UBA2024

UBA2024 Half-bridge power IC for CFL lamps Rev. 03 — 16 October 2008 Product data sheet 1. General description The UBA2024P is a high-voltage monolithic integrated circuit. The Integrated Circuit (IC) is designed for driving Compact Fluorescent Lamps (CFL) in a half-bridge configuration. The IC features a soft start function, an adjustable internal oscillator and an internal drive function with a high-voltage level shifter for driving the half-bridge. To guarantee an accurate 50 % duty cycle, the oscillator signal is passed through a divider before being fed to the output drivers. 2. Features I I I I I I I Integrated half-bridge power transistors Integrated bootstrap diode Integrated low-voltage supply Adjustable oscillator frequency Maximum voltage of 550 V Minimum glow time control Soft start 3. Applications I Driver for any kind of load in a half-bridge configuration I Especially for electronically self-ballasted CFL for lamp currents up to 220 mA (RMS) under the restriction that the maximum junction temperature is not exceeded 4. Ordering information Table 1. Ordering information Package Name UBA2024P DIP8 Description plastic dual in-line package; 8 leads (300 mil) Version SOT97-1 Type number NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 5. Block diagram 6 UBA2024 VDD CONTROL VDD SW 7 HS 1 SWEEP AND GLOW TIME CONTROL VDD(stop) HIGH VOLTAGE LEVEL SHIFTER HIGH SIDE DRIVER 5 RC 8 OSCILLATOR DIVIDE-BY-2 DEAD TIME LOW SIDE DRIVER SGND 2 4 mdb029 HV 3 FS OUT LS PGND Fig 1. Block diagram 6. Pinning information 6.1 Pinning SW SGND FS PGND 1 2 8 7 RC VDD HV OUT UBA2024P 3 4 014aaa657 6 5 Fig 2. Pin configuration DIP8 package 6.2 Pin description Table 2. Symbol SW SGND FS PGND OUT HV VDD RC Pin description Pin 1 2 3 4 5 6 7 8 Description sweep timing input signal ground high-side floating supply output power ground half-bridge output high-voltage supply internal low-voltage supply output internal oscillator input UBA2024_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 16 October 2008 2 of 12 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 7. Functional description 7.1 Supply voltage The UBA2024 is powered by a supply voltage applied to pin HV. The IC generates its own low supply voltage for the internal circuitry. Therefore an additional external low-voltage supply is not required. 7.2 Start-up state With an increase of the supply voltage on pin HV, the IC enters the start-up state. In the start-up state the high-side power transistor is not conducting and the low-side power transistor is switched on. The internal circuit is reset and the capacitors on the bootstrap pin FS and low-voltage supply pin VDD are charged. Pins RC and SW are switched to ground. The start-up state is defined until VDD = VDD(start). 7.3 Sweep mode The IC enters the sweep mode at the moment the voltage on pin VDD > VDD(start). The capacitor on pin SW is charged by Isweep and the half-bridge circuit starts oscillating. The circuit enters the start-up state again when the voltage on pin VDD < VDD(stop). 7.4 Reset A DC reset circuit is incorporated in the high-side driver. The high-side transistor is switched off when the voltage on pin FS is below the high-side lockout voltage VFS(lock). 7.5 Oscillation The oscillation is based upon the 555-timer function. With the external resistor ROSC and capacitor COSC (see Figure 3) a self oscillating circuit is made, where ROSC and COSC determine the oscillating frequency. To realize an accurate 50 % duty cycle, an internal divider is used. Due to the presence of the divider, the bridge frequency is half the oscillator frequency. The output voltage of the bridge will change at the falling edge of the signal on pin RC. The design equation for the half-bridge frequency is: 1 f osc = ----------------------------------------k x R OSC x C OSC An overview of the oscillator signal, internal LS and HS drive signals and the output is given in Figure 3. UBA2024_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 16 October 2008 3 of 12 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps VRC 0 time HS drive 0 time LS drive 0 VOUT half bridge 0 time time 014aaa658 Fig 3. Oscillator, drivers and output signals When entering the sweep mode, the oscillator starts at 2.5 times the nominal bridge frequency and sweeps down to the nominal bridge frequency fnom; see Figure 4. During this continuously decreasing of the frequency, the circuit approaches the resonance frequency of the load. This causes a high voltage across the load, which ignites the lamp. The sweep time tsweep is determined by the charge current Ich(sw) and the external capacitor CSW. The sweep to resonance time should be much larger than the settling time of the supply voltage on pin HV to guarantee that the full high-voltage is present at the moment of ignition. The amplitude of the RC oscillator is equal to the minimum value of VRC(h) and VSW + 0.4 × VRC(h). During the sweep time a current is flowing through the lamp electrodes for preheating the filaments. UBA2024_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 16 October 2008 4 of 12 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps VHV 0 VDD VDD (start) time time VSW VDD 0.8 VRC(h) 0 fosc 2.5nom time nom 0 Vlamp Vign VgloA Vnom 0 tsweep 014aaa659 time minimum glow time control time Fig 4. Start-up frequency behavior 7.6 Glow time control The drawback of cold-started CFL lamps is its inherent glow time which reduces the switching lifetime of the electrodes (lamp). To make this glow phase as short as possible, the maximum power is given to the lamp during the glow time via a special control; see Figure 4. 