
3.3
0.8
0.8
V
VOUT = 0.1V or
VCC – 0.1V
VOH
Minimum High Level Output Voltage
3.0
3.3
2.2
2.5
V
VIN = VIH or VIL
IOH
–24mA
–24mA
VOL
Minimum Low Level Output Voltage
3.0
3.3
0.55
0.55
V
VIN = VIH or VIL
IOH
+24mA1
+24mA
IIN
Maximum Input Leakage Current
3.3
±1.0
µA
VI = VCC, GND
mA
VI = VCC – 2.1V
ICCT
Maximum ICC/Input
3.3
2.0 2
IOLD
Minimum Dynamic3 Output Current
3.3
50
mA
VOLD = 1.25V Max
3.3
–50
mA
VOHD = 2.35 Min
3.3
750
µA
VI = VCC, GND
IOHD
ICC
1.
2.
3.
4.
Condition
Maximum Quiescent Supply Current
IOL is +12mA for the RST_OUT output.
The PLL_EN input pin is not guaranteed to meet this specification.
Maximum test duration 2.0ms, one output loaded at a time.
The MC88LV926 can also be operated from a 5.0V supply. VOH output levels will vary 1:1 with VCC, input levels and current specs will be
unchanged, except VIH; when VCC > 4.0 volts, VIH minimum level is 2.7 volts.
TIMING SOLUTIONS
3
MOTOROLA
MC88LV926
RST_OUT
RST_IN
LOCK INDICATOR
RESET_OUT
Q
2X_Q
Q
Q0
Q
Q1
Q
Q2
Q
Q3
÷2
R
SYNC1
CH
PUMP
PFD
VCO
÷4
R
PLL_EN
0
1
÷4
R
÷8
÷4
R
÷4
R
POWER–ON
RESET
DELAY
CLKEN
÷4
R
MR
Figure 1. MC88LV926 Logic Block Diagram
SYNC INPUT TIMING REQUIREMENTS
Symbol
Parameter
tRISE/FALL
SYNC Input
Rise/Fall Time, SYNC Input
From 0.8V to 2.0V
tCYCLE,
SYNC Input
Input Clock Period
SYNC Input1
Duty Cycle
Duty Cycle, SYNC Input
Minimum
Maximum
Unit
—
5.0
ns
1
f2X_Qń4
2001
ns
50% ± 25%
1. When VCC > 4.0 volts, Maximum SYNC Input Period is 125ns.
FREQUENCY SPECIFICATIONS (TA = 0°C to 70°C; VCC = 3.3V ± 0.3V or 5.0V ±5%)
Symbol
Parameter
Guaranteed Minimum
Unit
Fmax (2X_Q)
Maximum Operating Frequency, 2X_Q Output
66
MHz
Fmax (‘Q’)
Maximum Operating Frequency,
Q0–Q3 Outputs
33
MHz
Maximum Operating Frequency is guaranteed with the 88LV926 in a phase–locked condition.
MOTOROLA
4
TIMING SOLUTIONS
MC88LV926
AC CHARACTERISTICS (TA = 0°C to 70°C; VCC = 3.3V ± 0.3V or 5.0V ±5%)
Symbol
Parameter
Mimimum
Maximum
Unit
Condition
tRISE/FALL
All Outputs
Rise/Fall Time, into 50Ω Load
0.3
1.6
ns
tRISE – 0.8V to 2.0V
tFALL – 2.0V to 0.8V
tRISE/FALL
2X_Q Output
Rise/Fall Time into a 50Ω Load
0.5
1.6
ns
tRISE – 0.8V to 2.0V
tFALL – 2.0V to 0.8V
tpulse width(a)1
(Q0, Q1, Q2, Q3)
Output Pulse Width
Q0, Q1, Q2, Q3 at 1.65V
0.5tcycle – 0.5
0.5tcycle + 0.5
ns
50Ω Load Terminated to
VCC/2 (See Application
Note 3)
tpulse width(b)1
(2X_Q Output)
Output Pulse Width
2X_Q at 1.65V
0.5tcycle – 0.5
0.5tcycle + 0.5
ns
50Ω Load Terminated to
VCC/2 (See Application
Note 3)
tSKEWr2
(Rising)
Output–to–Output Skew
Between Outputs Q0–Q2
(Rising Edge Only)
—
500
ps
Into a 50Ω Load
Terminated to VCC/2
(See Timing Diagram in
Figure 5.)
