NC7S86L6X

DATA SHEET www.onsemi.com TinyLogic HS 2-Input Exclusive-OR Gate MARKING DIAGRAMS NC7S86 SIP6 CASE 127EB Pin 1 Description The NC7S86 is a single 2−Input high performance CMOS Exclusive−OR Gate. Advanced Silicon Gate CMOS fabrication assures high speed and low power circuit operation over a broad VCC range. ESD protection diodes inherently guard both inputs and output with respect to the VCC and GND rails. Inputs are well buffered from the output to assure high noise immunity and reduced sensitivity to input edge rate. Features • • • • • • • • • Space Saving SOT23−5, SC−74A and SC−88A 5−Lead Packages Ultra Small MicroPak™ Leadless Package High Speed: tPD = 4.5 ns Typ Low Quiescent Power: ICC < 1 mA Balanced Output Drive: 2 mA IOL, −2 mA IOH Broad VCC Operating Range: 2 V – 6 V Balanced Propagation Delays Specified for 3 V Operation These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant A B =1 7S86MG G SOT23−5 CASE 527AH 7S86M SC−88A CASE 419A−02 S86MG G = Specific Device Code = 2−Digit Lot Run Traceability Code = 2−Digit Date Code Format = Assembly Plant Code = Date Code* Y ORDERING INFORMATION Figure 1. Logic Symbol © Semiconductor Components Industries, LLC, 2004 ZZ, 7S86, S86 KK XY Z M SC−74A CASE 318BQ *Date Code orientation and/or position may vary depending upon manufacturing location. IEEE / IEC June, 2022 − Rev. 4 ZZKK XYZ See detailed ordering, marking and shipping information in the package dimensions section on page 5 of this data sheet. 1 Publication Order Number: NC7S86/D NC7S86 Pin Configurations A 1 5 VCC B 2 GND 3 4 Y 5 NC 4 Y FUNCTION TABLE (Y = A ⊕ B) Pin Name NC B 2 Figure 3. MicroPak (Top Through View) PIN DESCRIPTIONS Y 6 VCC GND 3 Figure 2. SOT23−5, SC−88A and SC−74A (Top View) A, B A 1 Description Output Inputs Input A B Y Output L L L No Connect L H H H L H H H L H = HIGH Logic Level L = LOW Logic Level ABSOLUTE MAXIMUM RATINGS Symbol VCC IIK Parameter Min Supply Voltage DC Input Diode Current VIN DC Input Voltage IOK DC Output Diode Current Max Unit −0.5 6.5 V VIN < 0 V − −20 mA VIN > VCC − +20 −0.5 VCC + 0.5 V VOUT < 0 V − −20 mA VOUT > VCC − +20 VOUT DC Output Voltage −0.5 VCC + 0.5 V IOUT DC Output Source or Sink Current − ±12.5 mA DC VCC or Ground Current per Output Pin − ±25 mA ICC or IGND TSTG Storage Temperature −65 +150 °C TJ Junction Temperature − +150 °C TL Lead Temperature (Soldering, 10 Seconds) − +260 °C PD Power Dissipation in Still Air SC−74A / SOT23−5 − 390 mW SC−88A − 332 MicroPak−6 − 812 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 NC7S86 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 2.0 6.0 V Input Voltage 0 VCC V Output Voltage 0 VCC V −40 +85 °C VCC at 2.0 V 0 20 ns/V VCC at 3.0 V 0 20 VCC at 4.5 V 0 10 VCC at 6.0 V 0 5 SC−74A / SOT23−5 − 320 SC−88A − 377 MicroPak−6 − 154 VCC Supply Voltage VIN VOUT TA Operating Temperature tr, tf Input Rise and Fall Times qJA Conditions Thermal Resistance °C/W Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Unused inputs must be held HIGH or LOW. They may not float. DC ELECTICAL CHARACTERISTICS TA = +25°C Symbol Parameter VCC (V) Conditions TA = −40 to +85°C Min Typ Max Min Max Unit VIH HIGH Level Input Voltage 2.0 3.0 − 6.0 1.50 0.7 VCC − − − − 1.50 0.7 VCC − − V VIL LOW Level Input Voltage 2.0 3.0 − 6.0 − − − − 0.50 0.3 VCC − − 0.50 0.3 VCC V VOH HIGH Level Output Voltage 1.90 2.90 4.40 5.90 2.0 3.0 4.5 6.0 − − − − 1.90 2.90 4.40 5.90 − − − − V 2.68 4.18 5.68 2.85 4.35 5.85 − − − 2.63 4.13 5.63 − − − − − − − 0.0 0.0 0.0 0.0 0.10 0.10 0.10 0.10 − − − − 0.10 0.10 0.10 0.10 2.0 3.0 4.5 6.0 3.0 4.5 6.0 VOL LOW Level Output Voltage 2.0 3.0 4.5 6.0 IOH = −20 mA VIN = VIH or VIL VIN = VIH or VIL IOH = −1.3 mA IOH = −2.0 mA IOH = −2.6 mA IOL = 20 mA