NX3L1G3157
Low-ohmic single-pole double-throw analog switch
Rev. 10.1 — 24 November 2020
1
Product data sheet
General description
The NX3L1G3157 is a low-ohmic single-pole double-throw analog switch suitable for use
as an analog or digital 2:1 multiplexer/demultiplexer. It has a digital select input (S), two
independent inputs/outputs (Y0 and Y1) and a common input/output (Z). Schmitt trigger
action at the digital input makes the circuit tolerant to slower input rise and fall times.
The NX3L1G3157 allows signals with amplitude up to VCC to be transmitted from Z to Y0
or Y1; or from Y0 or Y1 to Z. Its low ON resistance (0.5 Ω) and flatness (0.13 Ω) ensures
minimal attenuation and distortion of transmitted signals.
2
Features and benefits
• Wide supply voltage range from 1.4 V to 4.3 V
• Very low ON resistance:
– 1.6 Ω (typical) at VCC = 1.4 V
– 1.0 Ω (typical) at VCC = 1.65 V
– 0.55 Ω (typical) at VCC = 2.3 V
– 0.50 Ω (typical) at VCC = 2.7 V
– 0.50 Ω (typical) at VCC = 4.3 V
• Break-before-make switching
• High noise immunity
• ESD protection:
– HBM JESD22-A114F Class 3A exceeds 7500 V
– MM JESD22-A115-A exceeds 200 V
– CDM AEC-Q100-011 revision B exceeds 1000 V
– IEC61000-4-2 contact discharge exceeds 8000 V for switch ports
• CMOS low-power consumption
• Latch-up performance exceeds 100 mA per JESD78 Class II Level A
• Direct interface with TTL levels at 3.0 V
• Control input accepts voltages above supply voltage
• High current handling capability (350 mA continuous current under 3.3 V supply)
• Specified from -40 °C to +85 °C and from -40 °C to +125 °C
3
Applications
• Cell phone
• PDA
• Portable media player
NX3L1G3157
NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
4
Ordering information
Table 1. Ordering information
Type number
Topside
[1]
marking
NX3L1G3157GM MJ
[1]
Package
Name
Description
Version
XSON6
plastic extremely thin small outline package; no leads; 6
terminals; body 1 x 1.45 x 0.5 mm
SOT886
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
4.1 Ordering options
Table 2. Ordering options
Type number
Orderable part
number
NX3L1G3157GM
NX3L1G3157GM,115
NX3L1G3157GM
NX3L1G3157GMZ
[1]
[2]
5
[1]
Package
Packing method
Minimum order Temperature
quantity
XSON6
REEL 7" Q1 NDP
5000
Tamb = -40 °C to +125 °C
XSON6
REEL 7" Q1 NDP
[2]
SSB
5000
Tamb = -40 °C to +125 °C
Will go EOL - migrate to new leadframe NX3L1G3157GMZ orderable part number
This packing method uses a Static Shielding Bag (SSB) solution. Material is to be kept in the sealed bag between uses.
Functional diagram
Y1
S
1 Y1
3 Y0
Z 4
Y0
001aac355
001aac354
Figure 1. Logic symbol
6
Z
S 6
Figure 2. Logic diagram
Pinning information
NX3L1G3157
Product data sheet
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NX3L1G3157
NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
6.1 Pinning
NX3L1G3157
Y1
1
6
S
GND
2
5
VCC
Y0
3
4
Z
001aag562
Transparent top view
Figure 3. Pin configuration SOT886 (XSON6)
6.2 Pin description
Table 3. Pin description
Symbol
Pin
Description
Y1
1
independent input or output
GND
2
ground (0 V)
Y0
3
independent input or output
Z
4
common output or input
VCC
5
supply voltage
S
6
select input
7
Functional description
Table 4. Function table
[1]
Input S
Channel on
L
Y0
H
Y1
[1]
H = HIGH voltage level; L = LOW voltage level.
