PCA82C250T/YM,118

PCA82C250 CAN controller interface Rev. 06 — 25 August 2011 Product data sheet 1. General description The PCA82C250 is the interface between a CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. 2. Features and benefits           Fully compatible with the “ISO 11898” standard High speed (up to 1 MBd) Bus lines protected against transients in an automotive environment Slope control to reduce Radio Frequency Interference (RFI) Differential receiver with wide common-mode range for high immunity against ElectroMagnetic Interference (EMI) Thermally protected Short-circuit proof to battery and ground Low-current Standby mode An unpowered node does not disturb the bus lines At least 110 nodes can be connected 3. Applications  High-speed automotive applications (up to 1 MBd). 4. Quick reference data Table 1. Quick reference data Symbol Parameter VCC supply voltage ICC supply current 1/tbit maximum transmission speed VCAN Conditions Min Max Unit 4.5 5.5 V Standby mode - 170 A non-return-to-zero 1 - MBd CANH, CANL input/output voltage 8 +18 V Vdiff differential bus voltage 1.5 3.0 V tPD propagation delay - 50 ns Tamb ambient temperature 40 +125 C High-speed mode PCA82C250 NXP Semiconductors CAN controller interface 5. Ordering information Table 2. Ordering information Type number PCA82C250T Package Name Description Version SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 6. Block diagram VCC 3 TXD Rs PROTECTION 1 8 DRIVER SLOPE/ STANDBY HS 7 RXD 4 6 Vref CANH RECEIVER 5 REFERENCE VOLTAGE CANL PCA82C250 2 GND Fig 1. mka669 Block diagram 7. Pinning information 7.1 Pinning TXD 1 8 Rs GND 2 7 CANH PCA82C250 VCC 3 6 CANL RXD 4 5 Vref mka670 Fig 2. PCA89C250 Product data sheet Pin configuration All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 2 of 18 PCA82C250 NXP Semiconductors CAN controller interface 7.2 Pin description Table 3. Pin description Symbol Pin Description TXD 1 transmit data input GND 2 ground VCC 3 supply voltage RXD 4 receive data output Vref 5 reference voltage output CANL 6 LOW-level CAN voltage input/output CANH 7 HIGH-level CAN voltage input/output Rs 8 slope resistor input 8. Functional description The PCA82C250 is the interface between a CAN protocol controller and the physical bus. It is primarily intended for high-speed automotive applications (up to 1 MBd). The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. It is fully compatible with the “ISO 11898” standard. A current limiting circuit protects the transmitter output stage against short-circuit to positive and negative battery voltage. Although the power dissipation is increased during this fault condition, this feature will prevent destruction of the transmitter output stage. If the junction temperature exceeds a value of approximately 160 C, the limiting current of both transmitter outputs is decreased. Because the transmitter is responsible for the major part of the power dissipation, this will result in reduced power dissipation and hence a lower chip temperature. All other parts of the PCA82C250 will remain in operation. The thermal protection is needed, in particular, when a bus line is short-circuited. The CANH and CANL lines are also protected against electrical transients which may occur in an automotive environment. Pin 8 (Rs) allows three different modes of operation to be selected: High-speed, Slope control and Standby. For high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. In this mode, no measures are taken to limit the rise and fall slope. Use of a shielded cable is recommended to avoid RFI problems. The High-speed mode is selected by connecting pin 8 to ground. For lower speeds or shorter bus length, an unshielded twisted pair or a parallel pair of wires can be used for the bus. To reduce RFI, the rise and fall slope should be limited. The rise and fall slope can be programmed with a resistor connected from pin 8 to ground. The slope is proportional to the current output at pin 8. If a HIGH level is applied to pin 8, the circuit enters a low-current Standby mode. In this mode, the transmitter is switched off and the receiver is switched to a low current. If dominant bits are detected (differential bus voltage >0.9 V), RXD will be switched to a PCA89C250 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 3 of 18 PCA82C250 NXP Semiconductors CAN controller interface LOW level. The microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). Because the receiver is slow in Standby mode, the first message will be lost. Table 4. Truth table of the CAN transceiver Supply TXD CANH CANL Bus state RXD 4.5 V to 5.5 V 0 HIGH LOW dominant 0 4.5 V to 5.5 V 1 (or floating) floating floating recessive 1 < 2 V (not powered) X[1] floating floating recessive X[1] 2 V < VCC < 4.5 V >0.75VCC floating floating recessive X[1] 2 V < VCC < 4.5 V X[1] floating if VRs > 0.75VCC floating if recessive VRs > 0.75VCC X[1] [1] X = don’t care. Table 5. Pin Rs summary Condition forced at pin Rs Mode Resulting voltage or current at pin Rs VRs > 0.75VCC Standby IRs < 10 A 10 A < IRs < 200 A Slope control 0.4VCC < VRs < 0.6VCC VRs < 0.3VCC High-speed IRs < 500 A 9. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to pin 2; positive input current. Symbol Parameter PCA89C250 Product data sheet Min Max Unit VCC supply voltage Conditions 0.3 +9.0 V Vn DC voltage at pins 1, 4, 5 and 8 0.3 VCC + 0.3 V V6, 7 DC voltage at pins 6 and 7 0 V < VCC < 5.5 V; no time limit 8.0 +18.0 V Vtrt transient voltage at pins 6 and 7 see Figure 8 150 +100 V Tstg storage temperature 55 +150 C Tamb ambient temperature 40 +125 C Tvj virtual junction temperature [1] 40 +150 C Vesd electrostatic discharge voltage [2] 2000 +2000 V [3] 200 +200 V [1] In accordance with “IEC 60747-1”. An alternative definition of virtual junction temperature is: Tvj = Tamb + Pd  Rth(vj-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb). [2] Classification A: human body model; C = 100 pF; R = 1500 ; V = 2000 V. [3] Classification B: machine model; C = 200 pF; R = 25 ; V = 200 V. All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 4 of 18 PCA82C250 NXP Semiconductors CAN controller interface 10. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air 160 K/W 11. Characteristics Table 8. Characteristics VCC = 4.5 to 5.5 V; Tamb = 40 to +125 C; RL = 60 ; I8 > 10 A; unless otherwise specified; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100 % tested at +25 C. Symbol Parameter Conditions Min Typ Max Unit dominant; V1 = 1 V - - 70 mA recessive; V1 = 4 V; R8 = 47 k - - 14 mA - - 18 mA - 100 170 A Supply I3 supply current recessive; V1 = 4 V; V8 = 1 V Standby; Tamb < 90 C [1] DC bus transmitter VIH HIGH-level input voltage output recessive 0.7VCC - VCC + 0.3 V VIL LOW-level input voltage output dominant 0.3 - 0.3VCC V IIH HIGH-level input current V1 = 4 V 200 - +30 A IIL LOW-level input current V1 = 1 V 100 - 600 A V6,7 recessive bus voltage V1 = 4 V; no load 2.0 - 3.0 V ILO off-state output leakage current 2 V < (V6,V7) < 7 V 2 - +1 mA 5 V < (V6,V7) < 18 V 5 - +12 mA V7 CANH output voltage V1 = 1 V 2.75 - 4.5 V V6 CANL output voltage V1 = 1 V 0.5 - 2.25 V V6, 7 difference between output voltage at pins 6 and 7 V1 = 1 V 1.5 - 3.0 V V1 = 1 V; RL = 45 ; VCC  4.9 V 1.5 - - V V1 = 4 V; no load 500 - +50 mV short-circuit CANH current V7 = 5 V; VCC  5 V - - 105 mA V7 = 5 V; VCC = 5.5 V - - 120 mA V6 = 18 V - - 160 mA Isc7 Isc6 short-circuit CANL current DC bus receiver: V1 = 4 V; pins 6 and 7 externally driven; 2 V < (V6, V7) < 7 V; unless otherwise specified Vdiff(r) Vdiff(d) differential input voltage (recessive) differential input voltage (dominant) 1.0 - +0.5 V 7 V < (V6, V7) < 12 V; not Standby mode 1.0 - +0.4 V 0.9 - 5.0 V 7 V < (V6, V7) < 12 V; not Standby mode 1.0 - 5.0 V Vdiff(hys) differential input hysteresis see Figure 5 - 150 - mV VOH HIGH-level output voltage pin 4; I4 = 100 A 0.8VCC - VCC V PCA89C250 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 5 of 18 PCA82C250 NXP Semiconductors CAN controller interface Table 8. Characteristics …continued VCC = 4.5 to 5.5 V; Tamb = 40 to +125 C; RL = 60 ; I8 > 10 A; unless otherwise specified; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100 % tested at +25 C. Symbol Parameter Conditions Min Typ VOL pin 4; I4 = 1 mA 0 I4 = 10 mA 0 CANH, CANL LOW-level output voltage Ri input resistance Rdiff differential input resistance Ci input capacitance Cdiff differential input capacitance CANH, CANL Max Unit - 0.2VCC V - 1.5 V 5 - 25 k 20 - 100 k - - 20 pF - - 10 pF Reference output reference output voltage Vref V8 = 1 V; 50 A < I5 < 50 A 0.45VCC - 0.55VCC V V8 = 4 V; 5 A < I5 < 5 A 0.4VCC - 0.6VCC V Timing (CL = 100 pF; see Figure 3, Figure 4, Figure 6 and Figure 7) tbit minimum bit time Rext = 0  - - 1 s tonTXD delay TXD to bus active Rext = 0  - - 50 ns toffTXD delay TXD to bus inactive Rext = 0  - 40 80 ns tonRXD delay TXD to receiver active Rext = 0  - 55 120 ns toffRXD delay TXD to receiver inactive Rext = 0 ; VCC < 5.1 V; Tamb < +85 C - 82 150 ns Rext = 0 ; VCC < 5.1 V; Tamb < +125 C - 82 170 ns tonRXD toffRXD delay TXD to receiver active delay TXD to receiver inactive Rext = 0 ; VCC < 5.5 V; Tamb < +85 C - 90 170 ns Rext = 0 ; VCC < 5.5 V; Tamb < +125 C - 90 190 ns Rext = 47 k - 390 520 ns Rext = 24 k - 260 320 ns Rext = 47 k - 260 450 ns Rext = 24 k - 210 320 ns V/s SR differential output voltage slew rate Rext = 47 k - 14 - tWAKE wake-up time from Standby via pin 8 - - 20 s tdRXDL bus dominant to RXD LOW V8 = 4 V; Standby mode - - 3 s - - 0.3VCC V - - Standby/Slope Control (pin 