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MC74VHC4066MG

MC74VHC4066MG

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOIC16

  • 描述:

    IC SWITCH SPST QUAD 16SOEIAJ

  • 数据手册
  • 价格&库存
MC74VHC4066MG 数据手册
MC74VHC4066 Quad Analog Switch/ Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS The MC74VHC4066 utilizes silicon−gate CMOS technology to achieve fast propagation delays, low ON resistances, and low O F F −c h a n n e l leakage current. This bilateral switch/multiplexer/demultiplexer controls analog and digital voltages that may vary across the full power−supply range (from VCC to GND). The VHC4066 is identical in pinout to the metal−gate CMOS MC14066 and the high−speed CMOS HC4066A. Each device has four independent switches. The device has been designed so that the ON resistances (RON) are much more linear over input voltage than RON of metal−gate CMOS analog switches. The ON/OFF control inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. For analog switches with voltage−level translators, see the VHC4316. http://onsemi.com MARKING DIAGRAMS 14 SOIC−14 D SUFFIX CASE 751A 1 1 14 1 • • • VHC 4066 ALYWG G TSSOP−14 DT SUFFIX CASE 948G Features • • • • • • • VHC4066G AWLYWW 1 Fast Switching and Propagation Speeds High ON/OFF Output Voltage Ratio Low Crosstalk Between Switches Diode Protection on All Inputs/Outputs Wide Power−Supply Voltage Range (VCC − GND) = 2.0 to 12.0 Volts Analog Input Voltage Range (VCC − GND) = 2.0 to 12.0 Volts Improved Linearity and Lower ON Resistance over Input Voltage than the MC14016 or MC14066 Low Noise Chip Complexity: 44 FETs or 11 Equivalent Gates These Devices are Pb−Free and are RoHS Compliant 1 14 YA 2 13 YB 3 12 XB B ON/OFF CONTROL C ON/OFF CONTROL GND 4 11 VCC A ON/OFF CONTROL D ON/OFF CONTROL XD 5 10 YD 6 9 YC 7 8 XC © Semiconductor Components Industries, LLC, 2014 September, 2014 − Rev. 7 FUNCTION TABLE On/Off Control Input State of Analog Switch L H Off On ORDERING INFORMATION PIN ASSIGNMENT XA A = Assembly Location WL, L = Wafer Lot Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) Device Package Shipping† MC74VHC4066DR2G SOIC−14 (Pb−Free) 2500 / Tape & Reel MC74VHC4066DTR2G TSSOP−14 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 Publication Order Number: MC74VHC4066/D MC74VHC4066 XA A ON/OFF CONTROL XB B ON/OFF CONTROL XC C ON/OFF CONTROL XD D ON/OFF CONTROL 1 2 YA 13 4 3 YB ANALOG OUTPUTS/INPUTS 5 8 9 YC 6 11 10 YD ANALOG INPUTS/OUTPUTS = XA, XB, XC, XD PIN 14 = VCC PIN 7 = GND 12 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Figure 1. Logic Diagram MAXIMUM RATINGS Symbol Parameter Value Unit – 0.5 to + 14.0 V V VCC Positive DC Supply Voltage (Referenced to GND) VIS Analog Input Voltage (Referenced to GND) – 0.5 to VCC + 0.5 Vin Digital Input Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V ± 25 mA 500 450 mW – 65 to + 150 _C 260 _C I DC Current Into or Out of Any Pin PD Power Dissipation in Still Air, SOIC Package† TSSOP Package† Tstg Storage Temperature TL Lead Temperature, 1 mm from Case for 10 Seconds †Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 2.0 12.0 V Analog Input Voltage (Referenced to GND) GND VCC V Digital Input Voltage (Referenced to GND) GND VCC V Static or Dynamic Voltage Across Switch — 1.2 V – 55 + 125 _C 0 0 0 0 0 1000 600 500 400 250 VCC Positive DC Supply Voltage (Referenced to GND) VIS Vin