FAN3216TMX

Dual 2-A High-Speed, Low-Side Gate Drivers FAN3216 / FAN3217 The FAN3216 and FAN3217 dual 2 A gate drivers are designed to drive N−channel enhancement−mode MOSFETs in low−side switching applications by providing high peak current pulses during the short sw itching intervals. They are both available with TTL input thresholds. Internal circuitry provides an under−voltage lockout function by holding the output LOW until the supply voltage is within the operating range. In addition, the drivers feature matched internal propagation delays between A and B channels for applications requiring dual gate drives with critical timing, such as synchronous rectifiers. This also enables connecting two drivers in parallel to effectively double the current capability driving a single MOSFET. The FAN3216/17 drivers incorporate MillerDrivet architecture for the final output stage. This bipolar−MOSFET combination provides high current during the Miller plateau stage of the MOSFET turn−on / turn−off process to minimize switching loss, while providing rail−to−rail voltage swing and reverse current capability. The FAN3216 offers two inverting drivers and the FAN3217 offers two non−inverting drivers. Both are offered in a standard 8−pin SOIC package. Features • • • • • • • • • • • • • • Industry−Standard Pinouts 4.5 V to 18 V Operating Range 3 A Peak Sink/Source at VDD = 12 V 2.4 A Sink / 1.6 A Source at VOUT = 6 V Inverting Configuration (FAN3216) and Non−Inverting Configuration (FAN3217) Internal Resistors Turn Driver Off If No Inputs 12 ns / 9 ns Typical Rise/Fall Times (1 nF Load) 20 ns Typical Propagation Delay Matched within 1 ns to the Other Channel TTL Input Thresholds MillerDrivet Technology Double Current Capability by Paralleling Channels Standard SOIC−8 Package Rated from –40°C to +125°C Ambient These are Pb−Free Devices Applications • • • • • Switch−Mode Power Supplies High-Efficiency MOSFET Switching Synchronous Rectifier Circuits DC-to-DC Converters Motor Control © Semiconductor Components Industries, LLC, 2019 September, 2020 − Rev. 4 www.onsemi.com 8 1 SOIC8 CASE 751EB PACKAGE OUTLINE 1 8 2 7 3 6 4 5 Figure 1. SOIC−8 (Top View) MARKING DIAGRAM 8 XXXXX AYWWG G 1 SOIC8 A = Assembly Lot Code L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. ORDERING INFORMATION See detailed ordering and shipping information on page 14 of this data sheet. 1 Publication Order Number: FAN3217/D FAN3216 / FAN3217 PIN CONFIGURATIONS NC 1 INA 2 GND 3 INB 4 A B 8 NC NC 1 7 OUTA INA 2 6 VDD GND 3 5 OUTB INB 4 Figure 2. FAN3216 Pin Configuration A B 8 NC 7 OUTA 6 VDD 5 OUTB Figure 3. FAN3217 Pin Configuration THERMAL CHARACTERISTICS (Note 1) Package QJL (Note 2) QJT (Note 3) QJA (Note 4) YJB (Note 5) YJT (Note 6) Unit 40 31 89 43 3.0 °C/W 8−Pin Small Outline Integrated Circuit (SOIC) 1. Estimates derived from thermal simulation; actual values depend on the application. 2. Theta_JL (QJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any thermal pad) that are typically soldered to a PCB. 3. Theta_JT (QJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform temperature by a top−side heatsink. 4. Theta_JA (QJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow. The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51−2, JESD51−5, and JESD51−7, as appropriate. 5. Psi_JB (YJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an application circuit board reference point for the thermal environment defined in Note 4. For the SOIC−8 package, the board reference is defined as the PCB copper adjacent to pin 6. 