PTN5100
USB Type-C power delivery PHY and protocol IC
Rev. 1.1 — 25 July 2017
Product data sheet
1. General description
PTN5100 is a single port USB Type-C Power Delivery (PD) PHY and Protocol IC that
provides Type-C Configuration channel interface and USB PD Physical and Protocol layer
functions to a System PD Port Policy Controller (Policy Engine and Device Policy
Manager, Alternate mode controller). It complies with USB PD[1] and Type-C[2]
specifications and delta updates of PD spec. This IC is targeted for a wide range of
platforms (Standard Notebook PCs, Desktop PCs, Chromebooks, Tablets, Convertibles,
Smart phones) and PC Accessories (e.g. Docks, Monitors, Cable adapters etc.)
applications. PTN5100 is architected to deliver robust performance, compliant behavior,
configurability and system implementation flexibility that are essential to tide over
interoperability and compliance hurdles in the platform applications.
PTN5100 can support system realization of the following PD roles: (i) Provider (P) only, (ii)
Provider/Consumer (P/C) (iii) Consumer only (C) (iv) Consumer/Provider (C/P). Further, it
can be register programmed to operate in Type-C specific Upstream Facing Port (UFP),
Downstream Facing Port (DFP) or Dual Role Port (DRP) role.
PTN5100 implements VCONN low RON switch with register programmable Forward
Current protection feature. The VCON switch also provides Reverse current protection
feature to detect reverse current flow into the system whenever (inductive or) charged
cable is unplugged from the connector.
PTN5100 operates from platform power supply VDD, or it can also be powered from USB
power VBUS directly, which is especially required for operation under Dead Battery (DB)
condition and certain platform use cases. The host interface operates on VIO supply to
facilitate interfacing to systems that use IO supply rail different from VDD supply rail.
It provides SPI/I2C interface for system host control/status update. The interface choice is
pre- configured in NXP factory.
PTN5100 is available in a small footprint package option: HVQFN20 4 mm x 4 mm,
0.5 mm pitch.
Remark:
1. The term 'EC' is used interchangeably with 'Embedded Controller', 'AP', 'Application
Processor' or 'System Management Controller, SMC' or System Host Controller
throughout this document.
2. The terms 'PMIC', 'Power Management Interface Controller', 'Charger IC' are used
interchangeably throughout this document.
PTN5100
NXP Semiconductors
USB Type-C power delivery PHY and protocol IC
2. Features and benefits
2.1 USB PD and Type-C Features
Complies with USB PD[1] and USB Type-C[2] specifications.
Supports implementation of various system PD roles: P, P/C, C, C/P
Supports Type-C role configurability
Type-C role (DFP, UFP, DRP) is Non-Volatile Memory (NVM) and register
programmable based on OEM platform requirements
Implements UFP role pull down behavior to handle dead battery condition on
battery powered platforms
Supports register programmable and variable ‘Rp’ indication (for DRP/DFP usage
and accessory detection)
Implements 'Rd' indication on CC pin (for Device side implementation)
CC detection/indication scheme based on Type-C role
Indication of orientation detection via CC_ORIENT pin and status register(s)
Debug and Audio Accessory detection and indication in status register(s)
Cooperatively works under the control of Policy controller MCU for power delivery
negotiation and contract(s), Alternate mode and VDM exchanges
Implements BMC (de)coding, 4B5B symbol (de)coding, CRC generation/checking,
PD packet assembling/disassembling including Preamble, SOP, EOP, Good CRC
response, Retries, Hard and Cable resets
PD PHY and Protocol layer interface control and status update handled via SPI/I2C
interface
SOP* Configurability
Register programmable to generate and receive SOP, SOP', SOP'-debug, SOP",
SOP"-debug'' in DFP/DRP (host use case)
Register programmable to receive and respond on SOP, SOP'-debug and
SOP"-debug commands
Supports low RON VCONN switch with enable/disable (Hi-Z) support
Capable of maximum current delivery of 1 A over 2.7 V to 5.5 V
Supports register programmable Forward current protection control
Supports register programmable Reverse current protection
2.2 System protection features
Back current protection on all pins when PTN5100 is unpowered
CC1 and CC2 pins are 5.5 V tolerant
VBUS pin and VBUS power path MOSFET enable pins are 28 V tolerant
2.3 General
Delivers (active LOW enable) gate control signals for PMOS Power MOSFETs on
VBUS source and sink power paths
Provides dedicated IO pin (CC_ORIENT) for indicating Cable/plug orientation and IO
pin (DBGACC_FOUND) for indicating Debug accessory detection
Delivers up to 30 mA (max) for powering Policy controller MCU
Supports SPI slave interface (SPI modes 1 and 2 supported) up to 30 MHz
PTN5100
Product data sheet
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Rev. 1.1 — 25 July 2017
© NXP Semiconductors N.V. 2017. All rights reserved.