VIO* TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time, ON/OFF Control Inputs (Figure 14) VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 9.0 V VCC = 12.0 V ns Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. *For voltage drops across the switch greater than 1.2 V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded. http://onsemi.com 2 This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC ). Unused outputs must be left open. I/O pins must be connected to a properly terminated line or bus. MC74VHC4066 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ DC ELECTRICAL CHARACTERISTIC Digital Section (Voltages Referenced to GND) Guaranteed Limit Symbol Parameter Test Conditions VCC V – 55 to 25_C v 85_C v 125_C Unit VIH Minimum High−Level Voltage ON/OFF Control Inputs Ron = Per Spec 2.0 3.0 4.5 9.0 12.0 1.5 2.1 3.15 6.3 8.4 1.5 2.1 3.15 6.3 8.4 1.5 2.1 3.15 6.3 8.4 V VIL Maximum Low−Level Voltage ON/OFF Control Inputs Ron = Per Spec 2.0 3.0 4.5 9.0 12.0 0.5 0.9 1.35 2.7 3.6 0.5 0.9 1.35 2.7 3.6 0.5 0.9 1.35 2.7 3.6 V Iin Maximum Input Leakage Current ON/OFF Control Inputs Vin = VCC or GND 12.0 ± 0.1 ± 1.0 ± 1.0 μA ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND VIO = 0 V 6.0 12.0 2 4 20 40 40 160 μA DC ELECTRICAL CHARACTERISTICS Analog Section (Voltages Referenced to GND) Guaranteed Limit VCC V – 55 to 25_C v 85_C v 125_C Vin = VIH VIS = VCC to GND IS v 2.0 mA (Figures 2 through 7) 2.0† 3.0† 4.5 9.0 12.0 — — 120 70 70 — — 160 85 85 — — 200 100 100 Vin = VIH VIS = VCC or GND (Endpoints) IS v 2.0 mA (Figures 2 through 7) 2.0 3.0 4.5 9.0 12.0 — — 70 50 30 — — 85 60 60 — — 100 80 80 Maximum Difference in “ON” Resistance Between Any Two Channels in the Same Package Vin = VIH VIS = 1/2 (VCC − GND) IS v 2.0 mA 2.0 4.5 9.0 12.0 — 20 15 15 — 25 20 20 — 30 25 25 Ω Ioff Maximum Off−Channel Leakage Current, Any One Channel Vin = VIL VIO = VCC or GND Switch Off 12.0 0.1 0.5 1.0 μA Ion Maximum On−Channel Leakage Current, Any One Channel Vin = VIH VIS = VCC or GND 12.0 0.1 0.5 1.0 μA Symbol Ron ΔRon Parameter Maximum “ON” Resistance Test Conditions Unit Ω †At supply voltage (VCC) approaching 3 V the analog switch−on resistance becomes extremely non−linear. Therefore, for low−voltage operation, it is recommended that these devices only be used to control digital signals. http://onsemi.com 3 MC74VHC4066 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, ON/OFF Control Inputs: tr = tf = 6 ns) Guaranteed Limit Symbol Parameter VCC V – 55 to 25_C v 85_C v 125_C Unit tPLH, tPHL Maximum Propagation Delay, Analog Input to Analog Output (Figures 18 and 13) 2.0 3.0 4.5 9.0 12.0 40 30 5 5 5 50 40 7 7 7 60 50 8 8 8 ns tPLZ, tPHZ Maximum Propagation Delay, ON/OFF Control to Analog Output (Figures 14 and 15) 2.0 3.0 4.5 9.0 12.0 80 60 20 20 20 90 70 25 25 25 110 80 35 35 35 ns tPZL, tPZH Maximum Propagation Delay, ON/OFF Control to Analog Output (Figures 14 and 15) 2.0 3.0 4.5 9.0 12.0 80 45 20 20 20 90 50 25 25 25 100 60 30 30 30 ns ON/OFF Control Input — 10 10 10 pF Control Input = GND Analog I/O Feedthrough — — 35 1.0 35 1.0 35 1.0 C Maximum Capacitance Typical @ 25°C, VCC = 5.0 V CPD 15 Power Dissipation Capacitance (Per Switch) (Figure 17)* * Used to determine the no−load dynamic power consumption: P D = CPD VCC http://onsemi.com 4 2f + ICC VCC . pF MC74VHC4066 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted) VCC