MFRC52302HN1,157

Advance Product Change Notification Issue Date: 201405006A 14-May-2014 Here’s your personalized quality information concerning products Digi-Key purchased from NXP. For detailed information we invite you to view this notification online Management Summary Change of bonding wire diameter from 25 µm to 18 µm for MFRC520, MFRC522, MFRC523 Change Category [ ] Wafer Fab process [X] Assembly [ ] Product Marking [ ] Design Process [ ] Wafer Fab [ ] Assembly [ ] Electrical spec./Test [ ] Mechanical Specification materials Materials coverage [ ] Wafer Fab location [ ] Assembly Location [ ] Test Location [] Packing/Shipping/Labeling Wire Diameter change for MFRC520, MFRC522, MFRC523 Details of this Planned Change NXP will change the bonding wire diameter for all MFRC520, MFRC522, MFRC523 types from currently 25 µm to 18µm. The change has been internally verified not to affect product functionality or reliability and after an internal release by NXP the change will be implemented. The qualification report is available on request. Why do we Plan this Change Following our material policy to improve quality and to standardize materials where possible in line with materials used in that location. Identification of Affected Products Product identification does not change The Product identification does not change. Backwards traceability will be assured via date codes. Product Availability Sample Information Samples are available from 07-Jul-2014 Production Planned first shipment 01-Sep-2014 Impact no impact to the product's functionality anticipated. Data Sheet Revision No impact to existing datasheet Disposition of Old Products Existing inventory will be shipped until depleted Timing and Logistics The Self Qualification Report will be ready on 07-Jul-2014. The Final PCN is planned to be issued on: 14-Jul-2014. Your acknowledgement of this change, conform JEDEC JESD46 D, is expected till 13-Jun-2014. Contact and Support For all inquiries regarding the ePCN tool application or access issues, please contact NXP "Global Quality Support Team". For all Quality Notification content inquiries, please contact your local NXP Sales Support team. For specific questions on this notice or the products affected please contact our specialist directly: Name Jean-François Tant Position Customer Quality Manager e-mail address jean-francois.tant@nxp.com At NXP Semiconductors we are constantly striving to improve our product and processes to ensure they reach the highest possible Quality Standards. Customer Focus, Passion to Win. NXP Quality Management Team. About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted unaudited revenue of $4.36 billion in 2012. You have received this email because you are a designated contact or subscribed to NXP’s Quallity Notifications. NXP shall not be held liable if this Notification is not correctly distributed within your organization. This message has been automatically distributed. Please do not reply. View Notification Subscription NXP | Privacy Policy | Terms of Use NXP Semiconductors High Tech Campus, 5656 AG Eindhoven, The Netherlands © 2006-2010 NXP Semiconductors. All rights reserved. Support