FDD8870 / FDU8870
N-Channel PowerTrench® MOSFET
30V, 160A, 3.9mΩ
General Description
Features
This N-Channel MOSFET has been designed specifically to
improve the overall ef ficiency of DC/ DC converters using
either synchronous or conven tional swit ching PW M
controllers. It has been optimized for low gate charge, low
rDS(ON) and fast switching speed.
• rDS(ON) = 3.9mΩ, VGS = 10V, ID = 35A
• rDS(ON) = 4.4mΩ, VGS = 4.5V, ID = 35A
• High performance t rench t echnology for ext remely low
rDS(ON)
• Low gate charge
Applications
• High power and current handling capability
• DC/DC converters
D
D
G
S
D-PAK
TO-252
(TO-252)
I-PAK
(TO-251AA)
G
S
G D S
MOSFET Maximum Ratings TC = 25°C unless otherwise noted
Symbol
VDSS
VGS
ID
Drain to Source Voltage
Parameter
Ratings
30
Units
V
Gate to Source Voltage
±20
V
Continuous (TC = 25oC, VGS = 10V) (Note 1)
160
A
Continuous (Tamb = 25oC, VGS = 10V, with RθJA = 52oC/W)
150
A
21
A
Drain Current
Continuous (TC = 25oC, VGS = 4.5V) (Note 1)
Pulsed
EAS
PD
TJ, TSTG
Single Pulse Avalanche Energy (Note 2)
Power dissipation
Derate above 25oC
Operating and Storage Temperature
Figure 4
A
690
mJ
160
1.07
W
W/oC
oC
-55 to 175
Thermal Characteristics
RθJC
Thermal Resistance Junction to Case TO-252, TO-251
0.94
o
C/W
RθJA
Thermal Resistance Junction to Ambient TO-252, TO-251
100
o
C/W
Thermal Resistance Junction to Ambient TO-252, 1in2 copper pad area
52
RθJA
©2008 Fairchild Semiconductor Corporation
oC/W
FDD8870 / FDU8870 Rev. 1.2
FDD8870 / FDU8870
March 2015
Device Marking
FDD8870
Device
FDD8870
Package
TO-252AA
Reel Size
13”
Tape Width
16mm
Quantity
2500 units
FDU8870
FDU8870
TO-251AA
Tube
N/A
75 units
F
F
Electrical Characteristics TC = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
V
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate to Source Leakage Current
ID = 250µA, VGS = 0V
VDS = 24V
VGS = 0V
VGS = ±20V
TC = 150oC
30
-
-
-
-
1
-
-
250
-
-
±100
nA
-
2.5
V
µA
On Characteristics
VGS(TH)
Gate to Source Threshold Voltage
rDS(ON)
Drain to Source On Resistance
VGS = VDS, ID = 250µA
1.2
ID = 35A, VGS = 10V
-
0.0032 0.0039
-
0.0036 0.0044
ID = 35A, VGS = 10V,
TJ = 175oC
-
0.0051 0.0063
ID = 35A, VGS = 4.5V
Ω
Dynamic Characteristics
CISS
Input Capacitance
CRSS
Reverse Transfer Capacitance
Qg(TOT)
Total Gate Charge at 10V
Qg(TH)
Threshold Gate Charge
Qgs2
Gate Charge Threshold to Plateau
COSS
Output Capacitance
RG
Gate Resistance
Qg(5)
Total Gate Charge at 5V
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller” Charge
Switching Characteristics
VDS = 15V, VGS = 0V,
f = 1MHz
VGS = 0.5V, f = 1MHz
VGS = 0V to 10V
VGS = 0V to 5V
VGS = 0V to 1V
VDD = 15V
ID = 35A
Ig = 1.0mA
-
5160
-
-
990
-
pF
pF
-
590
-
pF
-
2.1
-
Ω
-
91
118
nC
-
48
62
nC
-
5
6.5
nC
-
14
-
nC
-
9
-
nC
-
18
-
nC
(VGS = 10V)
tON
Turn-On T ime
-
-
139
ns
td(ON)
Turn-On Delay Time
-
9
-
ns
tr
Rise Time
td(OFF)
Turn-Off Delay Time
tf
tOFF
-
83
-
ns
-
83
-
ns
Fall Time
-
42
-
ns
Turn-Off Time
-
-
189
ns
ISD = 35A
-
-
1.25
V
-
-
1.0
V
ISD = 35A, dISD/dt = 100A/µs
-
-
37
ns
-
-
21
nC
VDD = 15V, ID = 35A
VGS = 10V, RGS = 3.3Ω
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Voltage
trr
Reverse Recovery Time
QRR
Reverse Recovered Charge
ISD = 15A
ISD = 35A, dISD/dt = 100A/µs
Notes:
1: Package current limitation is 35A.
