Ordering number : ENA1956A
LC87FBK08A
CMOS IC
8K-byte FROM and 256-byte RAM integrated
http://onsemi.com
8-bit 1-chip Microcontroller
Overview
TheLC87FBK08A is an 8-bit microcontroller that, centered around a CPU running at a minimum bus cycle time of
83.3ns, integrates on a single chip a number of hardware features such as 8K-byte flash ROM (On-boardprogrammable), 256-byte RAM, an On-chip-debugger, sophisticated 16-bit timers/counters (may be divided into 8-bit
timers), a 16-bit timer/counter (may be divided into 8-bit timers/counters or 8-bit PWMs), two 8-bit timers with a
prescaler, a base timer serving as a time-of-day clock, an asynchronous/synchronous SIO interface, a 12-bit/8-bit 8channel AD converter, a system clock frequency divider, an internal high-accuracy oscillator, an internal reset and a
15-source 9-vector interrupt feature.
Features
Flash ROM
• Capable of On-board programming with wide range (2.7 to 5.5V) of voltage source.
• Block-erasable in 128 byte units
• Writable in 2-byte units
• 8192 × 8 bits
RAM
• 256 × 9 bits
Minimum Bus Cycle
• 83.3ns (12MHz at VDD=2.7V to 5.5V)
Note: The bus cycle time here refers to the ROM read speed.
* This product is licensed from Silicon Storage Technology, Inc. (USA).
Semiconductor Components Industries, LLC, 2013
May, 2013
Ver.1.03
51712HKIM 20120427-S00002 No.A1956-1/28
LC87FBK08A
Minimum Instruction Cycle Time
• 250ns (12MHz at VDD=2.7V to 5.5V)
Ports
• Normal withstand voltage I/O ports
Ports I/O direction can be designated in 1-bit units
Ports I/O direction can be designated in 4-bit units
• Dedicated oscillator ports/input ports
• Reset pin
• Power pins
12 (P1n, P20, P21, P70, CF2/XT2)
8 (P0n)
1 (CF1/XT1)
1 (RES)
2 (VSS1, VDD1)
Timers
• Timer 0: 16-bit timer/counter with a capture register.
Mode 0: 8-bit timer with an 8-bit programmable prescaler (with an 8-bit capture register) × 2 channels
Mode 1: 8-bit timer with an 8-bit programmable prescaler (with an 8-bit capture register)
+ 8-bit counter (with an 8-bit capture register)
Mode 2: 16-bit timer with an 8-bit programmable prescaler (with a 16-bit capture register)
Mode 3: 16-bit counter (with a 16-bit capture register)
• Timer 1: 16-bit timer/counter that supports PWM/toggle outputs
Mode 0: 8-bit timer with an 8-bit prescaler (with toggle outputs) + 8-bit timer/
counter with an 8-bit prescaler (with toggle outputs)
Mode 1: 8-bit PWM with an 8-bit prescaler × 2 channels
Mode 2: 16-bit timer/counter with an 8-bit prescaler (with toggle outputs)
(toggle outputs also possible from the lower-order 8 bits)
Mode 3: 16-bit timer with an 8-bit prescaler (with toggle outputs)
(The lower-order 8 bits can be used as PWM)
• Timer 6: 8-bit timer with a 6-bit prescaler (with toggle outputs)
• Timer 7: 8-bit timer with a 6-bit prescaler (with toggle outputs)
• Base timer
1) The clock is selectable from the subclock (32.768kHz crystal oscillation), system clock, and timer 0 prescaler
output.
2) Interrupts are programmable in 5 different time schemes
SIO
• SIO1: 8-bit asynchronous/synchronous serial interface
Mode 0: Synchronous 8-bit serial I/O (2- or 3-wire configuration, 2 to 512 tCYC transfer clocks)
Mode 1: Asynchronous serial I/O (half-duplex, 8 data bits, 1 stop bit, 8 to 2048 tCYC baudrates)
Mode 2: Bus mode 1 (start bit, 8 data bits, 2 to 512 tCYC transfer clocks)
Mode 3: Bus mode 2 (start detect, 8 data bits, stop detect)
AD Converter: 12 bits/8 bits × 8 channels
• 12 bits/8 bits AD converter resolution selectable
Remote Control Receiver Circuit (sharing pins with P15, SCK1, INT3, and T0IN)
• Noise rejection function (noise filter time constant selectable from 1 tCYC, 32 tCYC, and 128 tCYC)
Clock Output Function
• Capable generating clock outputs with a frequency of 1/1, 1/2, 1/4, 1/8, 1/16, 1/32, 1/64 of the source clock selected
as the system clock.
• Capable generating the source clock for the subclock
Watchdog Timer
• Capable generating an internal reset on an overflow of a timer running on the low-speed RC oscillator clock or
subclock.
• Operating mode at standby is selectable from 3 modes (continue counting/stop operation/stop counting with a
count value held).
No.A1956-2/28
LC87FBK08A
Interrupts
• 15 sources, 9 vector addresses
1) Provides three levels (low (L), high (H), and highest (X)) of multiplex interrupt control. Any interrupt requests of
the level equal to or lower than the current interrupt are not accepted.
2) When interrupt requests to two or more vector addresses occur at the same time, the interrupt of the highest level
takes precedence over the other interrupts. For interrupts of the same level, the interrupt into the smallest vector
address takes precedence.
No.
Vector Address
Level
Interrupt Source
1
00003H
X or L
INT0
2
0000BH
X or L
INT1
3
00013H
H or L
INT2/T0L/INT4
4
0001BH
H or L
INT3/base timer
5
00023H
H or L
T0H
6
0002BH
H or L
T1L/T1H
7
00033H
H or L
None
8
0003BH
H or L
SIO1
9
00043H
H or L
ADC/T6/T7
10
0004BH
H or L
Port 0
• Priority levels X > H > L
• Of interrupts of the same level, the one with the smallest vector address takes precedence.
Subroutine Stack Levels: 128levels (The stack is allocated in RAM.)
High-speed Multiplication/Division Instructions
• 16 bits × 8 bits
(5 tCYC execution time)
• 24 bits × 16 bits
(12 tCYC execution time)
• 16 bits ÷ 8 bits
(8 tCYC execution time)
• 24 bits ÷ 16 bits
(12 tCYC execution time)
Oscillation Circuits
• Internal oscillation circuits
Low-speed RC oscillation circuit (SRC):
For system clock / For Watchdog timer (100kHz)
Medium-speed RC oscillation circuit (RC):
For system clock (1MHz)
Frequency variable RC oscillation circuit (MRC): For system clock (8MHz±2.5%, Ta=-10°C to +85°C)
• External oscillation circuits
Hi-speed CF oscillation circuit (CF):
For system clock, with internal Rf
Low speed crystal oscillation circuit (X’tal):
For low-speed system clock / For Watchdog timer,
with internal Rf
1) The CF and crystal oscillation circuits share the same pins. The active circuit is selected under program control.
2) Both the CF and crystal oscillator circuits stop operation on a system reset. After reset is released, oscillation
is stopped so start the oscillation operation by program.
System Clock Divider Function
• Can run on low current.
• The minimum instruction cycle selectable from 300ns, 600ns, 1.2μs, 2.4μs, 4.8μs, 9.6μs, 19.2μs, 38.4μs, and
76.8μs (at a main clock rate of 10MHz).
Internal Reset Function
• Power-on reset (POR) function
1) POR reset is generated only at power-on time.
2) The POR release level can be selected from 4 levels (2.57V, 2.87V, 3.86V, and 4.35V) through option
configuration.
• Low-voltage detection reset (LVD) function
1) LVD and POR functions are combined to generate resets when power is turned on and when power voltage falls
below a certain level.
2) The use or disuse of the LVD function and the low voltage threshold level (3 levels: 2.81V, 3.79V, 4.28V) can be
selected by optional configuration.
