FOD420

6  DIP 随 Triac 驱  FOD420, FOD4208, FOD4216, FOD4218 说 FOD420、FOD4208、FOD4216 FOD4218    ，  SCR   ， !" #。FOD4216  FOD4218 % &'()* +。, -.6 /01(DIP) 2。 www.onsemi.cn PDIP6 GW CASE 709AG 6 1  PDIP6 7.3x6.5, 2.54P CASE 646CE 6 •3300 mApeak 4 •356 1 ♦3600 V (FOD420, FOD4216) V (FOD4208, FOD4218) •3*+ ♦31.3 mA (FOD4216, FOD4218) ♦32 mA (FOD420, FOD4208) •3 4 dv/dt dv/dt (10,000 V/ms) •378!"#$： ♦3UL1577, 5,000 VACRMS (1 !&) ♦3DIN−EN/IEC60747−5−5 • 9',() RoHS -. ♦3800 PDIP6 7.3x6.5, 2.54P CASE 646CF 6 1 MARKING DIAGRAM ON FOD420 V X YY D ON = ON Semiconductor Logo FOD420 = Device Number V = VDE mark. DIN EN/IEC60747−5−5 Option (only appears on component ordered with this option) X = One−Digit Year Code YY = Digit Work Week D = Assembly Package Code  •3? •3+@? •3 4#, •3AC A   ANODE 1 CATHODE 2 N/C 3 6 MAIN TERM. 5 NC* 4 MAIN TERM. *DO NOT CONNECT (TRIAC SUBSTRATE) ORDERING INFORMATION See detailed ordering and shipping information on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2018 August, 2020 − Rev. 4 1 Publication Order Number: FOD4218CN/D FOD420, FOD4208, FOD4216, FOD4218     0110/1.89  1 ，    < 150 VRMS I–IV < 300 VRMS I–IV 55/100/21  2 (DIN VDE 0110/1.89) 175  !" # $ !"#$， tm = 10 s， 1360 Vpeak ， B， VIORM x 1.875 = VPR，100% ( ， tm = 1 s， %&' < 5 pC 1594 Vpeak VIORM )*+,- 850 Vpeak VIOTM )./0 6000 Vpeak 1&234 ≥7 mm 1&,-56 ≥7 mm ,-7834 (,- 9) ≥0.4 mm :; ( ( \X 300 mApeak de (25°C lm;9@) \X 450 mW f0 25°C @g \X 5.9 mW/°C PD(DETECTOR) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. (#yz{) |}f0)* $%~，G&€'‚。|}f0()ƒ*K，„…†G€，&€'‡ˆG‚，‰Š &‹N。 www.onsemi.cn 3 FOD420, FOD4208, FOD4216, FOD4218 *+ (VWXYZ， TA = 25°C) !"  ,试-) ) &.# /0# &'# $ 123) 456 VF jk IF = 20 mA \X − 1.28 1.50 V IR !k> VR = 6 V \X − 0.01 10 mA qAn>，(+k IF = 0, TA = 100°C ( n ,/0Œ IF = 0 A ( qLo，(+k 4p = 5 V (，(+k VT = 3 V \X − IL ‘> VT = 2.2 V \X − 5 − mA tON ‡L@5 PF = 1.0, IT = 300 mA VRM = VDM = 424 VAC FOD420, FOD4216, FOD4218 − 60 − ms VRM = VDM = 565 VAC FOD4208 tOFF n@5 VRM = VDM = 424 VAC FOD420, FOD4216, FOD4218 − 52 − ms VRM = VDM = 565 VAC FOD4208 dv/dtC ’>@0Œ,/? VD = 230 VRMS, ID = 300 mAPK \X − 10 − V/ms di/dtC Lo>0Œ,/? VD = 230 VRMS, ID = 300 mAPK \X − 9 − A/ms F / ,/ 0Œ IT = 0 A, VRM = VDM = 424 VAC \X 10,000 − − V/ms f = 60 Hz, t = 1 • ( 1.3 mA）9,°)* IF (60 mA) 5。 5. ”4 VISO ˜&G=²?7 。°³，_` 1、2 " 3 @I，_` 4、5 " 6 @I。5,000 VACRMS i 1 •´ 6,000 VACRMS i 1 c•。 www.onsemi.cn 4 FOD420, FOD4208, FOD4216, FOD4218 /0 Figure 1 shows a typical circuit for when hot line switching is required. In this circuit the “hot” side of the line is switched and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line. Rin is calculated so that IF is equal to the rated IFT of the VCC Rin 1 2 3 6 FOD420 FOD4208 FOD4216 FOD4218 part, 2 mA for FOD420 and FOD4208, 1.3 mA for FOD4216 and FOD4218. The 39 W resistor and 0.01 mF capacitor are for snubbing of the triac and may or may not be