MOC8111M, MOC8112M, MOC8113M
6-Pin DIP Optocoupler for Power Supply Applications
(No Base Connection)
Features
Description
■ High isolation voltage
The MOC811XM series consists of a Gallium Arsenide
IRED coupled with an NPN phototransistor. The base of
the transistor is not bonded to an external pin for
improved noise immunity.
■
■
■
■
■
7500 VAC Peak—1 second
High BVCEO minimum 70 Volts
Current transfer ratio in selected groups:
MOC8111M: 20% min.
MOC8112M: 50% min.
MOC8113M: 100% min.
Maximum switching time in saturation specified
Underwriters Laboratory (UL) recognized
(File #E90700, Vol. 2)
IEC60747-5-2 approved (ordering option V)
Applications
■ Power supply regulators
■ Digital logic inputs
■ Microprocessor inputs
■ Appliance sensor systems
■ Industrial controls
Schematic
ANODE 1
6 N/C
6
CATHODE 2
1
5 COLLECTOR
6
1
N/C 3
4 EMITTER
6
1
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
MOC8111M, MOC8112M, MOC8113M — 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
September 2009
Symbol
Parameter
Value
Unit
260
mW
3.5
mW/°C
TOTAL DEVICE
PD
Total Device Power Dissipation @ TA = 25°C
Derate above 25°C
TOPR
Ambient Operating Temperature Range
-40 to +100
°C
TSTG
Storage Temperature Range
-40 to +150
°C
TSOL
Lead Soldering Temperature (Wave Solder)
(1/16" from case, 10 sec. duration)
260
°C
Forward Current – Continuous
90
mA
Forward Current – Peak (PW = 1µs, 300pps)
3
A
VR
Reverse Voltage
6
V
PD
LED Power Dissipation @ TA = 25°C
INPUT LED
IF
IF(pk)
Derate above 25°C
135
mW
1.8
mW/°C
200
mW
2.67
mW/°C
OUTPUT TRANSISTOR
PD
Detector Power Dissipation @ TA = 25°C
Derate above 25°C
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
2
MOC8111M, MOC8112M, MOC8113M — 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Absolute Maximum Ratings (TA = 25°C Unless otherwise specified.)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Individual Component Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
1.35
1.65
V
1.15
1.50
EMITTER
VF
Input Forward Voltage
IF = 60mA
VR
Reverse Voltage
IR = 10µA
CJ
Capacitance
IF = 10mA
IR
Reverse Leakage Current
6.0
15
V
VF = 0V, f = 1.0MHz
50
pF
VF = 1V, f = 1.0MHz
65
VR = 3.0V
.35
10
µA
DETECTOR
BVCEO
Breakdow Voltage, Collector to Emitter
IC = 1.0mA, IF = 0
70
V
BVECO
Breakdow Voltage, Emitter to Collector
IE = 100µA, IF = 0
7
V
ICEO
Leakage Current, Collector to Emitter
VCE = 10V, IF = 0
5
CCE
Capacitance, Collector to Emitter
VCE = 0 V, f = 1MHz
8
50
V
pF
Isolation Characteristics
Symbol
Characteristic
Test Conditions
VISO
Input-Output Isolation Voltage
f = 60Hz, t = 1 sec.
CISO
Isolation Capacitance
VI-O = 0, f = 1MHz
Min.
Typ.
Max.
7500
Units
VAC(PK)
0.5
pF
Transfer Characteristic
Symbol
Characteristics
Test Conditions
Device
Min.