6. Psi_JT (YJT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and the center of the top of the package for the thermal environment defined in Note 4. PIN DEFINITIONS Pin Name Pin Description 1 NC No Connect. This pin can be grounded or left floating. 2 INA Input to Channel A. 3 GND Ground. Common ground reference for input and output circuits. Input to Channel B. 4 INB 5 (FAN3216) OUTB Gate Drive Output B (inverted from the input): Held LOW unless required input is present and VDD is above UVLO threshold. 5 (FAN3217) OUTB Gate Drive Output B: Held LOW unless required input(s) are present and VDD is above UVLO threshold. 6 VDD Supply Voltage. Provides power to the IC. 7 (FAN3216) OUTA Gate Drive Output A (inverted from the input): Held LOW unless required input is present and VDD is above UVLO threshold. 7 (FAN3217) OUTA Gate Drive Output A: Held LOW unless required input(s) are present and VDD is above UVLO threshold. 8 NC No Connect. This pin can be grounded or left floating. OUTPUT LOGIC FAN3216 (x = A or B) FAN3217 (x = A or B) INx OUTx INx OUTx 0 1 0 (Note 7) 0 1 (Note 7) 0 1 1 7. Default input signal if no external connection is made. www.onsemi.com 2 FAN3216 / FAN3217 BLOCK DIAGRAMS NC 1 8 NC VDD 100kW INA 2 7 OUTA 100kW UVLO GND 3 6 VDD VDD_OK V 100kW INB 4 5 OUTB 100kW Figure 4. FAN3216 Block Diagram NC 1 8 NC INA 2 7 100kW UVLO GND 3 OUTA 100kW 6 VDD VDD_OK INB 4 5 OUTB 100kW 100kW Figure 5. FAN3217 Block Diagram www.onsemi.com 3 FAN3216 / FAN3217 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min. Max. Unit −0.3 20.0 V VDD VDD to PGND VIN INA and INB to GND GND − 0.3 VDD + 0.3 V OUTA and OUTB to GND GND − 0.3 VDD + 0.3 V VOUT TL Lead Soldering Temperature (10 Seconds) 260 °C TJ Junction Temperature −55 150 °C TSTG Storage Temperature −65 150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VDD Supply Voltage Range VIN Input Voltage INA and INB TA Operating Ambient Temperature Min. Max. Unit 4.5 18.0 V 0 VDD V −40 125 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 4 FAN3216 / FAN3217 ELECTRICAL CHARACTERISTICS (Unless otherwise noted, VDD = 12 V, TJ = −40°C to +125°C. Currents are defined as positive into the device and negative out of the device.) Symbol Parameter Conditions Min Typ Max Unit 18.0 V 0.75 1.2 mA SUPPLY VDD Operating Range IDD Supply Current, Inputs Not Connected VON Turn−On Voltage INA = VDD, INB = 0 V 3.45 3.9 4.35 V VOFF Turn−Off Voltage INA = VDD, INB = 0 V 3.25 3.7 4.15 V 0.8 1.2 4.5 INPUTS VIL_T INx Logic Low Threshold VIH_T INx Logic High Threshold VHYS_T TTL Logic Hysteresis Voltage 0.2 V 1.6 2.0 V 0.4 0.8 V IIN+ Non−Inverting Input Current IN from 0 to VDD −1.0 175 mA IIN− Inverting Input Current IN from 0 to VDD −175 1.0 mA ISINK OUT Current, Mid−Voltage, Sinking (Note 8) OUTx at VDD/2, CLOAD = 0.22 mF, f = 1 kHz 2.4 A ISOURCE OUT Current, Mid−Voltage, Sourcing (Note 8) OUTx at VDD/2, CLOAD=0.1 mF, f = 1 kHz −1.6 A IPK_SINK OUT Current, Peak, Sinking (Note 8) CLOAD = 0.1 mF, f = 1 kHz 3 A OUT Current, Peak, Sourcing (Note 8) CLOAD = 0.1 mF, f = 1 kHz −3 A tRISE Output Rise Time (Note 9) CLOAD = 1000 pF 12 22 ns tFALL Output Fall Time (Note 9) CLOAD = 1000 pF 9 17 ns tD1, tD2 Output Propagation Delay, TTL Inputs (Note 9) 0 – 5 VIN, 1 V/ns Slew Rate 19 34 ns Propagation Matching Between Channels INA = INB, OUTA and OUTB at 50% Point 1 2 ns OUTPUTS IPK_SOURCE tDEL.MATCH IRVS 10 Output Reverse Current Withstand (Note 8) 500 mA 8. Not tested in production. 