8
Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
Conditions
select input S
Min
Max
Unit
-0.5
+4.6
V
[1]
-0.5
+4.6
V
[2]
-0.5
VCC + 0.5 V
VSW
switch voltage
IIK
input clamping current
VI < -0.5 V
-50
-
mA
ISK
switch clamping current
VI < -0.5 V or VI > VCC + 0.5 V
-
±50
mA
NX3L1G3157
Product data sheet
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NX3L1G3157
NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
Table 5. Limiting values...continued
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Max
Unit
ISW
switch current
VSW > -0.5 V or VSW < VCC + 0.5 V; source or
sink current
-
±350
mA
VSW > -0.5 V or VSW < VCC + 0.5 V; pulsed at 1
ms duration, < 10 % duty cycle; peak current
-
±500
mA
-65
+150
°C
-
250
mW
Tstg
storage temperature
Ptot
[1]
[2]
[3]
total power dissipation
[3]
Tamb = -40 °C to +125 °C
The minimum input voltage rating may be exceeded if the input current rating is observed.
The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed but may not exceed 4.6 V.
For XSON6 package: above 118 °C the value of Ptot derates linearly with 7.8 mW/K.
9
Recommended operating conditions
Table 6. Recommended operating conditions
Symbol Parameter
VCC
supply voltage
VI
input voltage
Conditions
select input S
[1]
VSW
switch voltage
Tamb
ambient temperature
Δt/ΔV
[1]
[2]
input transition rise and fall rate
[2]
VCC = 1.4 V to 4.3 V
Min
Max
Unit
1.4
4.3
V
0
4.3
V
0
VCC
V
-40
+125
°C
-
200
ns/V
To avoid sinking GND current from terminal Z when switch current flows in terminal Yn, the voltage drop across the bidirectional switch must not exceed
0.4 V. If the switch current flows into terminal Z, no GND current flows from terminal Yn. In this case, there is no limit for the voltage drop across the
switch.
Applies to control signal levels.
10 Static characteristics
Table 7. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
VIH
VIL
II
HIGH-level
input voltage
LOW-level
input voltage
input leakage
current
NX3L1G3157
Product data sheet
Conditions
Tamb = 25 °C
Tamb = -40 °C to +125 °C
Unit
Min
Typ
Max
Min
VCC = 1.4 V to 1.95 V
0.65VCC
-
-
0.65VCC
-
-
V
VCC = 2.3 V to 2.7 V
1.7
-
-
1.7
-
-
V
VCC = 2.7 V to 3.6 V
2.0
-
-
2.0
-
-
V
VCC = 3.6 V to 4.3 V
0.7VCC
-
-
0.7VCC
-
-
V
VCC = 1.4 V to 1.95 V
-
-
0.35VCC
-
VCC = 2.3 V to 2.7 V
-
-
0.7
-
0.7
0.7
V
VCC = 2.7 V to 3.6 V
-
-
0.8
-
0.8
0.8
V
VCC = 3.6 V to 4.3 V
-
-
0.3VCC
-
0.3VCC
select input S; VI = GND to
4.3 V; VCC = 1.4 V to 4.3 V
-
-
-
-
±0.5
All information provided in this document is subject to legal disclaimers.