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PTN5100
NXP Semiconductors
USB Type-C power delivery PHY and protocol IC
Supports I2C slave interface standard mode (100 kHz), Fast mode (400 kHz) and Fast
mode plus (1 MHz)
I2C Device slave address programmable up to 3 values
Supports 3.3 V or 1.8 V capable I2C-bus or SPI interface
Supports register access - device configuration, control and status/interrupt
interfacing through Slave I2C-bus interface
Power supplies - VDD (3.3 V 10 %) or VBUS
Tolerant up to 28 V on VBUS and operational up to maximum of 25 V on VBUS
Operating temperature 20 C to 85 C
ESD 8 kV HBM, 1 kV CDM
Package: HVQFN20 4 mm 4 mm, 0.5 mm pitch
3. Applications
PC platforms: Notebook PCs, Desktop PCs, Ultrabooks, Chromebooks
Tablets, 2:1 Convertibles, Smartphones and Portable devices
PC accessories/peripherals: Docking, Mobile Monitors, Multi-Function Monitors,
Portable/External hard drives, Cable adaptors, Dongles and accessories, etc.
4. Ordering information
Table 1.
Ordering information
Type number
Topside
marking
Package
Name
Description
Version
PTN5100BS
5100
HVQFN20
plastic thermal enhanced very thin quad flat package;
no leads; 20 terminals; body 4 4 0.85 mm[2]
SOT917-4
PTN5100ABS
510A
HVQFN20
plastic thermal enhanced very thin quad flat package;
no leads; 20 terminals; body 4 4 0.85 mm[3]
SOT917-4
[1]
Total height after printed-circuit board mounting 2 V
inputs
0.05
VDDIO
-
-
V
VDDIO < 2 V
0.1
VDDIO
-
-
V
LOW-level output voltage at VDDIO > 2 V
3mA sink current
VDDIO < 2 V
0
-
0.4
V
0
-
0.2
VDDIO
V
LOW-level output current
3
-
-
mA
20
-
-
mA
6
-
-
mA
10
-
10
A
VOL
IOL
Conditions
VOL = 0.4 V;
Standard and Fast modes
VOL = 0.4 V;
Fast mode plus
VOL = 0.6 V;
Fast mode
IIL
LOW-level input current
Pin voltage - 0.1VDDIO to 0.9VIO,
max
CI
Capacitance of IO pin
-
-
10
pF
tHD,STA
Hold time (repeated) START Fast mode plus; After this period, the
condition
first clock pulse is generated
0.26
-
-
s
tLOW
LOW period of I2C clock
0.5
-
-
s
tHIGH
HIGH period of I2C clock
Fast mode plus
0.26
-
-
s
tSU;STA
Setup time (repeated)
START condition
Fast mode plus
0.26
-
-
s
tHD;DAT
Data Hold time
Fast mode plus
0
-
-
s
Fast mode plus
tSU;DAT
Data Setup time
Fast mode plus
50
-
-
ns
tr
Rise time of I2C_SCL and
I2C_SDA signals
Fast mode plus
-
-
120
ns
tf
Fall time of I2C_SCL and
I2C_SDA signals
Fast mode plus
-
-
120
ns
tSU;STO
Setup time for STOP
condition
Fast mode plus
0.26
-
-
s
tBUF
Bus free time between
Fast mode plus
STOP and START condition
0.5
-
-
s
PTN5100
Product data sheet
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Rev. 1.1 — 25 July 2017
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PTN5100
NXP Semiconductors
USB Type-C power delivery PHY and protocol IC
Table 12. I2C characteristics …continued
Applicable across operating temperature and power supply ranges as per Section 10 (unless otherwise noted). Typical values
are specified at 27 C (unless otherwise noted).[1]
Symbol
Parameter
Conditions
tVD;DAT
Data valid time
Fast mode plus
0.45
-
-
s
tVD;ACK
Data valid acknowledge
time
Fast mode plus
0.45
-
-
s
tSP
Pulse width of spikes that
must be suppressed by
input filter
-
-
50
ns
[1]
Min
Typ
Max
Unit
VDDIO is I2C bus pull up voltage.
