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OM7609/BGA2748

OM7609/BGA2748

  • 厂商:

    NXP(恩智浦)

  • 封装:

    -

  • 描述:

    EVAL BOARD FOR BGA2748

  • 数据手册
  • 价格&库存
OM7609/BGA2748 数据手册
DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage MBD128 BGA2748 MMIC wideband amplifier Product specification Supersedes data of 2002 Jul 03 2010 Sep 13 NXP Semiconductors Product specification MMIC wideband amplifier BGA2748 FEATURES PINNING • Internally matched PIN DESCRIPTION • Wide frequency range 1 • Optimized for 900 MHz 2, 5 GND2 3 RF out 4 GND1 6 RF in • Excellent isolation • Low noise • Unconditionally stable. APPLICATIONS VS 6 5 4 1 • Cable systems • LNB IF amplifiers 6 • General purpose 1 • ISM. 2 Top view DESCRIPTION 4 3 2, 5 MAM455 Marking code: G3* Silicon Monolitic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 SMD plastic package. 3 * = - : made in Hong Kong * = p : made in Hong Kong * = t : made in Malaysia Fig.1 Simplified outline (SOT363) and symbol. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT VS DC supply voltage 3 4 V IS DC supply current 5.7 − mA insertion power gain f = 1 GHz 21.8 − dB NF noise figure f = 1 GHz 1.9 − dB PL(sat) saturated load power f = 1 GHz −2.3 − dBm |s21 |2 CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. 2010 Sep 13 2 NXP Semiconductors Product specification MMIC wideband amplifier BGA2748 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134) SYMBOL PARAMETER VS DC supply voltage IS supply current CONDITIONS MIN. RF input AC coupled Ts ≤ 80 °C MAX. UNIT − 4 V − 15 mA Ptot total power dissipation − 200 mW Tstg storage temperature −65 +150 °C Tj operating junction temperature − 150 °C PD maximum drive power − 10 dBm THERMAL RESISTANCE SYMBOL Rth j-s PARAMETER CONDITIONS VALUE UNIT 300 K/W Ptot = 200 mW; Ts ≤ 80 °C thermal resistance from junction to solder point CHARACTERISTICS VS = 3 V; IS = 5.7 mA; f = 1 GHz; Tj = 25 °C; unless otherwise specified. SYMBOL CONDITIONS supply current IS |s21 PARAMETER |2 insertion power gain MIN. TYP. MAX. UNIT 4.5 5.7 8 mA f = 1 GHz − 21.8 − dB f = 2 GHz − 18.5 − dB − 18 − dB RL IN return losses input f = 1 GHz f = 2 GHz − 14 − dB RL OUT return losses output f = 1 GHz − 7 − dB f = 2 GHz − 8 − dB NF noise figure f = 1 GHz − 1.9 − dB f = 2 GHz − 2.4 − dB |s21|2 − 1.9 − GHz −3 dB below flat gain at 1 GHz BW bandwidth at PL(sat) saturated load power f = 1 GHz − −2.3 − dBm f = 2 GHz − −3.3 − dBm PL 1 dB load power at 1 dB gain compression; f = 1 GHz − −9.2 − dBm at 1 dB gain compression; f = 2 GHz − −10.9 − dBm IP3(in) IP3(out) 2010 Sep 13 input intercept point output intercept point f = 1 GHz − −23.7 − dBm f = 2 GHz − −19.9 − dBm f = 1 GHz − −1.9 − dBm f = 2 GHz − −1.4 − dBm 3 NXP Semiconductors Product specification MMIC wideband amplifier BGA2748 APPLICATION INFORMATION Figure 2 shows a typical application circuit for the BGA2748 MMIC. The device is internally matched to 50 Ω, and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2, C3 should be not more than 100 pF for applications above 100 MHz. However, when the device is operated below 100 MHz, the capacitor value should be increased. DC-block handbook, halfpage DC-block 100 pF 100 pF DC-block 100 pF input output MGU437 The 22 nF supply decoupling capacitor, C1 should be located as closely as possible to the MMIC. Fig.3 Easy cascading application circuit. Separate paths must be used for the ground planes of the ground pins GND1, GND2, and these paths must be as short as possible. When using vias, use multiple vias per pin in order to limit ground path inductance. mixer handbook, halfpage from RF circuit to IF circuit or demodulator wideband amplifier Vshalfpage handbook, MGU438 oscillator C1 Vs RF in RF input RF out C2 RF output Fig.4 Application as IF amplifier. C3 GND1 GND2 MGU435 Fig.2 Typical application circuit. mixer handbook, halfpage to IF circuit or demodulator antenna LNA Figure 3 shows two cascaded MMICs. This configuration doubles overall gain while preserving broadband characteristics. Supply decoupling and grounding conditions for each MMIC are the same as those for the circuit of Fig.2. wideband amplifier MGU439 oscillator Fig.5 Application as RF amplifier. The excellent wideband characteristics of the MMIC make it and ideal building block in IF amplifier applications such as LBNs (see Fig.4). As a buffer amplifier between an LNA and a mixer in a receiver circuit, the MMIC offers an easy matching, low noise solution (see Fig.5). mixer handbook, halfpage from modulation or IF circuit to power amplifier wideband amplifier In Fig.6 the MMIC is used as a driver to the power amplifier in part of a transmitter circuit. Good linear performance and matched input and output offer quick design solutions in such applications. MGU440 oscillator Fig.6 Application as driver amplifier. 