MOC8111_04

6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 PACKAGE MOC8112 MOC8113 SCHEMATIC ANODE 1 6 N/C 6 1 6 CATHODE 2 5 COLLECTOR 1 N/C 3 4 EMITTER 6 1 DESCRIPTION The MOC811X series consists of a Gallium Arsenide IRED coupled with an NPN phototransistor. The base of the transistor is not bonded to an external pin for improved noise immunity FEATURES • High isolation voltage 5300 VAC RMS—1 minute • High BVCEO minimum 70 Volts • Current transfer ratio in selected groups: MOC8111: 20% min. MOC8112: 50% min. MOC8113: 100% min. • Maximum switching time in saturation specified • Underwriters Laboratory (UL) recognized (File #E90700) • VDE recognized (File #94766) APPLICATIONS • • • • • Power Supply Regulators Digital Logic Inputs Microprocessor Inputs Appliance Sensor Systems Industrial Controls © 2004 Fairchild Semiconductor Corporation Page 1 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 ABSOLUTE MAXIMUM RATINGS (TA =25°C Unless otherwise specified) Parameter INPUT LED Forward Current – Continuous Forward Current – Peak (PW = 1µs, 300pps) Reverse Voltage LED Power Dissipation @ TA = 25°C Derate above 25°C OUTPUT TRANSISTOR Detector Power Dissipation @ TA = 25°C Derate above 25°C TOTAL DEVICE Total Device Power Dissipation @ TA = 25°C Derate above 25°C Ambient Operating Temperature Range Storage Temperature Range Lead Soldering Temperature (1/16” from case, 10 sec. duration) PD TOPR TSTG TSOL 260 3.5 -55 to +100 -55 to +150 260 mW mW/°C °C °C °C PD 200 2.67 mW mW/°C IF IF(pk) VR PD 90 3 6 135 1.8 mA A Volts mW mW/°C Symbol Value Unit © 2004 Fairchild Semiconductor Corporation Page 2 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter EMITTER Input Forward Voltage Reverse Voltage Capacitance Reverse Leakage Current DETECTOR Breakdow Voltage Collector to Emitter Breakdow Voltage Emitter to Collector Leakage Current Collector to Emitter Capacitance Collector to Emitter IC = 1.0 mA, IF = 0 IE = 100 µA, IF = 0 VCE = 10 V, IF = 0 VCE = 0 V, f = 1 MHz BVCEO BVECO ICEO CCE All All All All 70 7 5 8 50 V V V pF IF = 60 mA IF = 10 mA IR = 10 µA VF = 0 V, f = 1.0 MHz VF = 1 V, f = 1.0 MHz VR = 3.0 V VF VR CJ IR All All All All 6.0 1.35 1.15 15 50 65 .35 10 1.65 1.50 V V pF µA Test Conditions Symbol Device Min Typ Max Unit ISOLATION CHARACTERISTICS Characteristic Input-Output Isolation Voltage Isolation Resistance Isolation Capacitance Test Conditions f = 60 Hz, t = 1 min. VI-O = 500 VDC VI-O = 0, f = 1 MHz Symbol VISO RISO CISO Min 5300 1011 0.5 Typ Max Units VRMS Ω pF © 2004 Fairchild Semiconductor Corporation Page 3 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified) DC CHARACTERISTICS Output/Input Current Transfer Ratio Collector-Emitter Saturation Voltage AC CHARACTERISTICSØ Non-Saturated Switching Times Turn-On Time Turn-Off Time Saturated Switching Times Turn-On Time Rise-Time Turn-Off Time Fall-Time IF = 20 mA, VCE = 0.4 V IF = 10 mA, VCE = 0.4 V IF = 20 mA, VCE = 0.4 V IF = 10 mA, VCE = 0.4 V IF = 20 mA, VCE = 0.4 V IF = 10 mA, VCE = 0.4 V IF = 20 mA, VCE = 0.4 V IF = 10 mA, VCE = 0.4 V ton tr toff tf MOC8111 MOC812, MOC8113 MOC8111 MOC812, MOC8113 MOC8111 MOC812, MOC8113 MOC8111 MOC812, MOC8113 3.0 4.2 2.0 3.0 18 23 11 14 5.5 8.0 4.0 6.0 34 39 20 24 µS µS µS µS RL = 100 Ω, IC = 2 mA, VCC = 10 V See Figure 7 ton toff All All 6.0 5.5 10 10 µS µS Test Conditions Symbol Device MOC8111 IF = 10 mA, VCE = 5V CTR MOC8112 MOC8113 IF = 10 mA, IC = 2.5 mA Test Conditions VCE(SAT) Symbol All Device Min Min 20 50 100 0.27 Typ 0.4 Max V Units % Typ Max Units © 2004 Fairchild Semiconductor Corporation Page 4 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 TYPICAL PERFORMANCE CURVES Fig. 1 LED Forward Voltage vs. Forward Current 1.8 1.4 TA = 25°C VCE = 5.0 V 1.2 Normalized to IF = 10 mA MOC8112 MOC8113 Fig. 2 Normalized CTR vs. Forward Current 1.7 VF - FORWARD VOLTAGE (V) 1.6 1.0 1.5 