No.A1956-3/28
LC87FBK08A
Standby Function
• HALT mode: Halts instruction execution while allowing the peripheral circuits to continue operation.
1) Oscillation is not halted automatically.
2) There are four ways of resetting the HALT mode.
(1) Setting the reset pin to the low level
(2) System resetting by low-voltage detection
(3) System resetting by watchdog timer
(4) Occurrence of an interrupt
• HOLD mode: Suspends instruction execution and the operation of the peripheral circuits.
1) The CF, low-/medium-/ Frequency variable RC, and crystal oscillators automatically stop operation.
Note: The oscillation of the low-speed RC oscillator is also controlled directly by the watchdog timer and its
standby-mode-time oscillation is also controlled.
2) There are five ways of resetting the HOLD mode.
(1) Setting the reset pin to the lower level.
(2) System resetting by low-voltage detection
(3) System resetting by watchdog timer
(4) Having an interrupt source established at either INT0, INT1, INT2, INT4
* INT0 and INT1 HOLD mode reset is available only when level detection is set.
(5) Having an interrupt source established at port 0.
• X'tal HOLD mode: Suspends instruction execution and the operation of the peripheral circuits except the base timer.
1) The CF, low-/medium-/ Frequency variable RC oscillators automatically stop operation.
Note: The oscillation of the low-speed RC oscillator is also controlled directly by the watchdog timer and its
standby-mode-time oscillation is also controlled.
2) The state of crystal oscillation established when the X'tal HOLD mode is entered is retained.
3) There are six ways of resetting the X'tal HOLD mode.
(1) Setting the reset pin to the low level.
(2) System resetting by watchdog timer or low-voltage detection.
(3) System resetting by watchdog timer or low-voltage detection.
(4) Having an interrupt source established at either INT0, INT1, INT2, INT4
* INT0 and INT1 HOLD mode reset is available only when level detection is set.
(5) Having an interrupt source established at port 0.
(6) Having an interrupt source established in the base timer circuit.
Note: Available only when X’tal oscillation is selected.
Onchip Debugger (flash versions only)
• Supports software debugging with the IC mounted on the target board.
• Software break point setting for debugger.
• Stepwise execution on debugger.
• Real time RAM data monitoring function on debugger.
All the RAM data map can be monitored on screen when the program is running.
(The RAM & SFR data can be changed by screen patch when the program is running)
• Two channels of on-chip debugger pins are available to be compatible with small pin count devices.
DBGP0 (P0), DBGP1 (P1)
Data Security Function (flash versions only)
• Protects the program data stored in flash memory from unauthorized read or copy.
Note: This data security function does not necessarily provide absolute data security.
Package Form
• MFP24S (300mil) : Lead-/Halogen-free type (discontinued)
• SSOP24 (225mil) : Lead-/Halogen-free type
• SSOP24 (275mil) : Lead-/Halogen-free type (build-to-order)
• VCT24 (3mm×3mm) : Lead-/Halogen-free type (build-to-order)
Development Tools
• On-chip-debugger : (1) TCB87 TypeB + LC87FBK08A
(2) TCB87 TypeC (3 wire version) + LC87FBK08A
No.A1956-4/28
LC87FBK08A
Flash ROM Programming Boards
Package
Programming boards
MFP24S(300mil)
W87F2GM
SSOP24(225mil)
W87F2GS
SSOP24(275mil)
(build-to-order)
VCT24(3mm×3mm)
(build-to-order)
Flash ROM Programmer
Maker
Model
Single
AF9709/AF9709B/AF9709C
Programmer
(Including Ando Electric Co., Ltd. models)
Gang
(Including Ando Electric Co., Ltd. models)
AF9723/AF9723B(Main body)
Flash Support Group, Inc.
(FSG)
Programmer
AF9833(Unit)
(Including Ando Electric Co., Ltd. models)
Flash Support Group, Inc.
(FSG)
+
Our company
Device
Rev 03.28 or later
87F008SU
-
-
-
-
(Note 2)
-
AF9101/AF9103(Main body)
In-circuit
Programmer
(FSG models)
SIB87(Inter Face Driver)
(Our company model)
(Note 1)
Our company
Supported version
Single/Gang
SKK / SKK Type B / SKK Type C
Programmer
(SanyoFWS)
1.06 or later
In-circuit/Gang
SKK-DBG Type B / SKK-DBG Type C
Chip Data Version
Programmer
(SanyoFWS)
2.34 or later
Application Version
LC87FBK08
For information about AF-Series:
Flash Support Group, Inc.
TEL: +81-53-459-1050
E-mail: sales@j-fsg.co.jp
Note1: On-board-programmer from FSG (AF9101/AF9103) and serial interface driver from Our company (SIB87)
together
can give a PC-less, standalone on-board-programming capabilities.
Note2: It needs a special programming devices and applications depending on the use of programming environment.
Please ask FSG or Our company for the information.
No.A1956-5/28
LC87FBK08A
Package Dimensions
Package Dimensions
unit : mm (typ)
3112B
unit : mm (typ)
3287
6.5
12.5
1.0
0.5
0.63
6.4
12
13
4.4
1
24
7.6
13
5.4
24
12
1
0.15
0.35
(0.75)
0.15
0.22
0.5
0.1
0.1
(1.3)
1.5max
1.7max
(1.5)
(0.5)
SANYO : MFP24S(300mil)
SANYO : SSOP24(225mil)
Package Dimensions
Package Dimensions
unit : mm (typ)
3175C
unit : mm (typ)
3366
TOP VIEW
7.8
24
SIDE VIEW
BOTTOM VIEW
13
3.0
0.4
0.5
5.6
7.6
(C0.14)
12
1
0.65
24
0.15
2 1
0.19
0.22
0.4
(0.5)
(0.035)
0.8
1.5max
(1.3)
SIDE VIEW
0.1
(0.33)
(0.09)
(0.125)
3.0
SANYO : VCT24(3.0X3.0)
SANYO : SSOP24(275mil)
No.A1956-6/28
LC87FBK08A
Pin Assignment
P70/INT0/T0LCP/AN8
1
24
P07/T7O/DBGP02
RES
2
23
P06/AN6/T6O/DBGP01
VSS1
3
22
P05/AN5/CKO/DBGP00
CF1/XT1
4
21
P04/AN4
CF2/XT2
5
20
P03/AN3
VDD1
6
19
P02/AN2
P10
7
18
P01/AN1
P11
8
17
P00/AN0
P12
9
16
P21/INT4/T1IN
P13/SO1/DBGP12
10
15
P20/INT4/T1IN
P14/SI1/SB1/DBGP11
11
14
P17/T1PWMH/BUZ/INT1/T0HCP
P15/SCK1/INT3/T0IN/DBGP10
12
13
P16/T1PWML/INT2/T0IN
LC87FBK08A
Top view
MFP24S(300mil)/SSOP24(225mil) “Lead-/Halogen-free Type”
SSOP24(275mil) “Lead-/Halogen-free Type”
MFP24S
SSOP24
NAME
MFP24S
SSOP24
NAME
1
P70/INT0/T0LCP/AN8
13
P16/T1PWML/INT2/T0IN
2
RES
14
P17/T1PWMH/BUZ/INT1/T0HCP
3
VSS1
15
P20/INT4/T1IN
4
CF1/XT1
16
P21/INT4/T1IN
5
CF2/XT2
17
P00/AN0
6
VDD1
18
P01/AN1
7
P10
19
P02/AN2
8
P11
20
P03/AN3
9
P12
21
P04/AN4
10
P13/SO1/DBGP12
22
P05/AN5/CKO/DBGP00
11
P14/SI1/SB1/DBGP11
23
