MRS1504T3G

MRS1504T3 Surface Mount Standard Recovery Power Rectifier SMB Power Surface Mount Package Features mesa epitaxial construction with glass passivation. Ideally suited for high frequency switching power supplies; free wheeling diodes and polarity protection diodes. Features http://onsemi.com • Compact Package with J−Bend Leads Ideal for Automated Handling • Stable, High Temperature, Glass Passivated Junction • Pb−Free Package is Available Mechanical Characteristics: STANDARD RECOVERY RECTIFIER 1.5 AMPERES, 400 VOLTS • • • • • • Case: Molded Epoxy Epoxy Meets UL 94 V−0 @ 0.125 in Weight: 95 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Maximum Temperature of 260°C / 10 Seconds for Soldering Polarity: Notch and/or Band in Plastic Body Indicates Cathode Lead SMB CASE 403A PLASTIC MARKING DIAGRAM MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TI = 118°C) Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TI = 118°C) Non−Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) Storage/Operating Case Temperature Range Operating Temperature Range Symbol VRRM VRWM VR IO IFRM IFSM Value 400 Unit V AYWW RGG G G 1.5 3.0 50 A A A A = Assembly Location Y = Year WW = Work Week RGG = Device Code G = Pb−Free Package (Note: Microdot may be in either location) Tstg, TC TJ −55 to 150 −55 to 150 °C °C ORDERING INFORMATION Device MRS1504T3 Package SMB SMB (Pb−Free) Shipping † 2500/Tape & Reel 2500/Tape & Reel THERMAL CHARACTERISTICS Rating Thermal Resistance, Junction−to−Lead (Note 1) Thermal Resistance, Junction−to−Ambient (on 1″ sq. Cu. PCB pattern) Symbol Rtjl Rtja Value 18 79 Unit °C/W °C/W MRS1504T3G Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Minimum pad size. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2006 1 June, 2006 − Rev. 4 Publication Order Number: MRS1504T3/D MRS1504T3 ELECTRICAL CHARACTERISTICS Rating Maximum Instantaneous Forward Voltage (Note 2), see Figure 2 (IF = 1.5 A) (IF = 2.25 A) Maximum Instantaneous Reverse Current, see Figure 4 (VR = 400 V) (VR = 200 V) 2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0% IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 Symbol VF 1.04 1.10 IR 1.0 0.5 340 180 0.96 1.02 mA TJ = 25_C TJ = 100_C Unit V 100 100 10 TJ = 100°C 1.0 TJ = 150°C TJ = 25°C TJ = −40°C 0.1 0.6 0.8 1.0 1.2 1.4 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 1.6 10 TJ = 100°C 1.0 TJ = 150°C TJ = 25°C 0.1 0.6 0.8 1.0 1.2 1.4 1.6 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage I R, MAXIMUM REVERSE CURRENT (AMPS) 100E−6 I R, REVERSE CURRENT (AMPS) 10E−6 TJ = 150°C TJ = 100°C 10E−3 Figure 2. Maximum Forward Voltage 1.0E−3 TJ = 150°C TJ = 100°C 100E−6 10E−6 1.0E−6 100E−9 TJ = 25°C 1.0E−6 10E−9 TJ = 25°C 100E−9 10E−9 0 100 200 300 VR, REVERSE VOLTAGE (VOLTS) 400 1.0E−9 0 100 200 300 VR, REVERSE VOLTAGE (VOLTS) 400 Figure 3. Typical Reverse Current I O , AVERAGE FORWARD CURRENT (AMPS) FREQ = 20 kHz PFO , AVERAGE POWER DISSIPATION (WATTS) 2.5 dc 2.0 SQUARE WAVE 1.5 1.0 Ipk/Io = p Ipk/Io = 5 Ipk/Io = 10 0.5 0 0 20 40 Ipk/Io = 20 2.5 2.0 Figure 4. Maximum Reverse Current dc SQUARE WAVE Ipk/Io = p Ipk/Io = 5 Ipk/Io = 10 Ipk/Io = 20 1.5 1.0 0.5 0 0 Figure 5. Current Derating 60 80 100 120 TL, LEAD TEMPERATURE (°C) 140 160 Figure 6. Forward Power Dissipation http://onsemi.com 2 0.5 1.0 1.5 2.0 IO, AVERAGE FORWARD CURRENT (AMPS) 2.5 MRS1504T3 100 TJ = 25°C C, CAPACITANCE (pF) 10 1.0 0 10 20 30 40 50 60 VR, REVERSE VOLTAGE (VOLTS) 70 80 Figure 7. Capacitance R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZE 1.0 50% 20% 0.1 10% 5.0% 2.0% 0.01 1.0% Rtjl(t) = Rtjl*r(t) 0.001 0.00001 0.0001 0.001 0.01 T, TIME (s) 0.1 1.0 10 100 Figure 8. Thermal Response, Junction−to−Lead R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0 50% 0.1 20% 10% 5.0% 2.0% 0.01 1.0% Rtjl(t) = Rtjl*r(t) 0.001 0.00001 0.0001 0.001 0.01 0.1 T, TIME (s) 1.0 10 100 1,000 Figure 9. Thermal Response, Junction−to−Ambient http://onsemi.com 3 MRS1504T3 PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE F HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM A A1 b c D E HE L L1 MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063 b D A L L1 c A1 SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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