tSKEWf2
(Falling)
Output–to–Output Skew
Between Outputs Q0–Q2
(Falling Edge Only)
—
1.0
ns
Into a 50Ω Load
Terminated to VCC/2
(See Timing Diagram in
Figure 5.)
tSKEWall2
Output–to–Output Skew
2X_Q, Q0–Q2, Q3
—
750
ps
Into a 50Ω Load
Terminated to VCC/2
(See Timing Diagram in
Figure 5.)
tSKEW QCLKEN1,2
Output–to–Output Skew
2X_Q = 50MHz
QCLKEN to 2X_Q
2X_Q = 66MHz
ns
9.76
7.06
—
Into a 50Ω Load
Terminated to VCC/2
(See Timing Diagram in
Figure 5.)
tLOCK3
Phase–Lock Acquisition Time,
All Outputs to SYNC Input
1
10
ms
tPHL MR – Q1
Propagation Delay,
MR to Any Output (High–Low)
1.5
13.5
ns
tREC, MR to SYNC5,
1
Reset Recovery Time rising MR edge to
falling SYNC edge
9
—
ns
tW, MR LOW5, 1
Minimum Pulse Width, MR input Low
5
—
ns
tW, RST_IN LOW1
tPZL1
Minimum Pulse Width, RST_IN Low
10
—
ns
When in Phase–Lock
Output Enable Time
RST_IN Low to RST_OUT Low
1.5
16.5
ns
See Application
Note 5
tPLZ1
Output Enable Time
RST_IN High to RST_OUT High Z
1016 ‘Q’ Cycles
(508 Q/2 Cycles)
1024 ‘Q’ Cycles
(512 Q/2 Cycles)
ns
See Application
Note 5
Into a 50Ω Load
Terminated to VCC/2
1. These specifications are not tested, they are guaranteed by statistical characterization. See Application Note 1 for a discussion of this
methodology.
2. Under equally loaded conditions and at a fixed temperature and voltage.
3. With VCC fully powered–on: tCLOCK Max is with C1 = 0.1µF; tLOCK Min is with C1 = 0.01µF.
4. See Application Note 4 for the distribution in time of each output referenced to SYNC.
5. Specification is valid only when the PLL_EN pin is low.
6. Guaranteed that QCLKEN will meet the setup and hold time requirement of the 68060.
TIMING SOLUTIONS
5
MOTOROLA
MC88LV926
Application Notes
2. A 470KΩ resistor tied to either Analog VCC or Analog
GND, as shown in Figure 2., is required to ensure no jitter
is present on the MC88LV926 outputs. This technique
causes a phase offset between the SYNC input and the
Q0 output, measured at the pins. The tPD spec describes
how this offset varies with process, temperature, and
voltage. The specs were arrived at by measuring the
phase relationship for the 14 lots described in note 1 while
the part was in phase–locked operation. The actual
measurements were made with a 10MHz SYNC input
(1.0ns edge rate from 0.8V to 2.0V). The phase
measurements were made at 1.5V. See Figure 2. for a
graphical description.
1. Several specifications can only be measured when the
MC88LV926 is in phase–locked operation. It is not
possible to have the part in phase–lock on ATE
(automated test equipment). Statistical characterization
techniques were used to guarantee those specifications
which cannot be measured on the ATE. MC88LV926 units
were fabricated with key transistor properties intentionally
varied to create a 14 cell designed experimental matrix. IC
performance was characterized over a range of transistor
properties (represented by the 14 cells) in excess of the
expected process variation of the wafer fabrication area.
Response Surface Modeling (RSM) techniques were
used to relate IC performance to the CMOS transistor
properties over operation voltage and temperature. IC
performance to each specification and fab variation were
used in conjunction with Yield Surface Modeling
(YSM) methodology to set performance limits of ATE
testable specifications within those which are to be
guaranteed by statistical characterization. In this way, all
units passing the ATE test will meet or exceed the
non–tested specifications limits.