P06/AN6/T6O/DBGP01
12
P15/SCK1/INT3/T0IN/DBGP10
24
P07/T7O/DBGP02
No.A1956-7/28
13 P20/INT4/T1IN
14 P21/INT4/T1IN
15 P00/AN0
16 P01/AN1
17 P02/AN2
18 P03/AN3
LC87FBK08A
12 P17/T1PWMH/BUZ/INT1/T0HCP
P04/AN4 19
11 P16/T1PWML/INT2/T0IN
P05/AN5/CKO/DBGP00 20
P06/AN6/T6O/DBGP01 21
10 P15/SCK1/INT3/T0IN/DBGP10
LC87FBK08A
P07/T7O/DBGP02 22
9 P14/SI1/SB1/DBGP11
8 P13/SO1/DBGP12
P70/INT0/T0LCP/AN8 23
RES 24
P11 6
P10 5
VDD1 4
CF2/XT2 3
CF1/XT1 2
VSS1 1
7 P12
Top view
VCT24(3mm×3mm) “Lead-/Halogen-free Type”
VCT24
NAME
VCT24
NAME
1
VSS1
13
P20/INT4/T1IN
2
CF1/XT1
14
P21/INT4/T1IN
3
CF2/XT2
15
P00/AN0
4
VDD1
16
P01/AN1
5
P10
17
P02/AN2
6
P11
18
P03/AN3
7
P12
19
P04/AN4
8
P13/SO1/DBGP12
20
P05/AN5/CKO/DBGP00
P06/AN6/T6O/DBGP01
9
P14/SI1/SB1/DBGP11
21
10
P15/SCK1/INT3/T0IN/DBGP10
22
P07/T7O/DBGP02
11
P16/T1PWML/INT2/T0IN
23
P70/INT0/T0LCP/AN8
12
P17/T1PWMH/BUZ/INT1/T0HCP
24
RES
No.A1956-8/28
LC87FBK08A
System Block Diagram
Interrupt control
IR
PLA
Flash ROM
Standby control
SRC
RC
Clock
generator
CF/
X'tal
PC
MRC
ACC
WDT
Reset circuit
(LVD/POR)
Reset control
RES
B register
C register
Bus interface
SIO1
Port 0
Timer 0
Port 1
Timer 1
Port 2
Timer 6
Port 7
Timer 7
ADC
Base timer
INT0 to 2
INT3 (Noise filter)
ALU
PSW
RAR
RAM
Stack pointer
On-chip debugger
Port 2 INT4
No.A1956-9/28
LC87FBK08A
Pin Description
Pin Name
I/O
Description
Option
VSS1
-
- Power supply pin
No
VDD1
-
+ Power supply pin
No
Port 0
I/O
• 8-bit I/O port
• I/O specifiable in 4-bit units
P00 to P07
• Pull-up resistors can be turned on and off in 4-bit units.
• HOLD reset input
• Port 0 interrupt input
• Pin functions
Yes
P05: System clock output
P06: Timer 6 toggle output
P07: Timer 7 toggle output
P00(AN0) to P06(AN6): AD converter input
P05(DBGP00) to P07(DBGP02): On-chip debugger 0 port
Port 1
I/O
• 8-bit I/O port
• I/O specifiable in 1-bit units
P10 to P17
• Pull-up resistors can be turned on and off in 1-bit units.
• Pin functions
P13: SIO1 data output
P14: SIO1 data input / bus I/O
P15: SIO1 clock I/O / INT3 input (with noise filter) / timer 0 event input / timer 0H capture input
P16: Timer 1PWML output / INT2 input/HOLD reset input/timer 0 event input / timer 0L capture
input
P17: Timer 1PWMH output / beeper output / INT1 input / HOLD reset input / timer 0H capture
Yes
input
P15(DBGP10) to P13(DBGP12): On-chip-debugger 1 port
Interrupt acknowledge type
Port 2
I/O
Rising &
Rising
Falling
INT1
enable
enable
disable
enable
enable
INT2
enable
enable
enable
disable
disable
INT3
enable
enable
enable
disable
disable
Falling
H level
L level
• 2-bit I/O port
• I/O specifiable in 1-bit units
P20 to P21
• Pull-up resistors can be turned on and off in 1-bit units.
• Pin functions
P20 to P21: INT4 input / HOLD reset input / timer 1 event input / timer 0L capture input / timer
0H capture input
Yes
Interrupt acknowledge types
INT4
Port 7
P70
I/O
Rising
Falling
enable
enable
Rising &
Falling
enable
H level
L level
disable
disable
• 1-bit I/O port
• I/O specifiable in 1-bit units
• Pull-up resistors can be turned on and off in 1-bit units.
• Pin functions
P70: INT0 input / HOLD reset input / timer 0L capture input
P70(AN8): AD converter input
No
Interrupt acknowledge types
INT0
Rising
Falling
enable
enable
Rising &
Falling
disable
H level
L level
enable
enable
Continued on next page.
No.A1956-10/28
LC87FBK08A
Continued from preceding page.
Pin Name
RES
CF1/XT1
I/O
Description
I/O
Option
External reset input / internal reset output
No
• Ceramic resonator or 32.768kHz crystal oscillator input pin
I
• Pin function
No
General-purpose input port
CF2/XT2
• Ceramic resonator or 32.768kHz crystal oscillator output pin
I/O
• Pin function
No
General-purpose I/O port
Port Output Types
The table below lists the types of port outputs and the presence/absence of a pull-up resistor.
Data can be read into any input port even if it is in the output mode.
Port Name
Option selected in
units of
Option type
P00 to P07
1 bit
1
P10 to P17
1 bit
P20 to P21
1 bit
Output type
Pull-up resistor
CMOS
Programmable (Note 1)
2
Nch-open drain
No
1
CMOS
Programmable
2
Nch-open drain
Programmable
1
CMOS
Programmable
2
Nch-open drain
Programmable
Nch-open drain
Programmable
Ceramic resonator/32.768kHz crystal resonator
No
P70
-
No
CF2/XT2
-
No
output Nch-open drain
(N-channel open drain when set to general-purpose
output port)
Note 1: The control of the presence or absence of the programmable pull-up resistors for port 0 and the switching
between low-and high-impedance pull-up connection is exercised in nibble (4-bit) units (P00 to 03 or
P04 to 07).
User Option Table
Option Name
Port output type
Mask version
Flash-ROM
Option Selected in
*1
Version
Units of
P00 to P07
1 bit
CMOS
P10 to P17
1 bit
CMOS
P20 to P21
1 bit
CMOS
Option to be Applied on
Option Selection
Nch-open drain
Nch-open drain
Nch-open drain
Program start
-
address
Low-voltage
×
-
-
*2
Detect function
01E00h
detection reset
function
Power-on reset
00000h
Enable:Use
Disable:Not Used
Detect level
-
3-level
Power-On reset level
-
4-level
function
*1: Mask option selection - No change possible after mask is completed.
*2: Program start address of the mask version is 00000h.
No.A1956-11/28
LC87FBK08A
Recommended Unused Pin Connections
Recommended Unused Pin Connections
Port Name
Board
Software
P00 to P07
Open
Output low
P10 to P17
Open
Output low
P20 to P21
Open
Output low
P70
Open
Output low
CF1/XT1
Pulled low with a 100kΩ resistor or less
General-purpose input port
CF2/XT2
Pulled low with a 100kΩ resistor or less
General-purpose input port
On-chip Debugger Pin Connection Requirements
For the treatment of the on-chip debugger pins, refer to the separately available documents entitled "RD87 on-chip
debugger installation manual".
Power Pin Treatment Recommendations (VDD1, VSS1)
Connect bypass capacitors that meet the following conditions between the VDD1 and VSS1 pins:
• Connect among the VDD1 and VSS1 pins and bypass capacitors C1 and C2 with the shortest possible heavy lead
wires, making sure that the impedances between the both pins and the bypass capacitors are as possible (L1=L1’ ,
L2=L2’).
