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CS8190ENF16

CS8190ENF16

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    DIP16_300MIL

  • 描述:

    IC DRIVER 16DIP

  • 数据手册
  • 价格&库存
CS8190ENF16 数据手册
CS8190 Precision Air-Core Tach/Speedo Driver with Return to Zero The CS8190 is specifically designed for use with air−core meter movements. The IC provides all the functions necessary for an analog tachometer or speedometer. The CS8190 takes a speed sensor input and generates sine and cosine related output signals to differentially drive an air−core meter. Many enhancements have been added over industry standard tachometer drivers such as the CS289 or LM1819. The output utilizes differential drivers which eliminates the need for a zener reference and offers more torque. The device withstands 60 V transients which decreases the protection circuitry required. The device is also more precise than existing devices allowing for fewer trims and for use in a speedometer. 20 16 1 1 PDIP−16 NF SUFFIX CASE 648 SO−20W DWF SUFFIX CASE 751D PIN CONNECTIONS AND MARKING DIAGRAM Features Direct Sensor Input High Output Torque Low Pointer Flutter High Input Impedance Overvoltage Protection Return to Zero Internally Fused Leads in PDIP−16 and SO−20W Packages These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant PDIP−16 1 CP+ SQOUT FREQIN GND GND COS+ COS− VCC 16 CS8190ENF16 AWLYYWWG • • • • • • • • www.onsemi.com CP− F/VOUT VREG GND GND SINE+ SINE− BIAS SO−20W 1 A WL YY WW G 20 CS−8190 AWLYYWWG CP+ SQOUT FREQIN GND GND GND GND COS+ COS− VCC CP− F/VOUT VREG GND GND GND GND SIN+ SIN− BIAS = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. © Semiconductor Components Industries, LLC, 2012 September, 2017 − Rev. 8 1 Publication Order Number: CS8190/D CS8190 BIAS Charge Pump CP+ F/VOUT + - CP− SQOUT Input Comp. VREG + - FREQIN Voltage Regulator GND GND VREG 7.0 V GND GND SINE+ COS+ COS Output + + Func. Gen. + - + - SINE Output SINE− COS− High Voltage Protection VCC Figure 1. Block Diagram ABSOLUTE MAXIMUM RATINGS Rating Value Unit 60 24 V V Operating Temperature −40 to +105 °C Storage Temperature −40 to +165 °C Junction Temperature −40 to +150 °C 4.0 kV 260 peak 230 peak °C °C Supply Voltage, VCC < 100 ms Pulse Transient Continuous ESD (Human Body Model) Lead Temperature Soldering: Wave Solder (through hole styles only) (Note 1) Reflow: (SMD styles only) (Note 2) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. 10 seconds maximum. 2. 60 second maximum above 183°C. www.onsemi.com 2 CS8190 ELECTRICAL CHARACTERISTICS (−40°C ≤ TA ≤ 85°C, 8.5 V ≤ VCC ≤ 15 V, unless otherwise specified.) Characteristic Test Conditions Min Typ Max Unit − 50 125 mA − 8.5 13.1 16 V Positive Input Threshold − 1.0 2.0 3.0 V Input Hysteresis − 200 500 − mV − −10 −80 mA 0 − 20 kHz −1.0 − VCC V SUPPLY VOLTAGE SECTION ICC Supply Current VCC = 16 V, −40°C, No Load VCC Normal Operation Range INPUT COMPARATOR SECTION Input Bias Current (Note 3) 0 V ≤ VIN ≤ 8.0 V Input Frequency Range − Input Voltage Range in series with 1.0 kW Output VSAT (SQOUT) ICC = 10 mA − 0.15 0.40 V Output Leakage (SQOUT) VCC = 7.0 V − − 10 mA Low VCC Disable Threshold − 7.0 8.0 8.5 V Logic 0 Input Voltage − 1.0 − − V Output Voltage − 6.25 7.00 7.50 V Output Load Current − − − 10 mA VOLTAGE REGULATOR SECTION Output Load Regulation 0 to 10 mA − 10 50 mV Output Line Regulation 8.5 V ≤ VCC ≤ 16 V − 20 150 mV Power Supply Rejection VCC = 13.1 V, 1.0 VP/P 1.0 kHz 34 46 − dB CHARGE PUMP SECTION Inverting Input Voltage − 1.5 2.0 2.5 V Input Bias Current − − 40 150 nA VBIAS Input Voltage − 1.5 2.0 2.5 V − 0.7 1.1 V −0.10 0.28 +0.70 % Non Invert. Input Voltage IIN = 1.0 mA Linearity (Note 4) @ 0, 87.5, 175, 262.5, + 350 Hz F/VOUT Gain @ 350 Hz, CCP = 0.0033 mF, RT = 243 kW 7.0 10 13 mV/Hz Norton Gain, Positive IIN = 15 mA 0.9 1.0 1.1 I/I Norton Gain, Negative IIN = 15 mA 0.9 1.0 1.1 I/I FUNCTION GENERATOR SECTION: −40C  TA  85C, VCC = 13.1 V unless otherwise noted Return to Zero Threshold TA = 25°C 5.2 6.0 7.0 V Differential Drive Voltage, (VCOS+ − VCOS−) 8.5 V ≤ VCC ≤ 16 V, q = 0° 5.5 6.5 7.5 V Differential Drive Voltage, (VSIN+ − VSIN−) 8.5 V ≤ VCC ≤ 16 V, q = 90° 5.5 6.5 7.5 V Differential Drive Voltage, (VCOS+ − VCOS−) 8.5 V ≤ VCC ≤ 16 V, q = 180° −7.5 −6.5 −5.5 V Differential Drive Voltage, (VSIN+ − VSIN−) 8.5 V ≤ VCC ≤ 16 V, q = 270° −7.5 −6.5 −5.5 V Differential Drive Current 8.5 V ≤ VCC ≤ 16 V − 33 42 mA −1.5 0 1.5 deg Zero Hertz Output Angle − 3. Input is clamped by an internal 12 V Zener. 4. Applies to % of full scale (270°). www.onsemi.com 3 CS8190 ELECTRICAL CHARACTERISTICS (−40°C ≤ TA ≤ 85°C, 8.5 V ≤ VCC ≤ 15 V, unless otherwise specified.) Characteristic Test Conditions Min Typ Max Unit FUNCTION GENERATOR SECTION: −40C  TA  85C, VCC = 13.1 V unless otherwise noted (continued) Function Generator Error (Note 5) Reference Figures 2, 3, 4, 5 VCC = 13.1 V q = 0° to 305° −2.0 0 +2.0 deg Function Generator Error 13.1 V ≤ VCC ≤ 16 V −2.5 0 +2.5 deg Function Generator Error 13.1 V ≤ VCC ≤ 11 V −1.0 0 +1.0 deg Function Generator Error 13.1 V ≤ VCC ≤ 9.0 V −3.0 0 +3.0 deg Function Generator Error 25°C ≤ TA ≤ 80°C −3.0 0 +3.0 deg Function Generator Error 25°C ≤ TA ≤ 105°C −5.5 0 +5.5 deg Function Generator Error −40°C ≤ TA ≤ 25°C −3.0 0 +3.0 deg Function Generator Gain TA = 25°C, q vs F/VOUT 60 77 95 °/V 5. Deviation from nominal per Table 1 after calibration at 0° and 270°. PIN FUNCTION DESCRIPTION PACKAGE PIN # PDIP−16 SO−20W PIN SYMBOL 1 1 CP+ 2 2 SQOUT Buffered square wave output signal. 3 3 FREQIN Speed or RPM input signal. 4, 5, 12, 13 4−7, 14−17 GND Ground Connections. 6 8 COS+ Positive cosine output signal. 7 9 COS− Negative cosine output signal. 8 10 VCC Ignition or battery supply voltage. 9 11 BIAS Test point or zero adjustment. 10 12 SIN− Negative sine output signal. 11 13 SIN+ Positive sine output signal. 14 18 VREG Voltage regulator output. 15 19 F/VOUT 16 20 CP− FUNCTION Positive input to charge pump. Output voltage proportional to input signal frequency. Negative input to charge pump. www.onsemi.com 4 CS8190 TYPICAL PERFORMANCE CHARACTERISTICS FńVOUT + 2.0 V ) 2.0 6 5 4 3 2 1 0 −1 −2 −3 −4 −5 −6 −7 FREQ CCP RT (VREG * 0.7 V) 7 6 COS F/V Output (V) Output Voltage (V) 7 5 4 3 2 1 SIN 0 45 90 135 180 225 Degrees of Deflection (°) 270 0 315 0 Figure 2. Function Generator Output Voltage vs. Degrees of Deflection 135 180 225 270 Frequency/Output Angle (°) Angle −7.0 V 7.0 V Deviation (°) q 1.00 0.75 0.50 0.25 0.00 −0.25 −0.50 (VCOS+) − (VCOS−) −0.75 −1.00 −1.25 −7.0 V −1.50 0 Figure 4. Output Angle in Polar Form 45 90 225 135 180 Theoretical Angle (°) 270 Figure 5. Nominal Output Deviation 45 Ideal Angle (Degrees) 40 35 30 25 20 Ideal Degrees 15 Nominal Degrees 10 5 0 1 5 9 13 315 1.50 1.25 7.0 V SIN ) * VSIN * ƫ ƪVVCOS ) * VCOS * 90 Figure 3. Charge Pump Output Voltage vs. Output Angle (VSINE+) − (VSINE−) Q + ARCTAN 45 17 25 29 21 Nominal Angle (Degrees) 33 37 Figure 6. Nominal Angle vs. Ideal Angle (After Calibrating at 180) www.onsemi.com 5 41 45 315 CS8190 Table 1. Function Generator Output Nominal Angle vs. Ideal Angle (After Calibrating at 270) Nominal q Degrees Ideal q Degrees Nominal q Degrees Ideal q Degrees Nominal q Degrees Ideal q Degrees Nominal q Degrees Ideal q Degrees Nominal q Degrees Ideal q Degrees Nominal q Degrees 0 0 17 17.98 34 33.04 75 74.00 160 159.14 245 244.63 1 1.09 18 18.96 35 34.00 80 79.16 165 164.00 250 249.14 2 2.19 19 19.92 36 35.00 85 84.53 170 169.16 255 254.00 3 3.29 20 20.86 37 36.04 90 90.00 175 174.33 260 259.16 4 4.38 21 21.79 38 37.11 95 95.47 180 180.00 265 264.53 5 5.47 22 22.71 39 38.21 100 100.84 185 185.47 270 270.00 6 6.56 23 23.61 40 39.32 105 106.00 190 190.84 275 275.47 7 7.64 24 24.50 41 40.45 110 110.86 195 196.00 280 280.84 8 8.72 25 25.37 42 41.59 115 115.37 200 200.86 285 286.00 9 9.78 26 26.23 43 42.73 120 119.56 205 205.37 290 290.86 10 10.84 27 27.07 44 43.88 125 124.00 210 209.56 295 295.37 11 11.90 28 27.79 45 45.00 130 129.32 215 214.00 300 299.21 12 12.94 29 28.73 50 50.68 135 135.00 220 219.32 305 303.02 13 13.97 30 29.56 55 56.00 140 140.68 225 225.00 14 14.99 31 30.39 60 60.44 145 146.00 230 230.58 15 16.00 32 31.24 65 64.63 150 150.44 235 236.00 16 17.00 33 32.12 70 69.14 155 154.63 240 240.44 Ideal q Degrees Note: Temperature, voltage and nonlinearity not included. CIRCUIT DESCRIPTION and APPLICATION NOTES on−chip amplifier and function generator circuitry. The various trip points for the circuit (i.e., 0°, 90°, 180°, 270°) are determined by an internal resistor divider and the bandgap voltage reference. The coils are differentially driven, allowing bidirectional current flow in the outputs, thus providing up to 305° range of meter deflection. Driving the coils differentially offers faster response time, higher current capability, higher output voltage swings, and reduced external component count. The key advantage is a higher torque output for the pointer. The output angle, q, is equal to the F/V gain multiplied by the function generator gain: The CS8190 is specifically designed for use with air−core meter movements. It includes an input comparator for sensing an input signal from an ignition pulse or speed sensor, a charge pump for frequency to voltage conversion, a bandgap voltage regulator for stable operation, and a function generator with sine and cosine amplifiers to differentially drive the meter coils. From the partial schematic of Figure 7, the input signal is applied to the FREQIN lead, this is the input to a high impedance comparator with a typical positive input threshold of 2.0 V and typical hysteresis of 0.5 V. The output of the