tf
SDA
tr
tSU;DAT
70 %
30 %
70 %
30 %
cont.
tHD;DAT
tf
tVD;DAT
tHIGH
tr
70 %
30 %
SCL
70 %
30 %
70 %
30 %
tHD;STA
70 %
30 %
cont.
tLOW
9th clock
1 / fI2C
S
1st clock cycle
tBUF
tf
SDA
tSU;STA
tHD;STA
tVD;ACK
tSP
tSU;STO
70 %
30 %
SCL
Sr
P
9th clock
S
aaa-020541
Fig 16. I2C timing diagram
PTN5100
Product data sheet
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USB Type-C power delivery PHY and protocol IC
11.6 SPI characteristics
Table 13. SPI interface: AC/DC characteristics
Applicable across operating temperature and power supply ranges as per Section 10 (unless otherwise noted). Typical values
are specified at 27 C (unless otherwise noted).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fSPI
SPI clock frequency
(SPI_CLK)
Applies to both TX and RX
-
-
20
MHz
tSPI;HI
SPI clock HIGH time
20
-
-
ns
tSPI;LO
SPI clock LOW time
20
-
-
ns
tSPI;rise
SPI clock (LOW to HIGH) rise
time
0.1
-
-
V/ns
tSPI;fall
SPI clock (HIGH to LOW) fall
time
0.1
-
-
V/ns
tSPI;CSNS
SPI_CS Not Setup time
Relative to SPI clock pin
0
-
-
ns
tSPI;CSNH
SPI_CS Not Hold time
Relative to SPI clock pin
0
-
-
ns
tSPI;DINS
Data In Setup time
Applies to
5
SPI_MOSI_I2C_SDA; relative
to SPI clock
-
-
ns
tSPI;DINH
Data In Hold time
Applies to
5
SPI_MOSI_I2C_SDA; relative
to SPI clock
-
-
ns
tSPI;DONS
SPI clock edge to Valid Data
Out
Applies to SPI_MISO
-
-
7
ns
tSPI;DONH
SPI clock edge to Data Out
Hold time
Applies to SPI_MISO
0
-
CL;SPI
Maximum IO capacitance
supported
SPI_CLK_I2C_SCL,
SPI_MOSI_I2C_SDA
-
-
10
pF
CIN;SPI
Maximum IO capacitance
SPI_MISO, SPI_CS
-
-
10
pF
VIH;SPI
HIGH-level input voltage
SPI_MISO
0.7
V_MCUPWR
-
-
V
VIL;SPI
LOW-level input voltage
SPI_MISO
-
-
0.3
V
V_MCUPWR
VOL;SPI
LOW-level output voltage
SPI_CLK_I2C_SCL, SPI_CS,
SPI_MOSI_I2C_SDA
-
-
0.5
V
V_MCUPWR
0.5
-
-
V
ns
IOL = 4 mA
VOH;SPI
HIGH-level output voltage
SPI_CLK_I2C_SCL, SPI_CS,
SPI_MOSI_I2C_SDA
IOH = 4 mA
ILIH;EN
HIGH-level input leakage
current
VI = 3.3 V
1
-
1
A
ILIL;EN
LOW-level input leakage
current
VI = GND
1
-
1
A
PTN5100
Product data sheet
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PTN5100
NXP Semiconductors
USB Type-C power delivery PHY and protocol IC
SPI_CS
tSPI;FALL
tSPI;CSNH
tSPI;CSNS
SPI_CLK
tSPI;DINH
tSPI;DINS
MOSI
tSPI;RISE
MSB
LSB
HIGH-Z
HIGH-Z
MISO
aaa-020542
Fig 17. SPI write timing
SPI_CS
tSPI;HI
tSPI;LO
SPI_CLK
tSPI;DONH
MISO
MSB
LSB
tSPI;DONS
MOSI
aaa-020543
Fig 18. SPI read timing
11.7 CONTROL IO characteristics
Table 14. Control I/O characteristics
Applicable across operating temperature and power supply ranges as per Section 10 (unless otherwise noted). Typical values
are specified at 27 C (unless otherwise noted).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
System side CMOS output pins (CC_ORIENT, DBGACC_FOUND)
VOH
HIGH-level Output voltage
IOH = 4 mA
VIO 0.5
-
VOL
LOW-level Output voltage
IOL = 4 mA
-
-
0.5
V
CI
Capacitance of IO pin
-
-
20
pF
ILIH,EN
HIGH-level input leakage
current
VI = 3.3 V
1
-