MOC8111M
20
MOC8112M
50
MOC8113M
100
Typ. Max. Units
DC CHARACTERISTICS
CTR
Output/Input Current
Transfer Ratio
VCE(SAT) Collector-Emitter
Saturation Voltage
IF = 10mA, VCE = 5V
%
IF = 10mA, IC = 2.5mA
All
0.27
0.4
V
RL = 100Ω, IC = 2mA,
VCC = 10V, See Figure 7
All
6.0
10
µs
All
5.5
10
µs
IF = 20mA, VCE = 0.4V
MOC8111M
3.0
5.5
µs
IF = 10mA, VCE = 0.4V
MOC812M/3M
4.2
8.0
AC CHARACTERISTICS
Non-Saturated Switching Times
ton
Turn-On Time
toff
Turn-Off Time
Saturated Switching Times
ton
tr
toff
tf
Turn-On Time
Rise-Time
Turn-Off Time
Fall-Time
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
IF = 20mA, VCE = 0.4V
MOC8111M
2.0
4.0
IF = 10mA, VCE = 0.4V
MOC812M/3M
3.0
6.0
IF = 20mA, VCE = 0.4V
MOC8111M
18
34
IF = 10mA, VCE = 0.4V
MOC812M/3M
23
39
IF = 20mA, VCE = 0.4V
MOC8111M
11
20
IF = 10mA, VCE = 0.4V
MOC812M/3M
14
24
µs
µs
µs
www.fairchildsemi.com
3
MOC8111M, MOC8112M, MOC8113M — 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Electrical Characteristics (TA = 25°C Unless otherwise specified.)
As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.
Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Installation Classifications per DIN VDE 0110/1.89
Table 1
For Rated Main Voltage < 150Vrms
I-IV
For Rated Main voltage < 300Vrms
I-IV
Climatic Classification
55/100/21
Pollution Degree (DIN VDE 0110/1.89)
2
CTI
Comparative Tracking Index
175
VPR
Input to Output Test Voltage, Method b,
VIORM x 1.875 = VPR, 100% Production Test
with tm = 1 sec, Partial Discharge < 5pC
1594
Vpeak
Input to Output Test Voltage, Method a,
VIORM x 1.5 = VPR, Type and Sample Test
with tm = 60 sec, Partial Discharge < 5pC
1275
Vpeak
VIORM
Max. Working Insulation Voltage
850
Vpeak
VIOTM
Highest Allowable Over Voltage
6000
Vpeak
External Creepage
7
mm
External Clearance
7
mm
Insulation Thickness
0.5
mm
Insulation Resistance at Ts, VIO = 500V
109
Ω
RIO
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
4
MOC8111M, MOC8112M, MOC8113M — 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Safety and Insulation Ratings
Fig. 1 LED Forward Voltage vs. Forward Current
Fig. 2 Normalized CTR vs. Forward Current
1.8
1.4
TA = 25°C
VCE = 5.0 V
Normalized to
IF = 10 mA
1.2
1.6
1.0
NORMALIZED CTR
VF - FORWARD VOLTAGE (V)
1.7
1.5
TA = -55°C
1.4
1.3
1.2
0.8
0.6
0.4
TA = 25°C
0.2
1.1
TA = 100°C
1.0
0.0
1
10
100
0
5
IF - LED FORWARD CURRENT (mA)
VCE (sat) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
1.6
NORMALIZED CTR
IF = 5 mA
1.2
IF = 10 mA
1.0
0.8
IF = 20 mA
0.6
0.4
-75
Normalized to
IF = 10 mA
TA = 25°C
-50
-25
0
25
50
75
100
125
TA - AMBIENT TEMPERATURE (°C)
20
Fig. 4 Collector Emitter Saturation Voltage
vs Collector Current
100
10
1
IF = 2.5 mA
0.1
IF = 20 mA
0.01
IF = 5 mA
IF = 10 mA
TA = 25°C
0.001
0.01
0.1
1
10
IC - COLLECTOR CURRENT (mA)
Fig. 5 Switching Speed vs. Load Resistor
Fig. 6 Dark current vs. Ambient Temperature.
1000
ICEO - COLLECTOR-EMITTER DARK CURRENT (µA)
1e+1
IF = 10 mA
VCC = 10 V
TA = 25°C
SWITCHING SPEED - (µs)
15
IF - FORWARD CURRENT (mA)
Fig. 3 Normalized CTR vs. Ambient Temperature
1.4
10
100
Toff
Tf
10
Ton
1
Tr
0.1
VCE = 10V
1e+0
1e-1
1e-2
1e-3
1e-4
1e-5
1e-6
0.1
1
10
100
0
R-LOAD RESISTOR (kΩ)
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
25
50
75
100
125
TA - AMBIENT TEMPERATURE (°C)
www.fairchildsemi.com
5
MOC8111M, MOC8112M, MOC8113M — 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Typical Performance Characteristics
WAVE FORMS
VCC = 10V
INPUT PULSE
IF
IC
INPUT
RL = 100Ω
10%
OUTPUT
OUTPUT PULSE
90%
tr
ton
tf
toff
Adjust IF to produce IC = 2 mA
Figure 7. Switching Time Test Circuit and Waveforms
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
6
MOC8111M, MOC8112M, MOC8113M — 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
TEST CIRCUIT
Through Hole
0.4" Lead Spacing
8.13–8.89
6
4
8.13–8.89
6
4
1
3
6.10–6.60
6.10–6.60
Pin 1
1
3
Pin 1
5.08 (Max.)