2010 Sep 13 4 NXP Semiconductors Product specification MMIC wideband amplifier BGA2748 90° handbook, full pagewidth 1.0 +1 135° 0.8 45° +2 +0.5 0.6 +0.2 0.4 +5 0.2 100 MHz 180° 0.2 0 0.5 1 2 5 0° 0 3 GHz −5 −0.2 −0.5 −2 −135° −45° −1 MGU465 1.0 −90° IS = 5.66 mA; VS = 3 V; PD = −30 dBm; ZO = 50 Ω. Fig.7 Input reflection coefficient (s11); typical values. 90° handbook, full pagewidth 1.0 +1 135° 0.8 45° +2 +0.5 0.6 +0.2 0.4 +5 0.2 180° 0.2 0 0.5 1 5 100 MHz 0° 0 3 GHz −5 −0.2 −0.5 −2 −135° −45° −1 MGU466 IS = 5.66 mA; VS = 3 V; PD = −30 dBm; ZO = 50 Ω. −90° Fig.8 Output reflection coefficient (s22); typical values. 2010 Sep 13 5 1.0 NXP Semiconductors Product specification MMIC wideband amplifier BGA2748 MGU467 0 MGU468 30 handbook, halfpage handbook, halfpage 2 s12 (dBm) s21 2 (dB) −20 20 −40 10 −60 −80 0 0 1000 2000 0 3000 1000 f (MHz) IS = 5.66 mA; VS = 3 V; PD = −30 dBm; ZO = 50 Ω. Fig.9 IS = 5.66 mA; VS = 3 V; PD = −30 dBm; ZO = 50 Ω. Isolation (|s12|2) as a function of frequency; typical values. Fig.10 Insertion gain (|s21|2) as a function of frequency; typical values. MGU469 0 handbook, halfpage PL (dBm) PL (dBm) −10 −10 −20 −20 −40 −30 −20 MGU470 0 handbook, halfpage −30 −50 3000 2000 f (MHz) −30 −50 0 −10 PD (dBm) −40 −30 −20 0 −10 PD (dBm) VS = 3 V; f = 1 GHz; ZO = 50 Ω. VS = 3 V; f = 2 GHz; ZO = 50 Ω. Fig.11 Load power as a function of drive power at 1 GHz; typical values. Fig.12 Load power as a function of drive power at 2 GHz; typical values. 2010 Sep 13 6 NXP Semiconductors Product specification MMIC wideband amplifier BGA2748 MGU471 5 MGU472 15 handbook, halfpage NF (dB) K 4 10 3 2 5 1 0 0 0 1000 2000 f (MHz) 3000 0 1000 2000 f (MHz) 3000 IS = 5.66 mA; VS = 3 V; ZO = 50 Ω. IS = 5.66 mA; VS = 3 V; ZO = 50 Ω. Fig.13 Noise figure as a function of frequency; typical values. Fig.14 Stability factor as a function of frequency; typical values. Table 1 f (MHz) Scattering parameters: IS = 5.66 mA; VS = 3 V; PD = −30 dBm; ZO = 50 Ω; Tamb = 25 °C s11 s21 MAGNITUDE (ratio) ANGLE (deg) MAGNITUDE (ratio) s12 ANGLE (deg) s22 MAGNITUDE (ratio) ANGLE (deg) MAGNITUDE (ratio) ANGLE (deg) 100 0.08233 −6.058 5.4700 14.75 0.00049 −92.64 0.32715 −3.589 200 0.08934 1.505 6.8702 17.10 0.00078 −91.63 0.32763 −2.304 400 0.10677 1.621 9.7365 5.277 0.00164 −108.6 0.33688 −1.542 600 0.12257 −2.565 11.586 −12.73 0.00168 −119.4 0.36332 −1.800 800 0.12902 −8.769 12.372 −31.11 0.00233 −113.0 0.39884 −3.931 1000 0.12635 −11.24 12.519 −48.70 0.00363 −129.6 0.44177 −8.067 1200 0.11634 −9.574 12.232 −65.32 0.00551 −140.5 0.47449 −14.54 1400 0.11643 1.8040 11.550 −81.52 0.00659 −151.4 0.48300 −21.47 1600 0.12552 14.913 10.664 −96.69 0.00779 −163.4 0.46932 −28.10 1800 0.15177 23.659 9.6775 −111.1 0.00871 −176.5 0.43106 −34.03 2000 0.18258 27.689 8.5565 −124.5 0.01025 172.8 0.37882 −38.74 2200 0.20634 29.316 7.5480 −136.9 0.01124 160.7 0.31996 −41.11 2400 0.22422 28.365 6.5362 −148.4 0.01078 146.8 0.26441 −40.43 2600 0.22777 26.661 5.6120 −158.5 0.00884 131.1 0.22542 −37.88 2800 0.21931 28.691 4.8007 −167.7 0.00548 123.8 0.18502 −38.37 3000 0.22247 37.201 3.9567 −175.6 0.00384 160.7 0.12693 −37.56 2010 Sep 13 7 NXP Semiconductors Product specification MMIC wideband amplifier BGA2748 PACKAGE OUTLINE Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT363 2010 Sep 13 REFERENCES IEC JEDEC JEITA SC-88 8 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 NXP Semiconductors Product specification MMIC wideband amplifier BGA2748 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Limited warranty and liability ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be 2010 Sep 13 9 NXP Semiconductors Product specification MMIC wideband amplifier BGA2748 Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products ⎯ Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Terms and conditions of commercial sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 2010 Sep 13 10 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for the marking codes and the package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2010 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R77/04/pp11 Date of release: 2010 Sep 13
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