1
A
ILIL,EN
LOW-level input leakage
current
VI = GND
1
-
1
A
applies to CC_CTRL1
-
-
0.4
V
applies to SLV_ADDR
-
-
0.3
VDD
V
V
System side input pins (CC_CTRL1)
VIL
LOW-level Input voltage
PTN5100
Product data sheet
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PTN5100
NXP Semiconductors
USB Type-C power delivery PHY and protocol IC
Table 14. Control I/O characteristics …continued
Applicable across operating temperature and power supply ranges as per Section 10 (unless otherwise noted). Typical values
are specified at 27 C (unless otherwise noted).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VIH
HIGH-level input voltage
applies to SLV_ADDR
0.7 VDD
-
-
V
CI
Capacitance of IO pin
applies to CC_CTRL1,
SLV_ADDR
-
-
20
pF
ILIH,EN
HIGH-level input leakage
current
VI = 3.3 V
1
-
1
A
ILIL,EN
LOW-level input leakage
current
VI = GND
1
-
1
A
-
-
0.5
V
-
-
20
pF
System side open drain interface pins (INT_N); pulled up to VDDIO
VOL
LOW-level Output voltage
CI
Capacitance of IO pin
PTN5100
Product data sheet
IOL = 4 mA
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PTN5100
NXP Semiconductors
USB Type-C power delivery PHY and protocol IC
Table 14. Control I/O characteristics …continued
Applicable across operating temperature and power supply ranges as per Section 10 (unless otherwise noted). Typical values
are specified at 27 C (unless otherwise noted).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
FET enable pins (EN_USBSRC, EN_USBFET1, EN_USBFET2)
VOL,EN
LOW-level output voltage
IOL = 4 mA
-
-
0.5
V
VIH,EN
HIGH-level input voltage
FET enable pins are in Hi-Z
0.7
V_MCUPWR
25
V
ILIH,EN
HIGH-level input leakage
current
VI = 25 V
1
-
1
A
ILIL,EN
LOW-level input leakage
current
VI = GND
1
-
1
A
[1]
VFET_Bias is the bias voltage on the FET enable pins
PTN5100
Product data sheet
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PTN5100
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USB Type-C power delivery PHY and protocol IC
12. Package outline
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 4 x 4 x 0.85 mm
A
B
D
SOT917-4
terminal 1
index area
A
E
A1
c
detail X
e1
e
6
10
C
C A B
C
v
w
b
y1 C
y
L
11
5
e
Eh
e2
1
15
terminal 1
index area
20
X
16
Dh
0
5 mm
scale
Dimensions
Unit
mm
A
A1
b
max 1.00 0.05 0.30
nom 0.85
0.25
min 0.80
0.20
c
D(1)
Dh
E(1)
Eh
e
e1
e2
L
v
0.2
4.1
4.0
3.9
3.0
2.9
2.8
4.1
4.0
3.9
3.0
2.9
2.8
0.5
2
2
0.35
0.30
0.25
0.1
w
y
0.05 0.08
y1
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
SOT917-4
References
IEC
JEDEC
JEITA
MO-220
---
sot917-4_po
European
projection
Issue date
14-10-27
14-11-07
Fig 19. Package outline SOT917-4 (HVQFN20)
PTN5100
Product data sheet
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Rev. 1.1 — 25 July 2017
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USB Type-C power delivery PHY and protocol IC
13. Packing information
13.1 SOT917-4: HVQFN20; Reel pack, SMD, 13" Q2/T3 standard product
orientation; Orderable part number ending ,128 or HP; Ordering code
(12NC) ending 128
13.1.1 Packing method
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7DSH
5HHODVVHPEO\
%DUFRGHODEHO
(6'HPERVVHG
*XDUGEDQG
(6'ODEHO
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ZDUQLQJ
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'U\SDFN,'VWLFNHU
3ULQWHGSODQRER[
DDD
Fig 20. Reel pack for SMD
PTN5100
Product data sheet
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Rev. 1.1 — 25 July 2017
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USB Type-C power delivery PHY and protocol IC
Table 15.
Dimensions and quantities
Reel dimensions
d w (mm) [1]
SPQ/PQ (pcs)[2]
Reels per box
Outer box dimensions
l w h (mm)
330 12
6000
1
342 338 27
[1]
d = reel diameter; w = tape width.
[2]
Packing quantity dependent on specific product type.
View ordering and availability details at NXP order portal, or contact your local NXP representative.
13.1.2 Product orientation
47 47
EDOO
47 47
DDD
DDD
Tape pocket quadrants
Ball 1 is in quadrant Q2/T3
Fig 21. Product orientation in carrier tape
13.1.3 Carrier tape dimensions
PP
:
.
$
%
3
7
GLUHFWLRQRIIHHG
DDR
Fig 22. Carrier tape dimensions
Table 16. Carrier tape dimensions
In accordance with IEC 60286-3.
PTN5100
Product data sheet
A0 (mm)
B0 (mm)
K0 (mm)
T (mm)
P1 (mm)
W (mm)
4.30 0.10
4.30 0.10
1.10 0.10
0.30 0.05
8.0 0.10
12 0.30
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Rev. 1.1 — 25 July 2017
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PTN5100
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USB Type-C power delivery PHY and protocol IC
13.1.4 Reel dimensions
$
=
:
%
&
'
GHWDLO=
DDR
Fig 23. Schematic view of reel
Table 17. Reel dimensions
In accordance with IEC 60286-3.
PTN5100
Product data sheet
A [nom]
(mm)
W2 [max]
(mm)
B [min]
(mm)
C [min]
(mm)
D [min]
(mm)
330
18.4
1.5
12.8
20.2
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USB Type-C power delivery PHY and protocol IC
13.1.5 Barcode label
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&RXQWU\RIRULJLQ
LH0DGHLQRU
'LIIXVHGLQ(8>@
$VVHPEOHGLQ
3DFNLQJXQLW34LGHQWLILFDWLRQ
QGWUDFHDELOLW\ORWQXPEHU
QG\RXQJHVWGDWHFRGH
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7UDFHDELOLW\ORWQXPEHU
'DWHFRGH
:LWKOLQHDUEDUFRGH
4XDQWLW\
:LWKOLQHDUEDUFRGH
7\SHQXPEHU
1;31&
:LWKOLQHDUEDUFRGH
1;36(0,&21'8&7256
0$'(,1!&28175352'8&7,1)2@
738,'%
7/27
'5('$7(
''$7( 725,*
447 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 25.
PTN5100
Product data sheet
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Rev. 1.1 — 25 July 2017
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PTN5100
NXP Semiconductors
USB Type-C power delivery PHY and protocol IC
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 25. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
PTN5100
Product data sheet
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Rev. 1.1 — 25 July 2017
© NXP Semiconductors N.V. 2017. All rights reserved.
