NC7WZ16L6X

NC7WZ16 TinyLogic UHS Dual Buffer Description The NC7WZ16 is a dual buffer from ON Semiconductor’s Ultra−High Speed Series of TinyLogic. The device is fabricated with advanced CMOS technology to achieve ultra−high speed with high output drive while maintaining low static power dissipation over a very broad VCC operating range. The device is specified to operate over the 1.65 V to 5.5 V VCC range. The inputs and outputs are high impedance when VCC is 0 V. Inputs tolerate voltages up to 5.5 V independent of VCC operating voltage. www.onsemi.com MARKING DIAGRAMS SIP6 1.45x1.0 CASE 127EB Features • • • • • • • • • • Ultra−High Speed: tPD 2.4 ns (Typical) into 50 pF at 5 V VCC High Output Drive: ±24 mA at 3 V VCC Broad VCC Operating Range: 1.65 V to 5.5 V Matches Performance of LCX when Operated at 3.3 V VCC Power Down High−Impedance Inputs / Outputs Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation Proprietary Noise / EMI Reduction Circuitry Ultra−Small MicroPak™ Packages Space−Saving SC70 Package These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant A1 1 A2 Pin 1 UDFN6 1.0X1.0, 0.35P CASE 517DP Y1 SC−88 (SC−70 6 Lead) 1.25x2 CASE 419AD−01 Y2 T Figure 1. Logic Symbol C7KK XYZ Pin 1 C7, Z16 KK XY Z IEEC / IEC C7KK XYZ Z16T = Specific Device Code = 2−Digit Lot Run Traceability Code = 2−Digit Date Code Format = Assembly Plant Code = Year Coding Scheme = Plant Code Identifier = Die Run Code = Eight−Week Datacoding Scheme ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 1999 June, 2019 − Rev. 3 1 Publication Order Number: NC7WZ16/D NC7WZ16 Pin Configurations A1 1 6 Y1 GND 2 5 VCC A2 3 4 Y2 A1 1 GND 2 A2 3 Figure 2. SC70 (Top View) (Top View) 6 Y1 5 VCC 4 Y2 Figure 3. MicroPak (Top Through View) AAA Pin One NOTES: 1. AAA represents product code top mark (see ordering table). 2. Orientation of Top Mark determines Pin One location. Read the top product code mark left to right, Pin One is the lower left pin. Figure 4. Pin 1 Orientation PIN DEFINITIONS FUNCTION TABLE (Y = A) Pin # SC70 Pin # MicroPak Name 1 1 A1 Inputs Output Input 2 2 GND 3 3 4 Description A Y Ground L L A2 Input H H 4 Y2 Output 5 5 VCC 6 6 Y1 H = HIGH Logic Level L LOW Logic Level Supply Voltage Output www.onsemi.com 2 NC7WZ16 ABSOLUTE MAXIMUM RATINGS Symbol Min Max Unit VCC Supply Voltage −0.5 6.5 V VIN DC Input Voltage −0.5 6.5 V DC Output Voltage −0.5 6.5 V VOUT Parameter IIK DC Input Diode Current VIN < 0 V − −50 mA IOK DC Output Diode Current VOUT < 0 V − −50 mA IOUT DC Output Source / Sink Current − ±50 mA DC VCC or Ground Current − ±100 mA −65 +150 °C ICC or IGND TSTG Storage Temperature Range TJ Junction Temperature Under Bias − +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) − +260 °C PD Power Dissipation at +85°C SC70−6 − 190 mW MicroPak−6 − 327 MicroPak2™−6 − 327 Human Body Model, JEDEC: JESD22−A114 − 4000 Charge Device Model, JEDEC: JESD22−C101 − 2000 ESD V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT tr, tf Parameter Conditions Min Max Unit Supply Voltage Operating 1.65 5.50 V Supply Voltage Data Retention 1.50 5.50 0 5.5 Input Voltage Output Voltage Input Rise and Fall Times TA Operating Temperature qJA Thermal Resistance V 0 VCC V VCC = 1.8 V, 2.5 V ±0.2 V 0 20 ns/V VCC = 3.3 V ±0.3 V 0 10 VCC = 5.5 V ±0.5 V 0 5 −40 +125 °C SC70−6 − 659 °C/W MicroPak − 382 MicroPak2 − 382 °C/W Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 3. Unused inputs must be held HIGH or LOW. They may not float. www.onsemi.com 3 NC7WZ16 DC