NX3L4051
Single low-ohmic 8-channel analog switch
Rev. 5.1 — 30 September 2020
1
Product data sheet
General description
The NX3L4051 is a low-ohmic 8-channel analog switch, suitable for use as an analog
or digital multiplexer/demultiplexer. The NX3L4051 has three digital select inputs (S1
to S3), eight independent inputs/outputs (Y0 to Y7) and a common input/output (Z). All
eight switches share an enable input (E). A HIGH on E causes all switches into the high
impedance OFF-state, independent of Sn.
Schmitt trigger action at the digital inputs makes the circuit tolerant to slower input
rise and fall times. Low threshold digital inputs allows this device to be driven by 1.8
V logic levels in 3.3 V applications without significant increase in supply current ICC.
This makes it possible for the NX3L4051 to switch 4.3 V signals with a 1.8 V digital
controller, eliminating the need for logic level translation.The NX3L4051 allows signals
with amplitude up to VCC to be transmitted from Z to Yn or from Yn to Z. Its low ON
resistance (0.5 Ω) and flatness (0.13 Ω) ensures minimal attenuation and distortion of
transmitted signals.
2
Features and benefits
• Wide supply voltage range from 1.4 V to 4.3 V
• Very low ON resistance (peak):
– 1.7 Ω (typical) at VCC = 1.4 V
– 1.0 Ω (typical) at VCC = 1.65 V
– 0.6 Ω (typical) at VCC = 2.3 V
– 0.5 Ω (typical) at VCC = 2.7 V
0.5 Ω (typical) at VCC = 4.3 V
• Break-before-make switching
• High noise immunity
• ESD protection:
– HBM JESD22-A114F Class 3A exceeds 7500 V
– MM JESD22-A115-A exceeds 200 V
– CDM AEC-Q100-011 revision B exceeds 1000 V
– IEC61000-4-2 contact discharge exceeds 8000 V for switch ports
• CMOS low-power consumption
• Latch-up performance exceeds 100 mA per JESD 78B Class II Level A
• 1.8 V control logic at VCC = 3.6 V
• Control input accepts voltages above supply voltage
• Very low supply current, even when input is below VCC
• High current handling capability (350 mA continuous current under 3.3 V supply)
• Specified from -40 °C to +85 °C and from -40 °C to +125 °C
NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
3
Applications
•
•
•
•
•
•
4
Cell phone
PDA
Portable media player
Analog multiplexing and demultiplexing
Digital multiplexing and demultiplexing
Signal gating
Ordering information
Table 1. Ordering information
Type number Topside Package
mark
Temperature
range
Name
Description
Version
-40 °C to +125 °C
HXQFN16
plastic thermal enhanced extremely thin
quad flat package; no leads; 16 terminals;
body 3 × 3 × 0.5 mm
SOT1039-2
NX3L4051PW X3L4051 -40 °C to +125 °C
TSSOP16
plastic thin shrink small outline package; 16
leads; body width 4.4 mm
SOT403-1
NX3L4051HR M41
4.1 Ordering options
Table 2. Ordering options
Type number Orderable part
number
Package
Packing method
Minimum
Temperature
order quantity
NX3L4051HR
HXQFN16
REEL 7" Q1 NDP SSB
1500
Tamb = -40 °C to 125 °C
TSSOP16
REEL 13" Q1 NDP
2500
Tamb = -40 °C to 125 °C
NX3L4051HRZ
NX3L4051PW NX3L4051PW,118
NX3L4051
Product data sheet
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
5
Functional diagram
VCC
16
13 Y0
S1 11
14 Y1
S2 10
15 Y2
12 Y3
S3 9
13
Y0
S1
11
14
Y1
S2
10
15
Y2
S3
9
12
Y3
1
Y4
5
Y5
2
Y6
4
Y7
E
6
1 Y4
5 Y5
2 Y6
4 Y7
E 6
3 Z
3
Z
1-OF-8
DECODER
LOGIC
8
GND
001aal657
001aal658
Pin numbers are shown for TSSOP16 package only.