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PTN5100
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USB Type-C power delivery PHY and protocol IC
15. Soldering: PCB footprints
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627
+[
*[
3
'
&
Q63[
63[
+\
63\WRW
63\
*\
Q63\
6/\
%\
$\
63[WRW
;
6/[
%[
$[
5HFRPPHQGHGVWHQFLOWKLFNQHVVPP
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VROGHUODQGSOXVVROGHUSDVWH
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$[
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$\
%[
%\
&
'
6/[
6/\ 63[WRW 63\WRW 63[
63\
*[
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+[
+\
Q63[
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VRWBIU
Fig 26. PCB footprint for SOT917-4 (HVQFN20); reflow soldering
PTN5100
Product data sheet
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Rev. 1.1 — 25 July 2017
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USB Type-C power delivery PHY and protocol IC
16. Abbreviations
Table 21.
Abbreviations
Acronym
Description
AP
Application Processor
ASIC
Application Specific Integrated Circuit
CDM
Charged Device Model, an ESD standard
CPU
Central Processing Unit
DBP
Dead Battery Provisioning
DFP
Downstream Facing Port
DRP
Dual Role Port
EC
Embedded Controller
FCP
Forward Current Protection
FS
USB Full Speed signaling
HBM
Human Body Model, an ESD standard
HS
USB High Speed signaling
LDO
Low Drop-Out regulator
LS
USB Low Speed signaling
MM
Machine Model, an ESD standard
OC
Over-Current condition
OCD
Over-Current Detection
PCH
Platform Controller Hub
PD
Power Delivery specification
PMIC
Power Management IC
POR
Power ON Reset
RCP
Reverse Current Protection
SS
USB3.0 Super Speed Signaling
UFP
Upstream Facing Port
USB
Universal Serial Bus
17. References
PTN5100
Product data sheet
[1]
USB Power Delivery Specification Revision 2.0, version 1.1, May 2015
[2]
USB Type-C Cable and Connector Specification Revision 1, April 2015
[3]
PTN5100 Application Programming guide
[4]
UM10204, "I2C-bus specification and user manual"; NXP Semiconductors, Revision
03 June 19, 2007
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 25 July 2017
© NXP Semiconductors N.V. 2017. All rights reserved.
49 of 53
PTN5100
NXP Semiconductors
USB Type-C power delivery PHY and protocol IC
18. Revision history
Table 22.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PTN5100 v.1.1
20170725
Product data sheet
-
PTN5100 v.1
Modifications:
PTN5100 v.1
PTN5100
Product data sheet
•
Figure 15: Replaced “CBTL04GP043” with “XBAR switch” in Type-C high speed switch
block
20160801
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 25 July 2017
-
© NXP Semiconductors N.V. 2017. All rights reserved.
50 of 53
PTN5100
NXP Semiconductors
USB Type-C power delivery PHY and protocol IC
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PTN5100
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 25 July 2017
© NXP Semiconductors N.V. 2017. All rights reserved.
51 of 53
PTN5100
NXP Semiconductors
USB Type-C power delivery PHY and protocol IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PTN5100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 25 July 2017
© NXP Semiconductors N.V. 2017. All rights reserved.