• Connect a large-capacity capacitor C1 and a small-capacity capacitor C2 in parallel.
The capacitance of C2 should approximately 0.1μF.
L2
L1
VSS1
C1
C2
VDD1
L1’
L2’
No.A1956-12/28
LC87FBK08A
Absolute Maximum Ratings at Ta = 25°C, VSS1 =0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
VDD[V]
Maximum supply
VDD max
VDD1
Input voltage
VI
CF1
Input/output
VIO
Ports 0, 1, 2,
voltage
voltage
High level output current
Peak output
P70, CF2, RES
IOPH
Mean output
IOMH
Ports 0, 1, 2
typ
max
-0.3
+6.5
-0.3
VDD+0.3
-0.3
VDD+0.3
unit
V
CMOS output select
Per 1 applicable pin
current
-10
CMOS output select
Per 1 applicable pin
-7.5
(Note 1-1)
Total output
ΣIOAH(1)
Ports 0, 1, 2
Total of all applicable pins
current
Peak output
-25
IOPL(1)
current
Low level output current
Ports 0, 1, 2
current
min
Mean output
Total output
20
P00, P01
Per 1 applicable pin
30
IOPL(3)
P70, CF2
Per 1 applicable pin
10
IOML(1)
P02 to P07
Per 1 applicable pin
IOML(2)
P00, P01
Per 1 applicable pin
20
IOML(3)
P70, CF2
Per 1 applicable pin
7.5
ΣIOAL(1)
Ports 0, 1,
Total of all applicable pins
70
Ports 2, 7, CF2
Pd max(1)
MFP24S(300mil)
dissipation
Ta=-40 to +85°C
129
Package only
Pd max(2)
Ta=-40 to +85°C
Package with thermal
229
resistance board
(Note 1-2)
Pd max(3)
SSOP24(225mil)
mW
Ta=-40 to +85°C
111
Package only
Pd max(4)
mA
15
Ports 1, 2
current
Power
Per 1 applicable pin
IOPL(2)
current
(Note 1-1)
P02 to P07
Ports 1, 2
Ta=-40 to +85°C
Package with thermal
334
resistance board
(Note 1-2)
Operating ambient
Topr
temperature
Storage ambient
temperature
Tstg
-40
+85
-55
+125
°C
Note 1-1: The mean output current is a mean value measured over 100ms.
Note 1-2: SEMI standards thermal resistance board (size: 76.1×114.3×1.6tmm, glass epoxy) is used.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
No.A1956-13/28
LC87FBK08A
Allowable Operating Conditions at Ta = -40°C to +85°C, VSS1 = 0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
VDD[V]
Operating
VDD
VDD1
0.245μs ≤ tCYC ≤ 200μs
VHD
VDD1
RAM and register contents sustained
2.7
supply voltage
Memory
sustaining
min
in HOLD mode.
typ
max
unit
5.5
1.6
supply voltage
High level
VIH(1)
Ports 1, 2, 7
2.7 to 5.5
0.3VDD+0.7
VDD
input voltage
VIH(2)
Ports 0
2.7 to 5.5
0.3VDD+0.7
VDD
VIH(3)
CF1, CF2, RES
2.7 to 5.5
0.75VDD
VDD
VIL(1)
Ports 1, 2, 7
4.0 to 5.5
VSS
0.1VDD+0.4
2.7 to 4.0
VSS
0.2VDD
VIL(2)
Ports 0
4.0 to 5.5
VSS
0.15VDD+0.4
2.7 to 4.0
VSS
0.2VDD
VIL(3)
CF1, CF2, RES
2.7 to 5.5
VSS
0.25VDD
High level
IOH(1)
Ports 0, 1, 2
output current
IOH(2)
Low level
input voltage
IOH(3)
P05 (System clock
Per 1 applicable pin
Per 1 applicable pin
4.5 to 5.5
-1.0
2.7 to 4.5
-0.35
4.5 to 5.5
-6.0
2.7 to 4.5
-1.4
V
output function
IOH(4)
used)
IOH(1)
Ports 0, 1, 2
Total of all applicable pins
IOH(2)
Low level
IOL(1)
output current
IOL(2)
Ports 0, 1, 2
Per 1 applicable pin
-25
2.7 to 4.5
-8.0
4.5 to 5.5
7
2.7 to 4.5
1
IOL(3)
P70, CF2
Per 1 applicable pin
2.7 to 5.5
1
IOL(4)
P00, P01
Per 1 applicable pin
4.5 to 5.5
15
2.7 to 4.5
2
4.5 to 5.5
40
2.7 to 4.5
10
4.5 to 5.5
70
2.7 to 4.5
21
2.7 to 5.5
1
IOL(5)
IOL(1)
Ports 0
Total of all applicable pins
IOL(2)
IOL(3)
Ports 0, 1, 2, CF2
Total of all applicable pins
Ports 7
Total of all applicable pins
IOL(4)
IOL(5)
Instruction
4.5 to 5.5
mA
tCYC
cycle time
2.7 to 5.5
0.245
200
2.7 to 5.5
0.1
12
μs
(Note 2-1)
External
system clock
frequency
FEXCF
CF1
• CF2 pin open
• System clock frequency division
ratio=1/1
• External system clock duty=50±5%
MHz
• CF2 pin open
• System clock frequency division
ratio=1/2
3.0 to 5.5
0.2
24.4
• External system clock duty=50±5%
Note 2-1: Relationship between tCYC and oscillation frequency is 3/FmCF at a division ratio of 1/1 and 6/FmCF at
a division ratio of 1/2.
Continued on next page.
No.A1956-14/28
LC87FBK08A
Continued from preceding page.
Specification
Parameter
Symbol
Pin/Remarks
Conditions
VDD[V]
Oscillation
FmCF(1)
CF1, CF2
frequency
range
12MHz ceramic oscillation.
See Fig. 1.
FmCF(2)
CF1, CF2
(Note 2-2)
10MHz ceramic oscillation.
See Fig. 1.
FmCF(3)
CF1, CF2
min
typ
max
2.7 to 5.5
12
2.7 to 5.5
10
2.7 to 5.5
4
2.7 to 5.5
4
unit
4MHz ceramic oscillation.
CF oscillation normal amplifier size selected.
(CFLAMP=0) See Fig. 1.
4MHz ceramic oscillation.
CF oscillation low amplifier size
selected. (CFLAMP=1)
MHz
See Fig. 1.
FmMRC(1)
Frequency variable RC oscillation.
(Note 2-3)
FmMRC(2)
2.7 to 5.5
7.76
8.0
8.24
2.7 to 5.5
7.80
8.0
8.20
Frequency variable RC oscillation.
• Ta=-10 to +85°C
(Note 2-3)
FmRC
Internal medium-speed RC oscillation
2.7 to 5.5
0.5
1.0
2.0
FmSRC
Internal low-speed RC oscillation
2.7 to 5.5
50
100
200
FsX’tal
XT1, XT2
32.768kHz crystal oscillation
See Fig. 1.
Oscillation
tmsMRC
kHz
2.7 to 5.5
32.768
When Frequency variable RC
stabilization
oscillation state is switched from
time
stopped to enabled.
2.7 to 5.5
100
μs
See Fig. 3.
Note 2-2: See Tables 1 and 2 for the oscillation constants.
Note 2-3: When switching the system clock, allow an oscillation stabilization time of 100μs or longer after the
frequency variable RC oscillator circuit transmits from the "oscillation stopped" to "oscillation enabled" state.
