TFA9843AJ/N1,112

TFA9843AJ 20 W stereo power amplifier with volume control Rev. 01 — 28 April 2006 Preliminary data sheet 1. General description The TFA9843AJ contains two identical audio power amplifiers. The TFA9843AJ can be used as two Single-Ended (SE) channels with a volume control. The maximum gain is 26 dB. The TFA9843AJ comes in a 9-pin DIL-bent-SIL (DBS9P) power package. The TFA9843AJ is pin compatible with the TFA9842AJ, TFA9843(B)J, TFA9842(B)J and TFA9841J. The difference between the TFA9843AJ and the TFA9843(B)J, TFA9842(B)J, TFA9841J is the functionality of pin 7. The TFA9843AJ has a volume control on pin 7 (VC). The TFA9843(B)J, TFA9842(B)J and TFA9841J have a mode select on pin 7 (MODE). The TFA9843AJ contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. This gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. Almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (number of channels used, external heatsink and ambient temperature) allow it. 2. Features n n n n n n n n n n n 2 channel SE: 1 W to 20 W operation possibility Soft clipping Input clamps Volume control Standby and Mute mode No on or off switching plops Low standby current High supply voltage ripple rejection Outputs short-circuit protected to ground, supply and across the load Thermally protected Pin compatible with the TFA9842AJ, TFA9843(B)J, TFA9842(B)J, TFA9841J 3. Applications n n n n n CRT TV and LCD TV Monitors PC speakers Boom box Mini and micro audio receivers TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 4. Quick reference data Table 1. Quick reference data VCC = 18 V; Tamb = 25 °C; RL = 4 Ω; VI(VC) = VCC; Vi = 0 V; measured in test circuit of Figure 11; unless otherwise specified. Symbol Parameter Conditions [1] Min Typ Max Unit VCC supply voltage operating 9 18 28 V Iq quiescent current VCC = 18 V; RL = ∞ - 60 100 mA ICC(stb) standby supply current VCC = 18 V; VI(VC) < 0.8 V - - 150 µA Po output power THD = 10 %; RL = 4 Ω; VCC = 18 V 7 8.5 - W THD = 10 %; RL = 4 Ω; VCC = 22 V - 14 - W THD total harmonic distortion Po = 1 W - 0.1 0.5 % Gv(max) maximum voltage gain VI(VC) > 5.0V 25 26 27 dB ∆Gv voltage gain range 1.5 V < VI(VC) < 5.0 V - 80 - dB - 60 - dB SVRR supply voltage ripple rejection f = 1 kHz [2] [1] A minimum load of 3 Ω is allowed at supply voltages > 22 V. [2] Supply voltage ripple rejection is measured at the output, with a source impedance ZS = 0 Ω at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. 5. Ordering information Table 2. Ordering information Type number Package Name Description Version TFA9843AJ DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523 -1 TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 2 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 6. Block diagram VCC 9 IN1 4 8 OUT1 60 kΩ IN2 1 2 OUT2 60 kΩ CIV 3 VREF SHORT-CIRCUIT AND TEMPERATURE PROTECTION VCC VC 7 VOLUME CONTROL 0.5VCC 6 SVR TFA9843AJ 5 001aae428 GND Fig 1. Block diagram 7. Pinning information 7.1 Pinning IN2 1 OUT2 2 CIV 3 IN1 4 GND 5 SVR 6 VC 7 OUT1 8 VCC 9 TFA9843AJ 001aae429 Fig 2. Pin configuration TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 3 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 7.2 Pin description Table 3. Pin description Symbol Pin Description IN2 1 input 2 OUT2 2 loudspeaker terminal 2 CIV 3 common input voltage decoupling IN1 4 input 1 GND 5 ground SVR 6 half supply voltage decoupling (ripple rejection) VC 7 volume control input (standby, mute and volume control) OUT1 8 loudspeaker terminal 1 VCC 9 supply voltage 8. Functional description 8.1 Input configuration The input cut-off frequency is as follows: 1 f i ( –3dB ) = ----------------------------2π ( R i × C i ) (1) Single-ended application: Ri = 60 kΩ and Ci = 220 nF: 1 f i ( –3dB ) = ----------------------------------------------------------------- = 12 Hz 3 –9 2π ( 60 × 10 × 220 × 10 ) (2) As shown in Equation 2, large capacitor values for the inputs are not necessary; therefore switch-on delay during charging of the input capacitors can be minimized. This results in a good low frequency response and good switch-on behavior. The TFA9843AJ has clamps on the inputs. In Standby mode the voltage on the input pins is clamped for voltages lower than −0.1 V. When the TFA9843AJ is in Mute, Volume control or Operating mode (maximum gain) the input clamp voltage is 1 V (RMS). 8.2 Power amplifier The power amplifier is a single-ended amplifier with an all NPN output stage, capable of delivering a peak output current of 4 A. 8.2.1 Output power measurement The output power as a function of the supply voltage is measured on the output pins at THD = 10 %; see Figure 7. The maximum output power is limited by the supply voltage of 26 V and the maximum available output current is 4 A repetitive peak current. A minimum load of 3 Ω is required for supply voltages > 22 V; see Figure 4. The output power is measured with one channel driven. TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 4 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 8.2.2 Headroom Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion. At VCC = 18 V and Po = 6.5 W (SE with RL = 4 Ω) at THD < 0.5 % (see Figure 5), the Average Listening Level (ALL) music power without any distortion yields: 6.5 P o ( ALL, SE ) = ------------- = 410 mW 15.85 (3) The power dissipation can be derived from Figure 8 (SE) for 0 dB respectively 12 dB headroom; see Table 4. For the average listening level a power dissipation of 4.2 W can be used for a heatsink calculation. Table 4. Power rating as function of headroom Headroom Power output (THD < 0.5 %) (SE) Power dissipation (P); both channels driven 0 dB Po = 6.5 W 8.2 W 12 dB Po(ALL) = 410 mW 4.2 W 8.3 Mode selection The TFA9843AJ has four functional modes, which can be selected by applying the proper DC voltage to pin VC; see Table 5. Table 5. Mode selection VI(VC) Status Definition 0 V to 0.8 V Standby 1.2 V to 1.5 V Mute 1.5 V to 5.0 V Volume control 5.0 V to VCC On (maximum gain) in this mode the current consumption is very low and the outputs are floating; the device is in Standby mode when VI(VC) < 0.8 V in this mode the amplifier is DC-biased but not operational (no audio output); this allows the input coupling capacitors to be charged to avoid plop noise; the device is in Mute mode when 1.2 V < VI(VC) < 1.5 V in this mode the volume of the amplifier can be controlled; the gain can be adjusted between the range of 1.5 V < VI(VC) < 5.0 V in this mode the amplifier has its maximum gain; the Operating mode is activated at VI(VC) > 5.0 V 8.4 Supply voltage ripple rejection The supply voltage ripple rejection (SVRR) is measured with an electrolytic capacitor of 150 µF connected to pin SVR with a bandwidth of 20 Hz to 22 kHz. The SVRR as a function of the frequency is illustrated in Figure 10. A larger capacitor value on pin SVR improves the ripple rejection behavior at the lower frequencies. TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 5 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 8.5 Built-in protection circuits The TFA9843AJ contains two types of temperature sensors; one measures the local temperatures of the power stages and one measures the global chip temperature. At a local temperature of the power stage of approximately 185 °C or a global temperature of approximately 150 °C this detection circuit switches off the power stages for 2 ms. When the outputs are switched off the voltage is measured on the outputs. In the event of a short-circuit to ground or to VCC the device will remain in Protection mode. In all other cases the power stages switch-on automatically and the detection will take place again; however a too high temperature will switch-off the power stages immediately. This can result in repetitive switching during too high junction temperature. This protects the TFA9843AJ against short-circuits to ground, to the supply voltage, across the load and too high chip temperatures. The protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still flow through the short-circuit (as much as the power stage can handle without exceeding the critical temperature level). 9. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage operating −0.3 +28 V VI input voltage −0.3 VCC + 0.3 V IORM repetitive peak output current - 4 A Tstg storage temperature non-operating −55 +150 °C Tamb ambient temperature operating −40 +85 °C Ptot total power dissipation - 35 W VCC(scp) short-circuit protection supply voltage - 26 V 10. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Value Unit Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W Rth(j-c) thermal resistance from junction to case both channels driven 2.0 K/W TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 6 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 11. Static characteristics Table 8. Static characteristics VCC = 18 V; Tamb = 25 °C; RL = 4 Ω; VI(VC) = VCC; Vi = 0 V; measured in test circuit of Figure 11; unless otherwise specified. Symbol Parameter Conditions Min [1] Typ Max Unit VCC supply voltage operating 9 18 28 V Iq quiescent current RL = ∞ - 60 100 mA ICC(stb) standby supply current VCC = 18 V; VI(VC) < 0.8 V - - 150 µA VO output voltage VI(VC) input voltage on pin VC On mode (maximum gain) II(VC) [2] - 9 - V 5.0 - VCC V Volume control mode 1.5 - 5.0 V Mute mode 1.2 - 1.5 V Standby mode 0 - 0.8 V - - 20 µA input current on pin VC 0 V < VI(VC) < VCC [1] A minimum load of 3 Ω is allowed at supply voltages > 22 V. [2] The DC output voltage with respect to ground is approximately 0.5VCC. 12. Dynamic characteristics Table 9. Dynamic characteristics SE VCC = 18 V; Tamb = 25 °C; RL = 4 Ω; f = 1 kHz; VI(VC) = VCC; measured in test circuit of Figure 11; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Po output power THD = 10 %; RL = 4 Ω 7 8.5 - W THD = 0.5 %; RL = 4 Ω - 6.5 - W VCC = 22 V; THD = 10 %; RL = 4 Ω - 14 - W THD total harmonic distortion Po = 1 W - 0.1 0.5 % Gv(max) maximum voltage gain VI(VC) > 5.0 V 25 26 27 dB 80 - dB - V - kΩ ∆Gv voltage gain range 1.5 V < VI(VC) < 5.0 V - Vi input voltage gain = 0 dB; THD < 1 % 1.0 Zi input impedance Vn(o) noise output voltage SVRR supply voltage ripple rejection Vo(mute) mute output voltage αcs channel separation |∆Gv(max)| maximum voltage gain difference 40 60 [1] - 150 - µV fripple = 1 kHz [2] - 60 - dB fripple = 100 Hz to 20 kHz [2] - 60 - dB [3] - - 150 µV 50 60 - dB - - 1 dB ZS = 0 Ω TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 7 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control [1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance ZS = 0 Ω at the input. [2] Supply voltage ripple rejection is measured at the output, with a source impedance ZS = 0 Ω at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. [3] Output voltage in Mute mode (VI(VC) = 1.35 V) and an input voltage of 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, including noise. 001aae340 50 GV (dB) mce485 60 Po (W) 0 40 −50 2Ω 3Ω 20 −100 4Ω RL = 1 Ω 8Ω −150 0 0 2.0 4.0 8 6.0 12 16 20 VCC = 18 V 28 24 VCC (V) VI(VC) (V) THD = 10 % Fig 3. Voltage gain as a function of volume control voltage mce488 102 THD + N (%) Fig 4. Output power (one channel) as a function of supply voltage for various loads 001aaa446 10 THD+N (%) 10 1 1 10−1 10−1 10−2 10−1 1 10 Po (W) 102 VCC = 18 V; f = 1 kHz; RL = 4 Ω 10−2 10 103 104 f (Hz) 105 VCC = 18 V; Po = 1 W; RL = 4 Ω Fig 5. Total harmonic distortion-plus-noise as a function of output power Fig 6. Total harmonic distortion-plus-noise as a function of frequency TFA9843AJ_1 Preliminary data sheet 102 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 8 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control mce491 50 mce507 10 Ptot (W) Po (W) 40 8 30 6 20 4 10 2 0 8 12 16 20 24 28 VCC (V) THD = 10 %; RL = 4 Ω; f = 1 kHz 0 0 8 4 12 16 Po (W) 20 VCC = 18 V; RL = 4 Ω Fig 7. Output power as a function of supply voltage mce495 0 αcs (dB) Fig 8. Total power dissipation as a function of channel output power per channel (worst case, both channels driven) mce497 0 SVRR (dB) −20 −20 −40 −40 −60 −60 −80 −100 10 102 103 104 105 −80 10 f (Hz) VCC = 18 V; RL = 4 Ω 103 104 f (Hz) 105 VCC = 18 V; ZS = 0 Ω; Vripple = 300 mV (RMS); a bandpass filter of 20 Hz to 22 kHz has been applied; inputs short-circuited. Fig 9. Channel separation as a function of frequency (no bandpass filter applied) Fig 10. Supply voltage ripple rejection as a function of frequency TFA9843AJ_1 Preliminary data sheet 102 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 9 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 13. Application information 13.1 Application diagrams 13.1.1 Single-ended application VCC VCC 1000 µF 100 nF 9 220 nF IN1 4 Vi 8 OUT1 1000 µF 60 kΩ + − 220 nF IN2 1 Vi RL 4Ω 2 OUT2 1000 µF 60 kΩ CIV 3 VREF − + − SHORT-CIRCUIT AND TEMPERATURE PROTECTION RL 4Ω VCC VC 7 VOLUME CONTROL MICROCONTROLLER 22 µF 0.5VCC TFA9843AJ 6 SVR 10 µF 150 µF 5 GND 001aae430 Fig 11. SE application diagram Remark: By switching inductive loads, the output voltage can rise beyond the maximum supply voltage of 28 V. At high supply voltage it is recommended to use (Schottky) diodes between the supply voltage and ground. TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 10 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 13.1.2 Volume control drive options VCC R1 10 kΩ T1 D1 5.6 V 5V R2 1 kΩ GND R3 1 kΩ R4 VC 1 kΩ T3 PWM 3.3 V C1 10 µF R5 T2 1 kΩ 001aae337 Fig 12. Volume control drive circuit with 3.3 V PWM R4 PWM 5V VC 1 kΩ C1 10 µF 001aae338 Fig 13. Volume control drive circuit with 5 V PWM VCC R1 10 kΩ T1 D1 10 V R5 VC 16 kΩ R6 16 kΩ C1 10 µF 001aae339 Fig 14. Volume control drive circuit with potentiometer TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 11 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 13.2 Printed-circuit board 13.2.1 Layout and grounding To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large output signal currents from interfering with the small AC input signals. The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power. AUDIO POWER CS NIJMEGEN PF / 3002 .naJ 72 TVA TFA9843J 1000 µF 1 BTL1/2 100 nF −SE1+ 1000 µF 1000 µF 220 nF SVR 150 µF SVR −SE2+ 220 nF CIV 22 µF MODE SGND +VP 10 kΩ 10 kΩ CIV IN2+ IN1+ SB ON MUTE mce506 Fig 15. Printed-circuit board layout (single-sided); components view 13.2.2 Power supply decoupling Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor location should be as close as possible to the device and connected to the power ground. Proper power supply decoupling also prevents unwanted oscillations. For suppressing higher frequency transients (spikes) on the supply rail a capacitor with low ESR (typical 100 nF) has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor (e.g. 1000 µF or greater) must be placed close to the device. The bypass capacitor connected to pin SVR reduces the noise and ripple on the mid rail voltage. For good THD and noise performance, a low ESR capacitor is recommended. TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 12 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 13.3 Thermal behavior and heatsink calculation The measured maximum thermal resistance of the IC package, Rth(j-mb), is 2.0 K/W. A calculation for the heatsink can be made, with the following parameters: Tamb(max) = 60 °C (example) VCC = 18 V and RL = 4 Ω (SE) Tj(max) = 150 °C (specification) Rth(tot) is the total thermal resistance between the junction and the ambient including the heatsink. This can be calculated using the maximum temperature increase divided by the power dissipation: Rth(tot) = (Tj(max) − Tamb(max))/P At VCC = 18 V and RL = 4 Ω (2 × SE) the measured worst case sine wave dissipation is 8.4 W; see Figure 8. For Tj(max) = 150 °C the temperature raise, caused by the power dissipation, is: 150 − 60 = 90 °C: P × Rth(tot) = 90 °C Rth(tot) = 90/8.4 K/W = 10.7 K/W Rth(h-a) = Rth(tot) − Rth(j-mb) = 10.7 K/W − 2.0 K/W = 8.7 K/W This calculation is for an application at worst case (stereo) sine wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine wave power dissipation; see Section 8.2.2. This allows the use of a smaller heatsink: P × Rth(tot) = 90 °C Rth(tot) = 90/4.2 K/W = 21.4 K/W Rth(h-a) = Rth(tot) − Rth(j-mb) = 21.4 K/W − 2.0 K/W = 19.4 K/W TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 13 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control mce504 150 (1) (2) (3) (4) Tj (˚C) 100 (5) 50 0 8 12 16 20 24 28 VCC (V) (1) RL = 2 Ω (2) RL = 4 Ω (3) RL = 6 Ω (4) RL = 8 Ω (5) RL = 16 Ω 2 × SE loads; Tamb = 25 °C; external heatsink of 10 K/W; music signals. Fig 16. Junction temperature as a function of supply voltage 14. Test information 14.