2: Starting TJ = 25°C, L = 1.77mH, IAS = 28A, VDD = 27V, VGS = 10V.
:
F
©2008 Fairchild Semiconductor Corporation
FDD8870 / FDU8870 Rev. 1.2
FDD8870 / FDU8870
Package Marking and Ordering Information
FDD8870 / FDU8870
Typical Characteristics TC = 25°C unless otherwise noted
175
1.0
150
ID, DRAIN CURRENT (A)
POWER DISSIPATION MULTIPLIER
1.2
0.8
0.6
0.4
CURRENT LIMITED
BY PACKAGE
125
100
75
50
0.2
25
0
0
25
50
75
100
150
125
0
175
25
50
75
TC , CASE TEMPERATURE (oC)
100
125
150
175
o
TC, CASE TEMPERATURE ( C)
Figure 1. Normalized Power Dissipation vs Case
Temperature
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
2
ZθJC, NORMALIZED
THERMAL IMPEDANCE
1
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
PDM
0.1
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC x RθJC + TC
SINGLE PULSE
0.01
10-5
10-4
10-3
10-2
10-1
100
101
t, RECTANGULAR PULSE DURATION (s)
Figure 3. Normalized Maximum Transient Thermal Impedance
2000
1000
IDM, PEAK CURRENT (A)
TC = 25oC
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
VGS = 4.5V
175 - TC
I = I25
150
100
30
10-5
10-4
10-3
10-2
10-1
100
101
t, PULSE WIDTH (s)
Figure 4. Peak Current Capability
©2008 Fairchild Semiconductor Corporation
FDD8870 / FDU8870 Rev. 1.2
FDD8870 / FDU8870
Typical Characteristics TC = 25°C unless otherwise noted
1000
100
IAS, AVALANCHE CURRENT (A)
ID, DRAIN CURRENT (A)
10µs
100
100µs
10
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(ON)
1ms
10ms
1
DC
SINGLE PULSE
TJ = MAX RATED
TC = 25oC
STARTING TJ = 25oC
10
If R = 0
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
If R ≠ 0
tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
1
0.1
1
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
0.1
60
1
10
tAV, TIME IN AVALANCHE (ms)
Figure 6. Unclamped Inductive Switching
Capability
100
100
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
VDD = 15V
VGS = 5V
80
ID, DRAIN CURRENT (A)
80
TJ = 175oC
60
TJ = 25oC
40
VGS = 4V
VGS = 10V
60
VGS = 3V
40
VGS = 2.5V
TC = 25oC
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
20
20
o
TJ = -55 C
0
0
1.5
2.0
2.5
VGS , GATE TO SOURCE VOLTAGE (V)
0
3.0
0.2
0.4
0.6
VDS , DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Transfer Characteristics
Figure 8. Saturation Characteristics
8
1.6
NORMALIZED DRAIN TO SOURCE
ON RESISTANCE
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
ID = 35A
rDS(ON), DRAIN TO SOURCE
ON RESISTANCE (mΩ)
100
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 5. Forward Bias Safe Operating Area
ID , DRAIN CURRENT (A)
STARTING TJ = 150oC
6
4
ID = 1A
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
1.4
1.2
1.0
0.8
VGS = 10V, ID = 35A
2
2
4
6
8
10
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 9. Drain to Source On Resistance vs Gate
Voltage and Drain Current
©20048Fairchild Semiconductor Corporation
0.6
-80
-40
0
40
80