Pin numbers are shown for TSSOP16 package only.
Figure 1. Logic symbol
Figure 2. Functional diagram
NX3L4051
Product data sheet
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3 / 23
NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
6
Pinning information
Y7
2
Y1
11
Y0
Y4
VCC
Y2
15
14
13
10
7
S3
6
Y3
Y4
1
Y6
2
16 VCC
15 Y2
Z
3
14 Y1
4
13 Y0
Y5
5
12 Y3
E
6
11 S1
n.c.
7
10 S2
GND
8
9
n.c.
NX3L4051
Y7
4
5
E
3
GND
Y5
NX3L4051
12
8
1
S2
Z
Y6
terminal 1
index area
16
6.1 Pinning
S1
001aal659
Transparent top view
9
S3
001aal660
Figure 3. Pin configuration SOT1039-2 (HXQFN16)
Figure 4. Pin configuration SOT403-1 (TSSOP16)
6.2 Pin description
Table 3. Pin description
Symbol
Pin
Description
SOT1039-2
SOT403-1
Y0, Y1, Y2, Y3, Y4, Y5, Y6, Y7 11, 12, 13, 10, 15, 3, 16, 2
13, 14, 15, 12, 1, 5, 2, 4
independent input or output
Z
1
3
independent output or input
E
4
6
enable input (active LOW)
n.c.
5
7
not connected
GND
6
8
ground (0 V)
S1, S2, S3
9, 8, 7
11, 10, 9
select input
VCC
14
16
supply voltage
7
Functional description
Table 4. Function table
[1]
Input
Channel ON
E
S3
S2
S1
L
L
L
L
Y0 = Z
L
L
L
H
Y1 = Z
L
L
H
L
Y2 = Z
L
L
H
H
Y3 = Z
L
H
L
L
Y4 = Z
L
H
L
H
Y5 = Z
NX3L4051
Product data sheet
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4 / 23
NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
Input
Channel ON
E
S3
S2
S1
L
H
H
L
Y6 = Z
L
H
H
H
Y7 = Z
H
X
X
X
switches off
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care.
8
Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
Conditions
Sn and E
Min
Max
Unit
-0.5
+4.6
V
[1]
-0.5
+4.6
V
[2]
-0.5
VCC + 0.5 V
VSW
switch voltage
IIK
input clamping current
VI < -0.5 V
-50
-
mA
ISK
switch clamping current
VI < -0.5 V or VI > VCC + 0.5 V
-
±50
mA
ISW
switch current
VSW > -0.5 V or VSW < VCC + 0.5 V; source or
sink current
-
±350
mA
VSW > -0.5 V or VSW < VCC + 0.5 V; pulsed at 1
ms duration, < 10 % duty cycle; peak current
-
±500
mA
-65
+150
°C
Tstg
storage temperature
Ptot
total power dissipation
[1]
[2]
[3]
[4]
Tamb = -40 °C to +125 °C
HXQFN16
[3]
-
250
mW
TSSOP16
[4]
-
500
mW
The minimum input voltage rating may be exceeded if the input current rating is observed.
The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed but may not exceed 4.6 V.
For HXQFN16 package: above 135 °C the value of Ptot derates linearly with 16.9 mW/K.
For TSSOP16 package: above 60 °C the value of Ptot derates linearly with 5.5 mW/K above.
9
Recommended operating conditions
Table 6. Recommended operating conditions
Symbol Parameter
VCC
supply voltage
VI
input voltage
VSW
switch voltage
Tamb
ambient temperature
Δt/ΔV
input transition rise and fall rate
[1]
Conditions
Sn and E
[1]
Sn and E; VCC = 1.4 V to 4.3 V
Min
Max
Unit
1.4
4.3
V
0
4.3
V
0
VCC
V
-40
+125
°C
-
200
ns/V
To avoid sinking GND current from terminal Z when switch current flows in terminal Yn, the voltage drop across the bidirectional switch must not exceed
0.4 V. If the switch current flows into terminal Z, no GND current will flow from terminal Yn. In this case, there is no limit for the voltage drop across the
switch.