52 of 53
PTN5100
NXP Semiconductors
USB Type-C power delivery PHY and protocol IC
21. Contents
1
2
2.1
2.2
2.3
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.4
7.5
7.5.1
7.5.1.1
7.5.1.2
7.5.1.3
7.5.2
7.5.3
7.5.4
7.6
8
8.1
8.1.1
8.1.1.1
8.1.2
8.1.2.1
8.1.3
8.1.3.1
8.1.4
8.1.4.1
8.1.5
8.1.5.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
USB PD and Type-C Features . . . . . . . . . . . . . 2
System protection features . . . . . . . . . . . . . . . . 2
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 7
Type-C Configuration Channel functional block 8
USB Power Delivery Function . . . . . . . . . . . . . 9
VCONN Switch . . . . . . . . . . . . . . . . . . . . . . . 10
Forward Current Protection (FCP) . . . . . . . . . 11
Reverse Current Protection (RCP) . . . . . . . . . 11
Power FET control . . . . . . . . . . . . . . . . . . . . . 11
MCU interface and control . . . . . . . . . . . . . . . 12
I2C-bus interface. . . . . . . . . . . . . . . . . . . . . . . 12
I2C writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
I2C reads . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
I2C address auto-incrementing . . . . . . . . . . . 13
SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Register interface . . . . . . . . . . . . . . . . . . . . . . 13
Relevant Interface pins - SLV_ADDR,
SPI_CLK_I2C_SCL, SPI_MOSI_I2C_SDA,
SPI_CS, SPI_MISO, INT_N . . . . . . . . . . . . . . 13
Power supplies . . . . . . . . . . . . . . . . . . . . . . . 13
PTN5100 - Use case view . . . . . . . . . . . . . . . . 14
System use cases . . . . . . . . . . . . . . . . . . . . . 15
USB PD Provider/Consumer Notebook/Ultrabook/Chromebook/Tablet PC . 15
Brief description . . . . . . . . . . . . . . . . . . . . . . . 16
USB PD Provider with Type-C receptacle Desktop PC . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Brief description . . . . . . . . . . . . . . . . . . . . . . . 19
USB PD Consumer/Provider (Smartphone use
case) - Standalone PTN5100 . . . . . . . . . . . . . 21
Application description . . . . . . . . . . . . . . . . . . 22
Type-C cable adapters with PTN5100 . . . . . . 23
Application description . . . . . . . . . . . . . . . . . . 23
USB PD Consumer/Provider with Type-C
receptacle . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Application description . . . . . . . . . . . . . . . . . . 25
8.1.6
8.1.6.1
9
10
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
12
13
13.1
13.1.1
13.1.2
13.1.3
13.1.4
13.1.5
14
14.1
14.2
14.3
14.4
15
16
17
18
19
19.1
19.2
19.3
19.4
20
21
USB PD Consumer with Type-C receptacle
example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Application description . . . . . . . . . . . . . . . . . . 27
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 28
Recommended operating conditions . . . . . . 29
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 30
Device characteristics . . . . . . . . . . . . . . . . . . 30
USB PD and Type-C characteristics . . . . . . . 31
VCONN switch characteristics . . . . . . . . . . . . 32
Power AC/DC characteristics . . . . . . . . . . . . 33
I2C characteristics . . . . . . . . . . . . . . . . . . . . . 34
SPI characteristics . . . . . . . . . . . . . . . . . . . . . 36
CONTROL IO characteristics. . . . . . . . . . . . . 37
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 40
Packing information . . . . . . . . . . . . . . . . . . . . 41
SOT917-4: HVQFN20; Reel pack, SMD, 13"
Q2/T3 standard product orientation; Orderable
part number ending ,128 or HP; Ordering code
(12NC) ending 128. . . . . . . . . . . . . . . . . . . . . 41
Packing method . . . . . . . . . . . . . . . . . . . . . . . 41
Product orientation . . . . . . . . . . . . . . . . . . . . . 42
Carrier tape dimensions . . . . . . . . . . . . . . . . . 42
Reel dimensions . . . . . . . . . . . . . . . . . . . . . . 43
Barcode label . . . . . . . . . . . . . . . . . . . . . . . . . 44
Soldering of SMD packages . . . . . . . . . . . . . . 45
Introduction to soldering. . . . . . . . . . . . . . . . . 45
Wave and reflow soldering. . . . . . . . . . . . . . . 45
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 45
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 46
Soldering: PCB footprints . . . . . . . . . . . . . . . 48
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 49
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Revision history . . . . . . . . . . . . . . . . . . . . . . . 50
Legal information . . . . . . . . . . . . . . . . . . . . . . 51
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 51
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Contact information . . . . . . . . . . . . . . . . . . . . 52
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2017.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 25 July 2017
Document identifier: PTN5100