UBA2024AT

UBA2024 Half-bridge power IC for CFL lamps Rev. 04 — 17 September 2009 Product data sheet 1. General description The UBA2024 is a high-voltage monolithic Integrated Circuit (IC). The IC is designed for driving Compact Fluorescent Lamps (CFL) in a half-bridge configuration. The IC features a soft start function, an adjustable internal oscillator and an internal drive function with a high-voltage level shifter for driving the half-bridge. To guarantee an accurate 50 % duty cycle, the oscillator signal is passed through a divider before being fed to the output drivers. 2. Features I Integrated half-bridge power transistors N UBA2024P: 9 Ω N UBA2024AP: 6 Ω N UBA2024T: 9 Ω N UBA2024AT: 6.4 Ω I Integrated bootstrap diode I Integrated low-voltage supply I Adjustable oscillator frequency I 550 V maximum voltage I Minimum glow time control I Soft start 3. Applications I Driver for any kind of half-bridge configured load up to 23 W, provided that the maximum junction temperature is not exceeded. I Designed for electronically self-ballasted CFL lamps NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 4. Ordering information Table 1. Ordering information Package Name UBA2024P UBA2024AP UBA2024T UBA2024AT DIP8 DIP8 SO14 SO14 Description plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 14 leads; body width 3.9 mm plastic small outline package; 14 leads; body width 3.9 mm Version SOT97-1 SOT97-1 SOT108-1 SOT108-1 Type number 5. Block diagram (6) 4 UBA2024T (UBA2024P) VDD CONTROL VDD SW 6 (7) HS 8 (1) SWEEP AND GLOW TIME CONTROL VDD(stop) HIGH VOLTAGE LEVEL SHIFTER HIGH SIDE DRIVER (5) 14 RC 7 (8) OSCILLATOR DIVIDE-BY-2 DEAD TIME LOW SIDE DRIVER SGND 1,2,3,5,9,10,13 (2) (4) 12 mdb029 HV (3) 11 FS OUT LS PGND Fig 1. Block diagram 6. Pinning information 6.1 Pinning SGND SGND 1 2 3 4 5 6 7 014aaa804 14 OUT 13 SGND 12 PGND UBA2024P UBA2024AP SW SGND FS PGND 1 2 3 4 014aaa657 SGND 8 7 6 5 RC VDD HV OUT HV SGND VDD RC UBA2024T 11 FS UBA2024AT 10 SGND 9 8 SGND SW Fig 2. UBA2024_4 Pinning diagram SOT97-1 Fig 3. Pinning diagram SOT108-1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 2 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 6.2 Pin description Table 2. Symbol SW SGND FS PGND OUT HV VDD RC Pin description Pin SOT97-1 1 2 3 4 5 6 7 8 Pin SOT108-1 8 1, 2, 3, 5, 9, 10, 13 11 12 14 4 6 7 Description sweep timing input signal ground high-side floating supply output power ground half-bridge output high-voltage supply internal low-voltage supply output internal oscillator input 7. Functional description 7.1 Supply voltage The UBA2024 does not require an external low-voltage supply as the mains supply voltage applied to pin HV powers it. The IC derives its own low supply voltage from this for its internal circuitry. 7.2 Start-up state With an increase of the supply voltage on pin HV, the IC enters the start-up state. In the start-up state the high-side power transistor is not conducting and the low-side power transistor is switched on. The internal circuit is reset and the capacitors on the bootstrap pin FS and low-voltage supply pin VDD are charged. Pins RC and SW are switched to ground. The start-up state is defined until VDD = VDD(startup). 7.3 Sweep mode The IC enters the sweep mode when the voltage on pin VDD > VDD(startup). The capacitor on pin SW is charged by ISW and the half-bridge circuit starts oscillating. The circuit enters the start-up state again when the voltage on pin VDD < VDD(stop). The sweep time (tsweep) is determined by the charge current (Ich(sw)) and the external capacitor (CSW). Typical the total sweep time set by CSW is: t sweep = C SW ( nF ) × 10.3ms During the sweep time the current flowing through the lamp electrodes performs some preheating of the filaments. See Figure 5. (1) 7.4 Reset A DC reset circuit is incorporated in the high-side driver. The high-side transistor is switched off when the voltage on pin FS is below the high-side lockout voltage Vfloat(UVLO). UBA2024_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 3 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 7.5 Oscillation The oscillation is based upon the 555-timer function. A self oscillating circuit is made with the external resistor ROSC and the capacitor COSC (see Figure 4). To realize an accurate 50 % duty cycle, an internal divider is used. This reduces the bridge frequency to half the oscillator