Rev. 10.1 — 24 November 2020
Max
Max
(85 °C) (125 °C)
0.35VCC 0.35VCC V
0.3VCC V
±1
μA
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NX3L1G3157
NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
Table 7. Static characteristics...continued
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
IS(OFF)
IS(ON)
ICC
OFF-state
leakage
current
ON-state
leakage
current
Conditions
Tamb = 25 °C
Tamb = -40 °C to +125 °C
Unit
Min
Typ
Max
Min
Max
Max
(85 °C) (125 °C)
VCC = 1.4 V to 3.6 V
-
-
±5
-
±50
±500
nA
VCC = 3.6 V to 4.3 V
-
-
±10
-
±50
±500
nA
VCC = 1.4 V to 3.6 V
-
-
±5
-
±50
±500
nA
VCC = 3.6 V to 4.3 V
-
-
±10
-
±50
±500
nA
VCC = 3.6 V
-
-
100
-
690
6000
nA
VCC = 4.3 V
-
-
150
-
800
7000
nA
Y0 and Y1 port; see
Figure 4
Z port; see Figure 5
supply current VI = VCC or GND; VSW =
GND or VCC
CI
input
capacitance
-
1.0
-
-
-
-
pF
CS(OFF)
OFF-state
capacitance
-
35
-
-
-
-
pF
CS(ON)
ON-state
capacitance
-
130
-
-
-
-
pF
10.1 Test circuits
VCC
VIL or VIH
S
Y0
Z
Y1
1
2
switch
switch
S
1
VIH
2
VIL
IS
VI
VO
GND
001aac358
VI = 0.3 V or VCC - 0.3 V; VO = VCC - 0.3 V or 0.3 V.
Figure 4. Test circuit for measuring OFF-state leakage current
NX3L1G3157
Product data sheet
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NX3L1G3157
NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
VCC
VIL or VIH
IS
S
Y0
1
Z
Y1
2
switch
S
1
VIH
2
VIL
switch
VI
VO
GND
001aac359
VI = 0.3 V or VCC - 0.3 V; VO = VCC - 0.3 V or 0.3 V.
Figure 5. Test circuit for measuring ON-state leakage current
10.2 ON resistance
Table 8. ON resistance
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 7 to Figure 13.
Symbol
Parameter
Conditions
Tamb = -40 °C to +85 °C Tamb = -40 °C to +125 °C Unit
Min
RON(peak)
ON resistance (peak)
ON resistance
mismatch between
channels
[1]
[2]
[3]
ON resistance
(flatness)
Min
Max
VCC = 1.4 V
-
1.6
3.7
-
4.1
Ω
VCC = 1.65 V
-
1.0
1.6
-
1.7
Ω
VCC = 2.3 V
-
0.55
0.8
-
0.9
Ω
VCC = 2.7 V
-
0.5
0.75
-
0.9
Ω
-
0.5
0.75
-
0.9
Ω
VCC = 1.4 V
-
0.04
0.3
-
0.3
Ω
VCC = 1.65 V
-
0.04
0.2
-
0.3
Ω
VCC = 2.3 V
-
0.02
0.08
-
0.1
Ω
VCC = 2.7 V
-
0.02
0.075
-
0.1
Ω
-
0.02
0.075
-
0.1
Ω
VCC = 1.4 V
-
1.0
3.3
-
3.6
Ω
VCC = 1.65 V
-
0.5
1.2
-
1.3
Ω
VCC = 2.3 V
-
0.15
0.3
-
0.35
Ω
VCC = 2.7 V
-
0.13
0.3
-
0.35
Ω
VCC = 4.3 V
-
0.2
0.4
-
0.45
Ω
VI = GND to VCC;
ISW = 100 mA
[2]
VCC = 4.3 V
RON(flat)
Max
VI = GND to VCC;
ISW = 100 mA; see
Figure 6
VCC = 4.3 V
ΔRON
[1]
Typ
VI = GND to VCC;
ISW = 100 mA
[3]
Typical values are measured at Tamb = 25 °C.
Measured at identical VCC, temperature and input voltage.
Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and temperature.
NX3L1G3157
Product data sheet
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NX3L1G3157
NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
10.3 ON resistance test circuit and graphs
001aag564
1.6
RON
(Ω)
1.2
(1)
0.8
(2)
(3)
(4)
0.4
VSW
V
VCC
S
VIL or VIH
0
switch
Y0 1 switch
Y1 2
Z
VI
S
1
VIL
2
VIH
ISW
GND
001aag563
RON = VSW / ISW.