necessary depending upon the particular triac and load use. 360 W HOT 5 FKPF12N80 39 W* 4 240 VAC 0.01 mF 330 W LOAD NEUTRAL Figure 1. Hot−Line Switching Application Circuit 240 VAC R1 1 VCC Rin 2 3 D1 6 FOD420 FOD4208 FOD4216 FOD4218 SCR 5 4 SCR 360 W R2 D2 LOAD Figure 2. Inverse−Parallel SCR Driver Circuit Suggested method of firing two, back−to−back SCR’s with On Semiconductor triac driver. Diodes can be 1N4001; resistors, R1 and R2, are optional 330 W. NOTE: This optoisolator should not be used to drive a load directly. It is intended to be a discrete triac driver device only. www.onsemi.cn 5 FOD420, FOD4208, FOD4216, FOD4218 IFT – NORMALIZED LED TRIGGER CURRENT /08 VF – FORWARD VOLTAGE (V) 1.8 1.6 1.4 −55°C 1.2 25°C 1.0 85°C 0.8 0.6 0.1 1 10 IF – FORWARD CURRENT (mA) 100 1.6 1.4 1.2 1.0 0.8 0.6 −60 −40 Figure 3. Forward Voltage (VF) vs. Forward Current (IF) 100 t Duty Factor 0.005 0.01 1000 0.02 0.05 0.1 0.1 0.2 0.2 0.5 0.5 100 10 10 −6 10 −5 t t DF = t 10 −4 10 −3 10 −2 10 −1 t – LED PULSE DURATION (s) 10 0 10 1 10 1 1.4 1.3 1.2 1.1 1.0 0.9 0 200 400 600 800 PW – PULSE WIDTH (ms) 100 1000 ITM – ON−STATE CURRENT (mA) IFTH(PW) / IFTH(DC) − NORMALIZED IFTH 1.5 10 IFT / IF – NORMALIZED IF (mA) 1 Figure 6. Trigger Delay Time VL = 250 VP−P F = 60 Hz Normalized to DC 1.6 100 TD = t (IF / IFT 25°C) VD = 400 VP−P F = 60 Hz Figure 5. Peak LED Current vs. Duty Factor, Tau 1.7 −20 0 20 40 60 80 TA – AMBIENT TEMPERATURE (°C) Figure 4. Normalized LED Trigger Current (IFT) vs. Ambient Temperature (TA) tD – DELAY TIME (ms) If(pk) – PEAK LED CURRENT (mA) 10000 VAK = 5.0 V Normalized to TA = 25°C 100 10 1 1000 Figure 7. Pulse Trigger Current TA = 100°C 0 1 TA = 25°C 5 2 3 4 VTM – ON−STATE VOLTAGE (V) Figure 8. On−State Voltage (VTM) vs. On−State Current (ITM) www.onsemi.cn 6 6 FOD420, FOD4208, FOD4216, FOD4218 IDRM – NORMALIZED OFF−STATE CURRENT 2.2 Normalized to to TA = 25°C 2.0 1.8 1.6 1.4 1.2 1.0 0.8 −60 −40 −20 0 20 40 60 80 100 (b,µ) 10 VD = 800 V, IBD (mA) Normalized to to TA = 25°C 1 0.1 −60 −40 TA – AMBIENT TEMPERATURE (°C) −20 0 ITP = f (TA) 300 250 200 150 100 −20 40 60 80 100 Figure 10. Normalized Off−State Current (IDRM) vs. Ambient Temperature (TA) 350 50 −60 −40 20 TA – AMBIENT TEMPERATURE (°C) Figure 9. Normalized Holding Current (IH) vs. Ambient Temperature (TA) ITP – PEAK ON−STATE CURRENT (mA) IH – NORMALIZED HOLDING CURRENT /0 0 20 40 60 TA – AMBIENT TEMPERATURE (°C) Figure 11. Current Reduction www.onsemi.cn 7 80 100 FOD420, FOD4208, FOD4216, FOD4218 REFLOW PROFILE 245°C, 10 to 30 seconds Temperature (°C) 300 260°C peak 250 200 150 Time above 183°C, < 160 seconds 100 50 Ramp up = 2 to 10°C/second 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute) •Peak reflow temperature: 262°C (package surface temperature) •Time of temperature higher than 183°C for 160 seconds or less •One time soldering reflow is recommended Figure 12. Reflow Profile 订购:; 部)