frequency. The output voltage of the bridge will change at the falling edge of the signal on pin RC. The design equation for the half-bridge frequency is: 1 f osc = ----------------------------------------k x R OSC x C OSC An overview of the oscillator signal, internal LS and HS drive signals and the output is given in Figure 4. VRC 0 time HS drive 0 time LS drive 0 VOUT half bridge 0 time time 014aaa658 Fig 4. Oscillator, drivers and output signals When entering the sweep mode (VSW = 0 V), the bridge oscillator starts at 2.5 times the nominal bridge frequency and sweeps down to the nominal frequency (bridge), set by ROSC and COSC. During the sweep mode the amplitude of the RC oscillator on pin RC, will swing between Vtrip(osc)low and VSW + 0.4Vtrip(osc)high. The amplitude of the RC oscillator will continue to increase until VSW + 0.4Vtrip(osc)high = Vtrip(osc)high, this determines the end of the sweep time. The voltage on pin SW however will continue to rise until it reaches supply voltage level. During this continuous decrease in frequency, the circuit approaches the resonance frequency of the load, and this causes a high voltage across the load, which ignites the lamp. The sweep to resonance time should be much larger than the settling time of the supply voltage on pin HV, to guarantee that the full high-voltage is present at the moment of ignition. See Figure 5. UBA2024_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 4 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps VHV 0 VDD VDD(startup) time time VSW VDD 0.6 Vtrip(osc)high 0 fosc 2.5nom time nom 0 Vlamp Vign VgloA Vnom 0 tsweep 014aaa659 time minimum glow time control time Fig 5. Start-up frequency behavior 7.6 Glow time control The inherent glow time of cold-started CFL lamps reduces the switching lifetime of the electrodes. To make this glow phase as short as possible, the maximum power is given to the lamp during the glow time via a special control. See Figure 5. 7.7 Non-overlap time The non-overlap time is defined as the time when both MOSFETs are not conducting. The non-overlap time is fixed internally. 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VHV Parameter voltage on pin HV Conditions normal operation mains transients during 0.5 s VFS UBA2024_4 Min VHV Max 373 550 VHV + 14 Unit V V V voltage on pin FS © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 5 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps Table 3. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDD IDD Parameter supply voltage supply current Conditions low voltage; DC supply low voltage; peak value is internally limited; Tamb = 25 °C referenced to SGND IRC < 1 mA ISW < 1 mA pin OUT; repetitive [1] Min 0 0 Max 14 5 Unit V mA VPGND VRC VSW SR Tj Tamb Tstg VESD voltage on pin PGND voltage on pin RC voltage on pin SW slew rate junction temperature ambient temperature storage temperature electrostatic discharge voltage −1 0 0 −4 −40 −40 −55 +1 VDD VDD +4 +150 +150 +150 V V V V/ns °C °C °C human body model: pins HV and VDD pins SW, RC, FS, and OUT machine model: pin FS pins HV, VDD, SW, RC, and OUT [2] [3] 1000 2500 V V - 200 250 V V [1] [2] [3] The maximum junction temperature must not be exceeded. In accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1.5 kΩ series resistor and a 0.75 µH inductor. UBA2024_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 6 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 9. Thermal characteristics Table 4. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air SO14 package DIP8 package Rth(j-c) thermal resistance from junction to case in free air SO14 package DIP8 package [1] In accordance with IEC 60747-1 [1] [1] Typ 95 95 8 16 Unit K/W K/W K/W K/W 10. Characteristics Table 5. Characteristics Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol VHV VFS Parameter voltage on pin HV voltage on pin FS Conditions mains transients during 0.5 s; IHV < 30 mA mains transients during 0.5 s; IHV < 30 mA VHV = 100 V; ROSC = ∞; VSW = VDD; VRC = 0 V VHV = 100 V; ROSC = ∞; VSW = VDD; VRC = 0 V Min 0 0 Typ Max 550 564 Unit V V High-voltage supply Low-voltage supply VDD supply voltage 11.7 12.5 13.3 V Start-up state IHV VDD(startup) VDD(stop) VDD(hys) Ron current on pin HV start-up supply voltage stop supply voltage hysteresis of supply voltage on-state resistance 10 8 2 HS transistor; VHV = 310 V; ID = 100 mA UBA2024P