Figure 6. Test circuit for measuring ON resistance
2
3
4
VI (V)
5
Figure 7. Typical ON resistance as a function of input
voltage
001aag566
1.0
RON
(Ω)
RON
(Ω)
0.8
1.2
0.4
0.4
0
(1)
(2)
(3)
(4)
0.6
(1)
(2)
(3)
(4)
0.8
1.
2.
3.
4.
1
(6)
1. VCC = 1.5 V.
2. VCC = 1.8 V.
3. VCC = 2.5 V.
4. VCC = 2.7 V.
5. VCC = 3.3 V.
6. VCC = 4.3 V.
Measured at Tamb = 25 °C.
001aag565
1.6
0
(5)
0.2
0
1
2
VI (V)
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
1.
2.
3.
4.
Figure 8. ON resistance as a function of input voltage;
VCC = 1.5 V
NX3L1G3157
Product data sheet
0
3
0
1
2
VI (V)
3
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
Figure 9. ON resistance as a function of input voltage;
VCC = 1.8 V
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NX3L1G3157
NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
001aag567
1.0
RON
(Ω)
RON
(Ω)
0.8
0.8
0.6
0.6
(1)
(2)
(3)
(4)
0.4
0
0.2
0
1
2
0
3
VI (V)
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
1.
2.
3.
4.
Figure 10. ON resistance as a function of input voltage;
VCC = 2.5 V
0
1
2
VI (V)
3
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
Figure 11. ON resistance as a function of input voltage;
VCC = 2.7 V
001aag569
1.0
001aaj896
1.0
RON
(Ω)
RON
(Ω)
0.8
0.8
0.6
0.6
(1)
(2)
(3)
(4)
0.4
0
(1)
(2)
(3)
(4)
0.4
0.2
1.
2.
3.
4.
(1)
(2)
(3)
(4)
0.4
0.2
1.
2.
3.
4.
001aag568
1.0
0.2
0
1
2
3
VI (V)
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
1.
2.
3.
4.
Figure 12. ON resistance as a function of input voltage;
VCC = 3.3 V
NX3L1G3157
Product data sheet
0
4
0
1
2
3
4
VI (V)
5
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
Figure 13. ON resistance as a function of input voltage;
VCC = 4.3 V
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NX3L1G3157
NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
11 Dynamic characteristics
Table 9. Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for load circuit see Figure 16.
Symbol
Parameter
Conditions
Tamb = 25 °C
Min
ten
enable time
tdis
disable time
[1]
[2]
break-before-make
time
Tamb = -40 °C to +125 °C
Max
Min
Max
(85 °C)
Max
(125 °C)
Unit
S to Z or Yn; see Figure 14
VCC = 1.4 V to 1.6 V
-
28
43
-
48
52
ns
VCC = 1.65 V to 1.95 V
-
23
35
-
38
42
ns
VCC = 2.3 V to 2.7 V
-
17
27
-
29
32
ns
VCC = 2.7 V to 3.6 V
-
14
25
-
27
30
ns
VCC = 3.6 V to 4.3 V
-
14
25
-
27
30
ns
VCC = 1.4 V to 1.6 V
-
9
20
-
25
30
ns
VCC = 1.65 V to 1.95 V
-
6
15
-
20
23
ns
VCC = 2.3 V to 2.7 V
-
5
11
-
14
16
ns
VCC = 2.7 V to 3.6 V
-
4
10
-
12
14
ns
-
4
10
-
12
14
ns
VCC = 1.4 V to 1.6 V
-
19
-
4
-
-
ns
VCC = 1.65 V to 1.95 V
-
17
-
4
-
-
ns
VCC = 2.3 V to 2.7 V
-
13
-
2
-
-
ns
VCC = 2.7 V to 3.6 V
-
10
-
2
-
-
ns
VCC = 3.6 V to 4.3 V
-
10
-
2
-
-
ns
S to Z or Yn; see Figure 14
VCC = 3.6 V to 4.3 V
tb-m
Typ
[1]
[2]
see Figure 15
Typical values are measured at Tamb = 25 °C and VCC = 1.5 V, 1.8 V, 2.5 V, 3.3 V and 4.3 V respectively.