V Limit* 25_C 74HC Symbol Parameter Test Conditions BW Maximum On−Channel Bandwidth or Minimum Frequency Response (Figure NO TAG) fin = 1 MHz Sine Wave Adjust fin Voltage to Obtain 0 dBm at VOS Increase fin Frequency Until dB Meter Reads – 3 dB RL = 50 Ω, CL = 10 pF 4.5 9.0 12.0 150 160 160 MHz Off−Channel Feedthrough Isolation (Figure NO TAG) fin  Sine Wave Adjust fin Voltage to Obtain 0 dBm at VIS fin = 10 kHz, RL = 600 Ω, CL = 50 pF 4.5 9.0 12.0 − 50 − 50 − 50 dB fin = 1.0 MHz, RL = 50 Ω, CL = 10 pF 4.5 9.0 12.0 − 40 − 40 − 40 Vin v 1 MHz Square Wave (tr = tf = 6 ns) Adjust RL at Setup so that IS = 0 A RL = 600 Ω, CL = 50 pF 4.5 9.0 12.0 60 130 200 RL = 10 kΩ, CL = 10 pF 4.5 9.0 12.0 30 65 100 fin  Sine Wave Adjust fin Voltage to Obtain 0 dBm at VIS fin = 10 kHz, RL = 600 Ω, CL = 50 pF 4.5 9.0 12.0 – 70 – 70 – 70 fin = 1.0 MHz, RL = 50 Ω, CL = 10 pF 4.5 9.0 12.0 – 80 – 80 – 80 — — — Crosstalk Between Any Two Switches (Figure 16) Total Harmonic Distortion (Figure 20) fin = 1 kHz, RL = 10 kΩ, CL = 50 pF THD = THDMeasured − THDSource VIS = 4.0 VPP sine wave VIS = 8.0 VPP sine wave VIS = 11.0 VPP sine wave *Guaranteed limits not tested. Determined by design and verified by qualification. 4.5 9.0 12.0 0.10 0.06 0.04 350 300 250 200 150 +25 _C +125_C −55_C 100 50 0 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND Figure 2. Typical On Resistance, VCC = 2.0 V http://onsemi.com 5 mVPP dB % 400 RON @ 2 V THD Feedthrough Noise, Control to Switch (Figure NO TAG) Unit 1.80 2.00 MC74VHC4066 200 180 RON @ 4.5 V 160 +25 _C +125_C −55_C 140 120 100 80 60 40 20 0 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND Figure 3. Typical On Resistance, VCC = 4.5 V 90 80 RON @ 6 V 70 60 50 40 30 +25 _C +125_C −55_C 20 10 0 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND Figure 4. Typical On Resistance, VCC = 6.0 V http://onsemi.com 6 5.00 5.50 6.00 MC74VHC4066 90 +25 _C +125_C −55_C 80 RON @ 9V 70 60 50 40 30 20 10 0 0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00 Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND Figure 5. Typical On Resistance, VCC = 9.0 V 60 RON @ 12 V 50 40 30 20 +25 _C +125_C −55_C 10 0 0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00 10.00 Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND Figure 6. Typical On Resistance, VCC = 12 V http://onsemi.com 7 11.00 12.00 MC74VHC4066 PLOTTER VCC PROGRAMMABLE POWER SUPPLY - VCC MINI COMPUTER DC ANALYZER + 14 GND A VCC VCC OFF DEVICE UNDER TEST ANALOG IN COMMON OUT SELECTED CONTROL INPUT 7 VIL GND Figure 7. On Resistance Test Set−Up Figure 8. Maximum Off Channel Leakage Current, Any One Channel, Test Set−Up VCC VCC VCC 14 14 A VOS fin N/C ON ON 0.1μF SELECTED CONTROL INPUT 7 dB METER CL* GND VIH 7 SELECTED CONTROL INPUT VCC *Includes all probe and jig capacitance. Figure 9. Maximum On Channel Leakage Current, Test Set−Up VCC VIS Figure 10. Maximum On−Channel Bandwidth Test Set−Up VCC VCC/2 VOS 14 14 fin OFF 0.1μF CL* RL VCC/2 RL RL dB METER OFF/ON IS VOS CL* SELECTED CONTROL INPUT 7 VCC GND Vin ≤ 1 MHz tr = tf = 6 ns 7 SELECTED CONTROL INPUT CONTROL *Includes all probe and jig capacitance. *Includes all probe and jig capacitance. Figure 11. Off−Channel Feedthrough Isolation, Test Set−Up Figure 12. Feedthrough Noise, ON/OFF Control to Analog Out, Test Set−Up http://onsemi.com 8 MC74VHC4066 VCC 14 VCC