3. Two specs (tRISE/FALL and tPULSE Width 2X_Q output,
see AC Specifications) guarantee that the MC88LV926
meets the 33MHz and 66MHz 68060 P–Clock input
specification.
RC1
EXTERNAL
LOOP FILTER
330Ω
0.1µF
ANALOG VCC
470K
REFERENCE
RESISTOR
R2
C1
470K
REFERENCE
RESISTOR
RC1
330Ω
0.1µF
ANALOG GND
R2
C1
ANALOG GND
WITH THE 470KΩ RESISTOR TIED IN THIS FASHION THE TPD
SPECIFICATION, MEASURED AT THE INPUT PINS IS:
WITH THE 470KΩ RESISTOR TIED IN THIS FASHION THE TPD
SPECIFICATION, MEASURED AT THE INPUT PINS IS:
tPD = 2.25ns ± 1.0ns (TYPICAL VALUES)
3V
tPD = –0.80ns ± 0.30ns
3V
SYNC INPUT
SYNC INPUT
2.25ns
OFFSET
–0.8ns
OFFSET
5V
5V
Q0 OUTPUT
Q0 OUTPUT
Figure 2. Depiction of the Fixed SYNC to Q0 Offset (tPD) Which Is Present
When a 470KΩ Resistor Is Tied to VCC or Ground
MOTOROLA
6
TIMING SOLUTIONS
MC88LV926
RST_OUT PIN
VCC
1K
INTERNAL
LOGIC
CL
ANALOG GND
Figure 3. RST_OUT Test Circuit
2X_Q
12.5MHz
CRYSTAL
OSCILLATOR
Q0
Q1
Q2
SYNC
MR
PLL_EN
RST_IN
Q3
QCLKEN
RST_OUT
66MHz P–CLOCK OUTPUT
33MHz
B–CLOCK
AND SYSTEM
OUTPUTS
DELAY 33MHz CLKEN OUTPUT
Figure 4. Logical Representation of the MC88LV926 With Input/Output Frequency Relationships
SYNC Input
tCYCLE SYNC Input
tSKEWall
tSKEWf
tSKEWr
tSKEWf
tSKEWr
Q0–Q3 Outputs
tCYCLE ‘Q’ Outputs
2X_Q Output
QCLKEN
tSKEWQCLKEN
tSKEWQCLKEN
Figure 5. Output/Input Switching Waveforms and Timing Relationships
Timing Notes
1. The MC88LV926 aligns rising edges of the outputs and the SYNC input, therefore the SYNC input does not require a 50%
duty cycle.
2. All skew specs are measured between the VCC/2 crossing point of the appropriate output edges. All skews are specified as
‘windows’, not as a ± deviation around a center point.
TIMING SOLUTIONS
7
MOTOROLA
MC88LV926
5. The RST_OUT pin is an open drain N–Channel output.
Therefore an external pull–up resistor must be provide to
pull up the RST_OUT pin when it goes into the high
impedance state (after the MC88LV926 is phase–locked
to the reference input with RST_IN held high or 1024 ‘Q’
cycles after the RST_IN pin goes high when the part is
locked). In the tPLZ and tPZL specifications, a 1KΩ resistor
is used as a pull–up as shown in Figure 3.
The tPD spec includes the full temperature range from 0°C
to 70°C and the full VCC range from 3.0V to 3.3V. If the ∆T
and ∆VCC is a given system are less than the specification
limits, the tPD spec window will be reduced. The tPD
window for a given ∆T and ∆VCC is given by the following
regression formula:
TBD
Notes Concerning Loop Filter and Board Layout Issues
1. Figure 6. shows a loop filter and analog isolation scheme
which will be effective in most applications. The following
guidelines should be followed to ensure stable and
jitter–free operation:
purpose of the bypass filtering scheme shown in Figure
6. is to give the 88LV926 additional protection from the
power supply and ground plane transients that can occur
in a high frequency, high speed digital system.