7.7 Non-overlap time The non-overlap time is defined as the time that both MOSFETs are not conducting. The non-overlap time is internally fixed. UBA2024_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 16 October 2008 5 of 12 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VHV Parameter Conditions mains transients during 0.5 s VFS VDD IDD floating supply voltage low-voltage output supply voltage low-voltage output supply current power ground voltage internal oscillator input voltage on pin RC sweep time input voltage on pin SW slew rate output on pin OUT junction temperature ambient temperature storage temperature electrostatic discharge voltage human body model: pins HV and VDD pins SW, RC, FS, and OUT machine model: pin FS pins HV, VDD, SW, RC, and OUT [1] [2] [2] [1] Min VHV Max 373 550 VHV + 14 14 5 Unit V V V V mA high-voltage supply voltage normal operation DC supply peak value is internally limited; Tamb = 25 °C referenced to SGND Ii(RC) < 1 mA Ii(SW) < 1 mA repetitive 0 0 VPGND VI(RC) VI(SW) SR Tj Tamb Tstg Vesd −1 0 0 −4 −40 −40 −55 +1 VDD VDD +4 +150 +150 +150 V V V V/ns °C °C °C - 1000 2500 V V - 200 250 V V In accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1.5 kΩ series resistor and a 0.75 µH inductor. UBA2024_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 16 October 2008 6 of 12 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 9. Thermal characteristics Table 4. Symbol Rth(j-a) Rth(j-c) [1] Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to case Conditions in free air in free air [1] Typ Unit 95 K/W 16 K/W [1] In accordance with IEC 60747-1 10. Characteristics Table 5. Characteristics Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol VHV VFS VDD Parameter high-voltage supply voltage floating supply voltage low-voltage output supply voltage Conditions t < 0.5 s; IHV < 30 mA t < 0.5 s; IHV < 30 mA VHV = 100 V; ROSC = ∞; VSW = VDD; VRC = 0 V VHV = 100 V; ROSC = ∞; VSW = VDD; VRC = 0 V Min 0 0 11.7 Typ 12.5 Max 550 564 13.3 Unit V V V High-voltage supply Low-voltage supply Start-up state IHV high-voltage supply current 0.39 mA VDD(start) VDD(stop) VDD(hys) RHS(on) RLS(on) VHS(d) VLS(d) IHS(sat) start of oscillation voltage stop of oscillation voltage start-stop hysteresis voltage HS transistor on-resistance LS transistor on-resistance HS body diode forward voltage LS body diode forward voltage HS transistor saturation current VHV = 310 V; Id = 100 mA Id = 100 mA If = 200 mA If = 200 mA Vds = 30 V; Tj ≤ 125 °C; VHV = 310 V Vds = 30 V; Tj ≤ 125 °C RMS value If = 1 mA 10 8 2 1.4 1.2 900 11 8.5 2.5 9.7 8.5 1.8 1.6 - 12 9 3 11 9.4 2.2 2.0 - V V V Ω Ω V V mA Output stage ILS(sat) IO(max) Vboot tno VFS(lock) IFS LS transistor saturation current maximum output current bootstrap diode drop voltage non-overlap time floating supply lockout voltage floating supply current 900 0.7 1 3.6 1.0 1.35 4.2 14 220 1.3 1.7 4.8 18 mA mA V µs V µA VHV = 310 V; VFS = 12.2 V 10 UBA2024_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 16 October 2008 7 of 12 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps Table 5. Characteristics …continued Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol fosc fosc(nom) Parameter Conditions Min 40.05 Typ 41.32 Max 60 42.68 Unit kHz kHz Internal oscillator frequency range bridge oscillator VSW = VDD nominal frequency bridge oscillator bridge oscillator frequency variation with temperature high-level trip point factor high-level trip point voltage on pin RC low-level trip point factor low-level trip point voltage on pin VRC(l) = kl × VDD RC oscillator constant ROSC = 100 kΩ; COSC = 220 pF VSW = 0 V CSW = 33 nF; VDD = 12.2 V VRC(h) = kh × VDD ROSC = 100 kΩ; COSC = 220 pF; VSW = VDD ROSC = 100 kΩ; COSC = 220 pF; ∆T = −20 to +150 °C ∆fosc(nom) - 2 - % kh VRC(h) kl VRC(low) Kosc 0.382 4.58 0.030 0.367 1.065 0.395 4.94 0.033 0.413 1.1 0.408 5.29 0.036 0.458 1.35 V V V Sweep function Ich(sw) tsweep charge current for sweep sweep time 215 0.28 280 0.35 345 0.45 nA s 11. Application information 1.8 mH LFILT RFUS D1 D2 CBUF 4.7 uF D3 D4 CHB1 47 nF CLA 1.5 nF CHB2 47 nF 3.1 mH LLA max. 550 V 11 W/150 mA CFS 10 nF HV FS 6 3 1 7 SW VDD ROSC 110 K AC mains supply (230 V) 33 Ω OUT CDV 100 pF 5 8 RC COSC 180 pF CVDD 10 nF CSW 33 nF UBA2024P 4 2 SGND PGND mdb033 Fig 5. Schematic of standard compact fluorescent lamp application using UBA2024P UBA2024_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 16 October 2008 8 of 12 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 12. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 D seating plane ME A2 A L A1 c Z e b1 wM (e 1) b2 5 MH b 8 pin 1 index E 1 4 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 JEITA SC-504-8 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 6. UBA2024_3 Package outline SOT97-1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 16 October 2008 9 of 12 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 13. Revision history Table 6. Revision history Release date 20081016 Data sheet status Product data sheet Change notice Supersedes UBA2024_2 Document ID UBA2024_3 Modifications: • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Product data sheet Product data sheet UBA2024_1 - UBA2024_2 UBA2024_1 040203 030813 UBA2024_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 16 October 2008 10 of 12 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 14. Legal information 14.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 14.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com UBA2024_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 16 October 2008 11 of 12 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 16. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 3 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 3 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Sweep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Glow time control . . . . . . . . . . . . . . . . . . . . . . . 5 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 October 2008 Document identifier: UBA2024_3