NX3L4051
Product data sheet
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Rev. 5.1 — 30 September 2020
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
10 Static characteristics
Table 7. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
VIH
VIL
Conditions
Tamb = 25 °C
Typ
Max
Min
VCC = 1.4 V to 1.6 V
0.9
-
-
0.9
-
-
V
VCC = 1.65 V to 1.95 V
0.9
-
-
0.9
-
-
V
VCC = 2.3 V to 2.7 V
1.1
-
-
1.1
-
-
V
VCC = 2.7 V to 3.6 V
1.3
-
-
1.3
-
-
V
VCC = 3.6 V to 4.3 V
1.4
-
-
1.4
-
-
V
VCC = 1.4 V to 1.6 V
-
-
0.3
-
0.3
0.3
V
VCC = 1.65 V to 1.95 V
-
-
0.4
-
0.4
0.3
V
VCC = 2.3 V to 2.7 V
-
-
0.4
-
0.4
0.4
V
VCC = 2.7 V to 3.6 V
-
-
0.5
-
0.5
0.5
V
VCC = 3.6 V to 4.3 V
-
-
0.6
-
0.6
0.6
V
-
-
-
-
±0.5
±1
μA
VCC = 1.4 V to 3.6 V
-
-
±5
-
±50
±500
nA
VCC = 3.6 V to 4.3 V
-
-
±10
-
±50
±500
nA
VCC = 1.4 V to 3.6 V
-
-
±20
-
±200
±2000
nA
VCC = 3.6 V to 4.3 V
-
-
±40
-
±200
±2000
nA
VCC = 3.6 V
-
-
100
-
500
5000
nA
VCC = 4.3 V
-
-
150
-
800
6000
nA
VSW = GND or VCC
additional
supply current
VI = 2.6 V; VCC = 4.3 V
-
2.0
4.0
-
7
7
μA
VI = 2.6 V; VCC = 3.6 V
-
0.35
0.7
-
1
1
μA
VI = 1.8 V; VCC = 4.3 V
-
7.0
10.0
-
15
15
μA
VI = 1.8 V; VCC = 3.6 V
-
2.5
4.0
-
5
5
μA
VI = 1.8 V; VCC = 2.5 V
-
50
200
-
300
500
nA
-
1.0
-
-
-
-
pF
-
35
-
-
-
-
pF
HIGH-level
input voltage
LOW-level
input voltage
input leakage
current
Sn and E; VI = GND to 4.3
V; VCC = 1.4 V to 4.3 V
IS(OFF)
OFF-state
leakage
current
Yn ports; see Figure 5
ON-state
leakage
current
Z port; VCC = 1.4 V to 3.6
V; see Figure 6
ICC
ΔICC
Unit
Min
II
IS(ON)
Tamb = -40 °C to +125 °C
Max
Max
(85 °C) (125 °C)
supply current VI = VCC or GND; VSW =
GND or VCC
CI
input
capacitance
CS(OFF)
OFF-state
capacitance
NX3L4051
Product data sheet
Sn and E
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
Symbol Parameter
CS(ON)
Conditions
Tamb = 25 °C
ON-state
capacitance
Tamb = -40 °C to +125 °C
Min
Typ
Max
Min
-
350
-
-
Unit
Max
Max
(85 °C) (125 °C)
-
-
pF
10.1 Test circuits
VCC
Sn
VIL or VIH
Z
Yn
IS
E
VI
VO
VIH
GND
001aal661
VI = 0.3 V or VCC - 0.3 V; VO = VCC - 0.3 V or 0.3 V.