comparator, SQOUT, is applied to the charge pump input CP+ through an external capacitor CCP. When the input signal changes state, CCP is charged or discharged through R3 and R4. The charge accumulated on CCP is mirrored to C4 by the Norton Amplifier circuit comprising of Q1, Q2 and Q3. The charge pump output voltage, F/VOUT, ranges from 2.0 V to 6.3 V depending on the input signal frequency and the gain of the charge pump according to the formula: FńVOUT + 2.0 V ) 2.0 FREQ CCP RT q + AFńV AFG, where: AFG + 77° ńV(typ) The relationship between input frequency and output angle is: q + AFG 2.0 q + 970 FREQ FREQ CCP RT (VREG * 0.7 V) or, (VREG * 0.7 V) RT is a potentiometer used to adjust the gain of the F/V output stage and give the correct meter deflection. The F/V output voltage is applied to the function generator which generates the sine and cosine output voltages. The output voltage of the sine and cosine amplifiers are derived from the CCP RT The ripple voltage at the F/V converter’s output is determined by the ratio of CCP and C4 in the formula: DV + www.onsemi.com 6 CCP(VREG * 0.7 V) C4 CS8190 VREG 2.0 V F/VOUT + R3 − 0.25 V + SQOUT FREQIN VC(t) Q3 CP− F to V RT − CCP CP+ R4 C4 + Q1 QSQUARE Q2 − 2.0 V Figure 7. Partial Schematic of Input and Charge Pump T tDCHG tCHG VCC FREQIN 0 VREG SQOUT 0 ICP+ VCP+ 0 Figure 8. Timing Diagram of FREQIN and ICP Ripple voltage on the F/V output causes pointer or needle flutter especially at low input frequencies. The response time of the F/V is determined by the time constant formed by RT and C4. Increasing the value of C4 will reduce the ripple on the F/V output but will also increase the response time. An increase in response time causes a very slow meter movement and may be unacceptable for many applications. The CS8190 has an undervoltage detect circuit that disables the input comparator when VCC falls below 8.0 V(typical). With no input signal the F/V output voltage decreases and the needle moves towards zero. A second undervoltage detect circuit at 6.0 V(typical) causes the function generator to generate a differential SIN drive voltage of zero volts and the differential COS drive voltage to go as high as possible. This combination of voltages (Figure 2) across the meter coil moves the needle to the 0° position. Connecting a large capacitor(> 2000 mF) to the VCC lead (C2 in Figure 9) increases the time between these undervoltage points since the capacitor discharges slowly and ensures that the needle moves towards 0° as opposed to 360°. The exact value of the capacitor depends on the response time of the system,the maximum meter deflection and the current consumption of the circuit. It should be selected by breadboarding the design in the lab. www.onsemi.com 7 CS8190 R3 R4 CCP 0.0033 mF ± 30 PPM/°C 3.0 kW Speedo Input 1 CP+ 1.0 kW CP− F/VOUT SQOUT R2 CS8190 0.1 mF C3 GND GND Battery R1 0.47 mF RT Trim Resistor ± 20 PPM/°C GND GND COS+ SINE+ COS− SINE− BIAS VCC 3.9, D1 1.0 A 500 mW 600 PIV + VREG FREQIN 10 kW C4 C1 0.1 mF C2 2000 mF COSINE SINE D2 50 V, 500 mW Zener GND Air Core Gauge 200 W Speedometer Notes: 1. C2 (> 2000 mF) is needed if return to zero function is required. 2. The product of CCP and RT have a direct effect on the transfer function (f to V conversion) and therefore directly affect temperature compensation. 3. CCP Range; 20 pF to 0.2 mF. 4. RT Range; 100 kW to 500 kW. 5. The IC must be protected from transients above 60 V and reverse battery conditions. 6. Additional filtering on the FREQIN lead may be required. 7. Gauge coil connections to the IC must be kept as short as possible (≤ 3.0 inch) for best pointer stability. Figure 9. Speedometer or Tachometer Application Design Example is 2.85 ms. To ensure that CCP is charged, assume that the (R3 + R4) CCP time constant is less than 10% of the minimum input period. Maximum meter Deflection = 270° Maximum Input Frequency = 350 Hz 1. Select RT and CCP q + 970 FREQ CCP T + 10% RT + 270° Let CCP = 0.0033 mF, find RT RT + 970 Choose R4 = 1.0 kW. Discharge time: tDCHG = R4 × CCP = 3.3 kW × 0.0033 mF = 3.3 ms Charge time: tCHG = (R3 + R4)CCP = 4.3 kW. × 0.0033 mF = 14.2 ms 3. Determine C4 C4 is selected to satisfy both the maximum allowable ripple voltage and response time of the meter movement. 270° 350 Hz 0.0033 mF RT + 243 kW RT should be a 250 kW potentiometer to trim out any inaccuracies due to IC tolerances or meter movement pointer placement. 2. Select R3 and R4 Resistor R3 sets the output current from the voltage regulator. The maximum output current from the voltage regulator is 10 mA. R3 must ensure that the current does not exceed this limit. Choose R3 = 3.3 kW The maximum charge current for CCP is worst case estimated at: VREG * 0.7 V 3.3 kW 1 + 285 ms 350 Hz C4 + CCP(VREG * 0.7 V) DVMAX With C4 = 0.47 mF, the F/V ripple voltage is 44 mV. The last component to be selected is the return to zero capacitor C2. This is selected by increasing the input signal frequency to its maximum so the pointer is at its maximum deflection, then removing the power from the circuit. C2 should be large enough to ensure that the pointer always returns to the 0° position rather than 360° under all operating conditions. Figure 10 shows how the CS8190 and the CS8441 are used to produce a Speedometer and Odometer circuit. + 1.90 mA CCP must charge and discharge fully during each cycle of the input signal. Time for one cycle at maximum frequency www.onsemi.com 8 CS8190 R4 R3 Speedo Input 3.0 kW CCP 0.0033 mF ± 30 PPM/°C 1.0 kW 1 CP+ CP− F/VOUT SQOUT R2 0.1 mF CS8190 C3 GND GND Battery R1 3.9, D1 1.0 A 500 mW 600 PIV GND Trim Resistor ± 20 PPM/°C 243 kW GND COS+ COS− SINE− BIAS COSINE SINE C1 0.1 mF Air Core Gauge 200 W C2 10 mF RT GND SINE+ VCC D2 50 V, 500 mW Zener 0.47 mF VREG FREQIN 10 kW C4 + Speedometer 1 CS8441 Air Core Stepper Motor 200 W Odometer Notes: 1. C2 = 10 mF with CS8441 application. 2. The product of CCP and RT have a direct effect on the transfer function (f to V conversion) and therefore directly affect temperature compensation. 3. CCP Range; 20 pF to 0.2 mF. 4. RT Range; 100 kW to 500 kW. 5. The IC must be protected from transients above 60 V and reverse battery conditions. 6. Additional filtering on the FREQIN lead may be required. 7. Gauge coil connections to the IC must be kept as short as possible (≤ 3.0 inch) for best pointer stability. Figure 10. Speedometer With Odometer or Tachometer Application www.onsemi.com 9 CS8190 In some cases a designer may wish to use the CS8190 only as a driver for an air−core meter having performed the F/V conversion elsewhere in the circuit. Figure 11 shows how to drive the CS8190 with a DC voltage ranging from 2.0 V to 6.0 V. This is accomplished by forcing a voltage on the F/VOUT lead. The alternative scheme shown in Figure 12 uses an external op amp as a buffer and operates over an input voltage range of 0 V to 4.0 V. Figures 11 and 12 are not temperature compensated. CS8190 100 kW 100 kW VIN 0 V to 4.0 V DC + VREG 100 kW BIAS + − 10 kW − CP− F/VOUT CS8190 100 kW CP− − 100 kW + 10 kW N/C VIN 2.0 V to 6.0 V DC Figure 12. Driving the CS8190 from an External DC Voltage Using an Op Amp Buffer BIAS F/VOUT Figure 11. Driving the CS8190 from an External DC Voltage PACKAGE THERMAL DATA PDIP−16 SO−20W Unit RqJC Typical 15 9 °C/W RqJA Typical 50 55 °C/W Parameter ORDERING INFORMATION Device Package CS8190ENF16G PDIP−16 (Pb−Free) CS8190EDWF20G SO−20W (Pb−Free) CS8190EDWFR20G SO−20W (Pb−Free) Shipping† †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS PDIP−16 CASE 648−08 ISSUE V 16 1 SCALE 1:1 D A 16 9 E H E1 1 NOTE 8 b2 8 c B TOP VIEW END VIEW WITH LEADS CONSTRAINED NOTE 5 A2 A e/2 NOTE 3 L A1 C D1 e SEATING PLANE M eB END VIEW 16X b SIDE VIEW 0.010 M C A M B M NOTE 6 DATE 22 APR 2015 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3. 4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH. 5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR TO DATUM C. 6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED. 7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE LEADS, WHERE THE LEADS EXIT THE BODY. 8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS). DIM A A1 A2 b b2 C D D1 E E1 e eB L M INCHES MIN MAX −−−− 0.210 0.015 −−−− 0.115 0.195 0.014 0.022 0.060 TYP 0.008 0.014 0.735 0.775 0.005 −−−− 0.300 0.325 0.240 0.280 0.100 BSC −−−− 0.430 0.115 0.150 −−−− 10 ° MILLIMETERS MIN MAX −−− 5.33 0.38 −−− 2.92 4.95 0.35 0.56 1.52 TYP 0.20 0.36 18.67 19.69 0.13 −−− 7.62 8.26 6.10 7.11 2.54 BSC −−− 10.92 2.92 3.81 −−− 10 ° GENERIC MARKING DIAGRAM* 16 STYLE 1: PIN 1. CATHODE 2. CATHODE 3. CATHODE 4. CATHODE 5. CATHODE 6. CATHODE 7. CATHODE 8. CATHODE 9. ANODE 10. ANODE 11. ANODE 12. ANODE 13. ANODE 14. ANODE 15. ANODE 16. ANODE DOCUMENT NUMBER: DESCRIPTION: STYLE 2: PIN 1. COMMON DRAIN 2. COMMON DRAIN 3. COMMON DRAIN 4. COMMON DRAIN 5. COMMON DRAIN 6. COMMON DRAIN 7. COMMON DRAIN 8. COMMON DRAIN 9. GATE 10. SOURCE 11. GATE 12. SOURCE 13. GATE 14. SOURCE 15. GATE 16. SOURCE 98ASB42431B PDIP−16 XXXXXXXXXXXX XXXXXXXXXXXX AWLYYWWG 1 XXXXX A WL YY WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE H DATE 22 APR 2015 SCALE 1:1 A 20 q X 45 _ M E h 0.25 H NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 1 10 20X B b 0.25 M T A S B DIM A A1 b c D E e H h L q S L A 18X e SEATING PLANE A1 c T GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT* 20 20X 20X 1.30 0.52 20 XXXXXXXXXXX XXXXXXXXXXX AWLYYWWG 11 1 11.00 1 XXXXX A WL YY WW G 10 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ 98ASB42343B SOIC−20 WB = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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