Break-before-make guaranteed by design.
NX3L1G3157
Product data sheet
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NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
11.1 Waveform and test circuits
VI
VM
S input
GND
ten
Y1 connected to VEXT
Z output
OFF to HIGH
HIGH to OFF
VOH
tdis
VX
GND
tdis
Y0 connected to VEXT
Z output
HIGH to OFF
OFF to HIGH
VX
VOH
ten
VX
VX
001aag570
GND
Measurement points are given in Table 10.
Logic level: VOH is typical output voltage level that occurs with the output load.
Figure 14. Enable and disable times
Table 10. Measurement points
Supply voltage
Input
Output
VCC
VM
VX
1.4 V to 4.3 V
0.5VCC
0.9VOH
NX3L1G3157
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NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
VCC
S
Y0
Z
G
V
VI
VO
RL
Y1
VEXT = 1.5 V
CL
GND
001aag571
a. Test circuit
VI
0.5VI
0.9VO
0.9VO
VO
tb-m
001aag572
b. Input and output measurement points
Figure 15. Test circuit for measuring break-before-make timing
VCC
G
VI
V
VO
RL
S
Y0
1
Z
Y1
2
switch
VEXT = 1.5 V
CL
GND
001aag642
Test data is given in Table 11.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Figure 16. Load circuit for switching times
Table 11. Test data
Supply voltage
Input
VCC
VI
tr, tf
CL
RL
1.4 V to 4.3 V
VCC
≤ 2.5 ns
35 pF
50 Ω
NX3L1G3157
Product data sheet
Load
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NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
11.2 Additional dynamic characteristics
Table 12. Additional dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise
specified); tr = tf ≤ 2.5 ns; Tamb = 25 °C.
Symbol Parameter
THD
Conditions
Min
fi = 20 Hz to 20 kHz; RL = 32 Ω; see Figure 17
total harmonic
distortion
αiso
0.15
-
%
VCC = 1.65 V; VI = 1.2 V (p-p)
-
0.10
-
%
VCC = 2.3 V; VI = 1.5 V (p-p)
-
0.02
-
%
VCC = 2.7 V; VI = 2 V (p-p)
-
0.02
-
%
-
0.02
-
%
-
60
-
MHz
-
-90
-
dB
VCC = 1.4 V to 3.6 V
-
0.2
-
V
VCC = 3.6 V to 4.3 V
-
0.3
-
V
VCC = 1.5 V
-
3
-
pC
VCC = 1.8 V
-
4
-
pC
VCC = 2.5 V
-
6
-
pC
VCC = 3.3 V
-
9
-
pC
VCC = 4.3 V
-
15
-
pC
[1]
VCC = 1.4 V to 4.3 V
isolation (OFF-state)
[1]
fi = 100 kHz; RL = 50 Ω; see Figure 19
VCC = 1.4 V to 4.3 V
Vct
crosstalk voltage
Qinj
[1]
charge injection
Unit
-
RL = 50 Ω; see Figure 18
-3 dB frequency
response
Max
VCC = 1.4 V; VI = 1 V (p-p)
VCC = 4.3 V; VI = 2 V (p-p)
f(-3dB)
Typ
[1]
between digital inputs and switch; fi = 1 MHz; CL =
50 pF; RL = 50 Ω; see Figure 20
fi = 1 MHz; CL = 0.1 nF; RL = 1 MΩ; Vgen = 0 V; Rgen
= 0 Ω; see Figure 21
fi is biased at 0.5VCC.
11.3 Test circuits
VCC
0.5VCC
RL
S
VIL or VIH
Z
Y0 1 switch
Y1 2
switch
S
1
VIL
2
VIH
D
fi
GND
001aag573
Figure 17. Test circuit for measuring total harmonic distortion
NX3L1G3157
Product data sheet
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NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
VCC
0.5VCC
RL
S
VIL or VIH
Y0 1 switch
Y1 2
Z
switch
S
1
VIL
2
VIH
dB
fi
GND
001aag574
Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads -3 dB.