9. See Timing Diagrams of Figure 6 and Figure 7. TIMING DIAGRAMS 90% 90% Output Output 10% Input 10% VINH Input VINL tD1 tD2 tRISE VINH VINL tD2 tD1 tFALL tFALL Figure 6. Non−Inverting Timing Diagram tRISE Figure 7. Inverting Timing Diagram www.onsemi.com 5 FAN3216 / FAN3217 TYPICAL PERFORMANCE CHARACTERISTICS Typical characteristics are provided at TA = 25°C and VDD = 12 V unless otherwise noted. Figure 8. IDD (Static) vs. Supply Voltage (Note 10) Figure 9. IDD (Static) vs. Temperature (Note 10) Figure 10. IDD (Static) vs. Frequency Figure 11. IDD (1 nF Load) vs. Frequency Figure 12. Input Thresholds vs. Supply Voltage Figure 13. Input Thresholds vs. Temperature www.onsemi.com 6 FAN3216 / FAN3217 TYPICAL PERFORMANCE CHARACTERISTICS Typical characteristics are provided at TA = 25°C and VDD = 12 V unless otherwise noted. (continued) Figure 14. UVLO Threshold vs. Temperature IN fall to OUT rise IN rise to OUT fall IN rise to OUT fall IN fall to OUT rise Figure 15. Propagation Delay vs. Supply Voltage Figure 16. Propagation Delay vs. Supply Voltage IN or EN rise to OUT rise IN fall to OUT rise IN rise to OUT fall IN or EN fall to OUT fall Figure 17. Propagation Delays vs. Temperature Figure 18. Propagation Delays vs. Temperature www.onsemi.com 7 FAN3216 / FAN3217 TYPICAL PERFORMANCE CHARACTERISTICS Typical characteristics are provided at TA = 25°C and VDD = 12 V unless otherwise noted. (continued) Figure 19. Fall Time vs. Supply Voltage Figure 20. Rise Time vs. Supply Voltage Figure 21. Rise and Fall Times vs. Temperature www.onsemi.com 8 FAN3216 / FAN3217 TYPICAL PERFORMANCE CHARACTERISTICS Typical characteristics are provided at TA = 25°C and VDD = 12 V unless otherwise noted. (continued) Figure 22. Rise/Fall Waveforms with 2.2 nF Load Figure 23. Rise/Fall Waveforms with 10 nF Load Figure 24. Quasi−Static Source Current with VDD = 12 V (Note 11) Figure 25. Quasi−Static Sink Current with VDD = 12 V (Note 11) Figure 26. Quasi−Static Source Current with VDD = 8 V (Note 11) Figure 27. Quasi−Static Sink Current with VDD = 8 V (Note 11) 10. For any inverting inputs pulled low, non−inverting inputs pulled high, or outputs driven high, static IDD increases by the current flowing through the corresponding pull−up/down resistor shown in Figure 6 and Figure 7. 11. The initial spike in each current waveform is a measurement artifact caused by the stray inductance of the current−measurement loop. www.onsemi.com 9 FAN3216 / FAN3217 TEST CIRCUIT VDD 120 mF Al. El. 4.7 mF ceramic Current Probe LECROY AP015 IOUT IN 1 kHz 1 mF ceramic VOUT CLOAD 0.1 mF Figure 28. Quasi−Static IOUT / VOUT Test Circuit APPLICATIONS INFORMATION Input Thresholds the current as OUT swings between 1/3 to 2/3 VDD and the MOS devices pull the output to the HIGH or LOW rail. The purpose of the MillerDrive™ architecture is to speed up switching by providing high current during the Miller plateau region when the gate−drain capacitance of the MOSFET is being charged or discharged as part of the turn−on / turn−off process. For applications with zero voltage switching during the MOSFET turn−on or turn−off interval, the driver supplies high peak current for fast switching even though the Miller plateau is not present. This situation often occurs in synchronous rectifier applications because the body diode is generally conducting before the MOSFET is switched ON. The output pin slew rate is determined by VDD voltage and the load on the output. It is not user adjustable, but a series resistor can be added if a slower rise or fall time at the MOSFET gate is needed. The FAN3216 and the FAN3217 drivers consist of two identical channels that may be used