MBRS360T3G

MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G Surface Mount Schottky Power Rectifier This device employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. www.onsemi.com SCHOTTKY BARRIER RECTIFIERS 3.0 AMPERES, 60 VOLTS Features • • • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Excellent Ability to Withstand Reverse Avalanche Energy Transients Guard−Ring for Stress Protection NRVBS Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Mechanical Characteristics • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 • Weight: 217 mg (Approximately), SMC • • • • • 95 mg (Approximately), SMB Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Polarity: Polarity Band on Plastic Body Indicates Cathode Lead Device Meets MSL 1 Requirements ESD Ratings: ♦ Machine Model, C ♦ Human Body Model, 3B SMC 2−LEAD CASE 403AC SMB CASE 403A−03 MARKING DIAGRAMS AYWW B36G G AYWW B36G G B36 = Specific Device Code A = Assembly Location** Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) **The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package, the front side assembly code may be blank. ORDERING INFORMATION Device Package Shipping† MBRS360T3G SMC (Pb−Free) 2,500 / Tape & Reel MBRS360BT3G SMB (Pb−Free) 2,500 / Tape & Reel NRVBS360T3G* SMC (Pb−Free) 2,500 / Tape & Reel NRVBS360BT3G* SMB (Pb−Free) 2,500 / Tape & Reel NRVBS360BT3G −VF01* SMB (Pb−Free) 2,500 / Tape & Reel SBRS360BT3G SMB (Pb−Free) 2,500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2014 August, 2017 − Rev. 12 1 Publication Order Number: MBRS360T3/D MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G MAXIMUM RATINGS Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 60 V Average Rectified Forward Current IF(AV) 3.0 @ TL = 137°C 4.0 @ TL = 127°C A Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM Storage Temperature Range Tstg − 65 to +175 °C Operating Junction Temperature (Note 1) TJ − 65 to +175 °C 125 A Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. THERMAL CHARACTERISTICS Characteristic Symbol Thermal Resistance, Junction−to−Lead (Note 2) SMC Package SMB Package RqJL Thermal Resistance, Junction−to−Ambient (Note 2) SMC Package SMB Package RqJA Thermal Resistance, Junction−to−Ambient (Note 3) SMC Package SMB Package (Note 4) RqJA Value 11 15 136 145 71 73 Unit °C/W °C/W °C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 5) (iF = 3.0 A, TJ = 25°C) VF Maximum Instantaneous Reverse Current (Note 5) (Rated dc Voltage, TJ = 25°C) (Rated dc Voltage, TJ = 100°C) iR 0.63 0.03 3.0 V mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Mounted with minimum recommended pad size, PC Board FR4. 3. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. 4. Typical Value; 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. 5. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. www.onsemi.com 2 MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G TYPICAL ELECTRICAL CHARACTERISTICS 10 IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) 10 TJ = 150°C TJ = 175°C 1 TJ = 100°C TJ = 25°C 0.1 1 TJ = 150°C TJ = 25°C TJ = 100°C 0.1 TJ = −40°C 0.2 0.4 0.6 TJ = −40°C 0.01 0.8 0.0 0.2 0.4 0.6 0.8 VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 1.0E+00 IR, INSTANTANEOUS REVERSE CURRENT (A) 0.0 1.0E−01 TJ = 175°C 1.0E−02 TJ = 150°C 1.0E−03 TJ = 100°C 1.0E−04 1.0E−05 TJ = 25°C 1.0E−06 1.0E−07 0 10 20 30 40 50 VR, INSTANTANEOUS REVERSE VOLTAGE (V) 60 Figure 3. Typical Reverse Current 1.0E+00 IR, INSTANTANEOUS REVERSE CURRENT (A) 0.01 TJ = 175°C 1.0E−01 TJ = 175°C TJ = 150°C 1.0E−02 TJ = 100°C 1.0E−03 1.0E−04 TJ = 25°C 1.0E−05 1.0E−06 0 10 20 30 40 50 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Figure 4. Maximum Reverse Current www.onsemi.com 3 60 PFO, AVERAGE POWER DISSIPATION (W) 5 dc 4 SQUARE WAVE 3 2 1 0 RqJL = 15°C/W 0 20 40 60 80 100 120 140 TL, LEAD TEMPERATURE (°C) 160 180 4 TJ = 175°C 3.5 SQUARE WAVE 3 dc 2.5 2 1.5 1 0.5 0 0 0.5 1.5 1 2 TJ = 25°C 100 0 3 3.5 4 4.5 Figure 6. Forward Power Dissipation 1000 10 2.5 IO, AVERAGE FORWARD CURRENT (A) Figure 5. Current Derating C, CAPACITANCE (pF) IF(AV), AVERAGE FORWARD CURRENT (A) MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G 10 20 30 40 50 VR, REVERSE VOLTAGE (V) Figure 7. Typical Capacitance www.onsemi.com 4 60 70 5 r(t), TRANSIENT THERMAL RESPONSE MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G 100 D = 0.5 0.2 10 0.1 P(pk) 0.05 1 0.01 0.1 0.00001 Test Type > min pad 1 oz RqJC = min pad 1 oz C/W t1 t2 DUTY CYCLE, D = t1/t2 SINGLE PULSE 0.0001 0.001 0.01 1 0.1 100 10 1000 t, TIME (s) Figure 8. Thermal Response, Junction−to−Ambient, SMC Package 100 50% Duty Cycle R(t) (°C/W) 10 20% 10% 5% 2% P(pk) 1 1% Test Type > min pad 1 oz RqJC = min pad 1 oz C/W t1 0.1 t2 DUTY CYCLE, D = t1/t2 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 PULSE TIME (s) 1 10 Figure 9. Typical Thermal Response, Junction−to−Ambient, SMB Package www.onsemi.com 5 100 1000 MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G PACKAGE DIMENSIONS SMC 2−LEAD CASE 403AC ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.254mm PER SIDE. 4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H. 5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA DETERMINED BY DIMENSION L. HE E D A1 DIM A A1 A2 b c D E HE L c J DETAIL A TOP VIEW DETAIL A A2 L A MILLIMETERS MIN MAX 1.95 2.61 0.05 0.20 1.90 2.41 2.90 3.20 0.15 0.41 5.55 6.25 6.60 7.15 7.75 8.15 0.75 1.60 b END VIEW SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* 8.750 0.344 J 2X 3.790 0.149 2X 2.250 0.089 mm Ǔ ǒinches SCALE 4:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 INCHES MIN MAX 0.077 0.103 0.002 0.008 0.075 0.095 0.114 0.126 0.006 0.016 0.219 0.246 0.260 0.281 0.305 0.321 0.030 0.063 MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE J HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1. E b DIM A A1 b c D E HE L L1 D POLARITY INDICATOR OPTIONAL AS NEEDED MIN 1.95 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.30 2.47 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.077 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.091 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.097 0.008 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 A1 c SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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