Figure 5. Test circuit for measuring OFF-state leakage current
VCC
Sn
VIL or VIH
Z
IS
VI
Yn
E
VO
VIL
GND
001aal662
VI = 0.3 V or VCC - 0.3 V; VO = VCC - 0.3 V or 0.3 V.
Figure 6. Test circuit for measuring ON-state leakage current
10.2 ON resistance
[1]
Table 8. ON resistance
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 8 to Figure 14.
Symbol
Parameter
Conditions
Tamb = -40 °C to +85 °C
Min
RON(peak) ON resistance
(peak)
NX3L4051
Product data sheet
Typ
[2]
Tamb = -40 °C to +125 °C Unit
Max
Min
Max
VI = GND to VCC; ISW = 100
mA; see Figure 7
VCC = 1.4 V
-
1.7
3.7
-
4.1
Ω
VCC = 1.65 V
-
1.0
1.6
-
1.7
Ω
VCC = 2.3 V
-
0.6
0.8
-
0.9
Ω
VCC = 2.7 V
-
0.5
0.75
-
0.9
Ω
VCC = 4.3 V
-
0.5
0.75
-
0.9
Ω
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
Symbol
Parameter
Conditions
Tamb = -40 °C to +85 °C
Min
ΔRON
ON resistance
mismatch
between
channels
VI = GND to VCC; ISW = 100
mA
[1]
[2]
[3]
[4]
ON resistance
(flatness)
Tamb = -40 °C to +125 °C Unit
Max
Min
Max
[3]
VCC = 1.4 V; VSW = 0.4 V
-
0.18
0.30
-
0.30
Ω
VCC = 1.65 V; VSW = 0.5
V
-
0.18
0.20
-
0.30
Ω
VCC = 2.3 V; VSW = 0.7 V
-
0.07
0.10
-
0.13
Ω
VCC = 2.7 V; VSW = 0.8 V
-
0.07
0.10
-
0.13
Ω
-
0.07
0.10
-
0.13
Ω
VCC = 1.4 V
-
1.0
3.3
-
3.6
Ω
VCC = 1.65 V
-
0.5
1.2
-
1.3
Ω
VCC = 2.3 V
-
0.15
0.3
-
0.35
Ω
VCC = 2.7 V
-
0.13
0.3
-
0.35
Ω
VCC = 4.3 V
-
0.2
0.4
-
0.45
Ω
VCC = 4.3 V; VSW = 0.8 V
RON(flat)
Typ
[2]
VI = GND to VCC; ISW = 100
mA
[4]
For NX3L4051PW (TSSOP16 package), all ON resistance values are up to 0.05 Ω higher.
Typical values are measured at Tamb = 25 °C.
Measured at identical VCC, temperature and input voltage.
Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and temperature.
NX3L4051
Product data sheet
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
10.3 ON resistance test circuit and graphs
001aag564
1.6
RON
(Ω)
1.2
(1)
0.8
(2)
(3)
(4)
0.4
(5)
(6)
VSW
V
0
VCC
VIL or VIH
Sn
Z
Yn
E
VI
VIL
ISW
GND
001aal663
RON = VSW / ISW.
Figure 7. Test circuit for measuring ON resistance
2
3
4
VI (V)
5
Figure 8. Typical ON resistance as a function of input
voltage
001aag566
1.0
RON
(Ω)
RON
(Ω)
0.8
1.2
0.4
0.4
0
(1)
(2)
(3)
(4)
0.6
(1)
(2)
(3)
(4)
0.8
1.
2.
3.
4.
1
1. VCC = 1.5 V.
2. VCC = 1.8 V.
3. VCC = 2.5 V.
4. VCC = 2.7 V.
5. VCC = 3.3 V.
6. VCC = 4.3 V.
Measured at Tamb = 25 °C.
001aag565
1.6
0
0.2
0
1
2
VI (V)
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
1.
2.
3.
4.