0.25–0.36
7.62 (Typ.)
3.28–3.53
5.08 (Max.)
0.25–0.36
3.28–3.53
0.38 (Min.)
2.54–3.81
0.38 (Min.)
2.54–3.81
0.20–0.30
2.54 (Bsc)
(0.86)
15° (Typ.)
2.54 (Bsc)
(0.86)
0.41–0.51
1.02–1.78
0.20–0.30
0.41–0.51
0.76–1.14
10.16–10.80
1.02–1.78
0.76–1.14
Surface Mount
(1.78)
8.13–8.89
6
4
(1.52)
(2.54)
(7.49)
6.10–6.60
8.43–9.90
(10.54)
1
3
(0.76)
Pin 1
Rcommended Pad Layout
0.25–0.36
3.28–3.53
5.08
(Max.)
0.38 (Min.)
0.20–0.30
2.54 (Bsc)
(0.86)
0.16–0.88
(8.13)
0.41–0.51
1.02–1.78
0.76–1.14
Note:
All dimensions in mm.
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
7
MOC8111M, MOC8112M, MOC8113M — 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Package Dimensions
Option
Example Part Number
Description
No Suffix
MOC8111M
S
MOC8111SM
Through Hole
SR2
MOC8111SR2M
T
MOC8111TM
0.4" Lead Spacing
VDE 0884
Surface Mount Lead Bend
Surface Mount; Tape and Reel
V
MOC8111VM
TV
MOC8111TVM
IEC60747-5-2 (VDE), 0.4" Lead Spacing
SV
MOC8111SVM
IEC60747-5-2 (VDE), Surface Mount
SR2V
MOC8111SR2VM
IEC60747-5-2 (VDE), Surface Mount, Tape and Reel
Marking Information
1
MOC8111
2
X YY Q
6
V
3
5
4
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
One digit year code, e.g., ‘8’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
8
MOC8111M, MOC8112M, MOC8113M — 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Ordering Information
12.0 ± 0.1
4.5 ± 0.20
2.0 ± 0.05
Ø1.5 MIN
4.0 ± 0.1
0.30 ± 0.05
1.75 ± 0.10
11.5 ± 1.0
21.0 ± 0.1
9.1 ± 0.20
Ø1.5 ± 0.1/-0
10.1 ± 0.20
0.1 MAX
24.0 ± 0.3
User Direction of Feed
Note:
All dimensions are in millimeters.
Reflow Profile
300
260°C
280
260
>245°C = 42 Sec
240
220
200
180
°C
Time above
183°C = 90 Sec
160
140
120
1.822°C/Sec Ramp up rate
100
80
60
40
33 Sec
20
0
0
60
120
180
270
360
Time (s)
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
9
MOC8111M, MOC8112M, MOC8113M — 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Tape Dimensions
Auto-SPM™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EfficentMax™
EZSWITCH™*
™*
®
®
Fairchild
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
FAST®
FastvCore™
FETBench™
FlashWriter®*
FPS™
F-PFS™
FRFET®
SM
Global Power Resource
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MillerDrive™
MotionMax™
Motion-SPM™
OPTOLOGIC®
®
OPTOPLANAR
®
PDP SPM™
Power-SPM™
PowerTrench®
PowerXS™
Programmable Active Droop™
QFET®
QS™
Quiet Series™
RapidConfigure™
™
Saving our world, 1mW/W/kW at a time™
SmartMax™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
SyncFET™
Sync-Lock™
®
*
The Power Franchise®
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TriFault Detect™
TRUECURRENT™*
µSerDes™
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
Definition
Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I40
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
10
MOC8111M, MOC8112M, MOC8113M — 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
TRADEMARKS
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intended to be an exhaustive list of all such trademarks.