N74F827DB,118

INTEGRATED CIRCUITS 74F827 10-bit buffer/line driver, non-inverting (3-State) Product data Replaces Product specification 74F827/74F828 of 1994 Dec 5 
   2004 Jan 21 Philips Semiconductors Product data 10-bit buffer/line driver, non-inverting (3-State) FEATURES 74F827 DESCRIPTION • High impedance NPN base inputs for reduced loading (20 µA in The 74F827 10-Bit buffer provides high performance bus interface buffering for wide data/address paths or buses carrying parity. The device has NOR Output Enables (OE0, OE1) for maximum control flexibility. HIGH and LOW states) • IIL is 20 µA vs FAST family spec of 600 µA • Ideal where high speed, light bus loading and increased fan-in are required • Controlled rise and fall times to minimize ground bounce • Glitch free power-up in 3-State • Flow through pinout architecture for microprocessor oriented TYPE TYPICAL PROPAGATION DELAY TYPICAL SUPPLY CURRENT (TOTAL) 74F827 6.0ns 60 mA applications • Outputs sink 64 mA • 74F827 is available in SSOP type II package ORDERING INFORMATION COMMERCIAL RANGE: VCC = 5 V ± 10%; Tamb = 0 °C to +70 °C Package Type number Name Description Version N74F827N DIP24 plastic dual in-line package; 24 leads (300 mil) SOT222-1 N74F827D SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 N74F827DB SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 INPUT AND OUTPUT LOADING AND FAN-OUT TABLE 74F(U.L.) HIGH/LOW LOAD VALUE HIGH / LOW Data inputs 1.0/0.033 20 µA / 20 µA Output enable inputs (active-LOW) 1.0/0.033 20 µA / 20 µA 1200/106.7 24 mA / 64 mA PINS DESCRIPTION D0-D9 OE0-OE1 Q0-Q9 Data outputs NOTES: One (1.0) FAST Unit Load is defined as: 20 µA in the HIGH state and 0.6 mA in the LOW state. PIN CONFIGURATION OE0 1 24 VCC D0 2 23 Q0 D1 3 22 Q1 D2 4 21 Q2 D3 5 20 Q3 D4 6 19 Q4 D5 7 18 Q5 D6 8 17 Q6 D7 9 16 Q7 D8 10 15 Q8 D9 11 14 Q9 GND 12 13 OE1 SF00266 2004 Jan 21 2 Philips Semiconductors Product data 10-bit buffer/line driver, non-inverting (3-State) LOGIC SYMBOL 74F827 LOGIC SYMBOL (IEEE/IEC) 1 2 3 4 5 6 7 8 9 & 13 EN1 2 1 10 11 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 23 3 22 1 OE0 4 21 13 OE1 5 20 6 19 7 18 8 17 9 16 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Q9 23 22 21 20 19 18 17 16 15 14 VCC = Pin 24 GND = Pin 12 10 15 11 14 SF00267 SF00268 LOGIC DIAGRAM D0 D1 D2 D3 D4 D5 D6 D7 2 3 4 5 6 7 8 9 D8 10 D9 11 1 OE0 13 OE1 23 22 Q1 Q0 21 Q2 20 19 Q3 Q4 VCC = Pin 24 GND = Pin 12 INPUTS OUTPUTS OPERATING MODE OEn Dn Qn L L L Transparent L H H Transparent X Z High impedance H = = = = HIGH voltage level LOW voltage level Don’t care High impedance “off” state 2004 Jan 21 17 Q6 16 Q7 15 Q8 14 Q9 SF00272 FUNCTION TABLE H L X Z 18 Q5 3 Philips Semiconductors Product data 10-bit buffer/line driver, non-inverting (3-State) 74F827 ABSOLUTE MAXIMUM RATINGS Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the operating free-air temperature range. SYMBOL PARAMETER RATING UNIT VCC Supply voltage –0.5 to +7.0 V VIN Input voltage –0.5 to +7.0 V IIN Input current –30 to +5 mA –0.5 to +VCC V VOUT Voltage applied to output in HIGH output state IOUT Current applied to output in LOW output state Tamb Operating free-air temperature range Tstg Storage