MPXHZ6116A6T1

Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXHZ6116A Rev. 2.1, 06/2015 MPXHZ6116A, 20 to 115 kPa, Absolute, Integrated Pressure Sensor MPXHZ6116A The MPXHZ6116A series pressure sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor’s packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and high reliability of on-chip integration make this sensor a logical and economical choice for the system designer. Super small outline package The MPXHZ6116A series pressure sensor is a state-of-the-art, monolithic, signal conditioned sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This piezoresistive transducer combines advanced micromachining techniques, thinfilm metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. MPXHZ6116A6U/6T1 Case 98ARH99066A Features Top view • Resistant to high humidity and common automotive media • 1.5% maximum error over 0 °C to 85 °C • Temperature compensated from -40 °C to +125 °C • Durable thermoplastic (PPS) surface mount package (SSOP) • Ideally suited for microprocessor or microcontroller-based systems DNC 5 4 VOUT DNC 6 3 GND DNC 7 2 VS DNC 8 1 DNC Pin 1 identification, chamfered corner Pinout Ordering information # of Ports Part number Shipping Pressure type Absolute Device marking Package None Single Dual Gauge Differential Small Outline Package (MPXHZ6116A series) MPXHZ6116A6U MPXHZ6116A6T1 Rail 98ARH99066A • • MPHZ6116A Tape and Reel 98ARH99066A • • MPHZ6116A Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2009. 2010, 2015 Freescale Semiconductor, Inc. All rights reserved. Contents 1 2 3 4 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 Minimum recommended footprint for super small packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Related Documentation The MPXHZ6116A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. 3. In the Keyword search box at the top of the page, enter the device number MPXHZ6116A. In the Refine Your Result pane on the left, click on the Documentation link. MPXHZ6116A 2 Sensors Freescale Semiconductor, Inc. 1 General Description 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element Gain Stage #2 and Ground Reference Shift Circuitry VOUT Pins 1, 5, 6, 7, and 8 are internal device connections. Do . not connect to external circuitry or ground. GND Figure 1. Fully integrated pressure sensor schematic 1.2 Pinout DNC 5 4 VOUT DNC 6 3 GND DNC 7 2 VS DNC 8 1 DNC Pin 1 identification, chamfered corner Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name 1 DNC Function Do not connect to external circuitry or ground. Pin 1 is denoted by chamfered corner. 2 VS 3 GND 4 VOUT Output voltage 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. Voltage supply Ground MPXHZ6116A Sensors Freescale Semiconductor, Inc. 3 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Rating Symbol Value Units Maximum pressure Pmax 400 kPa Storage temperature Tstg -40 to +125 °C Operating temperature TA -40 to +125 °C Output source current @ full-scale output(2) Io + +0.5 mAdc Output sink current @ minimum pressure offset(2) Io - -0.5 mAdc 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 5.0 Vdc, TA = 25 °C unless otherwise noted, decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit POP 20 — 115 kPa Supply voltage(1) VS 4.75 5.0 5.25 Vdc Supply current IS — 6.0 10 mAdc Pressure range Full-scale span(2) (0 °C to 85 °C) VFSS — 4.2 — Vdc Offset(3) (0 °C to 85 °C) Voff 0.335 0.399 0.463 Vdc V/P — 44.2 — mV/kPa — -1.5 — +1.5 %VFSS POP 20 — 115 kPa Sensitivity Accuracy(4) (0 °C to 85 °C) Pressure range 1.Device is ratiometric within this specified excitation range. 2.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3.Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4.Accuracy (error budget) is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of VSS span at 25 °C due to all sources of error including the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: Offset Stability: TcSpan: TcOffset: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 °C. Output deviation, after 1000 temperature cycles, -40 °C to 125 °C, and 1.5 million pressure cycles, with minimum rated pressure applied. Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C. Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C. MPXHZ6116A 4 Sensors Freescale Semiconductor, Inc. 3 On-chip Temperature Compensation and Calibration The performance over temperature is achieved by integrating the shear–stress strain gauge, temperature compensation, calibration, and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the configuration in the basic chip carrier (case 98ARH99066A) prior to porting. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable thermoplastic package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as common automotive media. NOTE The MPXHZ6116A pressure sensor operating characteristics, internal reliability and qualification tests are based on use of air as the pressure media. Media, other than air, may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Die Fluorosilicone Gel Die Coat Stainless Steel Cap P1 Thermoplastic Case Wire Bond Lead Frame Absolute Element Sealed Vacuum Reference Die Bond Figure 3. Cross-sectional diagram SSOP (not to scale) +5 V VS MPXHZ6116A to ADC VOUT 100 nF GND 47 pF 51 K Figure 4. Recommended power supply decoupling and output filtering MPXHZ6116A Sensors Freescale Semiconductor, Inc. 5 5.0 VOUT = VS (0.008938 x P (kPa) - 0.09895) 4.5 ± (1.5 x TM x V x 0.008938) S 3.0 2.5 2.0 NOM 1.5 MIN 1.0 120 140 80 40 20 0 0 60 MAX 0.5 100 OUTPUT (V) 4.0 TEMP = 0 °C to 85 °C VS = 5.0 V ± 0.25 3.5 100 120 PRESSURE (kPa) Temperature Error Factor (TM) Figure 5. Output vs. absolute pressure 4.0 Break Points 3.0 2.0 Temp Multiplier - 40 0 to 85 125 2.85 0.96 1.66 1.0 0.0 -40 -20 0 20 40 60 80 Temperature in Cº 140 NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC Figure 6. Temperature error band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 Pressure (in kPa) 20 40 60 80 100 120 -1.0 Pressure 20 to 115 (kPa) -2.0 Error (Max) ±1.5 (kPa) -3.0 Figure 7. Pressure error band MPXHZ6116A 6 Sensors Freescale Semiconductor, Inc. 4 Package Information 4.1 Minimum recommended footprint for super small packages Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 8. SSOP footprint MPXHZ6116A Sensors Freescale Semiconductor, Inc. 7 4.2 Package dimensions This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf. Case 98ARH99066A, 8-lead super small outline package MPXHZ6116A 8 Sensors Freescale Semiconductor, Inc. Case 98ARH99066A, 8-lead super small outline package MPXHZ6116A Sensors Freescale Semiconductor, Inc. 9 Case 98ARH99066A, 8-lead super small outline package MPXHZ6116A 10 Sensors Freescale Semiconductor, Inc. 5 Revision History Table 4. Revision history Revision number Revision date 2.1 05/2015 Description • Updated format. • Corrected accuracy bullet on page 1, was 1.43% to 1.52%. Corrected device marking column on page 1. • Updated package drawing with current version. MPXHZ6116A Sensors Freescale Semiconductor, Inc. 11 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2009. 2010, 2015 Freescale Semiconductor, Inc. Document Number: MPXHZ6116A Rev. 2.1 06/2015