ELECTICAL CHARACTERISTICS TA = 25°C Symbol VIH VIL VOH VOL IIN Parameter VCC (V) Conditions TA = −40 to 85°C Min Typ Max Min Max Unit V HIGH Level Control Input Voltage 1.65 to 1.95 0.65 VCC − − 0.65 VCC − 2.3 to 5.5 0.70 VCC − − 0.70 VCC − LOW Level Control Input Voltage 1.65 to 1.95 − − 0.35 VCC − 0.35 VCC 2.3 to 5.5 − − 0.30 VCC − 0.30 VCC 1.55 1.65 − 1.55 − 1.80 1.70 1.80 − 1.70 − 2.30 2.20 2.30 − 2.20 − 3.00 2.90 3.00 − 2.90 − 4.50 4.40 4.50 − 4.40 − HIGH Level Output Voltage LOW Level Output Voltage Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current 1.65 VIN = VIH IOH = −100 mA 1.65 IOH = −4 mA 1.29 1.52 − 1.21 − 2.30 IOH = −8 mA 1.90 2.14 − 1.90 − 3.00 IOH = −16 mA 2.40 2.75 − 2.40 − 3.00 IOH = −24 mA 2.30 2.62 − 2.30 − 4.50 IOH = −32 mA 3.80 4.13 − 3.80 − IOL = 100 mA − 0.00 0.10 − 0.10 1.80 − 0.00 0.10 − 0.10 2.30 − 0.00 0.10 − 0.10 3.00 − 0.00 0.10 − 0.10 4.50 − 0.00 0.10 − 0.10 1.65 VIN = VIL V V V 1.65 IOL = 4 mA − 0.08 0.24 − 0.24 2.30 IOL = 8 mA − 0.10 0.30 − 0.30 3.00 IOL = 16 mA − 0.16 0.40 − 0.40 3.00 IOL = 24 mA − 0.24 0.55 − 0.55 4.50 IOL = 32 mA − 0.25 0.55 − 0.55 0 ≥ VIN ≥ 5.5 V − − ±0.1 − ±1.0 mA VIN or VOUT = 5.5 V − − 1.0 − 10 mA VIN = 5.5 V, GND − − 1.0 − 10 mA 1.65 to 5.5 0 1.65 to 5.50 www.onsemi.com 4 NC7WZ16 AC ELECTRICAL CHARACTERISTICS TA = 25°C Symbol tPLH, tPHL Parameter VCC (V) Propagation Delay (Figure 5, 6) Typ Max Min Max Unit − 5.5 9.6 − 10.6 ns − 4.6 8.0 − 8.8 2.50 ±0.20 − 3.0 5.2 − 5.8 3.30 ±0.30 − 2.3 3.6 − 4.0 5.00 ±0.50 − 1.8 2.9 − 3.2 − 3.0 4.6 − 5.1 − 2.4 3.8 − 4.2 0 − 2.5 − − − pF 3.30 − 10 − − − pF 5.00 − 12 − − − CL = 15 pF, RL = 1 MW 1.80 3.30 ±0.30 5.00 ±0.50 Input Capacitance CPD Power Dissipation Capacitance (Note 4) (Figure 7) TA = −40 to 85°C Min 1.65 CIN Conditions CL = 50 pF, RL = 500 W 4. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). tr = 3 ns VCC 90% 50% INPUT INPUT OUTPUT CL 10% RL 50% tW tPHL NOTE: 5. CL includes load and stray capacitance; inputs PRR = 1.0 MHz, tW = 500 ns. OUTPUT tf = 3 ns VCC 90% 10% tPLH 50% GND VOH 50% VOL Figure 5. AC Test Circuit Figure 6. AC Waveforms VCC A INPUT NOTE: 6. Input = AC Waveform; tr = tf = 1.8 ns; PRR = 10 MHz; Duty Cycle = 50%. Figure 7. ICCD Test Circuit www.onsemi.com 5 NC7WZ16 DEVICE ORDERING INFORMATION Top Mark Packages Shipping† NC7WZ16P6X Z16 6−Lead SC70, EIAJ SC−88a, 1.25 mm Wide 3000 / Tape & Reel NC7WZ16L6X C7 6−Lead MicroPak, 1.00 mm Wide 5000 / Tape & Reel NC7WZ16FHX C7 6−Lead, MicroPak2, 1x1 mm Body, .35 mm Pitch 5000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SIP6 1.45X1.0 CASE 127EB ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13590G SIP6 1.45X1.0 DATE 31 AUG 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−88 (SC−70 6 Lead), 1.25x2 CASE 419AD−01 ISSUE A SYMBOL D e e E1 E DATE 07 JUL 2010 MIN MAX A 0.80 1.10 A1 0.00 0.10 A2 0.80 1.00 b 0.15 0.30 c 0.10 0.18 D 1.80 2.00 2.20 E 1.80 2.10 2.40 E1 1.15 1.25 1.35 0.65 BSC e L TOP VIEW NOM 0.26 0.36 L1 0.42 REF L2 0.15 BSC 0.46 θ 0º 8º θ1 4º 10º q1 A2 A q b q1 L L1 A1 SIDE VIEW c L2 END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-203. DOCUMENT NUMBER: DESCRIPTION: 98AON34266E Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SC−88 (SC−70 6 LEAD), 1.25X2 PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6 1.0X1.0, 0.35P CASE 517DP ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13593G UDFN6 1.0X1.0, 0.35P DATE 31 AUG 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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