No.A1956-15/28
LC87FBK08A
Electrical Characteristics at Ta = -40°C to +85°C, VSS1 = 0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
VDD[V]
High level input
IIH(1)
current
Ports 0, 1, 2,
Output disabled
P70, RES
Pull-up resistor off
VIN=VDD
(Including output Tr's off leakage
min
typ
max
unit
2.7 to 5.5
1
2.7 to 5.5
1
2.7 to 5.5
15
current)
IIH(2)
CF1, CF2
Input port selected
VIN=VDD
IIH(3)
CF1
Reset state
VIN=VDD
Low level input
IIL(1)
current
Ports 0, 1, 2,
Output disabled
P70, RES
Pull-up resistor off
VIN=VSS
(Including output Tr's off leakage
2.7 to 5.5
-1
2.7 to 5.5
-1
μA
current)
IIL(2)
CF1, CF2
Input port selected
VIN=VSS
High level output
VOH(1)
voltage
VOH(2)
VOH(3)
Ports 0, 1, 2
P05 (System
IOH=-1mA
4.5 to 5.5
VDD-1
IOH=-0.35mA
2.7 to 5.5
VDD-0.4
IOH=-6mA
4.5 to 5.5
VDD-1
VDD-0.4
clock output
VOH(4)
function used)
IOH=-1.4mA
2.7 to 5.5
Low level output
VOL(1)
Ports 0, 1, 2
IOL=7mA
4.5 to 5.5
1.5
voltage
VOL(2)
IOL=1mA
2.7 to 5.5
0.4
VOL(3)
Ports7, CF2
IOL=1mA
2.7 to 5.5
0.4
VOL(4)
P00, P01
IOL=15mA
4.5 to 5.5
1.5
IOL=2mA
2.7 to 5.5
VOH=0.9VDD
When Port 0 selected
4.5 to 5.5
15
35
80
low-impedance pull-up.
2.7 to 4.5
18
50
150
VOH=0.9VDD
When Port 0 selected
2.7 to 5.5
VOL(5)
Pull-up resistance
Rpu(1)
Rpu(2)
Rpu(3)
Ports 0, 1, 2
P70
Port 0
V
0.4
kΩ
100
200
300
high-impedance pull-up.
Hysteresis voltage
VHYS
Ports 1, 2, P70,
RES
Pin capacitance
CP
All pins
2.7 to 5.5
0.1VDD
V
2.7 to 5.5
10
pF
For pins other than that under test:
VIN=VSS
f=1MHz
Ta=25°C
No.A1956-16/28
LC87FBK08A
SIO1 Serial I/O Characteristics at Ta = -40°C to +85°C, VSS1 = 0V (Note 4)
Input clock
Symbol
Frequency
tSCK(3)
Low level
tSCKL(3)
Specification
Pin/
Conditions
Remarks
SCK1(P15)
VDD[V]
• See Fig. 5.
tSCK(4)
Low level
tSCKL(4)
tCYC
SCK1(P15)
• CMOS output selected
2
• See Fig. 5.
1/2
2.7 to 5.5
tSCK
tSCKH(4)
1/2
Serial input
pulse width
Data setup time
tsDI(2)
SB1(P14),
SI1(P14)
Data hold time
• Must be specified with
respect to rising edge of
SIOCLK.
thDI(2)
(1/3)tCYC
2.7 to 5.5
tdD0(4)
SO1(P13),
Serial output
SB1(P14)
+0.01
0.01
• See Fig. 5.
Output delay time
unit
1
pulse width
High level
max
1
tSCKH(3)
Frequency
typ
2
2.7 to 5.5
pulse width
High level
min
pulse width
Output clock
Serial clock
Parameter
• Must be specified with respect to
μs
falling edge of SIOCLK.
• Must be specified as the time to
the beginning of output state
(1/2)tCYC
2.7 to 5.5
+0.05
change in open drain output
mode.
• See Fig. 5.
Note 4: These specifications are theoretical values. Add margin depending on its use.
Pulse Input Conditions at Ta = -40°C to +85°C, VSS1 = 0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
VDD[V]
High/low level
tPIH(1)
INT0(P70),
• Interrupt source flag can be set.
pulse width
tPIL(1)
INT1(P17),
• Event inputs for timer 0 or 1 are
INT2(P16),
enabled.
min
typ
2.7 to 5.5
1
2.7 to 5.5
2
max
unit
INT4(P20 to P21)
tPIH(2)
INT3(P15) when noise
• Interrupt source flag can be set.
tPIL(2)
filter time constant is
• Event inputs for timer 0 are
1/1
enabled.
tPIH(3)
INT3(P15) when noise
• Interrupt source flag can be set.
tPIL(3)
filter time constant is
• Event inputs for timer 0 are
1/32
INT3(P15) when noise
• Interrupt source flag can be set.
tPIL(4)
filter time constant is
• Event inputs for timer 0 are
tPIL(5)
RES
2.7 to 5.5
64
2.7 to 5.5
256
2.7 to 5.5
200
nabled.
tPIH(4)
1/128
tCYC
enabled.
• Resetting is enabled.
μs
No.A1956-17/28
LC87FBK08A
AD Converter Characteristics at VSS1 = 0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
VDD[V]
Resolution
N
AN0(P00) to
Absolute
ET
AN6(P06),
Conversion time
• See Conversion time calculation
TCAD
formulas. (Note 6-2)
Analog input
typ
2.7 to 5.5
(Note 6-1)
AN8(P70)
accuracy
min
VAIN
voltage range
max
unit
12
bit
3.0 to 5.5
±16
2.7 to 5.5
±20
4.0 to 5.5
32
115
3.0 to 5.5
64
115
2.7 to 5.5
134
215
2.7 to 5.5
VSS
VDD
Analog port
IAINH
VAIN=VDD
2.7 to 5.5
input current
IAINL
VAIN=VSS
2.7 to 5.5
LSB
μs
V
1
μA
-1
Specification
Parameter
Symbol
Pin/Remarks
Conditions
VDD[V]
Resolution
N
AN0(P00) to
Absolute
ET
AN6(P06),
Conversion time
(Note 6-1)
formulas. (Note 6-2)
Analog input
max
VAIN
voltage range
4.0 to 5.5
unit
8
bit
±1.5
2.7 to 5.5
• See Conversion time calculation
TCAD
typ
2.7 to 5.5
AN8(P70)
accuracy
min
20
90
3.0 to 5.5
40
90
2.7 to 5.5
80
135
2.7 to 5.5
VSS
VDD
Analog port
IAINH
VAIN=VDD
2.7 to 5.5
input current
IAINL
VAIN=VSS
2.7 to 5.5
LSB
1
-1
μs
V
μA
Conversion time calculation formulas:
12bits AD Converter Mode: TCAD(Conversion time) = ((52/(AD division ratio))+2)×(1/3)×tCYC
8bits AD Converter Mode: TCAD(Conversion time) = ((32/(AD division ratio))+2)×(1/3)×tCYC
External
Operating supply
oscillation
voltage range
(FmCF)
(VDD)
CF-12MHz
CF-8MHz
CF-4MHz
System division ratio
Cycle time
(SYSDIV)
(tCYC)
4.0V to 5.5V
1/1
3.0V to 5.5V
AD division
AD conversion time
(TCAD)
ratio
(ADDIV)
12bit AD
8bit AD
250ns
1/8
34.8μs
21.5μs
1/1
250ns
1/16
69.5μs
42.8μs
2.7V to 5.5V
1/1
250ns
1/32
138.8μs
85.5μs
4.0V to 5.5V
1/1
375ns
1/8
52.25μs
32.25μs
3.0V to 5.5V
1/1
375ns
1/16
104.25μs
64.25μs
2.7V to 5.5V
1/1
375ns
1/32
208.25μs
128.25μs
3.0V to 5.5V
1/1
750ns
1/8
104.5μs
64.5μs
2.7V to 5.5V
1/1
750ns
1/16
208.5μs
128.5μs
Note 6-1: The quantization error (±1/2LSB) must be excluded from the absolute accuracy. The absolute accuracy must
be measured in the microcontroller's state in which no I/O operations occur at the pins adjacent to the analog
input channel.
