MC100EP58DT

MC10EP58, MC100EP58 3.3V / 5V ECL 2:1 Multiplexer Description The MC10/100EP58 is a 2:1 multiplexer. The device is pin and functionally equivalent to the EL58 and LVEL58 devices. The 100 Series contains temperature compensation. http://onsemi.com Features • 310 ps Typical Propagation Delay • Maximum Frequency > 3 GHz Typical • PECL Mode Operating Range: VCC = 3.0 V to 5.5 V • • • 8 8 with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −3.0 V to −5.5 V Open Input Default State Q Output Will Default LOW with Inputs Open or at VEE Pb−Free Packages are Available 1 SOIC−8 D SUFFIX CASE 751 1 8 HEP58 ALYW G 8 8 1 1 1 8 HP58 ALYWG G 1 KP58 ALYWG G 5U MG G TSSOP−8 DT SUFFIX CASE 948R KEP58 ALYW G DFN8 MN SUFFIX CASE 506AA H K 5U 3P M = MC10 = MC100 = MC10 = MC100 = Date Code 3P MG G • MARKING DIAGRAMS* 1 4 1 4 A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2008 August, 2008 − Rev. 7 1 Publication Order Number: MC10EP58/D MC10EP58, MC100EP58 Table 1. PIN DESCRIPTION NC Da 1 2 8 7 1 VCC Q MUX Db SEL 3 6 0 4 5 Q PIN FUNCTION Da*, Db* ECL Data Inputs SEL* ECL Select Inputs Q, Q ECL Data Outputs VCC Positive Supply VEE Negative Supply NC No Connect EP (DFN8 only) Thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open. VEE Figure 1. 8−Lead Pinout (Top View) and Logic Diagram * Pins will default LOW when left open. Table 2. TRUTH TABLE SEL Data H L a b Table 3. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor ESD Protection N/A Human Body Model Machine Model Charged Device Model Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC−8 TSSOP−8 DFN8 Flammability Rating Oxygen Index: 28 to 34 Transistor Count > 4 kV > 200 V > 2 kV Pb Pkg Pb−Free Pkg Level 1 Level 1 Level 1 Level 1 Level 3 Level 1 UL 94 V−0 @ 0.125 in 41 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. http://onsemi.com 2 MC10EP58, MC100EP58 Table 4. MAXIMUM RATINGS Rating Unit VCC Symbol PECL Mode Power Supply Parameter VEE = 0 V Condition 1 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 8 SOIC 8 SOIC 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 8 SOIC 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 8 TSSOP 8 TSSOP 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 8 TSSOP 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder 3 Typ Max >3 Unit GHz ps D to Q,Q SEL to Q,Q Q, Q 200 280 380 0.2