PHB78NQ03LT
N-channel TrenchMOS logic level FET
Rev. 05 — 13 June 2005
Product data sheet
1. Product profile
1.1 General description
Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic
package using TrenchMOS technology.
1.2 Features
■ Logic level threshold
■ Fast switching
1.3 Applications
■ Computer motherboards
■ DC-to-DC converters
1.4 Quick reference data
■ VDS ≤ 25 V
■ RDSon ≤ 9 mΩ
■ ID ≤ 40 A
■ QGD = 4 nC (typ)
2. Pinning information
Table 1:
Pinning
Pin
Description
1
gate (G)
2
drain (D)
3
source (S)
mb
mounting base; connected to drain
Simplified outline
Symbol
D
mb
[1]
G
mbb076
2
1
3
SOT404 (D2PAK)
[1]
It is not possible to make a connection to pin 2.
S
PHB78NQ03LT
Philips Semiconductors
N-channel TrenchMOS logic level FET
3. Ordering information
Table 2:
Ordering information
Type number
PHB78NQ03LT
Package
Name
Description
Version
D2PAK
plastic single-ended surface mounted package; 3 leads (one lead cropped) SOT404
4. Limiting values
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
25 °C ≤ Tj ≤ 175 °C
-
25
V
VDGR
drain-gate voltage
25 °C ≤ Tj ≤ 175 °C; RGS = 20 kΩ
-
25
V
VGS
gate-source voltage
-
±20
V
ID
drain current
Tmb = 25 °C; VGS = 5 V
-
40
A
Tmb = 100 °C; VGS = 5 V
-
40
A
Tmb = 25 °C; VGS = 10 V; Figure 2 and 3
-
40
A
Tmb = 100 °C; VGS = 10 V; Figure 2
-
40
A
IDM
peak drain current
Tmb = 25 °C; pulsed; tp ≤ 10 µs; Figure 3
-
160
A
Ptot
total power dissipation
Tmb = 25 °C; Figure 1
-
107
W
Tstg
storage temperature
−55
+175
°C
Tj
junction temperature
−55
+175
°C
-
40
A
-
160
A
-
100
mJ
Source-drain diode
Tmb = 25 °C
IS
source (diode forward) current
ISM
peak source (diode forward) current Tmb = 25 °C; pulsed; tp ≤ 10 µs
Avalanche ruggedness
EDS(AL)S non-repetitive drain-source
avalanche energy
unclamped inductive load; ID = 32 A;
tp = 0.17 ms; VDD ≤ 25 V; RGS = 50 Ω;
VGS = 10 V; starting at Tj = 25 °C
9397 750 15071
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 13 June 2005
2 of 12
PHB78NQ03LT
Philips Semiconductors
N-channel TrenchMOS logic level FET
03aa16
120
003aaa756
120
Ider
(%)
Pder
(%)
80
80
40
40
0
0
0
50
100
150
Tmb (°C)
0
200
P tot
P der = ----------------------- × 100%
P
°
50
100
150
ID
I der = ------------------- × 100%
I
°
tot ( 25 C )
D ( 25 C )
Fig 1. Normalized total power dissipation as a
function of mounting base temperature
Fig 2. Normalized continuous drain current as a
function of mounting base temperature
003aaa757
103
ID
(A)
200
Tmb (°C)
Limit RDSon = VDS / ID
tp = 10 µs
102
100 µ s
DC
10
1 ms
10 ms
1
10-1
1
10
VDS (V)
102
Tmb = 25 °C; IDM is single pulse; VGS = 10 V
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
9397 750 15071
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 13 June 2005
3 of 12
PHB78NQ03LT
Philips Semiconductors
N-channel TrenchMOS logic level FET
5. Thermal characteristics
Table 4:
Thermal characteristics
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-mb)
thermal resistance from junction to mounting base Figure 4
-
-
1.4
K/W
Rth(j-a)
thermal resistance from junction to ambient
-
50
-
K/W
mounted on a printed-circuit
board; minimum footprint;
vertical in still air
003aaa759
10
Zth(j-mb)
(K/W)
1
δ = 0.5
0.2
0.1
10-1
δ=
P
0.05
tp
T
0.02
single pulse
t
tp
10-2
10-5
T
10-4
10-3
10-2
10-1
tp (s)
1
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
9397 750 15071
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 13 June 2005
4 of 12
PHB78NQ03LT
Philips Semiconductors
N-channel TrenchMOS logic level FET
6. Characteristics
Table 5:
