CM1624-08DE

EMI Filter for T-Flash / MicroSD Interfaces CM1624 Description The CM1624 is a combination EMI filter and line termination device with integrated TVS diodes for use on Multimedia Card interfaces. This state−of−the−art device utilizes solid−state, silicon− avalanche technology for superior clamping performance and DC electrical characteristics. The CM1624 has been optimized for protection of T−Flash/MicroSD interfaces in cellular phones and other portable electronics. The CM1624 consists of six circuits that includes series impedance matching resistors and pull−up resistors as required by the SD specification. TVS diodes are included on each line for ESD protection. An additional TVS diode connection is included for protection of the voltage (Vcc) bus. Termination resistor value of 40 W is provided on the SDData0, SDData1, SDData2, SDData3, CMD, and CLK lines. Pull−up resistors of 25 kW are included on the SDData0, SDData1, SDData2, SDData3 and CMD lines, as well. These may be configured for devices operating in SD or SPI mode. The TVS diodes provide effective suppression of ESD voltages in excess of ±15 kV (contact discharge) per IEC 61000−4−2, level 4. The CM1624 is in a 16−pin, RoHS/WEEE compliant, UDFN 16−pin package. It measures 3.30 x 1.35 x 0.50 mm. The leads are spaced at a pitch of 0.4 mm and are finished with lead−free NiPd. www.onsemi.com 16 1 UDFN16 DE SUFFIX CASE 517BE MARKING DIAGRAM 1624 MG G 1 1624 = Specific Device Code M = Single Character Date Code G = Pb−Free Package (Note: Microdot may be in either location) PINOUT DIAGRAM Features • Bidirectional EMI/RFI Filtering and Line Termination with • SDData1 Data1 SDData0 Data0 SDCLK ESD1 ESD3 GND PAD • • • • • • Integrated ESD Protection Provides ESD Protection to IEC61000−4−2: ±15 kV Contact Discharge TVS Working Voltage: 5 V Termination Resistors: 40 W Pull−up Resistors: 25 kW Typical Capacitance per Line: 12 pF (VIN = 2.5 V) Protection and Termination for Six Lines + Vcc Solid−state Technology CLK ESD1 VCC SDCMD CMD SDData3 Data3 SDData2 Data2 (Top View) Applications • T−Flash / MicroSD Interfaces • MMC Interfaces • CDMA, GSM, 3G Cell Phones ORDERING INFORMATION Mechanical Characteristics • • • • • 0.40 mm, uDFN 16−pin Package Nominal Dimensions: 3.30 x 1.35 x 0.50 mm Pitch: 0.4 mm Pin−lead Finish: NiPd RoHS/WEEE Compliance, Lead−free Finish © Semiconductor Components Industries, LLC, 2013 November, 2020 − Rev. 4 Device Package Shipping† CM1624−08DE UDFN16 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 Publication Order Number: CM1624/D CM1624 ELECTRICAL SCHEMATIC Table 1. PIN DESCRIPTIONS Pin Name Description 1 SDData1 Data line #1 input/output with pull−up resistor 2 SDData0 Data line #0 input/output with pull−up resistor 3 SDCLK Clock line Input/Output 4 ESD1 Single ESD 5 ESD3 Single ESD 6 SDCMD Command Line Input/Output 7 SDData3 Data line #3 input/output with pull−up resistor 8 SDData2 Data line #2 input/output with pull−up resistor 9 Data2 Data line #2 input/output with pull−up resistor 10 Data3 Data line #3 input/output with pull−up resistor 11 CMD Command Line Input/Output 12 VCC Power Supply ESD Protection 13 ESD1 Single ESD 14 CLK Clock line Input/Output 15 Data0 Data line #0 input/output with pull−up resistor 16 Data1 Data line #1 input/output with pull−up resistor GND PAD GND Ground return to shield www.onsemi.com 2 CM1624 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units Operating Temperature Range −40 to +85 °C Storage Temperature Range −55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter RCH Channel Resistance (R1 to R6) LCH Channel Inductance C Conditions Min Typ Max Units 34 40 46 W 20 Capacitance per Channel VIN = 0 V; 1 MHz; 30 mVRMS (Note 2) 16 VIN = 2.5 V; 1 MHz; 30 mVRMS (Note 2) RUP Pull−up Resistance (R7 to R11) ILEAK Diode Leakage Current per Channel VIN = 3 V VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA VESD fC 20 nH 24 12 21 pF pF 25 29 kW 0.1 0.5 mA 6.8 −0.8 9.0 −0.4 V ESD Protection − Peak Discharge Voltage at any channel input, in system: a) Contact discharge per IEC 61000−4−2 Standard and b) Air discharge per IEC 61000−4−2 Standard 5.6 −1.5 kV (Note 2) ±15 (Note 2) ±15 Cut−off frequency ZSOURCE = 50 W, ZLOAD = 50 W 300 MHz Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. All parameters specified at TA = 25°C unless otherwise noted. 2. This parameter is guaranteed by design and verified by device characterization www.onsemi.com 3 CM1624 PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 1. Insertion Loss vs. Frequency (Pins 1 and 16) Figure 2. Insertion Loss vs. Frequency (Pins 2 and 15) www.onsemi.com 4 CM1624 PERFORMANCE INFORMATION (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 3. Insertion Loss vs. Frequency (Pins 3 and 14) Figure 4. Insertion Loss vs. Frequency (Pins 6 and 11) www.onsemi.com 5 CM1624 PERFORMANCE INFORMATION (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 5. Insertion Loss vs. Frequency (Pins 7 and 10) Figure 6. Insertion Loss vs. Frequency (Pins 8 and 9) www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN16, 3.3x1.35, 0.4P CASE 517BE−01 ISSUE O 16 DATE 18 NOV 2009 1 SCALE 4:1 A B D 2X 0.10 C PIN ONE REFERENCE 2X 0.10 C L1 ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW EXPOSED Cu A DETAIL B 0.05 C (A3) 16X A1 0.05 C NOTE 4 16X A1 SIDE VIEW SEATING PLANE C 8 1 ÇÇ ÇÇ ÉÉ MOLD CMPD DETAIL B OPTIONAL CONSTRUCTION DETAIL A D2 L L L A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 3.30 BSC 2.70 2.90 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 GENERIC MARKING DIAGRAM* E2 XX MG G K 16 9 e 16X 1 b XX = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) 0.10 C A B BOTTOM VIEW 0.05 C NOTE 3 RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE 3.00 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 16X 0.40 1.55 0.50 16X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON47062E UDFN16, 3.3X1.35, 0.4P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative