MM74HC4050N

Revised October 1999 MM74HC4049 • MM74HC4050 Hex Inverting Logic Level Down Converter • Hex Logic Level Down Converter General Description The MM74HC4049 and the MM74HC4050 utilize advanced silicon-gate CMOS technology, and have a modified input protection structure that enables these parts to be used as logic level translators which will convert high level logic to a low level logic while operating from the low logic supply. For example, 0–15V CMOS logic can be converted to 0–5V logic when using a 5V supply. The modified input protection has no diode connected to VCC, thus allowing the input voltage to exceed the supply. The lower zener diode protects the input from both positive and negative static voltages. In addition each part can be used as a sim- ple buffer or inverter without level translation. The MM74HC4049 is pin and functionally compatible to the CD4049BC and the MM74HC4050 is compatible to the CD4050BC Features ■ Typical propagation delay: 8 ns ■ Wide power supply range: 2V–6V ■ Low quiescent supply current: 20 µA maximum (74HC) ■ Fanout of 10 LS-TTL loads Ordering Code: Order Number Package Number Package Description MM74HC4049M M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow MM74HC4049SJ M16D 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HC4049MTC MTC16 MM74HC4049N N16E 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153. 4.4mm Wide 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide MM74HC4050M M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow MM74HC4050SJ M16D 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HC4050MTC MTC16 MM74HC4050N N16E 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153. 4.4mm Wide 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Connection Diagrams MM74HC4049 © 1999 Fairchild Semiconductor Corporation MM74HC4050 DS005214 www.fairchildsemi.com MM74HC4049 • MM74HC4050 Hex Inverting Logic Level Down Converter • Hex Logic Level Down Converter February 1984 MM74HC4049 • MM74HC4050 Absolute Maximum Ratings(Note 1) Recommended Operating Conditions (Note 2) Supply Voltage (VCC ) −0.5 to +7.0V DC Input Voltage (VIN) −1.5 to +18V −0.5 to VCC +0.5V DC Output Voltage (VOUT) −20 mA Clamp Diode Current (IZK, IOK) DC Output Current, per pin (IOUT) ±25 mA DC VCC or GND Current, per pin (ICC) ±50 mA Max Units 2 6 V DC Input Voltage 0 15 V 0 VCC V −40 +85 °C (VIN) DC Output Voltage (VOUT) −65°C to +150°C Storage Temperature Range (TSTG) Min Supply Voltage (VCC) Operating Temperature Range (TA) Power Dissipation (PD) Input Rise or Fall Times (Note 3) 600 mW (tr, tf) VCC = 2.0V 1000 ns S.O. Package only 500 mW VCC = 4.5V 500 ns VCC = 6.0V 400 ns Lead Temperature (TL) (Soldering 10 seconds) 260°C Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Note 2: Unless otherwise specified all voltages are referenced to ground. Note 3: Power Dissipation temperature derating — plastic “N” package: − 12 mW/°C from 65°C to 85°C. DC Electrical Characteristics Symbol VIH VIL Parameter Conditions TA = 25°C VCC Typ TA = −40°C to 85°C TA = −55°C to 125°C Units Guaranteed Limits Minimum HIGH Level Input 2.0V 1.5 1.5 1.5 V Voltage 4.5V 3.15 3.15 3.15 V 6.0V 4.2 4.2 4.2 V Maximum LOW Level Input 2.0V 0.5 0.5 0.5 V 4.5V 1.35 1.35 1.35 V 6.0V 1.8 1.8 1.8 V Voltage VOH (Note 4) Minimum HIGH Level VIN = VIH or VIL Output Voltage |IOUT | ≤ 20 µA 2.0V 2.0 1.9 1.9 1.9 V 4.5V 4.5 4.4 4.4 4.4 V 6.0V 6.0 5.9 5.9 5.9 V |IOUT | ≤ 4.0 mA 4.5V 4.2 3.98 3.84 3.7 V |IOUT | ≤ 5.2 mA 6.0V 5.7 5.48 5.34 5.2 V VIN = VIH or VIL VOL Maximum LOW Level VIN = VIH or VIL Output Voltage |IOUT | ≤ 20 µA 2.0V 0 0.1 0.1 0.1 V 4.5V 0 0.1 0.1 0.1 V 6.0V 0 0.1 0.1 0.1 V V VIN = VIH or VIL |IOUT | ≤ 4 mA 4.5V 0.2 0.26 0.33 0.4 |IOUT | ≤ 5.2 mA 6.0V 0.2 0.26 0.33 0.4 V VIN = VCC or GND 6.0V ±0.1 ±1.0 ±1.0 µA 2.0V ±0.5 ±5 ±5 µA 6.0V 2.0 20 40 µA IIN Maximum Input Current ICC Maximum Quiescent Supply VIN = VCC or GND VIN = 15V Current IOUT = 0 µA Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. www.fairchildsemi.com 2 VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns Symbol Parameter tPHL, tPLH Conditions Typ Maximum Propagation Delay 8 Guaranteed Limit 15 Units ns AC Electrical Characteristics VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified) Symbol tPHL, tPLH tTHL, tTLH Parameter Conditions Typ TA = −40° to 85°C TA = −55° to 125°C Units Guaranteed Limits Maximum Propagation 2.0V 30 85 100 130 ns Delay 4.5V 10 17 20 26 ns ns 6.0V 9 15 18 22 Maximum Output 2.0V 25 75 95 110 ns Rise and Fall 4.5V 7 15 19 22 ns 6 13 16 19 Time CPD TA = 25°C VCC Power Dissipation 6.0V (per gate) 25 ns pF Capacitance (Note 5) CIN Maximum Input 5 10 10 10 pF Capacitance Note 5: CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. 3 www.fairchildsemi.com MM74HC4049 • MM74HC4050 AC Electrical Characteristics MM74HC4049 • MM74HC4050 Physical Dimensions inches (millimeters) unless otherwise noted 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow Package Number M16A 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M16D www.fairchildsemi.com 4 MM74HC4049 • MM74HC4050 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC16 5 www.fairchildsemi.com MM74HC4049 • MM74HC4050 Hex Inverting Logic Level Down Converter • Hex Logic Level Down Converter Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide Package Number N16E Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com www.fairchildsemi.com 6