independently at rated current or connected in parallel to double the individual current capacity. The input thresholds meet industry−standard TTL−logic thresholds independent of the VDD voltage, and there is a hysteresis voltage of approximately 0.4 V. These levels permit the inputs to be driven from a range of input logic signal levels for which a voltage over 2 V is considered logic HIGH. The driving signal for the TTL inputs should have fast rising and falling edges with a slew rate of 6 V/ms or faster, so a rise time from 0 to 3.3 V should be 550 ns or less. With reduced slew rate, circuit noise could cause the driver input voltage to exceed the hysteresis voltage and retrigger the driver input, causing erratic operation. Static Supply Current VDD In the IDD (static) typical performance characteristics shown in Figure 8 and Figure 9, each curve is produced with both inputs floating and both outputs LOW to indicate the lowest static IDD current. For other states, additional current flows through the 100 kW resistors on the inputs and outputs shown in the block diagram of each part (see Figure 6 and Figure 7). In these cases, the actual static IDD current is the value obtained from the curves plus this additional current. Input stage VOUT MillerDrive Gate Drive Technology FAN3216 and FAN3217 gate drivers incorporate the MillerDrive architecture shown in Figure 29. For the output stage, a combination of bipolar and MOS devices provide large currents over a wide range of supply voltage and temperature variations. The bipolar devices carry the bulk of Figure 29. MillerDrive Output Architecture www.onsemi.com 10 FAN3216 / FAN3217 • Keep the driver as close to the load as possible to Under−Voltage Lockout The FAN321x startup logic is optimized to drive ground−referenced N−channel MOSFETs with an under−voltage lockout (UVLO) function to ensure that the IC starts up in an orderly fashion. When VDD is rising, yet below the 3.9 V operational level, this circuit holds the output LOW, regardless of the status of the input pins. After the part is active, the supply voltage must drop 0.2 V before the part shuts down. This hysteresis helps prevent chatter when low VDD supply voltages have noise from the power switching. This configuration is not suitable for driving high−side P−channel MOSFETs because the low output voltage of the driver would turn the P−channel MOSFET on with VDD below 3.9 V. • • VDD Bypass Capacitor Guidelines To enable this IC to turn a device ON quickly, a local high-frequency bypass capacitor, CBYP, with low ESR and ESL should be connected between the VDD and GND pins with minimal trace length. This capacitor is in addition to the bulk electrolytic capacitance of 10 mF to 47 mF commonly found on driver and controller bias circuits. A typical criterion for choosing the value of CBYP is to keep the ripple voltage on the VDD supply to ≤5%. This is often achieved with a value ≥20 times the equivalent load capacitance CEQV, defined here as QGATE/VDD. Ceramic capacitors of 0.1 mF to 1 mF or larger are common choices, as are dielectrics, such as X5R and X7R with good temperature characteristics and high pulse current capability. If circuit noise affects normal operation, the value of CBYP may be increased to 50−100 times the CEQV, or CBYP may be split into two capacitors. One should be a larger value, based on equivalent load capacitance, and the other a smaller value, such as 1−10 nF mounted closest to the VDD and GND pins to carry the higher frequency components of the current pulses. The bypass