120
TJ, JUNCTION TEMPERATURE (oC)
160
200
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
FDD8870 / FDU8870 Rev. 1.2
FDD8870 / FDU8870
Typical Characteristics TC = 25°C unless otherwise noted
1.2
1.2
ID = 250µA
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
NORMALIZED GATE
THRESHOLD VOLTAGE
VGS = VDS, ID = 250µA
1.0
0.8
0.6
0.4
-80
-40
0
40
80
120
160
1.1
1.0
0.9
-80
200
-40
TJ, JUNCTION TEMPERATURE (oC)
Figure 11. Normalized Gate Threshold Voltage vs
Junction Temperature
80
120
160
200
10
VDD = 15V
CRSS = CGD
VGS , GATE TO SOURCE VOLTAGE (V)
CISS = CGS + CGD
C, CAPACITANCE (pF)
40
Figure 12. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
10000
COSS ≅ CDS + CGD
1000
VGS = 0V, f = 1MHz
400
0.1
0
TJ , JUNCTION TEMPERATURE (oC)
8
6
4
WAVEFORMS IN
DESCENDING ORDER:
ID = 35A
ID = 5A
2
0
1
10
VDS , DRAIN TO SOURCE VOLTAGE (V)
Figure 13. Capacitance vs Drain to Source
Voltage
©2004 Fairchild Semiconductor Corporation
30
0
20
40
60
Qg, GATE CHARGE (nC)
80
100
Figure 14. Gate Charge Waveforms for Constant
Gate Current
FDD8870 / FDU8870 Rev. 1.2
VDS
BVDSS
tP
L
VDS
VARY tP TO OBTAIN
IAS
+
RG
REQUIRED PEAK IAS
VDD
VDD
-
VGS
DUT
tP
IAS
0V
0
0.01Ω
tAV
Figure 15. Unclamped Energy Test Circuit
Figure 16. Unclamped Energy Waveforms
VDS
VDD
Qg(TOT)
VDS
L
VGS
VGS = 10V
VGS
Qg(5)
+
Qgs2
VDD
VGS = 5V
DUT
VGS = 1V
Ig(REF)
0
Qg(TH)
Qgs
Qgd
Ig(REF)
0
Figure 17. Gate Charge Test Circuit
Figure 18. Gate Charge Waveforms
VDS
tON
tOFF
td(ON)
td(OFF)
RL
tf
tr
VDS
90%
90%
+
VGS
VDD
-
10%
10%
0
DUT
90%
RGS
VGS
VGS
0
Figure 19. Switching Time Test Circuit
©2008 Fairchild Semiconductor Corporation
50%
10%
50%
PULSE WIDTH
Figure 20. Switching Time Waveforms
FDD8870 / FDU8870 Rev. 1.2
FDD8870 / FDU8870
Test Circuits and Waveforms
FDD8870 / FDU8870
Thermal Resistance vs. Mounting Pad Area
( T JM – TA )
P DM = ----------------------------Rθ JA
(EQ. 1)
In us ing surf ace m ount dev ices s uch as t he T O-252
package, the environment in which it is applied will have a
significant inf luence on t he part’s cur rent and m aximum
power dissipat ion ratings. Precise det ermination of P DM is
complex and influenced by many factors:
1. Mounting pad area onto which the device is attached and
whether there is copper on one side or both sides of the
board.
125
RθJA = 33.32+ 23.84/(0.268+Area) EQ.2
RθJA = 33.32+ 154/(1.73+Area) EQ.3
100
RθJA (oC/W)
The max imum rated junct ion temperature, T JM, and t he
thermal resist ance of t he heat dissipating pat h determines
the maximum allowable device power dissipation, PDM, in an
application.
Therefore t he application’s ambient
temperature, T A (oC), and t hermal res istance R θJA (oC/W)
must be rev iewed t o ens ure t hat T JM is never ex ceeded.
Equation 1 mat hematically represents the relationship and
serves as the basis for establishing the rating of the part.