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 14 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 15. Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 9 e1 Z e Q w M bp 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT A2(2) bp mm c D(1) D1(2) Dh E(1) Eh 2.7 0.80 0.58 13.2 2.3 0.65 0.48 12.8 10 mm v M c e2 m e e1 e2 6.2 14.7 3.5 2.54 1.27 5.08 3.5 5.8 14.3 L k 3 2 L1 L2 L3 m 12.4 11.4 6.7 11.0 10.0 5.5 4.5 3.7 2.8 P Q q q1 q2 3.4 1.15 17.5 4.85 3.8 3.1 0.85 16.3 3.6 v w x 0.8 0.3 0.02 Z(1) 1.65 1.10 Notes 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. Plastic surface within circle area D1 may protrude 0.04 mm maximum. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 00-07-03 03-03-12 SOT523-1 Fig 17. Package outline SOT523-1 (DBS9P) TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 15 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 16. Soldering 16.1 Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 16.2 Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 16.3 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 °C and 400 °C, contact may be up to 5 seconds. 16.4 Package related soldering information Table 10. Suitability of through-hole mount IC packages for dipping and wave soldering methods Package Soldering method Dipping Wave CPGA, HCPGA - suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable[1] PMFP[2] - not suitable [1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] For PMFP packages hot bar soldering or manual soldering is suitable. TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 16 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 17. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes TFA9843AJ_1 20060428 Preliminary data sheet - - TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 17 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 18.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com TFA9843AJ_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 28 April 2006 18 of 19 TFA9843AJ Philips Semiconductors 20 W stereo power amplifier with volume control 20. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.2 8.3 8.4 8.5 9 10 11 12 13 13.1 13.1.1 13.1.2 13.2 13.2.1 13.2.2 13.3 14 14.1 15 16 16.1 16.2 16.3 16.4 17 18 18.1 18.2 18.3 18.4 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Input configuration . . . . . . . . . . . . . . . . . . . . . . 4 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 4 Output power measurement . . . . . . . . . . . . . . . 4 Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5 Supply voltage ripple rejection . . . . . . . . . . . . . 5 Built-in protection circuits . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . 10 Application diagrams . . . . . . . . . . . . . . . . . . . 10 Single-ended application . . . . . . . . . . . . . . . . 10 Volume control drive options. . . . . . . . . . . . . . 11 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 12 Layout and grounding . . . . . . . . . . . . . . . . . . . 12 Power supply decoupling . . . . . . . . . . . . . . . . 12 Thermal behavior and heatsink calculation . . 13 Test information . . . . . . . . . . . . . . . . . . . . . . . . 14 Quality information . . . . . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Soldering by dipping or by solder wave . . . . . 16 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16 Package related soldering information . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 19 20 Contact information . . . . . . . . . . . . . . . . . . . . 18 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Koninklijke Philips Electronics N.V. 2006. All rights reserved. For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 28 April 2006 Document identifier: TFA9843AJ_1