Note 6-2: The conversion time refers to the period from the time an instruction for starting a conversion process till the
time the conversion results register(s) are loaded with a complete digital conversion value corresponding to
the analog input value.
The conversion time is 2 times the normal-time conversion time when:
• The first AD conversion is performed in the 12-bit AD conversion mode after a system reset.
• The first AD conversion is performed after the AD conversion mode is switched from 8-bit to 12-bit
conversion mode.
No.A1956-18/28
LC87FBK08A
Power-on Reset (POR) Characteristics at Ta = -40°C to +85°C, VSS1 = 0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
Option selected
voltage
POR release
PORRL
voltage
Detection
min
typ
max
• Select from option.
2.57V
2.45
2.57
2.69
(Note 7-1)
2.87V
2.75
2.87
2.99
3.86V
3.73
3.86
3.99
4.35V
4.21
4.35
4.49
0.7
0.95
unit
V
• See Fig. 7.
POUKS
voltage
(Note 7-2)
unknown state
Power supply
• Power supply rise
PORIS
rise time
100
time from 0V to 1.6V.
ms
Note7-1: The POR release level can be selected out of 4 levels only when the LVD reset function is disabled.
Note7-2: POR is in an unknown state before transistors start operation.
Low Voltage Detection Reset (LVD) Characteristics at Ta = -40°C to +85°C, VSS1=0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
Option selected
voltage
LVD reset voltage
LVDET
(Note 8-2)
• Select from option.
(Note 8-1)
(Note 8-3)
LVD hysteresys
LVHYS
• See Fig. 8.
width
Detection voltage
LVUKS
unknown state
Low voltage
detection
minimum width
min
max
2.81V
2.71
2.81
2.91
3.79V
3.67
3.79
3.91
4.28V
4.15
4.28
4.41
2.81V
60
3.79V
65
4.28V
65
unit
V
mV
• See Fig. 8.
(Note 8-4)
TLVDW
typ
0.7
0.95
V
• LVDET-0.5V
• See Fig. 9.
0.2
ms
(Reply sensitivity)
Note8-1: The LVD reset level can be selected out of 3 levels only when the LVD reset function is enabled.
Note8-2: LVD reset voltage specification values do not include hysteresis voltage.
Note8-3: LVD reset voltage may exceed its specification values when port output state changes and/or when a large
current flows through port.
Note8-4: LVD is in an unknown state before transistors start operation.
No.A1956-19/28
LC87FBK08A
Consumption Current Characteristics at Ta = -40°C to +85°C, VSS1 = 0V
Parameter
Normal mode
Symbol
IDDOP(1)
Specification
Pin/
Conditions
Remarks
VDD1
VDD[V]
min
typ
max
unit
• FmCF=12MHz ceramic oscillation mode
consumption
• System clock set to 12MHz side
current
• Internal low speed and medium speed RC
2.7 to 5.5
4.8
8.7
2.7 to 3.6
3.0
5.0
3.0 to 5.5
5.0
9.6
3.0 to 3.6
3.2
6.0
2.7 to 5.5
4.1
7.8
2.7 to 3.6
2.6
4.9
2.7 to 5.5
2.2
5.1
2.7 to 3.6
1.5
2.7
2.7 to 5.5
0.95
2.4
2.7 to 3.6
0.50
1.1
2.7 to 5.5
0.42
1.4
2.7 to 3.6
0.25
0.76
2.7 to 5.5
3.2
5.4
2.7 to 3.6
2.3
4.2
2.7 to 5.5
55
169
2.7 to 3.6
39
109
oscillation stopped.
(Note 9-1)
• Frequency variable RC oscillation stopped.
(Note 9-2)
• 1/1 frequency division ratio
IDDOP(2)
• CF1=24MHz external clock
• System clock set to CF1 side
• Internal low speed and medium speed RC
oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/2 frequency division ratio
IDDOP(3)
• FmCF=10MHz ceramic oscillation mode
• System clock set to 10MHz side
• Internal low speed and medium speed RC
oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/1 frequency division ratio
IDDOP(4)
• FmCF=4MHz ceramic oscillation mode
• System clock set to 4MHz side
• Internal low speed and medium speed RC
oscillation stopped.
• Frequency variable RC oscillation stopped.
mA
• 1/1 frequency division ratio
IDDOP(5)
• CF oscillation low amplifier size selected.
(CFLAMP=1)
• FmCF=4MHz ceramic oscillation mode
• System clock set to 4MHz side
• Internal low speed and medium speed RC
oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/4 frequency division ratio
IDDOP(6)
• FsX’tal=32.768kHz crystal oscillation mode
• Internal low speed RC oscillation stopped.
• System clock set to internal medium speed
RC oscillation.
• Frequency variable RC oscillation stopped.
• 1/2 frequency division ratio
IDDOP(7)
• FsX’tal=32.768kHz crystal oscillation mode
• Internal low speed and medium speed RC
oscillation stopped.
• System clock set to 8MHz with
frequency variable RC oscillation
• 1/1 frequency division ratio
IDDOP(8)
• External FsX’tal and FmCF oscillation stopped.
• System clock set to internal low speed RC
oscillation.
• Internal medium speed RC oscillation sopped.
• Frequency variable RC oscillation stopped.
• 1/1 frequency division ratio
IDDOP(9)
μA
• External FsX’tal and FmCF oscillation stopped.
• System clock set to internal low speed RC
5.0
55
136
3.3
39
103
oscillation.
• Internal medium speed RC oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/1 frequency division ratio
• Ta=-10 to +50°C
Note9-1: Values of the consumption current do not include current that flows into the output transistors and internal
pull-up resistors.
Note9-2: The consumption current values do not include operational current of LVD function if not specified.
Continued on next page.
No.A1956-20/28
LC87FBK08A
Continued from preceding page.
Parameter
Normal mode
Symbol
IDDOP(10)
Specification
Pin/
Conditions
Remarks
VDD1
VDD[V]
consumption
• System clock set to 32.768kHz side
current
• Internal low speed and medium speed RC
(Note 9-1)
min
typ
max
unit
• FsX’tal=32.768kHz crystal oscillation mode
2.7 to 5.5
28
89
2.7 to 3.6
11
38
oscillation stopped.
• Frequency variable RC oscillation stopped.
(Note 9-2)
• 1/2 frequency division ratio
IDDOP(11)
μA
• FsX’tal=32.768kHz crystal oscillation mode
• System clock set to 32.768kHz side
• Internal low speed and medium speed RC
5.0
28
78
3.3
11
29
2.7 to 5.5
2.4
4.5
2.7 to 3.6
1.3
2.2
3.0 to 5.5
2.7
5.3
3.0 to 3.6
1.6
2.9
2.7 to 5.5
2.0
4.1
2.7 to 3.6
1.1
2.1
2.7 to 5.5
1.2
3.3
2.7 to 3.6
0.50
1.2
2.7 to 5.5
0.70
1.8
2.7 to 3.6
0.30
0.68
2.7 to 5.5
0.30
0.90
2.7 to 3.6
0.20
0.44
oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/2 frequency division ratio
• Ta=-10 to +50°C
HALT mode
IDDHALT(1)
• HALT mode
consumption
• FmCF=12MHz ceramic oscillation mode
current
• System clock set to 12MHz side
(Note 9-1)
• Internal low speed and medium speed RC
(Note 9-2)
oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/1 frequency division ratio
IDDHALT(2)
• HALT mode
• CF1=24MHz external clock
• System clock set to CF1 side
• Internal low speed and medium speed RC
oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/2 frequency division ratio
IDDHALT(3)
• HALT mode
• FmCF=10MHz ceramic oscillation mode
• System clock set to 10MHz side
• Internal low speed and medium speed RC
oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/1 frequency division ratio
IDDHALT(4)
• HALT mode
• FmCF=4MHz ceramic oscillation mode
• System clock set to 4MHz side
mA
• Internal low speed and medium speed RC
oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/1 frequency division ratio
IDDHALT(5)
• HALT mode
• CF oscillation low amplifier size selected.
