CS9201YDFR8

CS9201 Micropower 5.0 V, 100 mA Low Dropout Linear Regulator with NOCAP The CS9201 is a precision 5.0 V, 100 mA voltage regulator with low quiescent current (450 µA typ. @ 100 µA load). The 5.0 V output is accurate within ±2% and supplies 100 mA of load current with a maximum dropout voltage of only 600 mV. The regulator is protected against reverse battery, short circuit, over voltage, and over temperature conditions. The device can withstand 74 V peak transients making it suitable for use in automotive environments. ON’s proprietary NOCAP solution is the first technology which allows the output to be stable without the use of an external capacitor. NOCAP is suitable for slow switching or steady loads. 1 PIN CONNECTIONS AND MARKING DIAGRAM VOUT GND GND NC A WL, L YY, Y WW, W 1 8 VIN GND GND NC = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION Device VOUT VIN SO–8 DF SUFFIX CASE 751 8 CS920 ALYW1 Features NOCAP Low Quiescent Current (450 µΑ typ. @ 100 µA load) 5.0 V, ±2% Output 100 mA Output Current Capability Fault Protection – 74 V Peak Transient Voltage – –15 V Reverse Voltage – Short Circuit – Thermal Shutdown – Overvoltage Shutdown • Internally Fused Leads • • • • • http://onsemi.com Package Shipping CS9201YDF8 SO–8 95 Units/Rail CS9201YDFR8 SO–8 2500 Tape & Reel Over Voltage Shutdown Current Source (Circuit Bias) NOCAP + Current Limit Sense Sense(1) – Error Amplifier Thermal Shutdown Bandgap Reference (1) GND Contact factory for optional Sense lead. Figure 1. Block Diagram  Semiconductor Components Industries, LLC, 2001 November, 2001 – Rev. 13 1 Publication Order Number: CS9201/D CS9201 MAXIMUM RATINGS* Parameter Value Unit Internally Limited – –15 to 36 74 V V Internally Limited – ESD Susceptibility (Human Body Model) 4.0 kV Package Thermal Resistance: Junction–to–Case, RθJC Junction–to–Ambient, RθJA 25 110 °C/W °C/W Junction Temperature –40 to +150 °C Storage Temperature –55 to +150 °C 230 Peak °C Power Dissipation Input Voltage (VIN): DC Peak Transient Voltage (60 V Load Dump @ VIN = 14 V) Output Current Lead Temperature Soldering: Reflow (SMD styles only) Note 1 1. 60 second maximum above 183°C. *The maximum package power dissipation must be observed. ELECTRICAL CHARACTERISTICS (6.0 V ≤ VIN ≤ 26 V, IOUT = 1.0 mA, –40°C ≤ TJ ≤ 125°C; unless otherwise stated.) Parameter Test Conditions Min Typ Max Unit 4.90 4.85 5.00 5.00 5.10 5.15 V V Output Stage Output Voltage, VOUT 9.0 V < VIN < 16 V, 100 uA ≤ IOUT ≤ 100 mA 6.0 V < VIN < 26 V, 100 uA ≤ IOUT ≤ 100 mA Dropout Voltage (VIN–VOUT) IOUT = 100 mA IOUT = 100 µA – 400 100 600 150 mV mV Load Regulation VIN = 14 V, 100 µA ≤ IOUT ≤ 100 mA – 5 50 mV Line Regulation 6.0 V < V < 26 V, IOUT = 1.0 mA – 5 50 mV Quiescent Current, (IQ) IOUT = 100 µA, VIN = 12 V IOUT ≤ 50 mA IOUT ≤ 100 mA – 450 4 12 750 6 20 µA mA mA Ripple Rejection 7.0 V ≤ VIN ≤ 17 V, IOUT = 100 mA, f = 120 Hz 60 75 – dB – 105 200 – mA 25 125 – mA 150 180 – °C 28 32 36 V Current Limit Short Circuit Output Current VOUT = 0 V Thermal Shutdown (Note 2) Overvoltage Shutdown – VOUT ≤ 1.0 V 2. This parameter is guaranteed by design, but not parametrically tested in production. PACKAGE LEAD DESCRIPTION Package Lead Number SO–8 Lead Symbol 1 VOUT 4, 5 NC 2, 3, 6, 7 GND 8 VIN Function 5.0 V, ± 2%, 100 mA output. No connection. Ground. Input voltage. http://onsemi.com 2 CS9201 20 18 16 14 12 5.04 Output Voltage (V) 10 8 6 125°C 25°C 100 mA 5.02 100 µA 20 mA 5.01 5.00 4.99 4.98 4.97 0 10 20 30 40 50 60 70 80 90 4.96 –40 –20 100 0 20 Output Current (mA) 100 120 140 1 125°C Quiescent Current (mA) 12 10 8 6 4 2 0 –2 –4 –6 –8 –10 –12 40 60 80 Temperature (°C) Figure 3. Output Voltage vs. Temperature VIN = 14 V Figure 2. Load Regulation vs. Output Current VIN = 14 V Line Regulation (mV) –40°C 25°C 125°C 0.9 0.8 0.7 –40°C 0.6 0.5 25°C 0.4 0.3 6 8 10 12 14 16 18 20 22 24 0 26 1 2 3 4 5 6 7 8 9 10 Output Current (mA) Input Voltage (V) Figure 4. Line Regulation vs. Input Voltage IOUT = 100 µA Figure 5. Quiescent Current vs. Output Current (Lightly Loaded) VIN = 14 V 14 0.70 25°C 12 Quiescent Current (mA) 4 2 0 –2 5.03 –40°C Quiescent Current (mA) Load Regulation (mV) TYPICAL PERFORMANCE CHARACTERISTICS 10 8 125°C 6 4 –40°C 2 0.60 0 10 20 30 40 50 60 70 80 90 25°C 125°C 0.55 0.50 0.45 0.40 0.35 0.30 0 –40°C 0.65 100 4 6 8 10 12 14 16 18 20 22 24 26 Input Voltage (V) Output Current (mA) Figure 6. Quiescent Current vs. Output Current VIN = 14 V Figure 7. Quiescent Current vs. Input Voltage IOUT = 100 µA http://onsemi.com 3 CS9201 CIRCUIT DESCRIPTION > 32 V VOLTAGE REFERENCE AND OUTPUT CIRCUITRY VIN Output Stage Protection VOUT The output stage is protected against overvoltage, short circuit and thermal runaway conditions (Figure 8). If the input voltage rises above 32 V (typ), the output shuts down. This response protects the internal circuitry and enables the IC to survive unexpected voltage transients. Should the junction temperature of the power device exceed 180°C (typ) the power transistor is turned off. Thermal shutdown is an effective means to prevent die overheating since the power transistor is the principle heat source in the IC. IOUT Load Dump Thermal Shutdown Figure 8. Typical Circuit Waveforms for Output Stage Protection VIN C1 * 0.1 µF Short Circuit VOUT CS9201 GND * C1 is required if regulator is distant from power source filter. Figure 9. Application and Test Diagram APPLICATION NOTES STABILITY CONSIDERATIONS / NOCAP NOCAP is an ON Semiconductor exclusive output stage which internally compensates the LDO regulator over temperature, load and line variations without the need for an expensive external capacitor NOCAP is ideally suited for slow switching or steady loads. If the load is characterized by transient current events, an output storage capacitor may be needed. If this is the case, the capacitor should be no larger than 100 nF. With loads that require greater transient suppression, a regulator with a traditional output stage (such as the CS8221) may be better suited for proper operation. Normally a low dropout or quasi–low dropout regulator (or any type requiring a slow lateral PNP in the control loop) necessitates a large external compensation capacitor at the output of the IC. The external capacitor is also used to curtail overshoot, determine startup delay time and load transient response. Traditional LDO regulators typically have low unity gain bandwidth, display overshoot and poor ripple rejection. Compensation is also an issue and depends on the external capacitor value, ESR (Equivalent Series Resistance) and board layout parasitics that all can create oscillations if not properly accounted for. http://onsemi.com 4 CS9201 CALCULATING POWER DISSIPATION IN A SINGLE OUTPUT LINEAR REGULATOR The value of RΘJA can then be compared with those in the package section of the data sheet. Those packages with RΘJA ’s less than the calculated value in equation 2 will keep the die temperature below 150°C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heatsink will be required. The maximum power dissipation for a single output regulator (Figure 10) is: PD(max)  {VIN(max)  VOUT(min)} IOUT(max)
VIN(max)IQ (1) HEAT SINKS where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current for the application, and IQ is the quiescent current the regulator consumes at IOUT(max). A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RΘJA: Once the value of PD(max) is known, the maximum permissible value of RΘJA can be calculated: R
JA  150°C  TA PD IIN R
JA  R
JC
R
CS
R
SA where: RΘJC = the junction–to–case thermal resistance, RΘCS = the case–to–heatsink thermal resistance, and RΘSA = the heatsink–to–ambient thermal resistance. (2) IOUT VIN CS9201 (3) RΘJC appears in the package section of the data sheet. Like RΘJA, it too is a function of package type. RΘCS and RΘSA are functions of the package type, heatsink and the interface between them. These values appear in heat sink data sheets of heat sink manufacturers. VOUT IQ Figure 10. Single output regulator with key performance parameters labeled. http://onsemi.com 5 CS9201 PACKAGE DIMENSIONS SO–8 DF SUFFIX CASE 751–07 ISSUE W –X– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. A 8 5 0.25 (0.010) S B 1 M Y M 4 K –Y– G C N X 45
SEATING PLANE –Z– 0.10 (0.004) H M D 0.25 (0.010) M Z Y S X S http://onsemi.com 6 J DIM A B C D G H J K M N S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0
8
0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0
8
0.010 0.020 0.228 0.244 CS9201 Notes http://onsemi.com 7 CS9201 NOCAP is a trademark of ON Semiconductor, and is patented. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: ONlit@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800–282–9855 Toll Free USA/Canada http://onsemi.com 8 CS9201/D