temperature range 128 mA 0 to +70 °C –65 to +150 °C RECOMMENDED OPERATING CONDITIONS LIMITS SYMBOL PARAMETER UNIT Min Nom Max 5.5 V VCC Supply voltage 4.5 5.0 VIH HIGH-level input voltage 2.0 – – V VIL LOW-level input voltage – – 0.8 V IIK Input clamp current – – –18 mA IOH HIGH-level output current – – –24 mA IOL LOW-level output current – – 64 mA Operating free-air temperature range 0 – +70 °C Tamb 2004 Jan 21 4 Philips Semiconductors Product data 10-bit buffer/line driver, non-inverting (3-State) 74F827 DC ELECTRICAL CHARACTERISTICS Over recommended operating free-air temperature range unless otherwise noted. SYMBOL VOH O TEST CONDITIONS1 PARAMETER HIGH level output voltage HIGH-level VCC = MIN, VIL = MAX MAX, VIH = MIN IOH 15 mA O = –15 VCC = MIN, VIL = MAX MAX, VIH = MIN IOH 24 mA O = –24 IOL O = 64 mA LIMITS UNIT MIN TYP2 MAX ± 10% VCC 2.4 – – V ± 5% VCC 2.4 3.3 – V ± 10% VCC 2.0 – – V ± 5% VCC 2.0 – – V ± 10% VCC – – 0.55 V ± 5% VCC – 0.42 0.55 V VOL O LOW level output voltage LOW-level VCC = MIN, VIL = MAX MAX, VIH = MIN VIK Input clamp voltage VCC = MIN; II = IIK – –0.73 –1.2 V II Input current at maximum input voltage VCC = 0 V; VI = 7.0 V – – 100 µA IIH HIGH-level input current VCC = MAX; VI = 2.7 V – – 20 µA IIL LOW-level input current VCC = MAX; VI = 0.5 V – – –20 µA IOZH Off-state output current, HIGH voltage applied VCC = MAX; VO = 2.7 V – – 50 µA IOZL Off-state output current, LOW voltage applied VCC = MAX; VO = 0.5 V – – –50 µA IOS Short circuit output current 3 VCC = MAX –100 – –225 mA – 50 70 mA ICC Supply current (total) – 70 100 mA – 60 90 mA ICCH ICCL VCC = MAX ICCZ NOTES: 1. For conditions shown as MIN or MAX, use the appropriate value specified under operating conditions for the applicable type. 2. All typical values are at VCC = 5 V, Tamb = 25 °C. 3. Not more than one output should be shorted at one time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a HIGH output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, IOS tests should be performed last. 2004 Jan 21 5 Philips Semiconductors Product data 10-bit buffer/line driver, non-inverting (3-State) 74F827 AC CHARACTERISTICS LIMITS SYMBOL PARAMETER Tamb = +25 °C VCC = 5 V CL = 50 pF; RL = 500 Ω CONDITIONS Tamb = 0 °C to +70 °C VCC = 5 V ± 10% CL = 50 pF; RL = 500 Ω Min Typ Max Min Max UNIT tPLH tPHL Propagation delay Dn to Qn Waveform 1 2.0 2.0 5.5 4.5 8.5 8.5 2.0 2.0 9.0 9.0 ns tPZH tPZL Output enable time OEn to Qn Waveform 2 Waveform 3 5.0 4.0 8.0 6.0 12.0 10.5 4.5 4.0 14.0 11.5 ns tPHZ tPLZ Output disable time OEn to Qn Waveform 2 Waveform 3 2.5 2.5 5.0 5.0 8.0 8.0 2.0 2.0 8.5 8.5 ns AC CHARACTERISTICS For 1 Output switching with CL = 300 pF and RL = 500 Ω load LIMITS SYMBOL PARAMETER Tamb = +25 °C VCC = 5 V CL = 300 pF; RL = 500 Ω CONDITIONS Tamb = 0 °C to +70 °C VCC = 5 V ± 10% CL = 300 pF; RL = 500 Ω MIN Typ Max MIN Max UNIT tPLH tPHL Propagation delay Dn to Qn Waveform 1 – – 9.5 7.5 13.0 10.0 – – 14.0 11.0 ns tPZH tPZL Output enable time OEn to Qn Waveform 2 Waveform 3 – – 15.0 9.5 20.0 13.0 – – 21.0 14.0 ns tPHZ tPLZ Output disable time OEn to Qn Waveform 2 Waveform 3 – – 15.0 9.5 19.0 13.5 – – 20.0 14.0 ns AC CHARACTERISTICS For 10 Outputs switching with CL = 300 pF and RL = 500 Ω load LIMITS SYMBOL PARAMETER Tamb = +25 °C VCC = 5 V CL = 300 pF; RL = 500 Ω CONDITIONS Tamb = 0 °C to +70 °C VCC = 5 V ± 10% CL = 300 pF; RL = 500 Ω MIN Typ Max MIN Max UNIT tPLH tPHL Propagation delay Dn to Qn Waveform 1 – – 12.0 14.0 16.0 17.0 – – 17.0 18.0 ns tPZH tPZL Output enable time OEn to Qn Waveform 2 Waveform 3 – – 15.0 17.0 20.0 21.0 – – 21.0 21.5 ns tPHZ tPLZ Output disable time OEn to Qn Waveform 2 Waveform 3 – – 15.0 12.5 19.0 15.5 – – 20.0 16.0 ns 2004 Jan 21 6 Philips Semiconductors Product data 10-bit buffer/line driver, non-inverting (3-State) 74F827 AC WAVEFORMS For all waveforms, VM = 1.5 V Dn VM VM tPLH tPHL Qn VM VM SF00125 Waveform 1. Propagation delay for non-inverting output OEn VM VM tPZH tPHZ Qn, Qn OEn VM VM tPZL VOH -0.3V tPLZ VM Qn, Qn VM VOL +0.3V 0V SF00263 SF00264 Waveform 2. 3-State Output Enable time to HIGH level and Output Disable time from HIGH level Waveform 3. 3-State Output Enable time to LOW level and Output Disable time from LOW level VCC 7.0 V VIN RL VOUT PULSE GENERATOR tw 90% NEGATIVE PULSE VM CL AMP (V) VM 10% D.U.T. RT 90% 10% tTHL (tf ) tTLH (tr ) tTLH (tr ) tTHL (tf ) 0V RL AMP (V) 90% 90% Test Circuit for Open Collector Outputs POSITIVE PULSE VM VM 10% TEST tPLZ tPZL All other SWITCH closed closed open DEFINITIONS: RL = Load resistor; see AC electrical characteristics for value. CL = Load capacitance includes jig and probe capacitance; see AC electrical characteristics for value. RT = Termination resistance should be equal to ZOUT of pulse generators. 10% tw SWITCH POSITION 0V Input Pulse Definition INPUT PULSE REQUIREMENTS family amplitude VM 74F 3.0 V 1.5 V rep. rate 1 MHz tw tTLH 500 ns 2.5 ns tTHL 2.5 ns SF00128 2004 Jan 21 7 Philips Semiconductors Product data 10-bit buffer/line driver, non-inverting (3-State) DIP24: plastic dual in-line package; 24 leads (300 mil) 2004 Jan 21 8 74F827 SOT222-1 Philips Semiconductors Product data 10-bit buffer/line driver, non-inverting (3-State) SO24: plastic small outline package; 24 leads; body width 7.5 mm 2004 Jan 21 9 74F827 SOT137-1 Philips Semiconductors Product data 10-bit buffer/line driver, non-inverting (3-State) SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm 2004 Jan 21 10 74F827 SOT340-1 Philips Semiconductors Product data 10-bit buffer/line driver, non-inverting (3-State) 74F827 REVISION HISTORY Rev Date Description _3 20040121 Product data (9397 750 12741). ECN 853-0880 A15336 of 21 January 2004. Replaces 74F827_74F828_2 dated 1994 Dec 5. Modifications: • Delete all references to 74F828 (product discontinued). • AC Characteristics table (for 10 outputs switching): change Limits columns’ headings from CL = 50 pF to CL = 300 pF. _2 19941205 Product specification. ECN 853-0880 14382 of 05 December 1994. Data sheet status Level Data sheet status [1] Product status [2] [3] Definitions I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.  Koninklijke Philips Electronics N.V. 2004 All rights reserved. Printed in U.S.A. Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 Date of release: 01-04 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. Document order number: 
   2004 Jan 21 11 9397 750 12741