UBA2024AP UBA2024T UBA2024AT LS transistor; ID = 100 mA UBA2024P UBA2024AP UBA2024T UBA2024AT 8.5 5.7 8.5 6.2 9.4 6.3 9.4 6.9 Ω Ω Ω Ω 9.7 6.5 9.7 7.0 11 7.4 11 8.0 Ω Ω Ω Ω 11 8.5 2.5 0.39 12 9 3 mA V V V Output stage UBA2024_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 7 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps Table 5. Characteristics …continued Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol VF Parameter forward voltage Conditions HS; IF = 200 mA LS; IF = 200 mA bootstrap diode; IF = 1 mA IDsat drain saturation current UBA2024P UBA2024AP UBA2024T UBA2024AT LS; VDS = 30 V; Tj ≤ 125 °C UBA2024P UBA2024AP UBA2024T UBA2024AT tno Vfloat(UVLO) IFS non-overlap time undervoltage lockout floating voltage current on pin FS VHV = 310 V; VFS = 12.2 V VSW = 0 V VSW = VDD operating; nominal; ROSC = 100 kΩ; COSC = 220 pF; VSW = VDD ∆fosc/fosc relative oscillator frequency variation high-level trip point factor high oscillator trip voltage low-level trip point factor low oscillator trip voltage oscillator constant Vtrip(osc)low = kL × VDD ROSC = 100 kΩ; COSC = 220 pF VSW = 0 V CSW = 33 nF; VDD = 12.2 V Vtrip(osc)high = kH × VDD ROSC = 100 kΩ; COSC = 220 pF; −20 °C ≤ Tj ≤ +150 °C 900 1350 900 1200 1 3.6 10 1.35 4.2 14 1.7 4.8 18 mA mA mA mA µs V µA Min 0.7 Typ 1.0 Max 2.2 2.0 1.3 Unit V V V HS; VDS = 30 V; Tj ≤ 125 °C; VHV = 310 V 900 1350 900 1200 mA mA mA mA Internal oscillator fosc oscillator frequency 40.05 150 41.32 60 42.68 kHz kHz kHz - 2 - % kH Vtrip(osc)high kL Vtrip(osc)low Kosc 0.382 4.58 0.030 0.367 1.065 0.395 4.94 0.033 0.413 1.1 0.408 5.29 0.036 0.458 1.35 V V V Sweep function Ich(sweep) tsweep sweep charge current sweep time 215 0.28 280 0.35 345 0.45 nA s UBA2024_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 8 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 11. Application information 1.8 mH LFILT RFUS D1 D2 CBUF 4.7 uF D3 D4 CHB1 47 nF CLA 1.5 nF CHB2 47 nF 3.1 mH LLA max. 550 V 11 W/150 mA CFS 10 nF HV FS SW VDD ROSC 110 K AC mains supply (230 V) 33 Ω OUT CDV 100 pF UBA2024 RC COSC 180 pF CVDD 10 nF CSW 33 nF PGND SGND mdb033 Fig 6. Schematic of standard compact fluorescent lamp application using UBA2024 UBA2024_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 9 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 12. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 D seating plane ME A2 A L A1 c Z e b1 wM (e 1) b2 5 MH b 8 pin 1 index E 1 4 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 JEITA SC-504-8 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 7. UBA2024_4 Package outline SOT97-1 (DIP8) © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 10 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE vMA Z 14 8 Q A2 pin 1 index θ Lp 1 e bp 7 wM L detail X A1 (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3 θ 0.010 0.057 inches 0.069 0.004 0.049 0.019 0.0100 0.35 0.014 0.0075 0.34 0.244 0.039 0.041 0.228 0.016 0.028 0.004 0.012 8 o 0 o Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 8. UBA2024_4 Package outline SOT108-1 (SO14) © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 11 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 13. Revision history Table 6. Revision history Release date 20090917 Data sheet status Product data sheet Change notice Supersedes UBA2024_3 Document ID UBA2024_4 Modifications: • • • UBA2024AP, UBA2024AT, and UBA2024T added to Table 1 “Ordering information”. SOT108-1 added as Figure 8. Additional information in Section 7.3 and Section 7.5. Product data sheet Product data sheet Product data sheet UBA2024_2 UBA2024_1 - UBA2024_3 UBA2024_2 UBA2024_1 081016 040203 030813 UBA2024_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 12 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 14. Legal information 14.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 14.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com UBA2024_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 17 September 2009 13 of 14 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 16. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 3 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Sweep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Glow time control . . . . . . . . . . . . . . . . . . . . . . . 5 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 September 2009 Document identifier: UBA2024_4