1a. All loop filter and analog isolation components should be
tied as close to the package as possible. Stray current
passing through the parasitics of long traces can cause
undesirable voltage transients at the RC1 pin.
1c. There are no special requirements set forth for the loop
filter resistors (470K and 330Ω). The loop filter capacitor
(0.1uF) can be a ceramic chip capacitor, the same as a
standard bypass capacitor.
1b. The 47Ω resistors, the 10µF low frequency bypass
capacitor, and the 0.1µF high frequency bypass capacitor
form a wide bandwidth filter that will make the 88LV926
PLL insensitive to voltage transients from the system
digital VCC supply and ground planes. This filter will
typically ensure that a 100mV step deviation on the digital
VCC supply will cause no more than a 100ps phase
deviation on the 88LV926 outputs. A 250mV step
deviation on VCC using the recommended filter values
will cause no more than a 250ps phase deviation; if a
25µF bypass capacitor is used (instead of 10µF) a
250mV VCC step will cause no more than a 100ps phase
deviation.
1d. The 470K reference resistor injects current into the
internal charge pump of the PLL, causing a fixed offset
between the outputs and the SYNC input. This also
prevents excessive jitter caused by inherent PLL
dead–band. If the VCO (2X_Q output) is running above
40MHz, the 470K resistor provides the correct amount of
current injection into the charge pump (2–3µA). If the
VCO is running below 40MHz, a 1MΩ reference resistor
should be used (instead of 470K).
2. In addition to the bypass capacitors used in the analog
filter of Figure 6., there should be a 0.1µF bypass
capacitor between each of the other (digital) four VCC
pins and the board ground plane. This will reduce output
switching noise caused by the 88LV926 outputs, in
addition to reducing potential for noise in the ‘analog’
section of the chip. These bypass capacitors should also
be tied as close to the 88LV926 package as possible.
If good bypass techniques are used on a board design
near components which may cause digital VCC and
ground noise, the above described VCC step deviations
should not occur at the 88LV926’s digital VCC supply. The
BOARD VCC
NOTE: FURTHER LOOP OPTIMIZATION MAY OCCUR
47Ω
470K
10µF LOW
FREQ BIAS
5
ANALOG VCC
6
RC1
7
ANALOG GND
330Ω
0.1µF HIGH
FREQ BIAS
0.1µF (LOOP
FILTER CAP)
ANALOG LOOP FILTER/VCO
SECTION OF THE MC88LV926
20–PIN SOIC PACKAGE (NOT
DRAWN TO SCALE)
47Ω
BOARD GND
A SEPARATE ANALOG POWER SUPPLY IS NOT NECESSARY AND
SHOULD NOT BE USED. FOLLOWING THESE PRESCRIBED GUIDELINES IS ALL THAT IS NECESSARY TO USE THE MC88LV926 IN A NORMAL DIGITAL ENVIRONMENT.
Figure 6. Recommended Loop Filter and Analog Isolation Scheme for the MC88LV926
MOTOROLA
8
TIMING SOLUTIONS
MC88LV926
MC68060
16.67MHz
X–TAL
OSCILLATOR
SYNC
SYSTEM RESET
RST_IN
2X_Q
QCLKEN
Q0
Q1
Q2
Q3
66MHz
ASIC
PCLK
CLKEN
RESET
ASIC
33MHz
RST_OUT
MEMORY MODULE
Figure 7. Typical MC88LV926/MC68060 System Configuration
TIMING SOLUTIONS
9
MOTOROLA
MC88LV926
OUTLINE DIMENSIONS
DW SUFFIX
SOIC PACKAGE
CASE 751D-06
ISSUE G
D
A
20
10X
0.25
M
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
11
H
M
B
E
M
1
10
h
20X
B
0.25
X 45 _
B
M
T A B
A
18X
MOTOROLA
e
A1
L
SEATING
PLANE
q
C
T
10
DIM
A
A1
B
C
D
E
e
H
h
L
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.40
1.00
0_
7_
TIMING SOLUTIONS
MC88LV926
NOTES
TIMING SOLUTIONS
11
MOTOROLA
MC88LV926
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12
TIMING
SOLUTIONS
MC88LV926/D