capacitor must provide the pulsed current from both of the driver channels and, if the drivers are switching simultaneously, the combined peak current sourced from the CBYP would be twice as large as when a single channel is switching. • • minimize the length of high−current traces. This reduces the series inductance to improve high−speed switching, while reducing the loop area that can radiate EMI to the driver inputs and surrounding circuitry. If the inputs to a channel are not externally connected, the internal 100 kW resistors indicated on block diagrams command a low output. In noisy environments, it may be necessary to tie inputs of an unused channel to VDD or GND using short traces to prevent noise from causing spurious output switching. Many high−speed power circuits can be susceptible to noise injected from their own output or other external sources, possibly causing output re−triggering. These effects can be obvious if the circuit is tested in breadboard or non−optimal circuit layouts with long input or output leads. For best results, make connections to all pins as short and direct as possible. FAN3216 and FAN3217 are pin−compatible with many other industry−standard drivers. The turn−on and turn−off current paths should be minimized, as discussed in the following section. Figure 30 shows the pulsed gate drive current path when the gate driver is supplying gate charge to turn the MOSFET on. The current is supplied from the local bypass capacitor, CBYP, and flows through the driver to the MOSFET gate and to ground. To reach the high peak currents possible, the resistance and inductance in the path should be minimized. The localized CBYP acts to contain the high peak current pulses within this driver−MOSFET circuit, preventing them from disturbing the sensitive analog circuitry in the PWM controller. VDD VDS CBYP FAN321x Layout and Connection Guidelines PWM The FAN3216 and FAN3217 gate drivers incorporates fast-reacting input circuits, short propagation delays, and powerful output stages capable of delivering current peaks over 2 A to facilitate voltage transition times from under 10 ns to over 150 ns. The following layout and connection guidelines are strongly recommended: • Keep high−current output and power ground paths separate from logic input signals and signal ground paths. This is especially critical for TTL−level logic thresholds at driver input pins Figure 30. Current Path for MOSFET Turn−On Figure 31 shows the current path when the gate driver turns the MOSFET OFF. Ideally, the driver shunts the current directly to the source of the MOSFET in a small circuit loop. For fast turn−off times, the resistance and inductance in this path should be minimized. www.onsemi.com 11 FAN3216 / FAN3217 VDD VDS VDD Turn−on threshold CBYP FAN321x IN− PWM IN+ (VDD) Figure 31. Current Path for MOSFET Turn−Off Operational Waveforms At power-up, the driver output remains LOW until the VDD voltage reaches the turn−on threshold. The magnitude of the OUT pulses rises with VDD until steady−state VDD is reached. The non−inverting operation illustrated in Figure 32 shows that the output remains LOW until the UVLO threshold is reached, then the output is in−phase with the input. VDD OUT Figure 33. Inverting Startup Waveforms Thermal Guidelines Gate drivers used to switch MOSFETs and IGBTs at high frequencies can dissipate significant amounts of power. It is important to determine the driver power dissipation and the resulting junction temperature in the application to ensure that the part is operating within