Figure 9. ON resistance as a function of input voltage;
VCC = 1.5 V
NX3L4051
Product data sheet
0
3
0
1
2
VI (V)
3
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
Figure 10. ON resistance as a function of input voltage;
VCC = 1.8 V
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
001aag567
1.0
RON
(Ω)
RON
(Ω)
0.8
0.8
0.6
0.6
(1)
(2)
(3)
(4)
0.4
0
0.2
0
1
2
0
3
VI (V)
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
1.
2.
3.
4.
Figure 11. ON resistance as a function of input voltage;
VCC = 2.5 V
0
1
2
VI (V)
3
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
Figure 12. ON resistance as a function of input voltage;
VCC = 2.7 V
001aag569
1.0
001aaj896
1.0
RON
(Ω)
RON
(Ω)
0.8
0.8
0.6
0.6
(1)
(2)
(3)
(4)
0.4
0
(1)
(2)
(3)
(4)
0.4
0.2
1.
2.
3.
4.
(1)
(2)
(3)
(4)
0.4
0.2
1.
2.
3.
4.
001aag568
1.0
0.2
0
1
2
3
VI (V)
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
1.
2.
3.
4.
Figure 13. ON resistance as a function of input voltage;
VCC = 3.3 V
NX3L4051
Product data sheet
0
4
0
1
2
3
4
VI (V)
5
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
Figure 14. ON resistance as a function of input voltage;
VCC = 4.3 V
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10 / 23
NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
11 Dynamic characteristics
Table 9. Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for load circuit see Figure 17.
Symbol Parameter
Conditions
Tamb = 25 °C
Min
ten
enable time
tdis
disable time
[1]
[2]
Tamb = -40 °C to +125 °C
Typ
Max
Min
Max
(85 °C)
Max
(125 °C)
Unit
E, Sn to Z or Yn; see
Figure 15
VCC = 1.4 V to 1.6 V
-
45
100
-
120
125
ns
VCC = 1.65 V to 1.95
V
-
32
75
-
85
95
ns
VCC = 2.3 V to 2.7 V
-
21
50
-
55
60
ns
VCC = 2.7 V to 3.6 V
-
19
45
-
45
50
ns
VCC = 3.6 V to 4.3 V
-
19
45
-
45
50
ns
VCC = 1.4 V to 1.6 V
-
25
80
-
90
105
ns
VCC = 1.65 V to 1.95
V
-
15
65
-
70
75
ns
VCC = 2.3 V to 2.7 V
-
9
30
-
35
40
ns
VCC = 2.7 V to 3.6 V
-
8
25
-
30
35
ns
-
8
25
-
30
35
ns
-
19
-
9
-
-
ns
VCC = 1.65 V to 1.95
V
-
17
-
7
-
-
ns
VCC = 2.3 V to 2.7 V
-
12
-
4
-
-
ns
VCC = 2.7 V to 3.6 V
-
10
-
3
-
-
ns
VCC = 3.6 V to 4.3 V
-
9
-
2
-
-
ns
E, Sn to Z or Yn; see
Figure 15
VCC = 3.6 V to 4.3 V
break-before-make see Figure 16
time
VCC = 1.4 V to 1.6 V
tb-m
[1]
[2]
Typical values are measured at Tamb = 25 °C and VCC = 1.5 V, 1.8 V, 2.5 V, 3.3 V and 4.3 V respectively.
Break-before-make guaranteed by design.
NX3L4051
Product data sheet
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Rev. 5.1 — 30 September 2020
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11 / 23
NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
11.1 Waveform and test circuits
VI
Sn, E input
VM
VM
GND
tdis
ten
output
OFF to HIGH
HIGH to OFF
VOH
VX
VX
GND
tdis
output
HIGH to OFF
OFF to HIGH
VOH
ten
VX
VX
GND
001aal664
Measurement points are given in Table 10.
Logic level: VOH is typical output voltage level that occurs with the output load.