75
50
25
0.01
(0.0645)
0.1
(0.645)
1
10
(6.45)
(64.5)
AREA, TOP COPPER AREA in2 (cm2)
Figure 21. Thermal Resistance vs Mounting
Pad Area
2. T he number of copper layers and t he t hickness of the
board.
3. The use of external heat sinks.
4. The use of thermal vias.
5. Air flow and board orientation.
6. For non st eady state applicat ions, t he pulse widt h, t he
duty cycle and the transient thermal response of the part,
the board and the environment they are in.
Fairchild provides t hermal i nformation t o as sist the
designer’s preliminary application evaluat ion. F igure 21
defines t he R θJA f or t he device as a f unction of t he top
copper (component s ide) area. T his is f or a horizont ally
positioned FR-4 board with 1oz copper after 1000 seconds
of steady state power with no air flow. This graph prov ides
the necessary information for calculation of the steady state
junction temperature or power
dissipat ion. P ulse
applications can be ev aluated us ing t he F airchild dev ice
Spice thermal model o r m anually ut ilizing the norm alized
maximum transient thermal impedance curve.
Thermal res istances c orresponding t o ot her c opper area s
can be obt ained f rom Figure 21 or by calc ulation using
Equation 2 or 3. Equation 2 is used for copper area defined
in inches square and equation 3 is for area in c entimeters
square. The area, in square inches or square centimeters is
the top copper area including the gate and source pads.
23.84
( 0.268 + Area )
R θ JA = 33.32 + -------------------------------------
(EQ. 2)
Area in Inches Squared
154
( 1.73 + Area )
R θ JA = 33.32 + ----------------------------------
(EQ. 3)
Area in Centimeters Squared
©2008 Fairchild Semiconductor Corporation
FDD8870 / FDU8870 Rev. 1.2
LDRAIN
DPLCAP
10
Dbody 7 5 DbodyMOD
Dbreak 5 11 DbreakMOD
Dplcap 10 5 DplcapMOD
RLDRAIN
RSLC1
51
5
51
EVTHRES
+ 19 8
+
LGATE
GATE
1
Lgate 1 9 5e-9
Ldrain 2 5 1.0e-9
Lsource 3 7 2e-9
EVTEMP
RGATE +
18 22
9
20
21
11
+
17
EBREAK 18
-
16
DBODY
MWEAK
6
MMED
MSTRO
RLGATE
LSOURCE
CIN
8
7
SOURCE
3
RSOURCE
RLSOURCE
RLgate 1 9 50
RLdrain 2 5 10
RLsource 3 7 20
Mmed 16 6 8 8 MmedMOD
Mstro 16 6 8 8 MstroMOD
Mweak 16 21 8 8 MweakMOD
ESLC
50
RDRAIN
6
8
ESG
DBREAK
+
RSLC2
Ebreak 11 7 17 18 32.7
Eds 14 8 5 8 1
Egs 13 8 6 8 1
Esg 6 10 6 8 1
Evthres 6 21 19 8 1
Evtemp 20 6 18 22 1
It 8 17 1
DRAIN
2
5
S1A
12
S2A
13
8
17
18
RVTEMP
S2B
13
19
CB
6
8
VBAT
5
8
EDS
-
IT
14
+
+
EGS
Rbreak 17 18 RbreakMOD 1
Rdrain 50 16 RdrainMOD 1.57e-3
Rgate 9 20 2.1
RSLC1 5 51 RSLCMOD 1e-6
RSLC2 5 50 1e3
Rsource 8 7 RsourceMOD 1.2e-3
Rvthres 22 8 RvthresMOD 1