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Tj = 25 °C
25
-
-
V
Tj = −55 °C
22
-
-
V
Static characteristics
V(BR)DSS drain-source breakdown voltage
VGS(th)
IDSS
gate-source threshold voltage
drain-source leakage current
ID = 250 µA; VGS = 0 V
ID = 1 mA; VDS = VGS; Figure 9 and 10
Tj = 25 °C
1
1.5
2
V
Tj = 175 °C
0.5
-
-
V
Tj = −55 °C
-
-
2.2
V
VDS = 25 V; VGS = 0 V
Tj = 25 °C
-
-
1
µA
Tj = 175 °C
-
-
500
µA
RG
gate resistance
f = 1 MHz
-
1
-
Ω
IGSS
gate-source leakage current
VGS = ±15 V; VDS = 0 V
-
10
100
nA
RDSon
drain-source on-state resistance
VGS = 5 V; ID = 25 A; Figure 6 and 8
Tj = 25 °C
-
10.5
13.5
mΩ
Tj = 175 °C
-
18.9
24.3
mΩ
VGS = 10 V; ID = 25 A; Figure 6 and 8
-
7.65
9
mΩ
ID = 25 A; VDS = 12 V; VGS = 4.5 V;
Figure 11 and 12
-
11
-
nC
-
3.6
-
nC
Dynamic characteristics
QG(tot)
total gate charge
QGS
gate-source charge
QGS1
pre-VGS(th) gate-source charge
-
1.8
-
nC
QGS2
post-VGS(th) gate-source charge
-
1.8
-
nC
QGD
gate-drain (Miller) charge
-
4
-
nC
VGS(pl)
gate-source plateau voltage
-
3
-
V
QG(tot)
total gate charge
ID = 0 A; VDS = 0 V; VGS = 4.5 V
-
8.6
-
nC
Ciss
input capacitance
970
-
pF
output capacitance
VGS = 0 V; VDS = 12 V; f = 1 MHz;
Figure 14
-
Coss
-
415
-
pF
Crss
reverse transfer capacitance
-
170
-
pF
Ciss
input capacitance
VGS = 0 V; VDS = 0 V; f = 1 MHz
-
1460
-
pF
VDS = 12 V; RL = 0.5 Ω; VGS = 5 V;
RG = 5.6 Ω
-
13
-
ns
-
46
-
ns
td(on)
turn-on delay time
tr
rise time
td(off)
turn-off delay time
-
20
-
ns
tf
fall time
-
15
-
ns
-
0.78
1.2
V
-
35
-
ns
-
20
-
nC
Source-drain diode
VSD
source-drain (diode forward) voltage IS = 25 A; VGS = 0 V; Figure 13
trr
reverse recovery time
Qr
recovered charge
IS = 20 A; dIS/dt = −100 A/µs; VGS = 0 V
9397 750 15071
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 13 June 2005
5 of 12
PHB78NQ03LT
Philips Semiconductors
N-channel TrenchMOS logic level FET
003aaa760
80
10 8
VGS (V) =
ID
(A)
6
003aaa761
30
VGS (V) =
5
4.5
60
3.6
RDSon
(mΩ)
4
20
4
4.5
40
3.6
5
6
8
10
3.2
20
10
2.8
2.4
0
0
0
0.2
0.4
0.6
0.8
VDS (V)
0
1
Tj = 25 °C
20
40
60
ID (A)
80
Tj = 25 °C
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values
Fig 6. Drain-source on-state resistance as a function
of drain current; typical values
003aaa762
80
ID
(A)
03af18
2
a
1.5
60
25 °C
Tj = 175 °C
40
1
20
0.5
0
0
2
4
VGS (V)
6
Tj = 25 °C and 175 °C; VDS > ID × RDSon
0
-60
60
120
Tj (°C)
180
R DSon
a = ---------------------------R DSon ( 25 °C )
Fig 7. Transfer characteristics: drain current as a
function of gate-source voltage; typical values
Fig 8. Normalized drain-source on-state resistance
factor as a function of junction temperature
9397 750 15071
Product data sheet
0
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 13 June 2005
6 of 12
PHB78NQ03LT
Philips Semiconductors
N-channel TrenchMOS logic level FET
03aa33
2.5
VGS(th)
(V)
2
1.5
03aa36
10-1
ID
(A)
max
10-2
typ
10-3
min
max
10-4
min
1
typ
10-5
0.5
0
-60
10-6
0
60
120
Tj (°C)
180
0
1
2
VGS (V)
3
Tj = 25 °C; VDS = 5 V
ID = 1 mA; VDS = VGS
Fig 9. Gate-source threshold voltage as a function of
junction temperature
Fig 10. Sub-threshold drain current as a function of
gate-source voltage
003aaa763
10
ID = 25 A
Tj = 25 °C
VGS
(V)
8
VDS
ID
6
12 V
VDD = 19 V
VGS(pl)
4
VGS(th)
VGS
2
QGS1
QGS2
QGS
0
0
10
20
QG (nC)
30
QGD
QG(tot)
003aaa508
ID = 25 A; VDS = 12 V and 19 V
Fig 11. Gate-source voltage as a function of gate
charge; typical values
Fig 12. Gate charge waveform definitions
9397 750 15071
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 13 June 2005