Figure 15. Enable and disable times
Table 10. Measurement points
Supply voltage
Input
Output
VCC
VM
VX
1.4 V to 4.3 V
0.5VCC
0.9VOH
VCC
VIL or VIH Sn
Z
G
Yn
E
VI
V
VO
RL
VEXT = 1.5 V
CL
VIL
GND
001aal665
a. Test circuit
VI
0.5VI
0.9VO
0.9VO
VO
tb-m
001aag572
b. Input and output measurement points
Figure 16. Test circuit for measuring break-before-make timing
NX3L4051
Product data sheet
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
VCC
VIL or VIH Sn
Z
G
Yn
E
VI
V
VO
RL
VEXT = 1.5 V
CL
VIL
GND
001aal666
Test data is given in Table 11.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
VI may be connected to Sn or E.
Figure 17. Test circuit for measuring switching times
Table 11. Test data
Supply voltage
Input
VCC
VI
tr, tf
CL
RL
1.4 V to 4.3 V
VCC
≤ 2.5 ns
35 pF
50 Ω
Load
11.2 Additional dynamic characteristics
Table 12. Additional dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise
specified); tr = tf ≤ 2.5 ns; Tamb = 25 °C.
Symbol Parameter
THD
total harmonic
distortion
Conditions
Min
fi = 20 Hz to 20 kHz; RL = 32 Ω; see Figure 18
αiso
-3 dB frequency
response
isolation (OFF-state)
crosstalk voltage
0.15
-
%
VCC = 1.65 V; VI = 1.2 V (p-p)
-
0.10
-
%
VCC = 2.3 V; VI = 1.5 V (p-p)
-
0.02
-
%
VCC = 2.7 V; VI = 2 V (p-p)
-
0.02
-
%
-
0.02
-
%
-
15
-
MHz
-
-90
-
dB
-
0.2
-
V
-
0.3
-
V
RL = 50 Ω; see Figure 19
[1]
VCC = 1.4 V to 4.3 V
fi = 100 kHz; RL = 50 Ω; see Figure 20
[1]
between digital inputs and switch; fi = 1 MHz; CL =
50 pF; RL = 50 Ω; see Figure 21
VCC = 1.4 V to 3.6 V
VCC = 3.6 V to 4.3 V
Xtalk
crosstalk
NX3L4051
Product data sheet
Unit
-
VCC = 1.4 V to 4.3 V
Vct
Max
VCC = 1.4 V; VI = 1 V (p-p)
VCC = 4.3 V; VI = 2 V (p-p)
f(-3dB)
Typ
[1]
between switches; fi = 100 kHz; RL = 50 Ω; see
Figure 22
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[1]
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
Symbol Parameter
Conditions
Min
VCC = 1.4 V to 4.3 V
Qinj
[1]
charge injection
Typ
Max
Unit
-
-90
-
dB
VCC = 1.5 V
-
3
-
pC
VCC = 1.8 V
-
4
-
pC
VCC = 2.5 V
-
6
-
pC
VCC = 3.3 V
-
9
-
pC
VCC = 4.3 V
-
15
-
pC
fi = 1 MHz; CL = 0.1 nF; RL = 1 MΩ; Vgen = 0 V; Rgen
= 0 Ω; see Figure 23
fi is biased at 0.5VCC.
11.3 Test circuits
VCC
0.5VCC
Sn
VIL or VIH
RL
Z
Yn
E
D
fi
VIL
GND
001aal667
Figure 18. Test circuit for measuring total harmonic distortion
VCC
0.5VCC
Sn
VIL or VIH
RL
Z
Yn
E
dB
fi
VIL
GND
001aal668
Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads -3 dB.
Figure 19. Test circuit for measuring the frequency response when channel is in ON-state
NX3L4051
Product data sheet
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
0.5VCC
0.5VCC
VCC
RL
RL
Sn
VIL or VIH
Z
Yn
E
dB
fi
VIH
GND
001aal669
Adjust fi voltage to obtain 0 dBm level at input.