Rvtemp 18 19 RvtempMOD 1
S1a 6 12 13 8 S1AMOD
S1b 13 12 13 8 S1BMOD
S2a 6 15 14 13 S2AMOD
S2b 13 15 14 13 S2BMOD
15
14
13
S1B
CA
RBREAK
-
+
8
22
RVTHRES
Vbat 22 19 DC 1
ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*500),10))}
.MODEL DbodyMOD D (IS=1.3E-11 IKF=10 N=1.01 RS=1.8e-3 TRS1=8e-4 TRS2=2e-7
+ CJO=2e-9 M=0.57 TT=1e-10 XTI=0.9)
.MODEL DbreakMOD D (RS=8e-2 TRS1=1e-3 TRS2=-8.9e-6)
.MODEL DplcapMOD D (CJO=1.6e-9 IS=1e-30 N=10 M=0.38)
.MODEL MmedMOD NMOS (VTO=1.76 KP=10 IS=1e-30 N=10 TOX=1 L=1u W=1u RG=2.1 T_ABS=25)
.MODEL MstroMOD NMOS (VTO=2.2 KP=650 IS=1e-30 N=10 TOX=1 L=1u W=1u T_ABS=25)
.MODEL MweakMOD NMOS (VTO=1.47 KP=0.05 IS=1e-30 N=10 TOX=1 L=1u W=1u RG=21 RS=0.1 T_ABS=25)
.MODEL RbreakMOD RES (TC1=8.3e-4 TC2=-4e-7)
.MODEL RdrainMOD RES (TC1=2e-4 TC2=8e-6)
.MODEL RSLCMOD RES (TC1=9e-4 TC2=1e-6)
.MODEL RsourceMOD RES (TC1=8e-3 TC2=1e-6)
.MODEL RvthresMOD RES (TC1=-2e-3 TC2=-9.5e-6)
.MODEL RvtempMOD RES (TC1=-2.6e-3 TC2=2e-7)
.MODEL S1AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-4 VOFF=-3)
.MODEL S1BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-3 VOFF=-4)
.MODEL S2AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-2 VOFF=-0.5)
.MODEL S2BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-0.5 VOFF=-2)
.ENDS
Note: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global
Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank
Wheatley.
©2008 Fairchild Semiconductor Corporation
FDD8870 / FDU8870 Rev. 1.2
FDD8870 / FDU8870
PSPICE Electrical Model
.SUBCKT FDD8870 2 1 3 ; rev July 2003
Ca 12 8 4.2e-9
Cb 15 14 4.2e-9
Cin 6 8 4.7e-9
dp.dbody n7 n5 = model=dbodymod
dp.dbreak n5 n11 = model=dbreakmod
dp.dplcap n10 n5 = model=dplcapmod
spe.ebreak n11 n7 n17 n18 = 32.7 GATE
spe.eds n14 n8 n5 n8 = 1
1
spe.egs n13 n8 n6 n8 = 1
spe.esg n6 n10 n6 n8 = 1
spe.evthres n6 n21 n19 n8 = 1
spe.evtemp n20 n6 n18 n22 = 1
RDRAIN
6
8
ESG
EVTHRES
+ 19 8
+
LGATE
DBREAK
50
-
EVTEMP
RGATE +
18 22
9
20
21
11
DBODY
16
MWEAK
6
EBREAK
+
17
18
-
MMED
MSTRO
RLGATE
CIN
DRAIN
2
8
LSOURCE
7
SOURCE
3
RSOURCE
RLSOURCE
i.it n8 n17 = 1
S1A
12
l.lgate n1 n9 = 5e-9
l.ldrain n2 n5 = 1.0e-9
l.lsource n3 n7 = 2e-9
res.rlgate n1 n9 = 50
res.rldrain n2 n5 = 10
res.rlsource n3 n7 = 20
S2A
14
13
13
8
S1B
CA
RBREAK
15
17
18
RVTEMP
S2B
13
CB
6
8
EGS
19
-
IT
14
+
+
VBAT
5
8
EDS
-
m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u, temp=m_temp
m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u, temp=m_temp
m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u, temp=m_temp
+
8
22
RVTHRES
res.rbreak n17 n18 = 1, tc1=8.3e-4,tc2=-4e-7