VIN = VIH or VIL 3.0 4.5 6.0 VIN = VIH or VIL IOL = 1.3 mA IOL = 2.0 mA IOL = 2.6 mA − − − 0.1 0.1 0.1 0.26 0.26 0.26 − − − 0.33 0.33 0.33 V V V IIN Input Leakage Current 6.0 VIN = VCC, GND − − ±0.1 − ±1.0 mA ICC Quiescent Supply Current 6.0 VIN = VCC, GND − − 1.0 − 10.0 mA www.onsemi.com 3 NC7S86 AC ELECTRICAL CHARACTERISTICS TA = +25°C TA = −40 to +85°C Min Typ Max Min Max Unit CL = 15 pF − 4.5 17 − − ns 2.0 3.0 4.5 6.0 CL = 50 pF − − − − 22 12 8.5 7 100 27 20 17 − − − − 125 35 25 21 ns 5.0 CL = 15 pF − 3 8 − − ns 2.0 3.0 4.5 6.0 CL = 50 pF − − − − 25 16 11 9 125 35 25 21 − − − − 155 45 31 26 ns − 2 10 − 10 pF − 8 − − − pF Symbol Parameter VCC (V) tPLH, tPHL Propagation Delay (Figure 4, 6) 5.0 tTLH, tTHL Output Transition Time (Figure 4, 6) CIN Input Capacitance CPD Power Dissipation Capacitance (Figure 5) Conditions Open 5.0 (Note 2) 2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). AC Loading and Waveforms VCC OUTPUT INPUT CL CL includes load and stray capacitance Input PRR = 1.0 MHz; tW = 500 ns Figure 4. AC Test Circuit VCC A INPUT Input = AC Waveform; PRR = Variable; Duty Cycle = 50%. Figure 6. AC Waveforms Figure 5. ICCD Test Circuit www.onsemi.com 4 NC7S86 ORDERING INFORMATION Top Mark Package Description Shipping† NC7S86M5X 7S86 SC−74A 3000 / Tape & Reel NC7S86M5X−L22090 7S86 SOT23−5 3000 / Tape & Reel NC7S86P5X S86 SC−88A 3000 / Tape & Reel NC7S86P5X−L22057 S86 SC−88A 3000 / Tape & Reel NC7S86L6X ZZ SIP6, MicroPak 5000 / Tape & Reel NC7S86L6X−L22175 ZZ SIP6, MicroPak 5000 / Tape & Reel Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MicroPak is trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SIP6 1.45X1.0 CASE 127EB ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13590G SIP6 1.45X1.0 DATE 31 AUG 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−74A CASE 318BQ ISSUE B 5 1 SCALE 2:1 5X DATE 18 JAN 2018 b 0.20 C A B E1 5 M 4 1 2 E 3 B 0.05 A1 e D A L DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIM A A1 b c D E E1 e L M TOP VIEW A SIDE VIEW DETAIL A C c SEATING PLANE END VIEW RECOMMENDED SOLDERING FOOTPRINT* MILLIMETERS MIN MAX 0.90 1.10 0.01 0.10 0.25 0.50 0.10 0.26 2.85 3.15 2.50 3.00 1.35 1.65 0.95 BSC 0.20 0.60 0_ 10 _ GENERIC MARKING DIAGRAM* 0.95 PITCH XXX MG G XXX M G 2.40 = Specific Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) 5X 1.00 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Some products may not follow the Generic Marking. 5X 0.70 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON66279G SC−74A Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L SCALE 2:1 A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DATE 17 JAN 2013 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 J GENERIC MARKING DIAGRAM* C K H XXXMG G SOLDER FOOTPRINT 0.50 0.0197 XXX = Specific Device Code M = Date Code G = Pb−Free Package 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. mm Ǔ ǒinches STYLE 1: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 2: PIN 1. ANODE 2. EMITTER 3. BASE 4. COLLECTOR 5. CATHODE STYLE 3: PIN 1. ANODE 1 2. N/C 3. ANODE 2 4. CATHODE 2 5. CATHODE 1 STYLE 4: PIN 1. SOURCE 1 2. DRAIN 1/2 3. SOURCE 1 4. GATE 1 5. GATE 2 STYLE 6: PIN 1. EMITTER 2 2. BASE 2 3. EMITTER 1 4. COLLECTOR 5. COLLECTOR 2/BASE 1 STYLE 7: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 8: PIN 1. CATHODE 2. COLLECTOR 3. N/C 4. BASE 5. EMITTER STYLE 9: PIN 1. ANODE 2. CATHODE 3. ANODE 4. ANODE 5. ANODE DOCUMENT NUMBER: DESCRIPTION: 98ASB42984B STYLE 5: PIN 1. CATHODE 2. COMMON ANODE 3. CATHODE 2 4. CATHODE 3 5. CATHODE 4 Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SC−88A (SC−70−5/SOT−353) PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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