Figure 20. Test circuit for measuring isolation (OFF-state)
0.5VCC
0.5VCC
VCC
RL
RL
Sn
VIL or VIH
Z
Yn
E
G
VI
logic
input
CL
V
VO
GND
001aal670
a. Test circuit
logic input
(Sn, E)
off
on
off
VO
Vct
001aal671
b. Input and output pulse definitions
Figure 21. Test circuit for measuring crosstalk voltage between digital inputs and switch
0.5VCC
0.5VCC
RL
RL
VCC
VIL or VIH
Sn
Y0
Z
Yn
E
VIH
dB
fi
GND
001aal672
Figure 22. Test circuit for measuring crosstalk between switches
NX3L4051
Product data sheet
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
VCC
Sn
Z
Yn
E
Rgen
G
VIL
VI
V
VO
RL
Vgen
CL
GND
001aal673
a. Test circuit
logic input
(Sn, E)
off
on
VO
off
VO
001aal674
b. Input and output pulse definitions
Definition: Qinj = ΔVO × CL.
ΔVO = output voltage variation.
Rgen = generator resistance.
Vgen = generator voltage.
VI may be connected to Sn or E.
Figure 23. Test circuit for measuring charge injection
NX3L4051
Product data sheet
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
12 Package outline
HXQFN16 (U): plastic thermal enhanced extremely thin quad flat package; no
leads; 16 terminals; body 3 x 3 x 0.5 mm
B
D
SOT1039-2
A
terminal 1
index area
E
A
A1
c
detail X
e1
1/2 e
e
v
w
b
5
8
C
C A B
C
y1 C
y
L
4
9
e
e2
Eh
1/2 e
1
12
terminal 1
index area
16
X
13
Dh
0
1
Dimensions
Unit
mm
max
nom
min
2 mm
scale
A
0.5
A1
b
c
D
0.05 0.35
3.1
0.30 0.127 3.0
0.00 0.25
2.9
Dh
E
Eh
e
e1
e2
L
v
1.95
1.85
1.75
3.1
3.0
2.9
1.95
1.85
1.75
0.5
1.5
1.5
0.40
0.35
0.30
0.1
w
y
0.05 0.05
y1
0.1
sot1039-2_po
References
Outline
version
IEC
SOT1039-2
---
JEDEC
JEITA
---
European
projection
Issue date
11-03-30
17-10-31
Figure 24. Package outline SOT1039-2 (HXQFN16)
NX3L4051
Product data sheet
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
D
SOT403-1
E
A
X
c
y
HE
v M A
Z
9
16
Q
A2
pin 1 index
(A 3 )
A1
A
θ
Lp
1
L
8
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.40
0.06
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT403-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Figure 25. Package outline SOT403-1 (TSSOP16)
NX3L4051
Product data sheet
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Rev. 5.1 — 30 September 2020
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
13 Abbreviations
Table 13. Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
PDA
Personal Digital Assistant
14 Revision history
Table 14. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NX3L4051 v.5.1
20200930
Product data sheet
-
NX3L4051 v.5
Modifications:
• Section 4: Added Section 4.1; NX3L4051HR,115 replaced with NX3L4051HRZ
NX3L4051 v.5
20120703
Modifications:
• For type number NX3L4051HR the sot code has changed to SOT1039-2.
NX3L4051 v.4
20111107
Modifications:
• Legal pages updated.
NX3L4051 v.3
20101222
NX3L4051 v.2
NX3L4051 v.1
NX3L4051
Product data sheet
Product data sheet
Product data sheet
-
NX3L4051 v.4
-
NX3L4051 v.3
Product data sheet
-
NX3L4051 v.2
20100812
Product data sheet
-
NX3L4051 v.1
20100415
Product data sheet
-
-
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NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
15 Legal information
15.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
NX3L4051
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
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20 / 23
NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
applications to automotive specifications and standards, customer (a) shall
use the product without NXP Semiconductors’ warranty of the product for
NX3L4051
Product data sheet
such automotive applications, use and specifications, and (b) whenever
customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 5.1 — 30 September 2020
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21 / 23
NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Tab. 5.