ANALOG IN ANALOG OUT ON 50% ANALOG IN CL* GND tPLH TEST POINT tPHL 50% ANALOG OUT 7 SELECTED CONTROL INPUT VCC *Includes all probe and jig capacitance. Figure 18. Propagation Delays, Analog In to Analog Out Figure 13. Propagation Delay Test Set−Up 1 POSITIONWHEN TESTING tPHZ AND tPZH tr CONTROL tf VCC 90% 50% 10% 1 kΩ 14 HIGH IMPEDANCE 10% tPZH VCC VCC 1 tPLZ 50% ANALOG OUT 2 GND tPZL 2 POSITIONWHEN TESTING tPLZ AND tPZL 1 CL* VOL SELECTED CONTROL INPUT tPHZ 90% 50% TEST POINT ON/OFF 2 VOH 7 HIGH IMPEDANCE *Includes all probe and jig capacitance. Figure 14. Propagation Delay, ON/OFF Control to Analog Out Figure 15. Propagation Delay Test Set−Up VIS VCC VCC 14 RL fin VOS A ON 0.1 μF 14 N/C OFF VCC OR GND RL RL SELECTED CONTROL INPUT CL* VCC/2 RL OFF/ON CL* VCC/2 7 7 VCC/2 SELECTED CONTROL INPUT ON/OFF CONTROL *Includes all probe and jig capacitance. Figure 16. Crosstalk Between Any Two Switches, Test Set−Up Figure 17. Power Dissipation Capacitance Test Set−Up http://onsemi.com 9 N/C MC74VHC4066 0 -10 VCC VOS fin ON RL CL* TO DISTORTION METER -30 7 -40 -50 DEVICE -60 VCC/2 SELECTED CONTROL INPUT FUNDAMENTAL FREQUENCY -20 0.1 μF dBm VIS SOURCE -70 VCC -80 -90 3.0 *Includes all probe and jig capacitance. 1.0 2.0 Figure 20. Total Harmonic Distortion, Test Set−Up Figure 19. Plot, Harmonic Distortion APPLICATION INFORMATION the example below, the difference between VCC and GND is twelve volts. Therefore, using the configuration in Figure 21, a maximum analog signal of twelve volts peak−to−peak can be controlled. When voltage transients above VCC and/or below GND are anticipated on the analog channels, external diodes (Dx) are recommended as shown in Figure 22. These diodes should be small signal, fast turn−on types able to absorb the maximum anticipated current surges during clipping. An alternate method would be to replace the Dx diodes with Mosorbs (high current surge protectors). Mosorbs are fast turn−on devices ideally suited for precise DC protection with no inherent wear out mechanism. FREQUENCY (kHz) The ON/OFF Control pins should be at VCC or GND logic levels, VCC being recognized as logic high and GND being recognized as a logic low. Unused analog inputs/outputs may be left floating (not connected). However, it is advisable to tie unused analog inputs and outputs to VCC or GND through a low value resistor. This minimizes crosstalk and feedthrough noise that may be picked−up by the unused I/O pins. The maximum analog voltage swings are determined by the supply voltages V CC and GND. The positive peak analog voltage should not exceed V CC . Similarly, the negative peak analog voltage should not go below GND. In VCC = 12 V + 12 V 14 ANALOG I/O ON ANALOG O/I VCC VCC Dx + 12 V 16 ON 0V 0V Dx SELECTED CONTROL INPUT 7 Dx VCC OTHER CONTROL INPUTS (VCC OR GND) Dx SELECTED CONTROL INPUT 7 Figure 21. 12 V Application OTHER CONTROL INPUTS (VCC OR GND) Figure 22. Transient Suppressor Application http://onsemi.com 10 MC74VHC4066 +5 V +5 V 14 ANALOG SIGNALS R* R* R* R* VHC4066 LSTTL/ NMOS 6 VHCT BUFFER LSTTL/ NMOS 5 15 ANALOG SIGNALS VHC4066 5 6 CONTROL INPUTS 14 14 ANALOG SIGNALS ANALOG SIGNALS CONTROL INPUTS 14 15 7 7 R* = 2 TO 10 kΩ a. Using Pull-Up Resistors b. Using HCT Buffer Figure 23. LSTTL/NMOS to HCMOS Interface VDD = 5 V 13 1 VCC = 5 TO 12 V 16 14 ANALOG SIGNALS 3 ANALOG SIGNALS VHC4066 5 2 5 9 4 6 11 6 14 CONTROL INPUTS 10 15 7 7 14 MC14504 8 Figure 24. TTL/NMOS−to−CMOS Level Converter Analog Signal Peak−to−Peak Greater than 5 V (Also see VHC4316) CHANNEL 4 1 OF 4 SWITCHES CHANNEL 3 1 OF 4 SWITCHES CHANNEL 2 1 OF 4 SWITCHES COMMON I/O INPUT CHANNEL 1 1 OF 4 SWITCHES 1 1 OF 4 SWITCHES + OUTPUT LF356 OR EQUIVALENT 0.01 μF 2 3 4 CONTROL INPUTS Figure 25. 