8) V8 input voltage for high-speed I8 input current for high-speed 500 A Vstb input voltage for Standby mode 0.75VCC - - V Islope slope control mode current 10 - 200 A Vslope slope control mode voltage 0.4VCC - 0.6VCC V [1] V8 = 0 V I1 = I4 = I5 = 0 mA; 0 V < V6 < VCC; 0 V < V7 < VCC; V8 = VCC. PCA89C250 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 6 of 18 PCA82C250 NXP Semiconductors CAN controller interface +5 V 100 nF VCC TXD CANH PCA82C250 Vref 60 Ω 100 pF CANL RXD Rs GND 30 pF Rext 015aaa208 Fig 3. Test circuit for dynamic characteristics. VCC VTXD 0V 0.9 V Vdiff 0.5 V 0.7VCC VRXD 0.3VCC tonTXD toffTXD tonRXD Fig 4. toffRXD mka672 Timing diagram for dynamic characteristics. VRXD HIGH LOW hysteresis 0.5 V Fig 5. PCA89C250 Product data sheet 0.9 V Vdiff mka673 Hysteresis. All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 7 of 18 PCA82C250 NXP Semiconductors CAN controller interface VCC VRs 0V VRXD tWAKE mka674 V1 = 1 V. Fig 6. Timing diagram for wake-up from Standby. 1.5 V Vdiff 0V VRXD tdRXDL mka675 V1 = 4 V; V8 = 4 V. Fig 7. Timing diagram for bus dominant to RXD LOW. +5 V VCC 1 nF TXD CANH PCA82C250 RXD SCHAFFNER GENERATOR 60 Ω 1 nF CANL Vref GND Rs Rext 015aaa246 The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b. Fig 8. PCA89C250 Product data sheet Test circuit for automotive transients. All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 8 of 18 PCA82C250 NXP Semiconductors CAN controller interface 12. Application information P8xC592/P8xCE598 CAN-CONTROLLER CTX0 CRX0 CRX1 PX,Y Rext +5 V TXD RXD Rs Vref VCC PCA82C250T 100 nF CAN-TRANSCEIVER GND CANH CANL CAN BUS LINE 124 Ω 124 Ω mka677 Fig 9. Application of the CAN transceiver. SJA1000 CAN-CONTROLLER TX0 TX1 RX0 RX1 6.8 kΩ 3.6 kΩ +5 V 390 Ω VDD 100 nF 390 Ω VSS 6N137 0V 100 nF 390 Ω 6N137 +5 V 390 Ω +5 V TXD RXD Vref Rs +5 V VCC PCA82C250 100 nF CAN-TRANSCEIVER Rext GND CANH CANL 124 Ω CAN BUS LINE 124 Ω mka678 Fig 10. Application with galvanic isolation. PCA89C250 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 9 of 18 PCA82C250 NXP Semiconductors CAN controller interface VCC 3 TXD Rs RXD 1 8 4 7 CANH PCA82C250 Vref 5 6 CANL 2 GND mka679 Fig 11. Internal pin configuration. PCA89C250 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 10 of 18 PCA82C250 NXP Semiconductors CAN controller interface 13. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 12. Package outline SOT96-1 (SO8) PCA89C250 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 11 of 18 PCA82C250 NXP Semiconductors CAN controller interface 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities PCA89C250 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 12 of 18 PCA82C250 NXP Semiconductors CAN controller interface 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 13) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10 Table 9. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 10. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 13. PCA89C250 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 13 of 18 PCA82C250 NXP Semiconductors CAN controller interface temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 13. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCA89C250 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 14 of 18 PCA82C250 NXP Semiconductors CAN controller interface 15. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA82C250_6 20110825 Product data sheet - PCA82C250_5 Modifications: PCA82C250 v.5 • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • Legal texts have been adapted to the new company name where appropriate. DIP8 package discontinued; bare die no longer available. Typing errors corrected in Table 8, Figure 3 and Figure 8. 20000113 Product specification - PCA82C250 v.3 PCA82C250 v.3 19971021 Preliminary specification PCA82C250 v.2 PCA82C250 v.2 19940915 - PCA82C250 v.1 PCA82C250 v.1 19940408 - - PCA89C250 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 15 of 18 PCA82C250 NXP Semiconductors CAN controller interface 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be PCA89C250 Product data sheet suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 16 of 18 PCA82C250 NXP Semiconductors CAN controller interface Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PCA89C250 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 06 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 17 of 18 PCA82C250 NXP Semiconductors CAN controller interface 18. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Soldering of SMD packages . . . . . . . . . . . . . . 12 Introduction to soldering . . . . . . . . . . . . . . . . . 12 Wave and reflow soldering . . . . . . . . . . . . . . . 12 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 August 2011 Document identifier: PCA89C250