7 of 12
PHB78NQ03LT
Philips Semiconductors
N-channel TrenchMOS logic level FET
003aaa764
80
003aaa765
104
IS
(A)
C
(pF)
60
103
40
Ciss
20
Coss
Tj = 25 °C
175 °C
0
0
0.4
0.8
VSD (V)
1.2
Tj = 25 °C and 175 °C; VGS = 0 V
102
10-1
1
10
VDS (V)
102
VGS = 0 V; f = 1 MHz
Fig 13. Source (diode forward) current as a function of
source-drain (diode forward) voltage; typical
values
Fig 14. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
9397 750 15071
Product data sheet
Crss
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 13 June 2005
8 of 12
PHB78NQ03LT
Philips Semiconductors
N-channel TrenchMOS logic level FET
7. Package outline
SOT404
Plastic single-ended surface mounted package (D2PAK); 3 leads (one lead cropped)
A
A1
E
mounting
base
D1
D
HD
2
Lp
1
3
c
b
e
e
Q
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
b
c
D
max.
D1
E
e
Lp
HD
Q
mm
4.50
4.10
1.40
1.27
0.85
0.60
0.64
0.46
11
1.60
1.20
10.30
9.70
2.54
2.90
2.10
15.80
14.80
2.60
2.20
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-10-13
05-02-11
SOT404
Fig 15. Package outline SOT404 (D2PAK)
9397 750 15071
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 13 June 2005
9 of 12
PHB78NQ03LT
Philips Semiconductors
N-channel TrenchMOS logic level FET
8. Revision history
Table 6:
Revision history
Document ID
Release
date
PHB78NQ03LT_5
20050613 Product
data sheet
Modifications:
Data sheet Change
status
notice
Doc. number
Supersedes
2004070095 9397 750 15071
PHB_PHD78NQ03LT_4
•
The format of this data sheet has been redesigned to comply with the new
presentation and information standard of Philips Semiconductors.
•
•
•
•
•
•
Removal of PHD78NQ03LT (now in separate data sheet).
•
•
Section 4 “Limiting values” ID, IDM, Ptot, IS, ISM and EDS(AL)S modified.
Section 4 “Limiting values” Figure 2 and 3 modified.
Section 5 “Thermal characteristics” Rth(j-mb) modified.
Section 5 “Thermal characteristics” Figure 4 modified.
Section 6 “Characteristics” RDSon, QG(tot), QGS, QGD, Ciss, Coss, Crss, td(on), tr, td(off), tf,
VSD, trr, Qr condition and/or values changed.
Section 6 “Characteristics” RG, QGS1, QGS2 and VGS(pl) added.
Section 6 “Characteristics” Figure 5, 6, 7, 11, 12, and 13 modified.
PHB_PHD78NQ03LT_4
20040726 Product
data sheet
-
9397 750 13432
PHP_PHB_PHD78NQ03LT_3
PHP_PHB_PHD78NQ03LT_3
20020626 Product
data sheet
-
9397 750 09667
PHP_PHB_PHD78NQ03LT_2
PHP_PHB_PHD78NQ03LT_2
20020322 Product
data sheet
-
9397 750 09418
PHP_PHB_PHD78NQ03LT_1
PHP_PHB_PHD78NQ03LT_1
20011114 Product
data sheet
-
9397 750 08916
-
9397 750 15071
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 13 June 2005
10 of 12
PHB78NQ03LT
Philips Semiconductors
N-channel TrenchMOS logic level FET
9. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
10. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
12. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
TrenchMOS — is a trademark of Koninklijke Philips Electronics N.V.
11. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
13. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 15071
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 13 June 2005
11 of 12
Philips Semiconductors
PHB78NQ03LT
N-channel TrenchMOS logic level FET
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information . . . . . . . . . . . . . . . . . . . . 11
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 13 June 2005
Document number: 9397 750 15071
Published in The Netherlands
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