(CFLAMP=1)
• FmCF=4MHz ceramic oscillation mode
• System clock set to 4MHz side
• Internal low speed and medium speed RC
oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/4 frequency division ratio
IDDHALT(6)
• HALT mode
• FsX’tal=32.768kHz crystal oscillation mode
• Internal low speed RC oscillation stopped.
• System clock set to internal medium speed
RC oscillation
• Frequency variable RC oscillation stopped.
• 1/2 frequency division ratio
Note9-1: Values of the consumption current do not include current that flows into the output transistors and internal
pull-up resistors.
Note9-2: The consumption current values do not include operational current of LVD function if not specified.
Continued on next page.
No.A1956-21/28
LC87FBK08A
Continued from preceding page.
Parameter
HALT mode
Symbol
IDDHALT(7)
Specification
Pin/
Conditions
remarks
VDD1
VDD[V]
consumption
• FsX’tal=32.768kHz crystal oscillation mode
current
• Internal low speed and medium speed RC
(Note 9-1)
min
typ
max
unit
• HALT mode
2.7 to 5.5
1.3
2.3
oscillation stopped.
mA
• System clock set to 8MHz with
(Note 9-2)
frequency variable RC oscillation
2.7 to 3.6
0.90
1.5
2.7 to 5.5
18
68
2.7 to 3.6
11
35
5.0
18
46
3.3
11
27
2.7 to 5.5
20
85
2.7 to 3.6
5.6
30
5.0
20
51
3.3
5.6
17
0.012
23
• 1/1 frequency division ratio
IDDHALT(8)
• HALT mode
• External FsX’tal and FmCF oscillation stopped.
• System clock set to internal low speed RC
oscillation.
• Internal medium speed RC oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/1 frequency division ratio
IDDHALT(9)
• HALT mode
• External FsX’tal and FmCF oscillation stopped.
• System clock set to internal low speed RC
oscillation.
• Internal medium speed RC oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/1 frequency division ratio
• Ta=-10 to +50°C
IDDHALT(10)
• HALT mode
• FsX’tal=32.768kHz crystal oscillation mode
• System clock set to 32.768kHz side
• Internal low speed and medium speed RC
oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/2 frequency division ratio
IDDHALT(11)
• HALT mode
• FsX’tal=32.768kHz crystal oscillation mode
• System clock set to 32.768kHz side
μA
• Internal low speed and medium speed RC
oscillation stopped.
• Frequency variable RC oscillation stopped.
• 1/2 frequency division ratio
• Ta=-10 to +50°C
HOLD mode
IDDHOLD(1)
consumption
current
(Note 9-1)
IDDHOLD(2)
HOLD mode
2.7 to 5.5
• CF1=VDD or open (External clock mode)
2.7 to 3.6
0.008
11
5.0
0.012
1.2
3.3
0.008
0.59
2.7 to 5.5
2.0
26
2.7 to 3.6
1.6
13
5.0
2.0
3.8
3.3
1.6
2.8
HOLD mode
• CF1=VDD or open (External clock mode)
(Note 9-2)
• Ta=-10 to +50°C
IDDHOLD(3)
HOLD mode
• CF1=VDD or open (External clock mode)
• LVD option selected
IDDHOLD(4)
HOLD mode
• CF1=VDD or open (External clock mode)
• Ta=-10 to +50°C
• LVD option selected
Timer HOLD
IDDHOLD(5)
mode
consumption
current
(Note 9-1)
(Note 9-2)
IDDHOLD(6)
Timer HOLD mode
2.7 to 5.5
16
70
• FsX’tal=32.768 kHz crystal oscillation mode
2.7 to 3.6
4.2
25
5.0
16
42
3.3
4.2
11
Timer HOLD mode
• FsX’tal=32.768kHz crystal oscillation mode
• Ta=-10 to +50°C
Note9-1: Values of the consumption current do not include current that flows into the output transistors and internal
pull-up resistors.
Note9-2: The consumption current values do not include operational current of LVD function if not specified.
No.A1956-22/28
LC87FBK08A
F-ROM Programming Characteristics at Ta = +10°C to +55°C, VSS1 = 0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
VDD[V]
Onboard
IDDFW(1)
VDD1
min
typ
max
unit
• Only current of the Flash block.
programming
2.7 to 5.5
5
10
mA
20
30
ms
40
60
μs
current
Programming
tFW(1)
• Erasing time
time
tFW(2)
• Programming time
2.7 to 5.5
Characteristics of a Sample Main System Clock Oscillation Circuit
Given below are the characteristics of a sample main system clock oscillation circuit that are measured using a Our
designated oscillation characteristics evaluation board and external components with circuit constant values with
which the oscillator vendor confirmed normal and stable oscillation.
Table 1 Characteristics of a Sample Main System Clock Oscillator Circuit with a Ceramic Oscillator
• CF oscillation normal amplifier size selected (CFLAMP=0)
MURATA
Nominal
Frequency
12MHz
Circuit Constant
Operating
Oscillation
Voltage
Stabilization Time
Type
Oscillator Name
[pF]
[pF]
[Ω]
[Ω]
SMD
CSTCE12M0G52-R0
(10)
(10)
Open
680
SMD
CSTCE10M0G52-R0
(10)
(10)
Open
680
2.7 to 5.5
C1
C2
Rf
Rd
Range
typ
max
[V]
[ms]
[ms]
2.7 to 5.5
0.02
0.3
0.02
0.3
Remarks
10MHz
LEAD
CSTLS10M0G53-B0
(15)
(15)
Open
680
2.7 to 5.5
0.02
0.3
SMD
CSTCE8M00G52-R0
(10)
(10)
Open
1.0k
2.7 to 5.5
0.02
0.3
LEAD
CSTLS8M00G53-B0
(15)
(15)
Open
1.0k
2.7 to 5.5
0.02
0.3
SMD
CSTCR6M00G53-R0
(15)
(15)
Open
1.5k
2.7 to 5.5
0.02
0.3
8MHz
Internal
C1, C2
6MHz
LEAD
CSTLS6M00G53-B0
(15)
(15)
Open
1.5k
2.7 to 5.5
0.02
0.3
SMD
CSTCR4M00G53-R0
(15)
(15)
Open
1.5k
2.7 to 5.5
0.03
0.45
LEAD
CSTLS4M00G53-B0
(15)
(15)
Open
1.5k
2.7 to 5.5
0.02
0.3
4MHz
• CF oscillation low amplifier size selected (CFLAMP=1)
MURATA
Nominal
Frequency
12MHz
Circuit Constant
Type
Oscillator Name
Operating
Oscillation
Voltage
Stabilization Time
C1
C2
Rf
Rd
Range
[pF]
[pF]
[Ω]
[Ω]
typ
max
[V]
[ms]
[ms]
SMD
CSTCE12M0G52-R0
(10)
(10)
Open
470
3.9 to 5.5
0.04
0.6
SMD
CSTCE10M0G52-R0
(10)
(10)
Open
470
2.9 to 5.5
0.03
0.45
CSTLS10M0G53-B0
(15)
(15)
Open
470
3.6 to 5.5
0.03
0.45
CSTLS10M0G53095-B0
(15)
(15)
Open
470
2.7 to 5.5
0.02
0.3
CSTCE8M00G52-R0
(10)
(10)
Open
680
2.7 to 5.5
0.03
0.45
10MHz
Remarks
LEAD
SMD
8MHz
CSTLS8M00G53-B0
(15)
(15)
Open
680
3.0 to 5.5
0.03
0.45
Internal
CSTLS8M00G53093-B0
(15)
(15)
Open
680
2.7 to 5.5
0.02
0.3
C1, C2
CSTCR6M00G53-R0
(15)
(15)
Open
1.0k
2.7 to 5.5
0.03
0.45
CSTLS6M00G53-B0
(15)
(15)
Open
1.0k
2.8 to 5.5
0.03
0.45
CSTLS6M00G53093-B0
(15)
(15)
Open
1.0k
2.7 to 5.5
0.02
0.3
SMD
CSTCR4M00G53-R0
(15)
(15)
Open
1.0k
2.7 to 5.5
0.04
0.6
LEAD
CSTLS4M00G53-B0
(15)
(15)
Open
1.0k
2.7 to 5.5
0.02
0.3
LEAD
SMD
6MHz
LEAD
4MHz
The oscillation stabilization time refers to the time interval that is required for the oscillation to get stabilized in
follwing cases (see Figure 3).