Tab. 6.
Tab. 7.
Ordering information ..........................................2
Ordering options ................................................2
Pin description ...................................................4
Function table ....................................................4
Limiting values .................................................. 5
Recommended operating conditions ................. 5
Static characteristics ......................................... 6
Tab. 8.
Tab. 9.
Tab. 10.
Tab. 11.
Tab. 12.
Tab. 13.
Tab. 14.
ON resistance ................................................... 7
Dynamic characteristics .................................. 11
Measurement points ........................................12
Test data ......................................................... 13
Additional dynamic characteristics .................. 13
Abbreviations ...................................................19
Revision history ...............................................19
Fig. 14.
ON resistance as a function of input voltage;
VCC = 4.3 V ................................................... 10
Enable and disable times ................................12
Test circuit for measuring break-beforemake timing .....................................................12
Test circuit for measuring switching times ....... 13
Test circuit for measuring total harmonic
distortion .......................................................... 14
Test circuit for measuring the frequency
response when channel is in ON-state ............14
Test circuit for measuring isolation (OFFstate) ................................................................15
Test circuit for measuring crosstalk voltage
between digital inputs and switch ....................15
Test circuit for measuring crosstalk between
switches ...........................................................15
Test circuit for measuring charge injection ...... 16
Package outline SOT1039-2 (HXQFN16) ........17
Package outline SOT403-1 (TSSOP16) ..........18
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Fig. 5.
Fig. 6.
Fig. 7.
Fig. 8.
Fig. 9.
Fig. 10.
Fig. 11.
Fig. 12.
Fig. 13.
Logic symbol ..................................................... 3
Functional diagram ............................................3
Pin configuration SOT1039-2 (HXQFN16) ........ 4
Pin configuration SOT403-1 (TSSOP16) ...........4
Test circuit for measuring OFF-state
leakage current ................................................. 7
Test circuit for measuring ON-state leakage
current ............................................................... 7
Test circuit for measuring ON resistance .......... 9
Typical ON resistance as a function of input
voltage ............................................................... 9
ON resistance as a function of input voltage;
VCC = 1.5 V ..................................................... 9
ON resistance as a function of input voltage;
VCC = 1.8 V ..................................................... 9
ON resistance as a function of input voltage;
VCC = 2.5 V ................................................... 10
ON resistance as a function of input voltage;
VCC = 2.7 V ................................................... 10
ON resistance as a function of input voltage;
VCC = 3.3 V ................................................... 10
NX3L4051
Product data sheet
Fig. 15.
Fig. 16.
Fig. 17.
Fig. 18.
Fig. 19.
Fig. 20.
Fig. 21.
Fig. 22.
Fig. 23.
Fig. 24.
Fig. 25.
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22 / 23
NX3L4051
NXP Semiconductors
Single low-ohmic 8-channel analog switch
Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
8
9
10
10.1
10.2
10.3
11
11.1
11.2
11.3
12
13
14
15
General description ............................................ 1
Features and benefits .........................................1
Applications .........................................................2
Ordering information .......................................... 2
Ordering options ................................................ 2
Functional diagram ............................................. 3
Pinning information ............................................ 4
Pinning ............................................................... 4
Pin description ................................................... 4
Functional description ........................................4
Limiting values .................................................... 5
Recommended operating conditions ................ 5
Static characteristics .......................................... 6
Test circuits ....................................................... 7
ON resistance ....................................................7
ON resistance test circuit and graphs ................9
Dynamic characteristics ...................................11
Waveform and test circuits .............................. 12
Additional dynamic characteristics ...................13
Test circuits ..................................................... 14
Package outline .................................................17
Abbreviations .................................................... 19
Revision history ................................................ 19
Legal information .............................................. 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2020.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 September 2020
Document identifier: NX3L4051
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