Figure 18. Test circuit for measuring the frequency response when channel is in ON-state
0.5VCC
VCC
0.5VCC
RL
RL
S
VIL or VIH
Z
Y0 1 switch
Y1 2
switch
S
1
VIH
2
VIL
dB
fi
GND
001aag561
Adjust fi voltage to obtain 0 dBm level at input.
Figure 19. Test circuit for measuring isolation (OFF-state)
NX3L1G3157
Product data sheet
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NX3L1G3157
NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
VCC
logic
input
G
VI
S
Y0
1
Z
Y1
2
switch
S
1
VIL
2
VIH
switch
RL
RL
0.5VCC
0.5VCC
V
CL
VO
001aah442
a. Test circuit
logic
input (S)
off
on
off
Vct
VO
001aah443
b. Input and output pulse definitions
Figure 20. Test circuit for measuring crosstalk voltage between digital inputs and switch
VCC
S
Y0
1
Z
Y1
2
switch
Rgen
VI
G
VO
RL
CL
Vgen
GND
001aac366
a. Test circuit
logic
(S) off
input
on
VO
off
ΔVO
001aac478
b. Input and output pulse definitions
Definition: Qinj = ΔVO × CL.
ΔVO = output voltage variation.
Rgen = generator resistance.
Vgen = generator voltage.
Figure 21. Test circuit for measuring charge injection
NX3L1G3157
Product data sheet
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Low-ohmic single-pole double-throw analog switch
12 Package outline
SOT886
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
b
1
2
3
4x
(2)
L
L1
e
6
5
e1
4
e1
6x
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
max
nom
min
A(1)
0.5
A1
b
D
E
0.04 0.25 1.50 1.05
0.20 1.45 1.00
0.17 1.40 0.95
e
e1
0.6
0.5
L
L1
0.35 0.40
0.30 0.35
0.27 0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
Outline
version
SOT886
sot886_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
04-07-22
12-01-05
MO-252
Figure 22. Package outline SOT886 (XSON6)
NX3L1G3157
Product data sheet
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Low-ohmic single-pole double-throw analog switch
13 Abbreviations
Table 13. Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
PDA
Personal Digital Assistant
TTL
Transistor-Transistor Logic
14 Revision history
Table 14. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NX3L1G3157 v.10.1
20201124
Product data sheet
-
NX3L1G3157 v.10
Modifications:
• Package SOT886 requiring SSB added. Refer to PCN number 201909001 XSON6 (SOT886)
Assembly/Test Transfer from ATGD and ATSN to ATBK
• Removed NX3L1G3157GW,125
NX3L1G3157 v.10
20120807
Modifications:
• Package outline drawing of SOT886 (Figure 22) modified.
NX3L1G3157 v.9
20111109
Modifications:
• Legal pages updated.
NX3L1G3157 v.8
20100426
NX3L1G3157 v.7
Product data sheet
NX3L1G3157 v.9
-
NX3L1G3157 v.8
Product data sheet
-
NX3L1G3157 v.7
20100324
Product data sheet
-
NX3L1G3157 v.6
NX3L1G3157 v.6
20100208
Product data sheet
-
NX3L1G3157 v.5
NX3L1G3157 v.5
20090407
Product data sheet
-
NX3L1G3157 v.4
NX3L1G3157 v.4
20080730
Product data sheet
-
NX3L1G3157 v.3
NX3L1G3157 v.3
20080721
Product data sheet
-
NX3L1G3157 v.2
NX3L1G3157 v.2
20080415
Product data sheet
-
NX3L1G3157 v.1
NX3L1G3157 v.1
20071008
Product data sheet
-
-
NX3L1G3157
Product data sheet
Product data sheet
-
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15 Legal information
15.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
15.2 Definitions
Draft — A draft status on a document indicates that the content is still
under internal review and subject to formal approval, which may result
in modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included in a draft version of a document and shall have no
liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
NX3L1G3157
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
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Low-ohmic single-pole double-throw analog switch
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
applications to automotive specifications and standards, customer (a) shall
use the product without NXP Semiconductors’ warranty of the product for
NX3L1G3157
Product data sheet
such automotive applications, use and specifications, and (b) whenever
customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
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Low-ohmic single-pole double-throw analog switch
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Tab. 5.