• The time interval that is required for the oscillation to get stabilized after the instruction for starting the mainclock
oscillation circuit is executed.
• The time interval that is required for the oscillation to get stabilized after the HOLD mode is reset and oscillation is
started.
• The time interval that is required for the oscillation to get stabilized after the X’tal Hold mode, under the state which
the main clock oscillation is enabled, is reset and oscillation is started.
No.A1956-23/28
LC87FBK08A
Characteristics of a Sample Subsystem Clock Oscillator Circuit
Given below are the characteristics of a sample subsystem clock oscillation circuit that are measured using a Our
designated oscillation characteristics evaluation board and external components with circuit constant values with which
the oscillator vendor confirmed normal and stable oscillation.
Table 2 Characteristics of a Sample Subsystem Clock Oscillator Circuit with a Crystal Oscillator
EPSON TOYOCOM
Nominal
Type
Frequency
32.768kHz
SMD
Circuit Constant
Oscillator
Name
MC-306
Operating
Oscillation
Voltage
Stabilization Time
C1
C2
Rf
Rd
Range
typ
max
[pF]
[pF]
[Ω]
[Ω]
[V]
[s]
[s]
9
9
Open
330k
2.7 to 5.5
1.4
4.0
Remarks
Applicable CL value =
7.0pF
SEIKO INSTRUMENTS
Nominal
Type
Frequency
32.768kHz
SMD
Circuit Constant
Oscillator
Name
SSP-T7-F
Operating
Oscillation
Voltage
Stabilization Time
C1
C2
Rf
Rd
Range
typ
max
[pF]
[pF]
[Ω]
[Ω]
[V]
[s]
[s]
18
18
Open
0
2.7 to 5.5
0.75
2.0
Remarks
Applicable CL value =
12.5pF
The oscillation stabilization time refers to the time interval that is required for the oscillation to get stabilized after VDD
goes above the operating voltage lower limit (see Figure 3).
• The time interval that is required for the oscillation to get stabilized after the instruction for starting the subclock
oscillation circuit is executed.
• The time interval that is required for the oscillation to get stabilized after the Hold mode, under the state which
the subclock oscillation is enabled, is reset and oscillation is started.
(Notes on the implementation of the oscillator circuit)
• Oscillation is influenced by the circuit pattern layout of printed circuit board. Place the oscillation-related
components as close to the CPU chip and to each other as possible with the shortest possible pattern length.
• Keep the signal lines whose state changes suddenly or in which large current flows as far away from the oscillator
circuit as possible and make sure that they do not cross one another.
• Be sure to insert a current limiting resistor (Rd) so that the oscillation amplitude never exceeds the input voltage
level that is specified as the absolute maximum rating.
• The oscillator circuit constants shown above are sample characteristic values that are measured using the Our
designated oscillation evaluation board. Since the accuracy of the oscillation frequency and other characteristics vary
according to the board on which the IC is installed, it is recommended that the user consult the resonator vendor for
oscillation evaluation of the IC on a user's production board when using the IC for applications that require high
oscillation accuracy. For further information, contact your resonator vendor or Our company sales representative
serving your locality.
• It must be noted, when replacing the flash ROM version of a microcontroller with a mask ROM version, that their
operating voltage ranges may differ even when the oscillation constant of the external oscillator is the same.
CF2/XT2
CF1/XT1
Rf
Rd
C1
CF/X’tal
C2
Figure 1 CF and XT Oscillator Circuit
0.5VDD
Figure 2 AC Timing Measurement Point
No.A1956-24/28
LC87FBK08A
VDD
Operating VDD
lower limit
0V
Power supply
Reset time
RES
Internal medium speed
RC oscillation
tmsCF/tmsXtal
CF1/XT1
CF2/XT2
tmsMRC
Frequency variable
RC oscillation
Instruction for enabling oscillation
executed
Operating
mode
Unpredictable
Reset
Instruction execution
Reset Time and Oscillation Stabilization Time
HOLD reset
signal
HOLD reset signal absent
HOLD reset signal valid
HALT reset signal valid
Internal medium speed
RC oscillation or
low speed RC oscillation
tmsCF/tmsXtal
CF1/XT1,
CF2/XT2
(Note)
tmsMRC
Frequency variable
RC oscillation
Instruction for enabling oscillation
executed
State
HOLD
HALT
Instruction execution
HOLD Reset Signal and Oscillation Stabilization Time
Note: External oscillation circuit is selected.
Figure 3 Oscillation Stabilization Times
No.A1956-25/28
LC87FBK08A
VDD
Note:
External circuits for reset may vary
depending on the usage of POR and LVD.
Please refer to the user’s manual for more
information.
RRES
RES
CRES
Figure 4 Reset Circuit
SIOCLK:
DATAIN:
DI0
DI1
DI2
DI3
DI4
DI5
DI6
DI7
DATAOUT:
DO0
DO1
DO2
DO3
DO4
DO5
DO6
DO7
tSCK
tSCKL
tSCKH
SIOCLK:
tsDI
thDI
DATAIN:
tdDO
DATAOUT:
Figure 5 Serial I/O Output Waveforms
tPIL
tPIH
Figure 6 Pulse Input Timing Signal Waveform
No.A1956-26/28
LC87FBK08A
(a)
POR release voltage
(PORRL)
(b)
VDD
Reset period
100μs or longer
Reset period
Unknown-state
(POUKS)
RES
Figure 7 Waveform observed when only POR is used (LVD not used)
(RESET pin: Pull-up resistor RRES only)
• The POR function generates a reset only when power is turned on starting at the VSS level.
• No stable reset will be generated if power is turned on again when the power level does not go down to the VSS level
as shown in (a). If such a case is anticipated, use the LVD function together with the POR function or implement an
external reset circuit.
• A reset is generated only when the power level goes down to the VSS level as shown in (b) and power is turned on
again after this condition continues for 100μs or longer.
LVD hysteresis width
(LVHYS)
LVD release voltage
(LVDET+LVHYS)
VDD
LVD reset voltage
(LVDET)
Reset period
Reset period
Reset period
Unknown-state
(LVUKS)
RES
Figure 8 Waveform observed when both POR and LVD functions are used
(RESET pin: Pull-up resistor RRES only)
• Resets are generated both when power is turned on and when the power level lowers.
• A hysteresis width (LVHYS) is provided to prevent the repetitions of reset release and entry cycles near the detection
level.
No.A1956-27/28
LC87FBK08A
VDD
LVD release voltage
LVD reset voltage
LVDET-0.5V
TLVDW
VSS
Figure 9 Low voltage detection minimum width
(Example of momentary power loss/Voltage variation waveform)
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warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical
experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use
as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in
which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for
any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
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PS No.A1956-28/28
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