acceptable temperature limits. The total power dissipation in a gate driver is the sum of two components, PGATE and PDYNAMIC: Turn−on threshold IN− P TOTAL + P GATE ) P DYNAMIC IN+ (eq. 1) PGATE (Gate Driving Loss): The most significant power loss results from supplying gate current (charge per unit time) to switch the load MOSFET on and off at the switching frequency. The power dissipation that results from driving a MOSFET at a specified gate−source voltage, VGS, with gate charge, QG, at switching frequency, fSW, is determined by: OUT P GATE + Q G V GS f SW n (eq. 2) where n is the number of driver channels in use (1 or 2). Figure 32. Non−Inverting Startup Waveforms PDYNAMIC (Dynamic Pre−Drive / Shoot−through Current): A power loss resulting from internal current consumption under dynamic operating conditions, including pin pull−up / pull−down resistors, can be obtained using the graphs in the Typical Performance Characteristics to determine the current IDYNAMIC drawn from VDD under actual operating conditions: The inverting configuration of startup waveforms are shown in Figure 33. With IN+ tied to VDD and the input signal applied to IN–, the OUT pulses are inverted with respect to the input. At power−up, the inverted output remains LOW until the VDD voltage reaches the turn−on threshold, then it follows the input with inverted phase. www.onsemi.com 12 FAN3216 / FAN3217 P DYNAMIC + I DYNAMIC V DD n switching frequency of 500 kHz, the total power dissipation is: (eq. 3) Once the power dissipated in the driver is determined, the driver junction rise with respect to circuit board can be evaluated using the following thermal equation, assuming Y JB was determined for a similar thermal design (heat sinking and air flow): T J + P TOTAL y JB ) T B P GATE + 60nC 7V P DYNAMIC + 3 mA 500 kHz 7V 2 + 0.42 W 2 + 0.042 W P TOTAL + 0.46 W (eq. 5) (eq. 6) (eq. 7) The SOIC−8 has a junction−to−board thermal characterization parameter of YJB = 43°C/W. In a system application, the localized temperature around the device is a function of the layout and construction of the PCB along with airflow across the surfaces. To ensure reliable operation, the maximum junction temperature of the device must be prevented from exceeding the maximum rating of 150°C; with 80% derating, TJ would be limited to 120°C. Rearranging Equation 4 determines the board temperature required to maintain the junction temperature below 120°C: (eq. 4) where: TJ = driver junction temperature; YJB = (psi) thermal characterization parameter relating temperature rise to total power dissipation; and TB = board temperature in location as defined in the Thermal Characteristics table. In the forward converter with synchronous rectifier shown in the typical application diagrams, the FDMS8660S is a reasonable MOSFET selection. The gate charge for each SR MOSFET would be 60 nC with VGS = VDD = 7 V. At a T B + T J * P TOTAL T B + 120°C * 0.46 W www.onsemi.com 13 y JB 43°CńW + 100°C (eq. 8) (eq. 9) FAN3216 / FAN3217 TYPICAL APPLICATION DIAGRAMS VIN VIN VOUT FAN3217 1 8 PWMA 2 7 GND 3 6 PWMB 4 5 PWM Timing/ Isolation 1 8 2 7 3 6 4 5 Vbias OUTA VDD OUTB FAN3217 Figure 34. Forward Converter with Synchronous Rectification Figure 35. Primary−Side Dual Driver in a Push−Pull Converter VIN FAN3217 PWM−A 8 1 2 A 3 GND PWM−B 4 7 VDD 6 B 5 Vbias FAN3217 Phase Shift Controller 8 1 PWM−C A 2 PWM−D 3 GND Vbias VDD 6 B 4 7 5 Figure 36. Phase−Shifted Full−Bridge with Two Gate Drive Transformers (Simplified) ORDERING INFORMATION Part Number Logic Input Threshold Package Packing Method