Tab. 6.
Tab. 7.
Ordering information ..........................................2
Ordering options ................................................2
Pin description ...................................................3
Function table ....................................................3
Limiting values .................................................. 3
Recommended operating conditions ................. 4
Static characteristics ......................................... 4
Tab. 8.
Tab. 9.
Tab. 10.
Tab. 11.
Tab. 12.
Tab. 13.
Tab. 14.
ON resistance ................................................... 6
Dynamic characteristics .................................... 9
Measurement points ........................................10
Test data ..........................................................11
Additional dynamic characteristics .................. 12
Abbreviations ...................................................16
Revision history ...............................................16
Fig. 12.
ON resistance as a function of input
voltage; VCC = 3.3 V ........................................8
ON resistance as a function of input
voltage; VCC = 4.3 V ........................................8
Enable and disable times ................................10
Test circuit for measuring break-beforemake timing .....................................................11
Load circuit for switching times ....................... 11
Test circuit for measuring total harmonic
distortion .......................................................... 12
Test circuit for measuring the frequency
response when channel is in ON-state ............13
Test circuit for measuring isolation (OFFstate) ................................................................13
Test circuit for measuring crosstalk voltage
between digital inputs and switch ....................14
Test circuit for measuring charge injection .......14
Package outline SOT886 (XSON6) .................15
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Fig. 5.
Fig. 6.
Fig. 7.
Fig. 8.
Fig. 9.
Fig. 10.
Fig. 11.
Logic symbol ..................................................... 2
Logic diagram ....................................................2
Pin configuration SOT886 (XSON6) ..................3
Test circuit for measuring OFF-state
leakage current ................................................. 5
Test circuit for measuring ON-state leakage
current ............................................................... 6
Test circuit for measuring ON resistance ...........7
Typical ON resistance as a function of input
voltage ............................................................... 7
ON resistance as a function of input
voltage; VCC = 1.5 V ........................................7
ON resistance as a function of input
voltage; VCC = 1.8 V ........................................7
ON resistance as a function of input
voltage; VCC = 2.5 V ........................................8
ON resistance as a function of input
voltage; VCC = 2.7 V ........................................8
NX3L1G3157
Product data sheet
Fig. 13.
Fig. 14.
Fig. 15.
Fig. 16.
Fig. 17.
Fig. 18.
Fig. 19.
Fig. 20.
Fig. 21.
Fig. 22.
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NX3L1G3157
NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
8
9
10
10.1
10.2
10.3
11
11.1
11.2
11.3
12
13
14
15
General description ............................................ 1
Features and benefits .........................................1
Applications .........................................................1
Ordering information .......................................... 2
Ordering options ................................................ 2
Functional diagram ............................................. 2
Pinning information ............................................ 2
Pinning ............................................................... 3
Pin description ................................................... 3
Functional description ........................................3
Limiting values .................................................... 3
Recommended operating conditions ................ 4
Static characteristics .......................................... 4
Test circuits ........................................................5
ON resistance ....................................................6
ON resistance test circuit and graphs ................7
Dynamic characteristics .....................................9
Waveform and test circuits .............................. 10
Additional dynamic characteristics ...................12
Test circuits ......................................................12
Package outline .................................................15
Abbreviations .................................................... 16
Revision history ................................................ 16
Legal information .............................................. 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2020.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 24 November 2020
Document identifier: NX3L1G3157