res.rdrain n50 n16 = 1.57e-3, tc1=2e-4,tc2=8e-6
res.rgate n9 n20 = 2.1
res.rslc1 n5 n51 = 1e-6, tc1=9e-4,tc2=1e-6
res.rslc2 n5 n50 = 1e3
res.rsource n8 n7 = 1.2e-3, tc1=8e-3,tc2=1e-6
res.rvthres n22 n8 = 1, tc1=-2e-3,tc2=-9.5e-6
res.rvtemp n18 n19 = 1, tc1=-2.6e-3,tc2=2e-7
sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod
sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod
sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod
sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod
v.vbat n22 n19 = dc=1
equations {
i (n51->n50) +=iscl
iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/500))** 10))
}
}
©2008 Fairchild Semiconductor Corporation
FDD8870 / FDU8870 Rev. 1.2
FDD8870 / FDU8870
SABER Electrical Model
rev July 2003
template FDD8870 n2,n1,n3 =m_temp
electrical n2,n1,n3
number m_temp=25
{
var i iscl
dp..model dbodymod = (isl=1.3e-11,ikf=10,nl=1.01,rs=1.8e-3,trs1=8e-4,trs2=2e-7,cjo=2e-9,m=0.57,tt=1e-10,xti=0.9)
dp..model dbreakmod = (rs=8e-2,trs1=1e-3,trs2=-8.9e-6)
dp..model dplcapmod = (cjo=1.6e-9,isl=10e-30,nl=10,m=0.38)
m..model mmedmod = (type=_n,vto=1.76,kp=10,is=1e-30, tox=1)
m..model mstrongmod = (type=_n,vto=2.2,kp=650,is=1e-30, tox=1)
m..model mweakmod = (type=_n,vto=1.47,kp=0.05,is=1e-30, tox=1,rs=0.1)
LDRAIN
sw_vcsp..model s1amod = (ron=1e-5,roff=0.1,von=-4,voff=-3)
DPLCAP 5
sw_vcsp..model s1bmod = (ron=1e-5,roff=0.1,von=-3,voff=-4)
10
sw_vcsp..model s2amod = (ron=1e-5,roff=0.1,von=-2,voff=-0.5)
RLDRAIN
RSLC1
sw_vcsp..model s2bmod = (ron=1e-5,roff=0.1,von=-0.5,voff=-2)
51
c.ca n12 n8 = 4.2e-9
RSLC2
c.cb n15 n14 = 4.2e-9
ISCL
c.cin n6 n8 = 4.7e-9
th
JUNCTION
FDD8870T
CTHERM1 TH 6 1e-3
CTHERM2 6 5 2e-3
CTHERM3 5 4 3e-3
CTHERM4 4 3 9e-3
CTHERM5 3 2 1e-2
CTHERM6 2 TL 2e-2
RTHERM1
CTHERM1
6
RTHERM1 TH 6 3e-2
RTHERM2 6 5 8e-2
RTHERM3 5 4 1.1e-1
RTHERM4 4 3 1.6e-1
RTHERM5 3 2 1.72e-1
RTHERM6 2 TL 2e-1
RTHERM2
CTHERM2
5
SABER Thermal Model
SABER thermal model FDD8870T
template thermal_model th tl
thermal_c th, tl
{
ctherm.ctherm1 th 6 =1e-3
ctherm.ctherm2 6 5 =2e-3
ctherm.ctherm3 5 4 =3e-3
ctherm.ctherm4 4 3 =9e-3
ctherm.ctherm5 3 2 =1e-2
ctherm.ctherm6 2 tl =2e-2
rtherm.rtherm1 th 6 =3e-2
rtherm.rtherm2 6 5 =8e-2
rtherm.rtherm3 5 4 =1.1e-1
rtherm.rtherm4 4 3 =1.6e-1
rtherm.rtherm5 3 2 =1.72e-1
rtherm.rtherm6 2 tl =2e-1
}
RTHERM3
CTHERM3
4
CTHERM4
RTHERM4
3
CTHERM5
RTHERM5
2
CTHERM6
RTHERM6
tl
©2008 Fairchild Semiconductor Corporation
CASE
FDD8870 / FDU8870 Rev. 1.2
FDD8870 / FDU8870
PSPICE Thermal Model
REV 23 July 2003
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