Quantity per Reel FAN3216TMX Dual Inverting Channels TTL SOIC−8 Tape & Reel 2,500 FAN3217TMX Dual Non−Inverting Channels TTL SOIC−8 Tape & Reel 2,500 www.onsemi.com 14 FAN3216 / FAN3217 RELATED PRODUCTS Type Part Number Gate Drive (Note 13) (Sink/Src) Single 1 A FAN3111C +1.1 A / −0.9 A CMOS Single Channel of Dual−Input/Single−Output SOT23−5, MLP6 Single 1 A FAN3111E +1.1 A / −0.9 A External (Note 13) Single Non−Inverting Channel with External Reference SOT23−5, MLP6 Single 2 A FAN3100C +2.5 A / −1.8 A CMOS Single Channel of Two−Input/One−Output SOT23−5, MLP6 Single 2 A FAN3100T +2.5 A / −1.8 A TTL Single Channel of Two−Input/One−Output SOT23−5, MLP6 Single 2 A FAN3180 +2.4 A / −1.6 A TTL Single Non−Inverting Channel + 3.3 V LDO SOT23−5 Dual 2 A FAN3216T +2.4 A / −1.6 A TTL Dual Inverting Channels Dual 2 A FAN3217T +2.4 A / −1.6 A TTL Dual Non−Inverting Channels Dual 2 A FAN3226C +2.4 A / −1.6 A CMOS Dual Inverting Channels + Dual Enable SOIC8, MLP8 Dual 2 A FAN3226T +2.4 A / −1.6 A TTL Dual Inverting Channels + Dual Enable SOIC8, MLP8 Dual 2 A FAN3227C +2.4 A / −1.6 A CMOS Dual Non−Inverting Channels + Dual Enable SOIC8, MLP8 Dual 2 A FAN3227T +2.4 A / −1.6 A TTL Dual Non−Inverting Channels + Dual Enable SOIC8, MLP8 Dual 2 A FAN3228C +2.4 A / −1.6 A CMOS Dual Channels of Two−Input/One−Output, Pin Config.1 SOIC8, MLP8 Dual 2 A FAN3228T +2.4 A / −1.6 A TTL Dual Channels of Two−Input/One−Output, Pin Config.1 SOIC8, MLP8 Dual 2 A FAN3229C +2.4 A / −1.6 A CMOS Dual Channels of Two−Input/One−Output, Pin Config.2 SOIC8, MLP8 Dual 2 A FAN3229T +2.4 A / −1.6 A TTL Dual Channels of Two−Input/One−Output, Pin Config.2 SOIC8, MLP8 Dual 2 A FAN3268T +2.4 A / −1.6 A TTL 20 V Non−Inverting Channel (NMOS) and Inverting Channel (PMOS) + Dual Enables SOIC8 Dual 2 A FAN3278T +2.4 A / −1.6 A TTL 30 V Non−Inverting Channel (NMOS) and Inverting Channel (PMOS) + Dual Enables SOIC8 Dual 4 A FAN3213T +4.3 A / −2.8 A TTL Dual Inverting Channels SOIC8 Dual 4 A FAN3214T +4.3 A / −2.8 A TTL Dual Non−Inverting Channels SOIC8 Dual 4 A FAN3223C +4.3 A / −2.8 A CMOS Dual Inverting Channels + Dual Enable SOIC8, MLP8 Dual 4 A FAN3223T +4.3 A / −2.8 A TTL Dual Inverting Channels + Dual Enable SOIC8, MLP8 Dual 4 A FAN3224C +4.3 A / −2.8 A CMOS Dual Non−Inverting Channels + Dual Enable SOIC8, MLP8 Dual 4 A FAN3224T +4.3 A / −2.8 A TTL Dual Non−Inverting Channels + Dual Enable SOIC8, MLP8 Dual 4 A FAN3225C +4.3 A / −2.8 A CMOS Dual Channels of Two−Input/One−Output SOIC8, MLP8 Dual 4 A FAN3225T +4.3 A / −2.8 A TTL Dual Channels of Two−Input/One−Output SOIC8, MLP8 Single 9 A FAN3121C +9.7 A / −7.1 A CMOS Single Inverting Channel + Enable SOIC8, MLP8 Single 9 A FAN3121T +9.7 A / −7.1 A TTL Single Inverting Channel + Enable SOIC8, MLP8 Single 9 A FAN3122T +9.7 A / −7.1 A TTL Single Non−Inverting Channel + Enable SOIC8, MLP8 Single 9 A FAN3122C +9.7 A / −7.1 A CMOS Single Non−Inverting Channel + Enable SOIC8, MLP8 Dual 12 A FAN3240 +12.0 A TTL Dual−Coil Relay Driver, Timing Config. 0 SOIC8 Dual 12 A FAN3241 +12.0 A TTL Dual−Coil Relay Driver, Timing Config. 1 SOIC8 Input Threshold Logic Package SOIC8 SOIC8 12. Typical currents with OUTx at 6 V and VDD = 12 V. 13. Thresholds proportional to an externally supplied reference voltage. MillerDrive is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 15 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC8 CASE 751EB ISSUE A DOCUMENT NUMBER: DESCRIPTION: 98AON13735G SOIC8 DATE 24 AUG 2017 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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