TA = -55°C 1.4 NORMALIZED CTR 100 0.8 0.6 1.3 1.2 TA = 25°C 1.1 TA = 100°C 1.0 1 10 0.4 0.2 0.0 0 5 10 15 20 IF - LED FORWARD CURRENT (mA) IF - FORWARD CURRENT (mA) Fig. 3 Normalized CTR vs. Ambient Temperature 1.6 VCE (sat) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) Fig. 4 Collector Emitter Saturation Voltage vs Collector Current 100 1.4 IF = 5 mA 10 NORMALIZED CTR 1.2 IF = 10 mA 1.0 1 IF = 2.5 mA 0.1 0.8 IF = 20 mA 0.6 Normalized to IF = 10 mA TA = 25°C -50 -25 0 25 50 75 100 125 0.01 IF = 5 mA TA = 25°C 0.001 0.01 0.1 1 IF = 10 mA IF = 20 mA 0.4 -75 10 TA - AMBIENT TEMPERATURE (°C) IC - COLLECTOR CURRENT (mA) © 2004 Fairchild Semiconductor Corporation Page 5 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 TYPICAL PERFORMANCE CURVES (continued) Fig. 5 Switching Speed vs. Load Resistor 1000 IF = 10 mA VCC = 10 V TA = 25°C 1e+1 Fig. 6 Dark current vs. Ambient Temperature. ICEO - COLLECTOR-EMITTER DARK CURRENT (µA) 1e+0 VCE = 10V SWITCHING SPEED - (µs) 100 1e-1 Toff Tf 10 1e-2 1e-3 Ton 1 Tr 1e-4 1e-5 0.1 0.1 1 10 100 1e-6 0 25 50 75 100 125 R-LOAD RESISTOR (kΩ) TA - AMBIENT TEMPERATURE (°C) © 2004 Fairchild Semiconductor Corporation Page 6 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 Package Dimensions (Through Hole) PIN 1 ID. Package Dimensions (Surface Mount) 0.350 (8.89) 0.330 (8.38) 3 2 1 PIN 1 ID. 0.270 (6.86) 0.240 (6.10) 0.270 (6.86) 0.240 (6.10) SEATING PLANE 0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14) 4 5 6 0.070 (1.78) 0.045 (1.14) 0.300 (7.62) TYP 0.200 (5.08) 0.135 (3.43) 0.200 (5.08) 0.165 (4.18) 0.020 (0.51) MIN 0.100 (2.54) TYP 0.016 (0.41) 0.008 (0.20) 0.154 (3.90) 0.100 (2.54) 0.020 (0.51) MIN 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0.016 (0.40) MIN 0.315 (8.00) MIN 0.405 (10.30) MAX 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0° to 15° 0.300 (7.62) TYP Lead Coplanarity : 0.004 (0.10) MAX Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.270 (6.86) 0.240 (6.10) 0.070 (1.78) 0.060 (1.52) 0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14) 0.415 (10.54) 0.100 (2.54) 0.295 (7.49) 0.030 (0.76) SEATING PLANE 0.200 (5.08) 0.135 (3.43) 0.154 (3.90) 0.100 (2.54) 0.004 (0.10) MIN 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0° to 15° 0.400 (10.16) TYP NOTE All dimensions are in inches (millimeters) © 2004 Fairchild Semiconductor Corporation Page 7 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 ORDERING INFORMATION1 Option No Suffix S SD W 300 300W 3S 3SD Example Part Number MOC8111 MOC8111S MOC8111SD MOC8111W MOC8111300 MOC8111300W MOC81113S MOC81113SD Description Through Hole Surface Mount Lead Bend Surface Mount; Tape and Reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape and Reel MOC8112 MOC8113 MARKING INFORMATION 1 MOC8111 V XX YY K 3 4 5 2 6 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) Two digit year code, e.g., ‘03’ Two digit work week ranging from ‘01’ to ‘53’ Assembly package code © 2004 Fairchild Semiconductor Corporation Page 8 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 Carrier Tape Specifications 12.0 ± 0.1 4.85 ± 0.20 0.30 ± 0.05 4.0 ± 0.1 4.0 ± 0.1 Ø1.55 ± 0.05 1.75 ± 0.10 MOC8112 MOC8113 7.5 ± 0.1 13.2 ± 0.2 9.55 ± 0.20 16.0 ± 0.3 0.1 MAX 10.30 ± 0.20 Ø1.6 ± 0.1 User Direction of Feed NOTE All dimensions are in inches (millimeters) Reflow Profile (Black Package, No Suffix) 300 Temperature (°C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 225 C peak 215°C, 10–30 s Time above 183°C, 60–150 sec Ramp up = 3C/sec 3.5 4 4.5 • Peak reflow temperature: 225°C (package surface temperature) • Time of temperature higher than 183°C for 60–150 seconds • One time soldering reflow is recommended Time (Minute) © 2004 Fairchild Semiconductor Corporation Page 9 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. © 2004 Fairchild Semiconductor Corporation Page 10 of 10 6/9/04