4−Input Multiplexer Figure 26. Sample/Hold Amplifier http://onsemi.com 11 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−14 NB CASE 751A−03 ISSUE L 14 1 SCALE 1:1 D DATE 03 FEB 2016 A B 14 8 A3 E H L 1 0.25 B M DETAIL A 7 13X M b 0.25 M C A S B S 0.10 X 45 _ M A1 e DETAIL A h A C SEATING PLANE DIM A A1 A3 b D E e H h L M MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 6.50 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 14 14X 1.18 XXXXXXXXXG AWLYWW 1 1 1.27 PITCH XXXXX A WL Y WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. STYLES ON PAGE 2 DOCUMENT NUMBER: DESCRIPTION: 98ASB42565B SOIC−14 NB Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com SOIC−14 CASE 751A−03 ISSUE L DATE 03 FEB 2016 STYLE 1: PIN 1. COMMON CATHODE 2. ANODE/CATHODE 3. ANODE/CATHODE 4. NO CONNECTION 5. ANODE/CATHODE 6. NO CONNECTION 7. ANODE/CATHODE 8. ANODE/CATHODE 9. ANODE/CATHODE 10. NO CONNECTION 11. ANODE/CATHODE 12. ANODE/CATHODE 13. NO CONNECTION 14. COMMON ANODE STYLE 2: CANCELLED STYLE 3: PIN 1. NO CONNECTION 2. ANODE 3. ANODE 4. NO CONNECTION 5. ANODE 6. NO CONNECTION 7. ANODE 8. ANODE 9. ANODE 10. NO CONNECTION 11. ANODE 12. ANODE 13. NO CONNECTION 14. COMMON CATHODE STYLE 4: PIN 1. NO CONNECTION 2. CATHODE 3. CATHODE 4. NO CONNECTION 5. CATHODE 6. NO CONNECTION 7. CATHODE 8. CATHODE 9. CATHODE 10. NO CONNECTION 11. CATHODE 12. CATHODE 13. NO CONNECTION 14. COMMON ANODE STYLE 5: PIN 1. COMMON CATHODE 2. ANODE/CATHODE 3. ANODE/CATHODE 4. ANODE/CATHODE 5. ANODE/CATHODE 6. NO CONNECTION 7. COMMON ANODE 8. COMMON CATHODE 9. ANODE/CATHODE 10. ANODE/CATHODE 11. ANODE/CATHODE 12. ANODE/CATHODE 13. NO CONNECTION 14. COMMON ANODE STYLE 6: PIN 1. CATHODE 2. CATHODE 3. CATHODE 4. CATHODE 5. CATHODE 6. CATHODE 7. CATHODE 8. ANODE 9. ANODE 10. ANODE 11. ANODE 12. ANODE 13. ANODE 14. ANODE STYLE 7: PIN 1. ANODE/CATHODE 2. COMMON ANODE 3. COMMON CATHODE 4. ANODE/CATHODE 5. ANODE/CATHODE 6. ANODE/CATHODE 7. ANODE/CATHODE 8. ANODE/CATHODE 9. ANODE/CATHODE 10. ANODE/CATHODE 11. COMMON CATHODE 12. COMMON ANODE 13. ANODE/CATHODE 14. ANODE/CATHODE STYLE 8: PIN 1. COMMON CATHODE 2. ANODE/CATHODE 3. ANODE/CATHODE 4. NO CONNECTION 5. ANODE/CATHODE 6. ANODE/CATHODE 7. COMMON ANODE 8. COMMON ANODE 9. ANODE/CATHODE 10. ANODE/CATHODE 11. NO CONNECTION 12. ANODE/CATHODE 13. ANODE/CATHODE 14. COMMON CATHODE DOCUMENT NUMBER: DESCRIPTION: 98ASB42565B SOIC−14 NB Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−14 WB CASE 948G ISSUE C 14 DATE 17 FEB 2016 1 SCALE 2:1 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. N F 7 1 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S DETAIL E K A −V− K1 J J1 ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE H G D DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ GENERIC MARKING DIAGRAM* 14 SOLDERING FOOTPRINT XXXX XXXX ALYWG G 7.06 1 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: 98ASH70246A DESCRIPTION: TSSOP−14 WB A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. 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